Circuit board, display module and display device

Abstract

The utility model discloses a circuit board, a display module and a display device, and relates to the technical field of display. In the circuit board, the distance between the first touch golden finger and the touch chip is relatively long, and the first type of touch wires in the touch wires are wound from the second board body part to one side, far away from the first touch golden finger, of the display golden finger and then extend into the first board body part, so that the wiring length of the first type of touch wires on the first board body part can be reduced. The distance between the second touch golden finger and the touch chip is close, and the wiring length of the second type of touch wires in the touch wires on the first plate body part is not too long. In other words, the wiring length of the touch wires on the first plate body part is short, wiring design of the display wires is facilitated, orthographic projection overlapping of the touch wires and the display wires is avoided, mutual interference of display signals transmitted by the display wires and touch signals transmitted by the touch wires is avoided, and the yield of the display module is increased.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a circuit board, a display module, and a display device. Background Art

[0002] As users have increasingly higher requirements for display products, display modules with a flexible multi-layer on cell (FMLOC) structure have been widely used.

[0003] In some embodiments, the display module includes a display panel and a circuit board bound and connected to the display panel. In order to realize the dual functions of display and touch of the display module, the circuit board may include display drive lines and touch drive lines. The display drive lines can provide display signals to the display panel to drive the display panel to realize display. The touch drive lines can provide touch signals to the display panel to enable the display panel to realize touch. Generally, in order to avoid direct contact between the display signal lines and the touch signal lines, the display drive lines and the touch drive lines need to be located on different conductive layers of the circuit board. Furthermore, in order to realize the thinning of the circuit board, the circuit board generally includes two conductive layers and an insulating layer located between the two conductive layers.

[0004] However, there is a signal interference problem at the position where the display driving lines and the touch driving lines overlap, which leads to a low yield of the display module. Summary of the Invention

[0005] This application provides a circuit board, a display module, and a display device that can solve the problems of signal interference and low yield of display modules. The technical solution is as follows:

[0006] In one aspect, a circuit board is provided, comprising:

[0007] a first plate portion;

[0008] a gold finger portion, the gold finger portion being located on one side of the first side edge of the first plate portion, the gold finger portion comprising a plurality of first touch gold fingers, a plurality of display gold fingers, and a plurality of second touch gold fingers spaced apart along an extending direction of the first side edge, the plurality of display gold fingers being located between the plurality of first touch gold fingers and the plurality of second touch gold fingers;

[0009] a second plate portion, the second plate portion being located on a side of the gold finger portion away from the first side edge;

[0010] A touch chip, wherein the touch chip is located on the first plate portion, and a distance between the touch chip and the plurality of second touch fingers is smaller than a distance between the touch chip and the plurality of first touch fingers;

[0011] Touch traces, the touch traces comprising a plurality of first-type touch traces arranged corresponding to the plurality of first touch fingers, and a plurality of second-type touch traces arranged corresponding to the plurality of second touch fingers; one end of the first-type touch trace is connected to the first touch finger, the other end of the first-type touch trace extends from the plurality of display fingers away from some of the plurality of first touch fingers to the first board portion and is connected to the touch chip, and a portion between the two ends of the first-type touch trace is located on the second board portion; one end of the second-type touch trace is connected to the second touch finger, and the other end is connected to the touch chip, and the second-type touch trace is located on the first board portion;

[0012] and a display wiring, wherein the display wiring is located on the first board portion and is connected to the display gold finger;

[0013] The orthographic projection of the display wiring on the first board portion and the orthographic projection of the touch wiring on the first board portion do not overlap.

[0014] Optionally, one end of the second plate portion is connected to the first area of ​​the gold finger portion, the other end of the second plate portion is connected to the second area of ​​the gold finger portion, and a first hollow area is defined between the portion between the two ends of the second plate portion and the gold finger portion;

[0015] The first area is an area where at least a portion of the first touch golden finger is located, and the second area is an area where at least a portion of the second touch golden finger is located.

[0016] Optionally, the second plate portion further has a second hollow area;

[0017] A portion of the first-type touch lines among the plurality of first-type touch lines is located between two ends on a first portion of the second hollow area of ​​the second plate portion close to the first plate portion;

[0018] A portion between two ends of another portion of the plurality of first-type touch traces is located on a second portion of the second hollow area of ​​the second plate portion away from the first plate portion.

[0019] Optionally, the circuit board further includes:

[0020] A connecting plate portion, the connecting plate portion being connected to the first plate portion, and the display wiring being further located on the connecting plate portion;

[0021] and a connector, wherein the connector is located on a side of the connecting plate portion away from the first plate portion, and the connector is connected to the display wiring, and the connector is also used to connect the power supply component of the display module.

[0022] Optionally, the connecting plate portion is connected to a second side of the first plate portion, and the second side and the first side are two different sides of the first plate portion; or

[0023] The first plate portion has a third hollow area, the connecting plate portion and the connector are both located in the third hollow area, and the connecting plate portion is connected to a side edge of the third hollow area.

[0024] Optionally, the shape of the orthographic projection of the connecting plate portion on the reference plane is a rectangle, an L-shape, or a curved shape;

[0025] The reference plane is parallel to the surface of the connecting plate body on which the display wiring is arranged.

[0026] Optionally, the first plate portion includes a first shielding layer, a first insulating layer, a first conductive layer, a second insulating layer, a second conductive layer, a third insulating layer and a second shielding layer stacked in sequence;

[0027] The touch wiring is located in the first conductive layer, and the display wiring is located in the second conductive layer;

[0028] The circuit board further includes a grounding portion located in the first conductive layer and the second conductive layer. The grounding portion located in the first conductive layer and the touch wiring are spaced apart, and the grounding portion located in the second conductive layer and the display wiring are spaced apart.

[0029] Optionally, the grounding portion located in the first conductive layer is connected to the first shielding layer through a via hole in the first insulating layer, and the grounding portion located in the second conductive layer is connected to the second shielding layer through a via hole in the third insulating layer.

[0030] Optionally, the second plate portion includes a third shielding layer, a fourth insulating layer, a third conductive layer, a fifth insulating layer and a fourth shielding layer; the gold finger portion includes a fourth conductive layer and a sixth insulating layer;

[0031] The first type of touch traces are further located in the third conductive layer, and the first touch gold finger, the plurality of display gold fingers, and the plurality of second touch gold fingers are all located in the fourth conductive layer;

[0032] The third conductive layer and the fourth conductive layer are both located in the same layer as the first conductive layer.

[0033] Optionally, the second plate portion further includes a fifth conductive layer and a seventh insulating layer located between the fifth insulating layer and the fourth shielding layer;

[0034] The grounding portion is further located in the fifth conductive layer, and the fifth conductive layer and the second conductive layer are located in the same layer.

