Laser processing controller and laser processing system

Abstract

The utility model discloses a laser processing controller and a laser processing system.The laser processing controller comprises a shell, a cavity is defined by the shell, a substrate is fixed in the cavity, the laser processing controller is characterized in that a first main control chip is arranged on the substrate, a first operating system is carried on the first main control chip, and a second main control chip is arranged on the first operating system; the first main control chip is connected with an external display; a second operating system is carried on the second main control chip, and the second main control chip is connected with an external laser and a galvanometer; and the memory is electrically connected with the first main control chip and the second main control chip. The laser processing controller is high in integration level and compact in structure, does not need to be connected with an external upper computer, and can directly carry out laser processing.

Description

Technical Field

[0001] The utility model relates to the technical field of laser processing equipment, in particular to a laser processing controller and a laser processing system. Background Art

[0002] Laser processing is currently the most advanced technology for marking industrial products internationally and has become an increasingly effective marking method. The main components of a laser processing system include: laser, galvanometer, field lens, laser processing control card, industrial computer, cabinet housing, scale, and lifting axis. The laser processing control card connects the industrial computer, galvanometer, and laser. Installing the laser control card driver software on the computer controls the galvanometer and laser, allowing the user to set a series of processing parameters and control the laser processing. The laser processing control card plays a crucial role as a hub for data distribution, processing, and execution.

[0003] Currently, the more mainstream laser processing controllers on the market feature USB and Ethernet interfaces. These interfaces communicate with the host computer system via USB and Ethernet cables. However, in industrial settings, loose cables often lead to card dropouts, which directly prevents secure and effective data transmission, significantly impacting processing efficiency. Cables are also subject to wear and aging, requiring regular inspection, maintenance, and replacement to ensure safe and effective use. Furthermore, cable length determines the data transmission distance, requiring the laser processing controller and host computer to operate in close proximity. Consequently, every laser processing controller requires a Windows-based industrial computer, which also needs to be installed with CAM software and drivers for communication with the control card. This is inflexible and increases costs. Utility Model Content

[0004] In order to overcome the above shortcomings, the purpose of the present invention is to provide a laser processing controller and a laser processing system, wherein the laser processing controller has high integration and compact structure, and can directly perform laser processing without connecting to an external host computer.

[0005] In order to achieve the above objectives, the technical solution adopted by the present invention is: a laser processing controller, including a housing, the housing defining a chamber, a substrate fixed in the chamber, and the substrate provided with:

[0006] a first main control chip, wherein the first main control chip is equipped with a first operating system and is connected to an external display;

[0007] a second main control chip, the second main control chip being equipped with a second operating system, the second main control chip being connected to an external laser and a galvanometer;

[0008] A memory is electrically connected to the first main control chip and the second main control chip.

[0009] The beneficial effects of the present invention are:

[0010] The laser processing controller integrates two main control chips, compared to the previous single main control chip. The previously external host computer is integrated into the first main control chip, eliminating the need for cables to connect to an external host computer. This eliminates the need for cables and reduces the cumbersome wiring associated with USB or Ethernet interfaces. The two main control chips share data through a single memory, saving costs and facilitating information exchange between the two main control chips.

[0011] Furthermore, there is one substrate, and the first main control chip, the second main control chip and the memory are all fixed on the substrate. The structure of one substrate is more convenient for installation, and the substrate is directly fixed in the cavity through a locking member.

[0012] Specifically, there are two baseboards, with the first and second main control chips soldered to each baseboard. The two baseboards are stacked one on top of the other and connected via a communication line. The memory is mounted on either baseboard. The baseboards are split and arranged vertically, reducing the footprint of each baseboard, saving space on the laser processing controller and making it easier to carry.

[0013] Furthermore, the first main control chip includes a first ARM processor, the second main control chip includes an electrically connected second ARM processor and an FPGA+DSP controller, and the FPGA+DSP controller is connected to the laser and the galvanometer.

[0014] Furthermore, a power interface is provided on the shell, and the power interface is electrically connected to the substrate. The power interface is used to connect to an external power source to supply power to the substrate.

[0015] Furthermore, the housing is provided with a galvanometer interface and a laser interface, the galvanometer interface and the laser interface are used to plug in the galvanometer and the laser respectively, and the galvanometer interface and the laser interface are electrically connected to the second main control chip.

[0016] Furthermore, the housing is provided with a display interface, the display interface is used to plug in a display, and the display interface is electrically connected to the first main control chip.

[0017] Furthermore, a bus expansion interface is also provided on the housing, and the bus expansion interface is used to connect to an external controller, and the bus expansion interface is electrically connected to the substrate.

[0018] Furthermore, the first operating system is a Windows system, and computer-aided manufacturing software is installed on the first operating system; the second operating system is a Linux system.

