Ultrasonic transducer

Abstract

The utility model relates to the field of ultrasonic transducers, and provides an ultrasonic transducer which comprises a sound lamination layer, and the sound lamination layer comprises a piezoelectric layer, a matching layer, a conductive layer, a first bonding layer and a second bonding layer. A second cutting groove is formed in one side of the piezoelectric layer, the second bonding layer comprises a third part and a fourth part which are integrally formed, the third part is arranged in the second cutting groove, and the fourth part is bonded and connected with the matching layer or the conductive layer; the first bonding layer is bonded with the other side of the piezoelectric layer and the conductive layer or the matching layer. According to the ultrasonic transducer, one side of the piezoelectric layer is provided with the second bonding layer, the second bonding layer comprises the third part and the fourth part which are integrally formed, the third part is arranged in the second cutting groove, and the fourth part is arranged between the piezoelectric layer and the matching layer or the conducting layer, so that the fourth part does not need to be ground off; and the piezoelectric layer and the matching layer or the conductive layer are directly connected through the fourth part, so that the operation steps of the acoustic lamination are reduced, the preparation efficiency is improved, and various defects of the prefabricated piezoelectric layer are also avoided.

Description

Technical Field

[0001] The utility model relates to the field of ultrasonic transducers, and further relates to an ultrasonic transducer. Background Art

[0002] When preparing medical ultrasonic transducers and piezoelectric composite materials, most of the layers of materials, including the piezoelectric material, are prepared in advance, and then the layers of materials are bonded together. For example, when preparing piezoelectric composite materials, it is necessary to cut a number of grooves of a certain depth on the piezoelectric material, and then fill the grooves with filler material. After the polymer material is cured, both sides are ground until the grooves are exposed, and then ground to the final thickness, and the electrode layer is plated. At this time, in order to ensure that the piezoelectric material does not break after cutting, the thickness of the piezoelectric material needs to be much larger than the thickness of the groove, and then the thickness of the piezoelectric material is made to meet the requirements through double-sided grinding, which greatly increases the workload of grinding. At the same time, in order to ensure that the grooves are filled with filler material, the amount of filler material poured into the grooves needs to be more than the actual amount of filler material that fills the grooves, resulting in the filler material being higher than the grooves and adhering to the filler surface of the piezoelectric material, increasing the difficulty of grinding and reducing the efficiency of grinding and thinning. Utility Model Content

[0003] In response to the above technical problems, the purpose of the present utility model is to provide an ultrasonic transducer, in which a second adhesive layer is provided on one side of the piezoelectric layer, and the second adhesive layer includes an integrally formed third part and a fourth part, the third part is arranged in the second groove, and the fourth part is arranged between the piezoelectric layer and the matching layer or the conductive layer. There is no need to grind off the fourth part, and the piezoelectric layer and the matching layer or the conductive layer are directly connected by gluing the fourth part, which reduces the operating steps of the acoustic stacking, improves the preparation efficiency, and avoids the various disadvantages of the prefabricated piezoelectric layer.

[0004] In order to achieve the above object, the utility model provides an ultrasonic transducer, comprising an acoustic stack, wherein the acoustic stack comprises a piezoelectric layer, a matching layer, a conductive layer, and a first adhesive layer and a second adhesive layer;

[0005] A second groove is provided on one side of the piezoelectric layer, and the second adhesive layer includes an integrally formed third portion and a fourth portion, the third portion is provided in the second groove, and the fourth portion is adhesively connected to the matching layer or the conductive layer;

[0006] The first adhesive layer is adhesively connected to the other side of the piezoelectric layer and the conductive layer or the matching layer.

[0007] In some embodiments, the conductive layer is pasted and arranged below the piezoelectric layer, a second groove is provided on the top of the piezoelectric layer, the second adhesive layer includes a third part and a fourth part, the third part is arranged in the second groove, and the fourth part is pasted and connected to the matching layer.

[0008] In some embodiments, the piezoelectric layer is pasted and arranged below the matching layer, a second groove is provided at the bottom of the piezoelectric layer, the second adhesive layer includes a third part and a fourth part, the third part is arranged in the second groove, and the fourth part is pasted and connected to the conductive layer.