[0035] On the other hand, a display module is provided, comprising: a display panel, a driver chip, and the circuit board as described in the above aspect;

[0036] The display panel has a display area and a peripheral area surrounding the display area, the peripheral area includes a bending area and a binding area, and the bending area is closer to the display area than the binding area;

[0037] The driving chip is located between the bending area and the binding area, and is connected to the display panel;

[0038] The gold finger portion of the circuit board is connected to the binding area of ​​the display panel, and the first board portion of the circuit board is farther away from the bending area than the second board portion.

[0039] Optionally, the driver chip is located on a side of the second board portion of the circuit board away from the gold finger portion.

[0040] Optionally, the display module further includes: a first buffer portion;

[0041] The first buffer portion is located on a side of the second plate portion close to the driving chip and is located between the second plate portion and the display panel.

[0042] Optionally, the orthographic projection of the driving chip on the display panel is located within a first hollow area between the second board portion and the first board portion of the circuit board.

[0043] Optionally, the display module further includes: a second buffer portion;

[0044] The second buffer portion is located at a side of the first hollow area of ​​the second plate portion and between the second plate portion and the display panel.

[0045] Optionally, the orthographic projection of the driving chip on the display panel is located within the orthographic projection of the second hollow area of ​​the second board portion of the circuit board on the display panel.

[0046] Optionally, the display module further includes: a third buffer portion;

[0047] The third buffer portion is located at a side of the second hollow area of ​​the second plate portion and between the second plate portion and the display panel.

[0048] In another aspect, a display device is provided, comprising: a power supply component, and the display module as described in the above aspect;

[0049] The power supply component is connected to the display module and is used to supply power to the display module.

[0050] The beneficial effects of the technical solution provided by this application include at least:

[0051] The present application provides a circuit board, a display module, and a display device. The circuit board includes a first board portion, a gold finger portion, a second board portion, a touch chip, touch traces, and display traces. Because the first touch finger and the touch chip are relatively far apart, a first type of touch trace among the touch traces is routed from the second board portion to a side of the display finger away from the first touch finger before extending back into the first board portion. This reduces the routing length of the first type of touch trace on the first board portion. Furthermore, because the second touch finger and the touch chip are relatively far apart, the routing length of the second type of touch trace among the touch traces on the first board portion is not excessive. In other words, the routing length of the touch trace on the first board portion is relatively short. Furthermore, the routing design of the display trace can prevent overlap of the orthographic projections of the touch trace and the display trace, thereby preventing interference between display signals transmitted in the display trace and touch signals transmitted in the touch trace, thereby improving the yield of the display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0053] Figure 1 This is a schematic diagram of a circuit board in the related art;

[0054] Figure 2 is a schematic diagram of another circuit board in the related art;

[0055] Figure 3 This is a schematic diagram of a circuit board provided in an embodiment of the present application;

[0056] Figure 4 This is a partial schematic diagram of a display module provided in an embodiment of the present application;

[0057] Figure 5 is a partial schematic diagram of another display module provided in an embodiment of the present application;

[0058] Figure 6 is a schematic diagram of another circuit board provided in an embodiment of the present application;

[0059] Figure 7 This is a partial schematic diagram of another display module provided in an embodiment of the present application;

[0060] Figure 8 This is a schematic diagram of another circuit board provided in an embodiment of the present application;

[0061] Figure 9 This is a partial schematic diagram of another display module provided in an embodiment of the present application;

[0062] Figure 10 This is a partial schematic diagram of another display module provided in an embodiment of the present application;

[0063] Figure 11 is a schematic diagram of another circuit board provided in an embodiment of the present application;

[0064] Figure 12 This is a partial schematic diagram of another display module provided in an embodiment of the present application;

[0065] Figure 13 is a schematic diagram of another circuit board provided in an embodiment of the present application;

[0066] Figure 14 This is a partial schematic diagram of another display module provided in an embodiment of the present application;

[0067] Figure 15 This is a partial schematic diagram of another display module provided in an embodiment of the present application;

[0068] Figure 16 is a schematic diagram of another circuit board provided in an embodiment of the present application;

[0069] Figure 17 This is a partial schematic diagram of another display module provided in an embodiment of the present application;

[0070] Figure 18 is a schematic diagram of another circuit board provided in an embodiment of the present application;

[0071] Figure 19 This is a partial schematic diagram of another display module provided in an embodiment of the present application;

[0072] Figure 20 This is a partial schematic diagram of another display module provided in an embodiment of the present application;

[0073] Figure 21is a schematic diagram of another circuit board provided in an embodiment of the present application;

[0074] Figure 22 This is a partial schematic diagram of another display module provided in an embodiment of the present application;

[0075] Figure 23 is a schematic diagram of another circuit board provided in an embodiment of the present application;

[0076] Figure 24 This is a partial schematic diagram of another display module provided in an embodiment of the present application;

[0077] Figure 25 This is a partial schematic diagram of another display module provided in an embodiment of the present application;

[0078] Figure 26 is a schematic diagram of another circuit board provided in an embodiment of the present application;

[0079] Figure 27 This is a partial schematic diagram of another display module provided in an embodiment of the present application;

[0080] Figure 28 is a schematic diagram of another circuit board provided in an embodiment of the present application;

[0081] Figure 29 This is a partial schematic diagram of another display module provided in an embodiment of the present application;

[0082] Figure 30 This is a partial schematic diagram of another display module provided in an embodiment of the present application;

[0083] Figure 31 is a schematic diagram of another circuit board provided in an embodiment of the present application;

[0084] Figure 32 This is a partial schematic diagram of another display module provided in an embodiment of the present application;

[0085] Figure 33 is a schematic diagram of another circuit board provided in an embodiment of the present application;

[0086] Figure 34 This is a partial schematic diagram of another display module provided in an embodiment of the present application;

[0087] Figure 35 This is a partial schematic diagram of another display module provided in an embodiment of the present application;

[0088] Figure 36 is a schematic diagram of another circuit board provided in an embodiment of the present application;

[0089] Figure 37This is a partial schematic diagram of another display module provided in an embodiment of the present application;

[0090] Figure 38 This is a partial cross-sectional schematic diagram of a circuit board provided in an embodiment of the present application;

[0091] Figure 39 is a partial cross-sectional schematic diagram of another circuit board provided in an embodiment of the present application;

[0092] Figure 40 is a partial cross-sectional schematic diagram of a display module provided in an embodiment of the present application;

[0093] Figure 41 is a top view of a display panel provided in an embodiment of the present application;

[0094] Figure 42 is a partial cross-sectional schematic diagram of another display module provided in an embodiment of the present application;

[0095] Figure 43 This is a partial cross-sectional schematic diagram of another display module provided in an embodiment of the present application;

[0096] Figure 44 This is a schematic diagram of a display device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0097] In order to make the objectives, technical solutions and advantages of this application clearer, the implementation methods of this application will be further described in detail below with reference to the accompanying drawings.