[0019] The utility model also discloses a laser processing system, including a display, a laser, and a galvanometer, wherein the display, the laser, and the galvanometer are all connected to the above-mentioned laser processing controller. The processing system only requires a laser processing controller to perform laser processing, without the need to connect to an additional host computer. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a system block diagram of an embodiment of the first embodiment of the present utility model;

[0021] Figure 2 This is a system block diagram of another embodiment of the first embodiment of the present utility model;

[0022] Figure 3 This is a schematic structural diagram of the first embodiment of the present utility model;

[0023] Figure 4 This is a schematic structural diagram of the first embodiment of the present utility model;

[0024] Figure 5 This is a system block diagram of the second embodiment of the present utility model.

[0025] In the picture:

[0026] 100. Laser processing controller;

[0027] 1. Housing; 2. Baseboard; 3. First main control chip; 4. Second main control chip; 5. Memory; 61. Power interface; 62. Galvanometer interface; 63. Laser interface; 64. Display interface; 65. Bus expansion interface; 66. LED indicator; 67. USB interface;

[0028] 200, display;

[0029] 300, laser;

[0030] 400. Galvanometer. DETAILED DESCRIPTION

[0031] The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more precise definition of the protection scope of the present invention.

[0032] Example

[0033] Attachment Figure 1 -Attached Figure 4Schematic diagram of the laser processing controller 100 in this embodiment

[0034] See attached Figure 1 As shown, a laser processing controller 100 of the present invention includes a shell 1, which defines a chamber, a substrate 2 is fixed in the chamber, a first main control chip 3, a second main control chip 4 and a memory 5 are provided on the substrate 2, the first main control chip 3 is equipped with a first operating system, and the first main control chip 3 is connected to an external display 200; the second main control chip 4 is equipped with a second operating system, and the second main control chip 4 is connected to an external laser 300 and a galvanometer 400; the memory 5 is electrically connected to the first main control chip 3 and the second main control chip 4.

[0035] In this embodiment, the laser processing controller 100 integrates two main control chips. Compared to conventional systems with only one main control chip, the previously external host computer is integrated into the first main control chip 3. This eliminates the need for cables to connect to an external host computer, freeing it from cable constraints and reducing the cumbersome wiring associated with USB interfaces 67 or Ethernet interfaces. The two main control chips share data through a single memory 5, saving costs and facilitating information exchange between the two main control chips.

[0036] In one embodiment, see the attached Figure 1 As shown, there is a single substrate 2, and the first main control chip 3, the second main control chip 4, and the memory 5 are all fixed on the substrate 2. In this case, the area of ​​the substrate 2 is relatively large, which causes the laser processing controller 100 to occupy a larger area. However, this structure with a single substrate 2 is more convenient for installation. The substrate 2 is directly fixed in the cavity by a locking member, which can be a bolt.

[0037] The first main control chip 3 and the second main control chip 4 are both welded and fixed on the substrate 2. The memory 5 is a random access memory 5 and can be directly welded on the substrate 2.

[0038] In one embodiment, a slot is provided on the substrate 2, into which the memory 5 is inserted, facilitating replacement of the memory 5. Circuits connecting the first main control chip 3, the second main control chip 4, and the memory 5 are printed on the substrate 2. This integrally printed structure makes the entire controller more compact.

[0039] In one embodiment, see the attached Figure 2 As shown, there are two substrates 2, the first main control chip 3 and the second main control chip 4 are respectively welded and fixed on the two substrates 2, the two substrates 2 are stacked up and down and connected by a communication line, and the memory 5 is fixed on any one of the substrates 2.

[0040] At this time, the substrate 2 is a split structure and is distributed up and down, which reduces the area of ​​a single substrate 2, saves the floor space of the laser processing controller 100, and makes it easier to carry the laser processing controller 100.

[0041] The first main control chip 3 includes a first ARM processor, the first operating system is a Windows system, and computer-aided manufacturing software is installed on the first operating system. The second main control chip 4 includes a second ARM processor and an FPGA+DSP controller electrically connected, the FPGA+DSP controller is connected to the laser 300 and the galvanometer 400, and the second operating system is a Linux system.

[0042] Computer-aided manufacturing software is CAM software. CAM software converts text or pattern target graphics into data through the first main control chip 3 and stores it in memory 5. The second main control chip 4 reads the data from memory 5, processes it, and integrates and outputs it to the galvanometer 400 and laser 300. In this way, a single laser processor can complete the entire laser processing process, eliminating the need for connection to a host computer. Because the first main control chip 3 only needs to process data, only an ARM processor is required. The second main control chip 4 needs to control the laser 300 and galvanometer 400, so it integrates an ARM processor and an FPGA+DSP controller.

[0043] See attached Figure 1 -Attached Figure 4 As shown, the housing 1 is provided with a power interface 61, which is electrically connected to the substrate 2 and is used to connect to an external power source to power the substrate 2. The substrate 2 is provided with a power conversion module that can convert AC power into the 24V DC power required by the substrate 2.

[0044] The housing 1 is provided with a galvanometer interface 62 and a laser interface 63, which are used to plug in the galvanometer 400 and the laser 300, respectively. The galvanometer interface 62 and the laser interface 63 are electrically connected to the second main control chip 4. The data processed by the second main control chip 4 is transmitted to the galvanometer interface 62 and the laser interface 63.