[0009] In some embodiments, the conductive layer includes a circuit board, and the circuit board is conductively connected to the piezoelectric layer;

[0010] The acoustic stack further comprises a backing layer, which is adhered below the circuit board.

[0011] In some embodiments, the second groove is arranged along the long axis direction, and the piezoelectric layer is in a 2-2 shape;

[0012] Alternatively, a number of the second grooves are arranged along the long axis direction, a number of the second grooves are arranged along the short axis direction, and the piezoelectric layer is in a 1-3 type.

[0013] In some embodiments, the acoustic stack has a short axis direction and a long axis direction perpendicular to each other, and a plurality of first grooves arranged along the short axis direction are provided on the top of the acoustic stack, and the first grooves cut the acoustic stack into a plurality of array elements;

[0014] It also includes a lens layer, which is cast and molded on the outside of the acoustic stack. The lens layer includes a first part and a second part. The first part is arranged in the first groove so that a plurality of array elements are arranged at intervals along the long axis direction; the second part wraps the acoustic stack.

[0015] In some embodiments, the top surface of the lens layer has a first curved surface arranged along the short axis direction, so that the top surface of the lens layer is convex outward or concave inward along the first curved surface.

[0016] In some embodiments, the top surface of the acoustic stack bulges outward along the long axis direction, and the top surface of the lens layer matches the top surface of the acoustic stack, so that the top surface of the lens layer has a second curved surface arranged along the long axis direction, and the top surface of the lens layer bulges outward or is concave inward along the second curved surface.

[0017] Compared with the prior art, the ultrasonic transducer provided by the present invention has at least one of the following beneficial effects:

[0018] 1. A second adhesive layer is provided on one side of the piezoelectric layer. The second adhesive layer includes an integrally formed third portion and a fourth portion. The third portion is provided in the second groove, and the fourth portion is provided between the piezoelectric layer and the matching layer or the conductive layer. There is no need to grind off the fourth portion. The piezoelectric layer and the matching layer or the conductive layer are directly connected by gluing the fourth portion, thereby reducing the number of operation steps for acoustic lamination, improving preparation efficiency, and avoiding various disadvantages of prefabricated piezoelectric layers.

[0019] 2. The lens layer is disposed on the outside of the acoustic stack. The second portion of the lens layer wraps the acoustic stack, and the first portion fills the first groove. This allows the lens layer to serve as a gap filler for several array elements on the acoustic stack, reducing the number of gap filler steps and improving the efficiency of ultrasonic transducer production. The lens layer also improves the protective performance of the acoustic stack. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The preferred embodiments will be described below in a clear and understandable manner with reference to the accompanying drawings to further illustrate the above-mentioned characteristics, technical features, advantages and implementation methods of the present invention.

[0021] Figure 1 It is an overall picture of the sound stack;

[0022] Figure 2 It is a structural diagram of the acoustic stack;

[0023] Figure 3 is the internal view of the lens layer;

[0024] Figure 4 is a structural diagram of an acoustic stack in another embodiment;

[0025] Figure 5 is an internal view of a lens layer in another embodiment;

[0026] Figure 6 This is the position diagram of the second groove;

[0027] Figure 7 is a diagram showing the position of the second groove in another embodiment;

[0028] Figure 8 It is a cross-sectional view of the ultrasonic transducer in the short axis direction.

[0029] Description of Figure Numbers:

[0030] Acoustic stack 1, short axis direction 101, long axis direction 102, piezoelectric layer 11, first groove 111, second groove 112, matching layer 12, second adhesive layer 13, third portion 131, fourth portion 132, circuit board 14, lens layer 2, first portion 21, second portion 22, first curved surface 23, second curved surface 24. DETAILED DESCRIPTION

[0031] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the specific implementation methods of the present invention will be described below with reference to the accompanying drawings. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings and other implementation methods can be obtained based on these drawings without inventive work.