[0098] Organic light-emitting diode (OLED) display technology has been widely used in small and medium-sized products (such as mobile phones and wearable devices). As people's requirements for display products become increasingly stringent, display modules with FMLOC structures are widely used.

[0099] In the process of lighting up the display panel in a display module, two important materials are the driver integrated circuit (DIC) and the flexible printed circuit (FPC). The driver chip, also known as the driver IC, can be purchased directly, while the flexible printed circuit needs to be designed according to the different needs of the product. Currently, flexible printed circuits need to be compatible with display modules with FMLOC structures. Simply put, the display module needs to realize both display and touch functions. The corresponding flexible printed circuit includes both display signals and touch signals. Since both display signals and touch signals are high-frequency signals, interference may occur.

[0100] Therefore, to reduce interference between display and touch signals while enabling the display module to simultaneously implement touch and display functions, the flexible printed circuit (FPC) included in the display module can be constructed with multiple conductive layers. In conventional designs, the display and touch traces in a flexible printed circuit board are distributed across different conductive layers, with a central conductive layer for grounding separating the display and touch traces to reduce interference between them. However, this design increases the number of conductive layers in the flexible printed circuit board, leading to increased manufacturing difficulty and cost. Consequently, existing flexible printed circuit boards with multiple conductive layers present technical challenges, such as high manufacturing difficulty and high cost.

[0101] At present, in order to reduce the difficulty and cost of manufacturing flexible circuit boards, the flexible circuit boards can include two conductive layers. Figure 1 The orthographic projections of the display and touch lines intersect in area A. However, in the two-layer conductive layer solution, the display and touch lines cannot be grounded through the conductive layer, which will cause mutual interference between the display and touch lines.

[0102] Specifically, refer to Figure 1 The flexible circuit board 00 includes a main board 01, multiple bonding pins 02 arranged on one side of the main board 01, a touch IC (TIC) 03 arranged on the main board 01, a connecting board 04 connected to the main board 01, and a connector 05 connected to the connecting board 04. Connector 05 extends from the side of the main board 01 relative to the main board 01. Connector 05 is used to connect to an external power supply component or terminal device, allowing the flexible circuit board to obtain signals from the outside to illuminate the display panel of the display module.

[0103] The connector can transmit display signals and touch signals, and the corresponding flexible circuit board includes display traces and touch traces connected to the connector (the touch traces connected to the connector will not interfere with the touch traces connected to the gold fingers, so they will not be described in detail below). In addition, the display traces connected to the connector need to be connected to the gold fingers located in the middle position among the multiple gold fingers. The gold fingers in the middle position can be bound and connected to the display panel to connect to the driver chip used to drive the display. In addition, the flexible circuit board also includes touch traces connected to the gold fingers located at both ends of the multiple gold fingers. The touch traces connected to the gold fingers at both ends need to be connected to the touch chip.

[0104] Figure 1In the figure, connector 05 extends from the left, and touch chip 03 is closer to the right end. Therefore, the touch trace connected by the gold finger on the left end will inevitably cross the orthographic projection of the display trace connected by connector 05 in the vertical direction ( Figure 1 A area in the ). Figure 2 In the figure, connector 05 extends from the bottom, and touch chip 03 is closer to the right end. Therefore, the touch trace connected by the gold finger on the left end will inevitably cross the orthographic projection of the display trace connected by connector 05 in the horizontal direction ( Figure 2 B area in the ).

[0105] That is, in Figure 1 and Figure 2 In this solution, if the flexible circuit board is configured with two conductive layers, it will be impossible to establish a ground connection between the display and touchscreen traces through the conductive layers. Therefore, to reduce interference between the display and touchscreen traces, the orthographic projections of the display and touchscreen traces must be perpendicularly intersected to minimize the intersection area. However, this design still cannot avoid interference between the display and touchscreen traces.

[0106] Figure 3 This is a schematic diagram of the structure of a circuit board provided in an embodiment of the present application. Figure 3 The circuit board 001 includes: a first board part 101, a gold finger part 102, a second board part 103, a touch chip 104, a touch line 105 and a display line 106.

[0107] refer to Figure 3 The gold finger portion 102 is located on one side of the first side 101a of the first board portion 101. The gold finger portion 102 includes a plurality of first touch gold fingers 1021, a plurality of display gold fingers 1022, and a plurality of second touch gold fingers 1023, spaced apart along the extending direction of the first side 101a. The plurality of display gold fingers 1022 are located between the plurality of first touch gold fingers 1021 and the plurality of second touch gold fingers 1023. The display gold fingers 1022 in the circuit board 001 are used to bind and connect to the binding area of ​​the display panel in the display module. The display gold fingers can be gold fingers used to transmit display signals. The first touch gold fingers 1021 and the second touch gold fingers 1023 can be collectively referred to as touch gold fingers. The touch gold fingers can be gold fingers used to transmit touch signals. The touch gold fingers in the circuit board 001 are used to bind and connect to the binding area of ​​the display panel in the display module.

[0108] The second plate portion 103 is located on a side of the gold finger portion 102 away from the first side edge 101 a. Alternatively, it can be understood that the first plate portion 101 and the second plate portion 103 are located on both sides of the gold finger portion 102 respectively.

[0109] The touch chip 104 is located on the first board portion 101, and the distance between the touch chip 104 and the plurality of second touch fingers 1023 is smaller than the distance between the touch chip 104 and the plurality of first touch fingers 1021. Figure 3 In the embodiment, the touch chip 104 can be arranged on the lower side of the plurality of second touch fingers 1023. The touch chip 104 is an electronic component that senses human-computer interaction behavior and realizes functions such as touch screen, gesture operation and handwriting input by sensing various signals such as human muscles, capacitive magnetic field and pressure.

[0110] The touch lines 105 are used to transmit touch signals. The touch lines 105 include a plurality of first-type touch lines 1051 and a plurality of second-type touch lines 1052 .

[0111] Multiple first-type touch traces 1051 are provided corresponding to the multiple first touch fingers 1021. One end of the first-type touch trace 1051 is connected to the first touch finger 1021, and the other end of the first-type touch trace 1051 extends from the side of the multiple display fingers 1022 away from the multiple first touch fingers 1021, into the first board portion 101, and is connected to the touch chip 104. The portion between the two ends of the first-type touch trace 1051 is located on the second board portion 103. In other words, the portion between the two ends of the first-type touch trace 1051 can be located on the side of the finger portion 102 away from the touch chip 104. The first-type touch trace 1051 can be routed on the second board portion 103, with only a small section of the trace provided on the first board portion 101 to connect to the touch chip 104.