[0045] There is one galvanometer interface 62, which is a DB15 interface. It supports XY2-100, SPI, and CANON protocols by default. It is used to control the deflection of the galvanometer 400, complete the laser light path deflection control, and can drive the 2D / 3D galvanometer 400. There are three laser interfaces, two of which are IO interfaces. The IO interface is used to meet the needs of the control card to flexibly interact with other external devices (such as motion axes, motors, relay switches, PLC control systems, visual systems, MES systems, etc.) for IO data, thereby improving its data interaction capabilities. The other laser interface is a DB25 interface, which supports optical fiber, CO2, and YAG laser 300 by default. It is used to control the connection of the laser 300, turn on / off the light, set the frequency, and control energy regulation.

[0046] In one embodiment, the housing 1 is provided with a display interface 64, which is used to connect to the display 200 and is electrically connected to the first main control chip 3. Two display interfaces 64 are provided, both of which are HDMI interfaces. The HDMI interfaces are connected to the display 200 to facilitate the user to view the system interface.

[0047] The housing 1 is further provided with a USB interface 67 , which is electrically connected to the base plate 2 . The USB interface 67 is used to connect an external mouse and keyboard to operate the first operating system.

[0048] The housing 1 is also provided with a bus expansion interface 65, which is used to connect to an external controller and is electrically connected to the base plate 2. The bus expansion interface 65 is an EtherCAT interface used for bus control, such as a motion control slave.

[0049] The housing 1 is also provided with an LED indicator light 66, which is electrically connected to the substrate 2. After the laser processing controller 100 successfully performs a power-on self-test, a green light is always on. During the processing, a red light is on. When the system alarms, two red lights are on at the same time.

[0050] See attached Figure 3 and attached Figure 4 As shown, the galvanometer interface 62 and the laser interface 63 are located on the same side of the housing 1 , and the other interfaces are located on the other side of the housing 1 for easy plugging.

[0051] In this embodiment, the target processing pattern is drawn in the CAM software of the first control chip, the required processing logic and process parameters are added, and the laser processing instruction set is sent to the second control chip via memory. The laser processing control program in the second control chip then performs the laser processing. The laser technician controller with dual integrated control chips eliminates the need for cables to connect to an external host computer, reducing the cost and complexity of external processing control computers. The controller is compact and easy to upgrade, bringing great convenience to operators.

[0052] In one embodiment, see the attached Figure 5 As shown, a laser processing system is also disclosed, including a display 200, a laser 300 and a galvanometer 400, which are all connected to the above-mentioned laser processing controller 100. A laser processing controller 100 can perform laser processing without connecting to an additional host computer.

[0053] The above implementation methods are only for illustrating the technical concept and features of the utility model. Its purpose is to enable people familiar with this technology to understand the content of the utility model and implement it. It cannot be used to limit the scope of protection of the utility model. Any equivalent changes or modifications made according to the spirit of the utility model should be included in the scope of protection of the utility model.

Claims

1. A laser processing controller, comprising a housing, wherein the housing defines a chamber, wherein a substrate is fixed in the chamber, wherein: The substrate is provided with: a first main control chip, wherein the first main control chip is equipped with a first operating system and is connected to an external display; a second main control chip, the second main control chip being equipped with a second operating system, the second main control chip being connected to an external laser and a galvanometer; A memory is electrically connected to the first main control chip and the second main control chip.

2. The laser processing controller according to claim 1, characterized in that: There is one substrate, and the first main control chip, the second main control chip and the memory are all fixed on the substrate.

3. The laser processing controller according to claim 1, wherein: There are two substrates, the first main control chip and the second main control chip are respectively welded and fixed on the two substrates, the two substrates are stacked up and connected by a communication line, and the memory is fixed on any one of the substrates.

4. The laser processing controller according to claim 1, wherein: The first main control chip includes a first ARM processor, and the second main control chip includes an electrically connected second ARM processor and an FPGA+DSP controller, and the FPGA+DSP controller is connected to the laser and the galvanometer.

5. The laser processing controller according to claim 1, wherein: The housing is provided with a power interface, the power interface is electrically connected to the substrate, and the power interface is used to connect to an external power source to supply power to the substrate.

6. The laser processing controller according to claim 1, characterized in that: The housing is provided with a galvanometer interface and a laser interface, the galvanometer interface and the laser interface are used to plug in the galvanometer and the laser respectively, and the galvanometer interface and the laser interface are electrically connected to the second main control chip.

7. The laser processing controller according to claim 1, characterized in that: The housing is provided with a display interface, which is used for plugging in a display and is electrically connected to the first main control chip.

8. The laser processing controller according to claim 1, characterized in that: The housing is further provided with a bus expansion interface, which is used to connect to an external controller and is electrically connected to the substrate.

9. The laser processing controller according to claim 1, characterized in that: The first operating system is a Windows system, and computer-aided manufacturing software is installed on the first operating system; the second operating system is a Linux system.

10. A laser processing system, characterized in that: The device comprises a display, a laser and a galvanometer, wherein the display, the laser and the galvanometer are all connected to the laser processing controller according to any one of claims 1 to 9.

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