[0032] To simplify the drawings, only the parts relevant to the utility model are schematically shown in each figure; they do not represent the actual structure of the product. Furthermore, to simplify the drawings and facilitate understanding, in some figures, only one of the components with the same structure or function is schematically depicted or labeled. In this document, "one" not only means "only one" but also "more than one."

[0033] It should be further understood that the term "and / or" used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.

[0034] It should be noted that, unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they can refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. Those skilled in the art will understand the specific meanings of these terms in this utility model based on the specific circumstances.

[0035] In addition, in the description of this application, the terms "first", "second", etc. are only used to distinguish the description and should not be understood as indicating or implying relative importance. It should be noted that the above embodiments can be freely combined as needed. The above are only preferred implementations of the present utility model. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present utility model, several improvements and modifications can be made, and these improvements and modifications should also be considered as the scope of protection of the present utility model.

[0036] refer to Figure 1 、 Figure 2 and Figure 8 The utility model provides an ultrasonic transducer, including an acoustic stack 1, which includes a piezoelectric layer 11, a matching layer 12, a conductive layer, a second adhesive layer 13, and a first adhesive layer; a second groove 112 is provided on one side of the piezoelectric layer 11, and the second adhesive layer 13 includes an integrally formed third portion 131 and a fourth portion, the third portion 131 is arranged in the second groove 112, and the fourth portion is adhesively connected to the matching layer 12 or the conductive layer; the first adhesive layer is adhesively connected to the other side of the piezoelectric layer 11 and the conductive layer or the matching layer 12.

[0037] In this embodiment, a second adhesive layer 13 is provided on one side of the piezoelectric layer 11. The second adhesive layer 13 includes an integrally formed third portion 131 and a fourth portion 132. The third portion 131 is disposed in the second groove 112, and the fourth portion 132 is disposed between the piezoelectric layer 11 and the matching layer 12 or the conductive layer. There is no need to grind off the fourth portion 132. The piezoelectric layer 11 and the matching layer 12 or the conductive layer are directly connected by gluing the fourth portion 132. This reduces the number of operating steps of the acoustic laminate 1, improves preparation efficiency, and avoids various disadvantages of prefabricated piezoelectric layers 11.

[0038] Specifically, the second groove 112 is cut on the piezoelectric layer 11 in order to set the piezoelectric layer 11 as a piezoelectric composite material, which includes but is not limited to 2-2 type and 1-3 type. The second groove 112 is arranged along the long axis direction 102, and the piezoelectric layer 11 is of 2-2 type. Several second grooves 112 are arranged along the long axis direction 102, and several second grooves 112 are arranged along the short axis direction 101, and the piezoelectric layer 11 is of 1-3 type. It is worth noting that when the piezoelectric layer 11 is of 1-3 type, the first groove 111 and part of the second groove 112 arranged along the short axis direction 101 overlap with each other. The conductive layer is adhered to the bottom of the piezoelectric layer 11 through the first adhesive layer, and the second groove 112 is provided on the top of the piezoelectric layer 11. The second adhesive layer 13 includes a third part 131 and a fourth part 132. The third part 131 is arranged in the second groove 112, and the fourth part 132 is adhered and connected to the matching layer 12. The acoustic stack 1 now includes a piezoelectric layer 11, a matching layer 12, a conductive layer, and a second adhesive layer 13. The conductive layer is adhesively bonded below the piezoelectric layer 11. A second groove 112 is defined at the top of the piezoelectric layer 11. The second adhesive layer 13 includes a third portion 131 and a fourth portion 132. The third portion 131 is disposed within the second groove 112, and the fourth portion 132 is adhesively bonded to the matching layer 12. The third portion 131 of the second adhesive layer 13 simultaneously fills the second groove 112 and is also adhesively bonded to the matching layer 12 via the fourth portion 132. This reduces the number of steps, improves preparation efficiency, and avoids various drawbacks associated with prefabricating the piezoelectric layer 11.