[0112] A plurality of second touch lines 1052 are provided corresponding to a plurality of second touch fingers 1023. One end of the second touch line 1052 is connected to the second touch finger 1023, and the other end is connected to the touch chip 104. The second touch line 1052 is located on the first board portion 101.

[0113] Display traces 106 are located on the first board portion 101 and are connected to display gold fingers 1022. Display traces 106 are used to transmit display signals. Display signals typically include communication signals (high-frequency signals), power signals, and other signals such as digital and analog signals.

[0114] In the embodiment of the present application, since the touch chip 104 and the second touch fingers 1023 are relatively close, even if the second-type touch traces 1052 are disposed on the first board portion 101, the wiring length of the second-type touch traces 1052 on the first board portion 101 will not be too long, and the wiring of the display traces 106 will not be significantly affected. Therefore, by designing the wiring of the display traces 106, the orthographic projection of the second-type touch traces 1052 on the first board portion 101 can be prevented from overlapping with the orthographic projection of the display traces 106 on the first board portion 101.

[0115] Furthermore, since the touch chip 104 and the first touch fingers 1021 are relatively far apart, if the first-type touch traces 1051 were directly arranged on the first board portion 101, the wiring length of the first-type touch traces 1051 on the first board portion 101 would be too long, thereby increasing the likelihood of the orthographic projections of the first-type touch traces 1051 overlapping with the display traces 106. Therefore, in the embodiment of the present application, the first-type touch traces 1051 are routed from the second board portion 103 around to a side of the multiple display fingers 1022 away from the multiple first touch fingers 1023 before extending back into the first board portion 101. This reduces the wiring length of the first-type touch traces 1051 on the first board portion 101, and further, through the wiring design of the display traces 106, avoids the orthographic projections of the first-type touch traces 1051 overlapping with the display traces 106.

[0116] In the embodiment of the present application, the wiring design of the first type of touch trace 1051 is implemented by additionally providing the second board portion 103, which can reduce the wiring length of the first type of touch trace 1051 on the first board portion 101. Furthermore, the wiring length of the second type of touch trace 1052 on the first board portion 101 is already relatively short. Thus, the wiring length of the touch trace 105 on the first board portion 101 can be reduced, and the wiring design of the display trace 106 can further prevent the orthographic projections of the touch trace 105 and the display trace 106 from overlapping. That is, the orthographic projection of the display trace 106 on the first board portion 101 and the orthographic projection of the touch trace 105 on the first board portion 101 do not overlap. The wiring length of the touch trace 105 on the first board portion 101 can refer to the path length of the portion of the touch trace 105 located on the first board portion 101.

[0117] Optionally, because the orthographic projection of the display trace 106 on the first board portion 101 and the orthographic projection of the touch trace 105 on the first board portion 101 do not overlap, even if the circuit board includes two conductive layers, interference between the display signal transmitted by the display trace 106 and the touch signal transmitted by the touch trace 105 can be avoided, thereby improving the yield of the display module. Furthermore, the circuit board including two conductive layers can reduce the number of conductive layers included in the circuit board, thereby reducing the cost.

[0118] In summary, embodiments of the present application provide a circuit board comprising a first board portion, a gold finger portion, a second board portion, a touch chip, touch traces, and display traces. Because the first touch finger and the touch chip are relatively far apart, a first type of touch trace among the touch traces is routed from the second board portion to the side of the display finger away from the first touch finger before extending back into the first board portion. This reduces the routing length of the first type of touch trace on the first board portion. Furthermore, because the second touch finger and the touch chip are relatively far apart, the routing length of the second type of touch trace among the touch traces on the first board portion is not excessive. In other words, the routing length of the touch trace on the first board portion is relatively short. Furthermore, the routing design of the display trace can prevent overlap of the orthographic projections of the touch trace and the display trace, thereby preventing interference between the display signal transmitted in the display trace and the touch signal transmitted in the touch trace, thereby improving the yield of the display module.

[0119] In the embodiment of the present application, touch signals may include transmission (TX) signals and reception (RX) signals. Accordingly, the traces in the touch traces 105 that transmit TX signals may be referred to as TX traces, and the traces in the touch traces 105 that transmit RX signals may be referred to as RX traces. The TX traces may be the transmitter, used to send information or data, while the RX traces may be used to receive information and data from the transmitter.

[0120] Optionally, each of the first-type touch traces 1051 and the second-type touch traces 1052 may include a TX trace and an RX trace. For example, a portion of the plurality of first-type touch traces 1051 may be TX traces, while another portion of the first-type touch traces 1051 may be RX traces. A portion of the plurality of second-type touch traces 1052 may be TX traces, while another portion of the second-type touch traces 1052 may be RX traces.

[0121] Optionally, each first-type touch trace 1051 can extend directly into the first board portion 101 from the gap between adjacent second touch fingers 1023 in the area where the second touch fingers 1023 are located. Alternatively, each first-type touch trace 1051 can extend directly into the first board portion 101 from the side of the second touch fingers 1023 away from the display finger. Alternatively, the finger portion 102 can further include multiple third touch fingers (not shown), each of which is located between adjacent second touch fingers 1023 (for example, multiple third touch fingers and multiple second touch fingers 1023 can be arranged in an interlaced manner) or on the side of the second touch fingers 1023 away from the display finger 1022. In this case, each first-type touch trace 1051 can be connected to a third touch finger before extending into the first board portion 101.

[0122] In the examples of this application, refer to Figure 3 One end of the second board portion 103 is connected to the first region Q1 of the gold finger portion 102, and the other end of the second board portion 103 is connected to the second region Q2 of the gold finger portion 102. A first hollow region L1 is defined between the portion between the two ends of the second board portion 103 and the gold finger portion 102. The first region Q1 is the region where at least some of the first touch gold fingers 1021 are located, and the second region Q2 is the region where at least some of the second touch gold fingers 1023 are located. The first hollow region L1 defined between the portion between the two ends of the second board portion 103 and the gold finger portion 102 can include the following two situations.

[0123] As a possible scenario, refer to Figure 4 After the circuit board 001 is bonded to the display panel 002 to form the display module 1000, the driver chip 003 connected to the display panel 002 can be located on the side of the second board portion 103 away from the first board portion 101. In this case, the presence of the first hollow area L1 between the ends of the second board portion 103 and the gold finger portion 102 can prevent the first type of touch traces 1051 on the second board portion 103 from affecting the gold fingers on the gold finger portion 102.

[0124] As another possible scenario, refer to Figure 5 After the circuit board 001 is bonded to the display panel 002 to form the display module 1000, the driver chip 003 connected to the display panel 002 can be located within the first hollow area L1. Alternatively, the first hollow area L1 can be understood as a hollow area that avoids the driver chip 003. In this case, the second board portion 103 is located on the side of the driver chip 003 away from the first board portion 101.

[0125] In the examples of this application, refer to Figure 6 The second plate portion 103 also has a second hollow area L2. Because the second plate portion 103 is provided with the second hollow area L2, the plurality of first-type touch traces 1051 need to avoid the second hollow area L2 when being routed on the second plate portion 103. Optionally, the portion between the ends of a portion of the plurality of first-type touch traces 1051 is located on the first portion 1031 of the second plate portion 103, which is close to the first plate portion 101, in the second hollow area L2. The portion between the ends of another portion of the plurality of first-type touch traces 1051 is located on the second portion 1032 of the second plate portion 103, which is far away from the first plate portion 101, in the second hollow area L2.

[0126] refer to Figure 7 After the circuit board 001 is bonded to the display panel 002 to form the display module 1000, the driver chip 003 connected to the display panel 002 can be located within the second hollow area L2. In this case, a first hollow area L1 can also be defined between the two ends of the second board portion 103 and the gold finger portion 102. The presence of the first hollow area L1 prevents the first type of touch traces 1051 on the second board portion 103 from interfering with the gold fingers on the gold finger portion 102.

[0127] Optionally, the second hollow area L2 in the second plate portion 103 is farther away from the first plate portion 101 than the first hollow area L1 , and the hollow area of ​​the second hollow area L2 in the second plate portion 103 is larger than that of the first hollow area L1 .

[0128] In the examples of this application, refer to Figures 3 to 7 Circuit board 001 further includes a connecting board portion 107 and a connector 108. Connecting board portion 107 is connected to first board portion 101, and display trace 106 is also located on connecting board portion 107. Connector 108 is located on a side of connecting board portion 107 away from first board portion 101 and is connected to display trace 106. Connector 108 is also used to connect to the power supply component of the display device.

[0129] Optionally, the connecting plate portion 107 may be connected to the second side 101b of the first plate portion 101. The second side 101b and the first side 101a may be two different sides of the first plate portion 101. For example, Figures 3 to 7 The second side 101b and the first side 101a may be two adjacent side edges, or the second side 101b may be a side edge in the first plate portion 101 corresponding to the first side edge 101a.

[0130] Optional, reference Figures 3 to 7 ,as well as Figures 8 to 12 The first plate portion 101 has four sides, and the four sides roughly form a rectangular shape. Figures 3 to 7 In the embodiment, the first side 101a may be the upper side of the first plate portion 101, and the second side 101b may be the left side of the first plate portion 101. Alternatively, referring to Figures 8 to 12 , the first side 101a can be the upper side of the first plate portion 101, and the second side 101b can be the lower side of the first plate portion 101. Alternatively, the first side 101a can be the upper side of the first plate portion 101, and the second side 101b can be the right side of the first plate portion 101. Of course, the first plate portion 101 can also have other shapes, and the embodiment of the present application does not specifically limit the shape of the first plate portion 101.

[0131] Alternatively, refer to Figures 13 to 17 The first plate portion 101 has a third hollow area L3, the connecting plate portion 107 and the connector 108 are both located in the third hollow area L3, and the connecting plate portion 107 is connected to the side of the third hollow area L3. Optionally, the third hollow area L3 has four sides. Figures 13 to 17 In the embodiment, the connecting plate portion 107 can be connected to the upper side of the third hollow area L3.

[0132] Optionally, the shape of the third hollow area L3 is substantially rectangular. Alternatively, the third hollow area L3 can be any shape that satisfies the wiring requirements. The embodiment of the present application does not impose any specific limitation on the shape of the third hollow area L3.

[0133] In the embodiment of the present application, the first board portion 101 of the circuit board may include other functional hollow areas, and the shape of each hollow area may be square, circular, rectangular or irregular, etc. For example Figures 3 to 7 The first board portion 101 of the middle circuit board 001 may include two hollow areas ( L4 and L5 ).

[0134] Optionally, the connecting plate portion 107 can be called the long neck portion of the circuit board, and the long neck portion can extend from any position of the first plate portion 101 and be connected to the first plate portion 101. Figures 8 to 12 The middle connecting plate portion 107 may extend from the middle portion of the lower side of the first plate portion 101. Or Figures 18 to 22 The middle connecting plate portion 107 can extend from the left end of the lower side of the first plate portion 101. The connection position of the connecting plate portion 107 and the first plate portion 101, and the length of the connecting plate portion 107 along the extending direction can be determined according to the specific product project.

[0135] In the examples of this application, refer to Figures 3 to 22 , the shape of the orthographic projection of the connecting plate portion 107 on the reference plane is a rectangle. Or, Figures 23 to 32 , the shape of the orthographic projection of the connecting plate portion 107 on the reference plane is L-shaped. Alternatively, Figures 33 to 37 The orthographic projection of the connecting plate portion 107 on the reference plane is curved. The present embodiment does not impose any specific restrictions on the shape of the connecting plate portion 107; it is sufficient to ensure that the connecting plate portion 107 can accommodate the display trace 106 connected to the connector 108. The reference plane is parallel to the surface of the connecting plate portion 107 on which the display trace 106 is disposed.

[0136] Optionally, when the orthographic projection of the connecting plate portion 107 on the reference plane is L-shaped, the L-shape may be an L-shape bent to the left (eg Figures 23 to 27 ), or an L-shaped shape that bends to the right (such as Figures 28 to 32 ).

[0137] In this embodiment of the present application, connector 108 has a power interface that can provide power signals to circuit board 100 and a MIPI (Mobile Industry Processor Interface) interface that provides MIPI signals. Accordingly, some of the display traces connected to connector 108 can be used to transmit power signals, and some can be used to transmit MIPI signals.

[0138] Among them, the power supply component in the display device can transmit the power signal to the circuit board 100 through the power interface. The purpose of MIPI is to standardize the interface camera, display interface and radio frequency / interface inside the electronic device (such as the display device), thereby reducing the complexity of electronic device design and increasing design flexibility. The benefit of standardization is that electronic device manufacturers can flexibly and uniformly select different chips and modules from the market as needed, making it faster and more convenient to change the design and function. Among them, MIPI signals are high-frequency signals.

[0139] Figure 38 : is a cross-sectional schematic diagram of a circuit board provided in an embodiment of the present application. Figure 38 The first board portion 101 includes a first shielding layer m1, a first insulating layer m2, a first conductive layer m3, a second insulating layer m4, a second conductive layer m5, a third insulating layer m6 and a second shielding layer m7 stacked in sequence.