[0039] It is worth noting that the second adhesive layer 13 includes, but is not limited to, epoxy glue. It can also be other materials with adhesive, decoupling, and isolation properties, which are not further limited in this application. The conductive layer includes a circuit board 14, which is conductively connected to the piezoelectric layer 11. The acoustic stack 1 also includes a backing layer, which is adhered beneath the circuit board 14. The conductive layer may also include conductive strips, which are conductively connected to the circuit board 14 and the piezoelectric layer 11.

[0040] In a modified embodiment, reference Figure 6 and Figure 7The piezoelectric layer 11 is pasted and arranged below the matching layer 12. A second groove 112 is provided at the bottom of the piezoelectric layer 11. The second adhesive layer 13 includes a third part 131 and a fourth part 132. The third part 131 is arranged in the second groove 112, and the fourth part 132 is pasted and connected to the conductive layer.

[0041] Specifically, the acoustic stack 1 includes a piezoelectric layer 11, a matching layer 12, a conductive layer and a second adhesive layer 13. The piezoelectric layer 11 is adhered to the bottom of the matching layer 12 through the first adhesive layer. A first groove 111 is provided at the bottom of the piezoelectric layer 11. The second adhesive layer 13 includes a third portion 131 and a fourth portion 132. The third portion 131 is arranged in the first groove 111, and the fourth portion 132 is adhered and connected to the conductive layer.

[0042] Further, refer to Figure 1 and Figure 3 The acoustic stack 1 has a short axis direction 101 and a long axis direction 102 that are perpendicular to each other. A plurality of first grooves 111 are provided on the top of the acoustic stack 1 along the short axis direction 101. The first grooves 111 divide the acoustic stack 1 into a plurality of array elements. The acoustic stack 1 also includes a lens layer 2, which is cast and molded on the outside of the acoustic stack 1. The lens layer 2 includes a first portion 21 and a second portion 22. The first portion 21 is disposed in the first grooves 111, so that the plurality of array elements are spaced apart along the long axis direction 102. The second portion 22 wraps the acoustic stack 1.

[0043] In this embodiment, the lens layer 2 is disposed on the outside of the acoustic stack 1. The second portion 22 of the lens layer 2 wraps the acoustic stack 1, and the first portion 21 fills the first groove 111. This allows the lens layer 2 to serve as a gap filler for several array elements on the acoustic stack 1. This reduces the number of gap filler steps for the array elements and improves the efficiency of ultrasonic transducer production. Furthermore, the lens layer 2 can also improve the protective performance of the acoustic stack 1.

[0044] Specifically, the short axis direction 101 is the width direction of the acoustic stack 1, and the long axis direction 102 is the length direction of the acoustic stack 1. First, a plurality of first grooves 111 are cut along the short axis direction 101 of the acoustic stack 1 to divide the acoustic stack 1 into a plurality of array elements. Cutting methods include, but are not limited to, blade cutting, laser cutting, etching cutting, etc. The lens layer 2 is then cast and molded outside the acoustic stack 1, such that the first portion 21 of the lens layer 2 fills the first grooves 111 and the second portion 22 wraps the entire acoustic stack 1. In this case, the first portion 21 can reduce direct interaction between array elements, while the second portion 22 can protect the entire acoustic stack 1. It is worth noting that the lens layer 2 is made of any of epoxy glue, silicone rubber, or polymer materials. In more detail, a conductive layer is first adhered to the underside of the piezoelectric layer 11 through a first adhesive layer. A second groove 112 is then formed on the top of the piezoelectric layer 11. A second adhesive layer 13 is then placed in the second groove 112. The third portion 131 of the second adhesive layer 13 fills the second groove 112, and a fourth portion 132 is placed on one side of the piezoelectric layer 11. The matching layer 12 is then placed on the fourth portion 132. After the second adhesive layer 13 is cured, it is bonded to the matching layer 12 and the piezoelectric layer 11. A first groove 111 is then cut along the short axis 101, and the acoustic stack 1 is grooved into a plurality of array elements. Finally, the lens layer 2 is placed on the outside of the acoustic stack 1. At this point, the surface of the piezoelectric layer 11 is plated with isolated positive and negative electrodes. The second groove 112 cuts through the top of the piezoelectric layer 11, so the matching layer 12 needs to be made of a conductive material. The piezoelectric layer 11 can be any of a piezoelectric single crystal, a polycrystalline piezoelectric ceramic, a polymer piezoelectric material, or a polymer-piezoelectric ceramic composite.