[0140] The first shielding layer m1 and the second shielding layer m7 may be electromagnetic interference (EMI) layers for shielding electromagnetic signals. The first insulating layer m2 is used to protect the first conductive layer m3. The second insulating layer m4 is used to insulate the first conductive layer m3 from the second conductive layer m5. The third insulating layer m6 is used to protect the second conductive layer m5.

[0141] from Figure 38 As can be seen, the first board portion 101 can be designed with a double conductive layer, or the circuit board 001 can be understood as having a double conductive layer design. Optionally, the touch traces 105 can be located on the first conductive layer m3, and the display traces 106 can be located on the second conductive layer m5. In other words, the touch traces 105 and the display traces 106 can be located on different conductive layers within the first board portion 101.

[0142] Optionally, the circuit board 001 further includes a ground portion located in the first conductive layer m3 and the second conductive layer m5. The ground portion can be used to receive a ground (GND) signal. Ground portions can be located in all areas of the first conductive layer m3 and the second conductive layer m5, except for areas where traces are located. For example, the ground portion located in the first conductive layer m3 is spaced apart from the touch trace 105, while the ground portion located in the second conductive layer m5 is spaced apart from the display trace 106.

[0143] In an embodiment of the present application, in order to achieve a better grounding effect for the circuit board 001, the following two methods can be adopted. Option 1: The grounding portion located in the first conductive layer m3 is connected to the first shielding layer m1 through the via of the first insulating layer m2, and the grounding portion located in the second conductive layer m5 is connected to the second shielding layer m7 through the via of the third insulating layer m6. Option 2: The first insulating layer m2 and the first shielding layer m1 above the grounding portion of the first conductive layer m3 are hollowed out, so that the grounding portion located in the first conductive layer m3 is exposed; the second insulating layer m4 and the second shielding layer m7 above the grounding portion of the second conductive layer m5 are hollowed out, so that the grounding portion located in the second conductive layer m5 is exposed. After the module process, a cover film (cover type) can be attached to the circuit board 001, and the cover film can be in contact and connected with the grounding portion.

[0144] In the embodiment of the present application, the first touch traces 1051 are led out from the first touch finger 1021 and then the first touch traces 1051 and the second touch traces 1052 are brought together on the same side of the display finger 1022 through the second board portion 103. In this way, the first touch traces 1051 and the second touch traces 1052 can be led together from the side of the display finger 1022 away from the first touch finger 1021 and connected to the touch chip 104. Figures 3 to 37 and related technologies Figure 1 In contrast, Figure 1 The touch line position needs to be set in the original Figures 3 to 37 In the solution, there is no need to set the touch line 105 (area C in the figure). Therefore, a grounding portion can be set in this area, and the grounding portion can be connected to the shielding layer to improve the electromagnetic shielding effect of the shielding layer in the circuit board.

[0145] exist Figures 3 to 12 as well as Figures 18 to 37 In the solution shown, since the first type of touch traces 1051 are wired on the second board portion 103, the size of the first board portion 101 can be reduced (where Figures 3 to 12 as well as Figures 18 to 37 The dotted line in the middle and lower sides is used to represent the size of the circuit board according to conventional design), that is, the area of ​​the main body of the circuit board is reduced, which is beneficial to the design of the module and the whole machine.

[0146] refer to Figure 38 The second board portion 103 may include a third shielding layer m8, a fourth insulating layer m9, a third conductive layer m10, a fifth insulating layer m11, and a fourth shielding layer m12. In other words, the second board portion 103 may include a single conductive layer. The gold finger portion 102 may include a fourth conductive layer m13 and a sixth insulating layer m14.

[0147] The first-type touch traces 1051 are also located in the third conductive layer m10. That is, the TX traces and RX traces included in the first-type touch traces 1051 are both located in the third conductive layer m10. The first touch gold finger 1021, multiple display gold fingers 1022, and multiple second touch gold fingers 1023 are all located in the fourth conductive layer m13.

[0148] Optionally, the first shielding layer m1 and the third shielding layer m8 are located on the same layer. The first insulating layer m2 and the fourth insulating layer m9 are located on the same layer. The first conductive layer m3, the fourth conductive layer m13, and the third conductive layer m10 are located on the same layer. The first insulating layer m2, the sixth insulating layer m14, and the fifth insulating layer m11 are located on the same layer. The second shielding layer m7 and the fourth shielding layer m12 are located on the same layer. "Located on the same layer" may mean being made of the same material and manufactured using a single process.

[0149] Figure 39 This is a cross-sectional schematic diagram of another circuit board provided in an embodiment of the present application. Figure 39 The second board portion 103 further includes a fifth conductive layer m15 and a seventh insulating layer m16 located between the fifth insulating layer m11 and the fourth shielding layer m12. The fifth conductive layer m15 and the second conductive layer m5 are located on the same layer. In other words, the second board portion 103 may include two conductive layers.

[0150] Optionally, when the second plate portion 103 includes two conductive layers, the first shielding layer m1 and the third shielding layer m8 are located on the same layer. The first insulating layer m2 and the fourth insulating layer m9 are located on the same layer. The first conductive layer m3, the fourth conductive layer m13, and the third conductive layer m10 are located on the same layer. The first insulating layer m2, the sixth insulating layer m14, and the fifth insulating layer m11 are located on the same layer. The second conductive layer m5 and the fifth conductive layer m15 are located on the same layer. The third insulating layer m6 and the seventh insulating layer m16 are located on the same layer. The second shielding layer m7 and the fourth shielding layer m12 are located on the same layer. "Located on the same layer" may mean being made of the same material and being prepared by a single process.

[0151] Optionally, when the second board portion 103 includes two conductive layers, the TX traces and RX traces included in the first type of touch traces 1051 may be located in the same conductive layer of the second board portion 103 or in different conductive layers.

[0152] For example, the TX and RX traces included in the first-type touch trace 1051 can both be arranged in the third conductive layer m10, and the fifth conductive layer m15 can be used to provide a ground portion. Alternatively, the TX and RX traces included in the first-type touch trace 1051 can be located in different conductive layers, and the orthographic projections of the TX and RX traces can be non-overlapping. For example, if the TX trace is located in the third conductive layer m10 and the RX trace is located in the fifth conductive layer m15, then the location in the fifth conductive layer m15 that overlaps with the TX trace is the ground portion, and the location in the third conductive layer m10 that overlaps with the RX trace is the ground portion.

[0153] In the embodiments of this application, Figure 38 The second board portion 103 of the circuit board shown has a conductive layer. Figure 39 The second board portion 103 of the circuit board shown has two conductive layers. In fact, when designing the second board portion 103, either one conductive layer or two conductive layers can be used, and the specific choice can be made according to the actual situation of different products.

[0154] for Figure 38 and Figure 39 In the circuit board shown, there is no insulating layer on the lower side of the fourth conductive layer m13 in the circuit board 001, so the lower side of the gold fingers (first touch gold finger 1021, multiple display gold fingers 1022 and multiple second touch gold fingers 1023) in the circuit board 001 can be bound and connected to the display panel binding area 002b2 included in the display module.

[0155] In an embodiment of the present application, the shielding layers included in the circuit board 001 can be an electromagnetic shielding film (a kind of electronic material film), which blocks or attenuates the propagation of electromagnetic energy between the shielded area and the outside world through a shielding body made of special materials. It can limit electromagnetic waves to a certain range, suppress or attenuate its electromagnetic radiation, and thus effectively block electromagnetic interference.

[0156] Optionally, the material of each conductive layer included in the circuit board 001 may include copper (Cu). Accordingly, the material of each trace located in the conductive layer may include copper.

[0157] Optionally, the material of the second insulating layer m4 located between the first conductive layer m3 and the second conductive layer m5 may include polyimide (PI). PI is a high-temperature resistant organic polymer material with good flexibility. Therefore, PI is typically provided between conductive layers to achieve conductive layer insulation. For a film layer in the circuit board that is located on the same layer as the second insulating layer m4, its material may also be PI.

[0158] Optionally, the first insulating layer m2 located on the side of the first conductive layer m3 away from the second conductive layer m5, and the third insulating layer m6 located on the side of the second conductive layer m5 away from the first conductive layer m3, may be a coverlay. The coverlay may be made of a combination of an insulating material and an adhesive, primarily to protect the circuits in the circuit board from short circuits and to act as a solder resist. The film layer in the circuit board 001 that is located on the same layer as the first insulating layer m2 and the third insulating layer m6 may also be a coverlay.

[0159] In the embodiment of the present application, by providing a second board portion 103 in the circuit board 001 (the second board portion 103 and the driver chip are located on the same side of the gold finger portion 102), the area of ​​the circuit board 001 is increased to allow for the extraction of the first-type touch traces 1051 (i.e., the first-type touch traces 1051 are independently extracted through the second board portion 103), thereby preventing the touch traces 105 and the display traces 106 from intersecting with each other. Therefore, when the circuit board 001 is a double-layer conductive circuit board, mutual interference between the touch signals transmitted by the touch traces 105 and the display signals transmitted by the display traces 106 is avoided, thereby reducing interference issues on the circuit board 001 and improving the signal quality of the circuit board 001.

[0160] In the embodiment of the present application, the circuit board 001 may be a flexible printed circuit board (FPC). The first board portion 101 of the circuit board 001 may also be provided with devices with other functions, such as Figures 3 to 37 Small rectangles are used to represent other devices, which may include at least one of a resistor, a capacitor, and a diode.

[0161] In summary, embodiments of the present application provide a circuit board comprising a first board portion, a gold finger portion, a second board portion, a touch chip, touch traces, and display traces. Because the first touch finger and the touch chip are relatively far apart, a first type of touch trace among the touch traces is routed from the second board portion to the side of the display finger away from the first touch finger before extending back into the first board portion. This reduces the routing length of the first type of touch trace on the first board portion. Furthermore, because the second touch finger and the touch chip are relatively far apart, the routing length of the second type of touch trace among the touch traces on the first board portion is not excessive. In other words, the routing length of the touch trace on the first board portion is relatively short. Furthermore, the routing design of the display trace can prevent overlap of the orthographic projections of the touch trace and the display trace, thereby preventing interference between the display signal transmitted in the display trace and the touch signal transmitted in the touch trace, thereby improving the yield of the display module.

[0162] Figure 40 This is a partial cross-sectional diagram of a display module provided by an embodiment of the present application. Figure 40 The display module 1000 includes: a display panel 002, a driving chip 003 and a circuit board 001 as described in the above embodiment. Figure 41 : is a top view of a display panel provided in an embodiment of the present application. Figure 41 The display panel 002 has a display area 200a and a peripheral area 200b surrounding the display area 200a. The peripheral area 200b includes a bending area 002b1 (bending) and a bonding area 002b2 (bonding). The bending area 002b1 is closer to the display area 200a than the bonding area 002b2.

[0163] Combine Figure 40 and Figure 41 The driver chip 003 is located between the bending area 002b1 and the binding area 002b2 and is connected to the display panel 002. The driver chip 003 can be used to drive the display panel 002 to realize display.

[0164] The gold finger portion 102 of the circuit board 001 is connected to the binding area 002b2 of the display panel 002. The first board portion 101 of the circuit board 001 is further away from the bending area 002b1 than the second board portion 103. That is, after the gold finger portion 102 of the circuit board 001 is connected to the binding area 002b2 of the display panel 002, the second board portion 103 of the circuit board 001 and the display panel can overlap in projection, while the first board portion 101 of the circuit board 001 and the display panel 002 do not need to overlap in projection.

[0165] In summary, embodiments of the present application provide a display module comprising a circuit board including a first board portion, a gold finger portion, a second board portion, a touch chip, touch traces, and display traces. Because the first touch finger and the touch chip are relatively far apart, a first type of touch trace among the touch traces is routed from the second board portion to a side of the display finger away from the first touch finger before extending back into the first board portion. This reduces the routing length of the first type of touch trace on the first board portion. Furthermore, because the second touch finger and the touch chip are relatively far apart, the routing length of the second type of touch trace on the first board portion is not excessive. In other words, the routing length of the touch trace on the first board portion is relatively short. Furthermore, the routing design of the display traces can prevent overlap of the orthographic projections of the touch traces and the display traces, thereby preventing interference between display signals transmitted in the display traces and touch signals transmitted in the touch traces, thereby improving the yield of the display module.

[0166] refer to Figure 4 , Figure 9 , Figure 14 , Figure 19 , Figure 24 , Figure 29 , Figure 34 And reference Figure 40 The driver chip 003 can be located on the side of the second board portion 103 of the circuit board 001 away from the gold finger portion 102. In this case, the first hollow area L1 may or may not be present between the second board portion 103 and the first board portion 101 of the circuit board 001, and this is not specifically limited in this embodiment of the application.

[0167] In the embodiment of the present application, since the second board portion 103 of the circuit board 001 and the display panel 002 overlap in projection, collision may occur between the second board portion 103 of the circuit board 001 and the display panel 002. Furthermore, since the driver chip 003 is located on the side of the second board portion 103 away from the gold finger portion 102, collision may also occur between the driver chip 003 and the side of the second board portion 103 away from the gold finger portion 102. Therefore, a certain safety distance must be maintained between the driver chip 003 and the second board portion 103.