[0045] In a modified embodiment, the piezoelectric layer 11 and the matching layer 12 are first bonded together using a first adhesive layer. The surface of the piezoelectric layer 11 is plated with mutually isolated positive and negative electrodes. A second groove 112 is then cut into the bottom of the piezoelectric layer 11. The cutting depth of the second groove 112 is slightly less than the thickness of the piezoelectric layer 11. This limitation does not apply if the matching layer 12 is made of a conductive material. The piezoelectric layer 11 is then turned bottom-up and filled with a second adhesive layer 13 within the second groove 112. The third portion 131 of the second adhesive layer 13 fills the second groove 112, and the fourth portion 132 is disposed on one side of the piezoelectric layer 11. A conductive layer is then placed on top of the fourth portion 132 of the second adhesive layer 13. A clamp is used to press the conductive layer, which draws the positive and negative electrode materials from the piezoelectric layer 11, against the electrode surface of the piezoelectric layer 11. The conductive layer is then placed in an oven for heating and curing. After curing, the first groove 111 is cut along the short axis 101 of the acoustic stack 1 to form a plurality of array elements. The acoustic stack 1 also includes a backing layer. The conductive layer includes a circuit board 14, which is connected to the piezoelectric layer 11 via the conductive layer. The backing layer is adhered to the bottom of the circuit board 14. The piezoelectric layer of the cut array element is adhered to the circuit board 14, which is then adhered to the backing layer. Alternatively, the circuit board 14 is adhered to the backing layer before the first slot 111 and the array element are cut. The backing layer absorbs acoustic energy radiated into the probe by vibrations of the acoustic stack 1, preventing this energy from being reflected and transmitted back to the acoustic stack 1, causing interference.

[0046] Further, refer to Figure 4 and Figure 5 The top surface of the lens layer 2 has a first curved surface 23 arranged along the short axis direction 101, so that the top surface of the lens layer 2 is convex outward or concave inward along the first curved surface 23.

[0047] In this embodiment, the top surface of the second portion 22 of the lens layer 2 is a first curved surface 23 arranged along the short axis direction 101. The first curved surface 23 is convex or concave toward the side away from the first portion 21, so that the top surface of the lens layer 2 is curved, thereby adjusting the focal length of the ultrasonic transducer.

[0048] Specifically, the lens layer 2 is formed on the outside of the acoustic stack layer 1. The lens layer 2 is curved along the short axis direction 101 and forms a curved surface, which can adjust the focal length of the ultrasonic transducer. The top of the lens layer 2 is also curved along the short axis direction 101, allowing for free selection of directions for contact and observation of the object, making it easier to eliminate corners. At this time, the top surface of the acoustic stack layer 1 is still flat along the short axis direction 101, that is, the lens layer 2 forms a first curved surface 23 along the short axis direction 101, and the top surface of the acoustic stack layer 1 is also arranged along the short axis direction 101. It is worth noting that the top surface of the lens layer 2 can be concave inward or convex outward along the first curved surface 23, both of which can adjust the focal depth of the transducer. The first curved surface 23 of the top surface of the lens layer 2 can be selected according to specific needs and usage scenarios, and this application does not further limit it.

[0049] Preferably, the top surface of the acoustic stack layer 1 bulges outward along the long axis direction 102 , and the top surface of the lens layer 2 matches the top surface of the acoustic stack layer 1 , so that the top surface of the lens layer 2 has a second curved surface 24 arranged along the long axis direction 102 , and the top surface of the lens layer 2 bulges outward along the second curved surface 24 .

[0050] In this embodiment, the acoustic stack layer 1 and the lens layer 2 are both convex outward in the long axis direction 102 and are curved along the long axis direction 102, thereby expanding the field of view of the acoustic stack layer 1 and the lens layer 2 in the long axis direction 102 and expanding the scanning range of the ultrasonic transducer.

[0051] Specifically, the acoustic stack 1 has a convex array shape, with the top surface of the acoustic stack 1 forming a second curved surface 24 along the long axis 102. The top surface of the acoustic stack 1 is provided with a plurality of first grooves 111. The top surface of the second portion 22 of the lens layer 2 matches the top surface of the acoustic stack 1. The lens layer 2 also forms a second curved surface 24 along the long axis 102, making the top surface of the lens layer 2 a composite convex surface with curvature along both the short axis 101 and the long axis 102. The highest point of the lens layer 2 is located at the center of the lens layer 2. It is worth noting that the top surface of the lens layer 2 can also be recessed inward along the second curved surface 24, significantly increasing the intensity of the focused ultrasound wave and reducing the target area to a subwavelength scale. The second curved surface 24 on the top surface of the lens layer 2 can be selected based on specific needs and usage scenarios and is not further limited in this application.

[0052] It should be noted that the above embodiments can be freely combined as needed. The above are only preferred embodiments of the present invention. It should be noted that those skilled in the art can make several improvements and modifications without departing from the principles of the present invention, and such improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. An ultrasonic transducer, characterized in that: include: an acoustic stack comprising a piezoelectric layer, a matching layer, a conductive layer, and a first adhesive layer and a second adhesive layer; A second groove is provided on one side of the piezoelectric layer, and the second adhesive layer includes an integrally formed third portion and a fourth portion, the third portion is provided in the second groove, and the fourth portion is adhesively connected to the matching layer or the conductive layer; The first adhesive layer is adhesively connected to the other side of the piezoelectric layer and the conductive layer or the matching layer.

2. The ultrasonic transducer according to claim 1, characterized in that: The conductive layer is pasted and arranged below the piezoelectric layer. A second groove is provided on the top of the piezoelectric layer. The second adhesive layer includes a third part and a fourth part. The third part is arranged in the second groove. The fourth part is pasted and connected to the matching layer.

3. The ultrasonic transducer according to claim 1, characterized in that: The piezoelectric layer is pasted and arranged below the matching layer. A second groove is provided at the bottom of the piezoelectric layer. The second pasting layer includes a third part and a fourth part. The third part is arranged in the second groove. The fourth part is pasted and connected to the conductive layer.

4. An ultrasonic transducer according to any one of claims 2 or 3, characterized in that: The conductive layer includes a circuit board, and the circuit board is conductively connected to the piezoelectric layer; The acoustic stack further comprises a backing layer, which is adhered below the circuit board.

5. The ultrasonic transducer according to claim 4, characterized in that: The second groove is arranged along the long axis direction of the acoustic stack, and the piezoelectric layer is in a 2-2 shape; Alternatively, a plurality of the second grooves are arranged along the long axis direction of the acoustic stack, and a plurality of the second grooves are arranged along the short axis direction of the acoustic stack, and the piezoelectric layer is in a 1-3 type.

6. The ultrasonic transducer according to claim 1, characterized in that: The acoustic stack has a short axis direction and a long axis direction perpendicular to each other, and a plurality of first grooves arranged along the short axis direction are provided on the top of the acoustic stack, and the first grooves cut the acoustic stack into a plurality of array elements; It also includes a lens layer, which is cast and molded on the outside of the acoustic stack. The lens layer includes a first part and a second part. The first part is arranged in the first groove so that a plurality of array elements are arranged at intervals along the long axis direction; the second part wraps the acoustic stack.

7. The ultrasonic transducer according to claim 6, characterized in that: The top surface of the lens layer has a first curved surface arranged along the short axis direction, so that the top surface of the lens layer is convex outward or concave inward along the first curved surface.

8. An ultrasonic transducer according to any one of claims 6 or 7, characterized in that: The top surface of the acoustic stacking layer bulges outward along the long axis direction, and the top surface of the lens layer matches the top surface of the acoustic stacking layer, so that the top surface of the lens layer has a second curved surface arranged along the long axis direction, and the top surface of the lens layer bulges outward or is concave inward along the second curved surface.

Images