[0168] Optionally, in order to further improve the collision of the second plate portion 103, the display panel 002 and the driver chip 100, refer to Figure 40The display module 1000 further includes a first buffer portion 004 (also referred to as a type film). The first buffer portion 004 is located on the side of the second plate portion 103 near the driver chip and between the second plate portion 103 and the display panel. The first buffer portion 004 cushions collisions between the second plate portion 103 and the display panel 002, as well as between the second plate portion 103 and the driver chip 003. This prevents the design of the second plate portion 103 from affecting the driver chip 003 and the display panel 002, thereby ensuring the yield of the second plate portion 103, the driver chip 003, and the display panel 002.

[0169] Figure 42 This is a partial cross-sectional diagram of another display module provided by an embodiment of the present application. Figure 5 , Figure 10 , Figure 15 , Figure 20 , Figure 25 , Figure 30 , Figure 35 as well as Figure 42 The orthographic projection of the driver chip 003 on the display panel 002 is located within the orthographic projection of the first hollow area L1 between the second board portion 103 and the first board portion 101 of the circuit board 001. Alternatively, the driver chip 003 can be understood as being located within the first hollow area L1. In this case, the driver chip 003 can be located on the side of the second board portion 103 closest to the gold finger portion 102.

[0170] In the embodiment of the present application, since the second body portion 103 of the circuit board 001 and the display panel 002 overlap in projection, there is a possibility of collision between the second body portion 103 of the circuit board 001 and the display panel 002. Furthermore, since the driver chip 003 is located within the first hollow area L1, there is a possibility of collision between the driver chip 003 and the side of the first hollow area L1. Therefore, a certain safety distance needs to be maintained between the driver chip 003 and the second body portion 103.

[0171] Optionally, in order to further improve the collision of the second plate portion 103, the display panel 002 and the driver chip 003, refer to Figure 42The display module 1000 further includes a second buffer portion 005 (also referred to as a type film). The second buffer portion 005 is located on the side of the first hollowed-out area L1 and between the second plate portion 103 and the display panel 002. The second buffer portion 005 cushions collisions between the second plate portion 103 and the display panel 002, as well as between the second plate portion 103 and the driver chip 003. This prevents the design of the second plate portion 103 from affecting the driver chip 003 and the display panel 002, thereby ensuring the yield of the second plate portion 103, the driver chip 003, and the display panel 002.

[0172] Figure 43 This is a partial cross-sectional diagram of another display module provided by an embodiment of the present application. Figure 7 , Figure 12 , Figure 17 , Figure 22 , Figure 27 , Figure 32 , Figure 37 as well as Figure 43 The orthographic projection of the driver chip 003 on the display panel 002 is located within the orthographic projection of the second hollowed-out area L2 of the second body portion 103 of the circuit board 001 on the display panel 002. Alternatively, the driver chip 003 can be understood as being located within the second hollowed-out area L2. In this case, a portion of the second body portion 103 is located on the side of the driver chip 003 closest to the gold finger portion 102, while another portion is located on the side of the driver chip 003 farther from the gold finger portion 102.

[0173] In the embodiment of the present application, since the second body portion 103 of the circuit board 001 and the display panel 002 overlap in projection, the second body portion 103 of the circuit board 001 and the display panel 002 may collide with each other. Furthermore, since the driver chip 003 is located within the second hollow area L2, the driver chip 003 and the side edges of the second hollow area L2 may also collide with each other, thereby requiring a certain safety distance to be maintained between the driver chip 003 and the second body portion 103.

[0174] Optionally, in order to further improve the collision of the second plate portion 103, the display panel 002 and the driver chip 003, refer to Figure 43The display module 1000 further includes a third buffer portion 006 (also referred to as a type film). The third buffer portion 006 is located on the side of the first hollowed-out area L1 and between the second plate portion 103 and the display panel 002. The third buffer portion 006 cushions collisions between the second plate portion 103 and the display panel 002, as well as between the second plate portion 103 and the driver chip 003. This prevents the design of the second plate portion 103 from affecting the driver chip 003 and the display panel 002, thereby ensuring the yield of the second plate portion 103, the driver chip 003, and the display panel 002.

[0175] refer to Figure 40 , Figure 42 and Figure 43 It can be seen that the display module 1000 further includes: a cover plate 007 , a glue layer 008 , a polarizer (POL) layer 009 , a panel bottom film (U-film) 010 , a heat dissipation film 011 , a gasket 012 and a bending protection layer 013 .

[0176] Optionally, the cover plate 007 may be a glass cover plate (CG) 007, the material of the adhesive layer 008 may be an optical adhesive (OC), the panel base film 010 (also referred to as the panel back film) is used to protect the back side of the display panel 022, and the panel base film 010 is bonded to the back side of the display panel 002 during the cutting process (EAC). The main function of the heat dissipation film 011 (surface conductive film, SCF) is to dissipate heat. The spacer 012 (spacer) can be coated between the panel base film 010 on the binding area of ​​the display panel 002 and the heat dissipation film 011 in the display area of ​​the display panel 002 to protect the display panel and to adjust the bending stress of the bending area 002b1 of the display panel 002. The bending protection layer 013 can be located in the bending area 002b1 of the display panel 002 to protect the bending area 002b1 and ensure the bending reliability of the bending area 022b.

[0177] Optional, reference Figure 40 , Figure 42 and Figure 43 It can be seen that the gold finger portion 102 of the circuit board 001 can be bonded and connected to the bonding area 002 b 2 of the display panel 002 via anisotropic conductive film (ACF) 014 .

[0178] In summary, embodiments of the present application provide a display module comprising a circuit board including a first board portion, a gold finger portion, a second board portion, a touch chip, touch traces, and display traces. Because the first touch finger and the touch chip are relatively far apart, a first type of touch trace among the touch traces is routed from the second board portion to a side of the display finger away from the first touch finger before extending back into the first board portion. This reduces the routing length of the first type of touch trace on the first board portion. Furthermore, because the second touch finger and the touch chip are relatively far apart, the routing length of the second type of touch trace on the first board portion is not excessive. In other words, the routing length of the touch trace on the first board portion is relatively short. Furthermore, the routing design of the display traces can prevent overlap of the orthographic projections of the touch traces and the display traces, thereby preventing interference between display signals transmitted in the display traces and touch signals transmitted in the touch traces, thereby improving the yield of the display module.

[0179] Figure 44 Schematic diagram of a display device provided by an embodiment of the present application. Figure 44 The display device includes a power supply component 2000 and the display module 1000 provided in the above embodiment. The power supply component 2000 is connected to the display module 1000 to supply power to the display module 1000.

[0180] Optionally, the display device may be an organic light-emitting diode (OLED) display device. The display device may be any suitable display device, including but not limited to mobile phones, tablet computers, televisions, monitors, laptop computers, digital photo frames, car navigation systems, e-books, and any other product or component with a display function.

[0181] Since the display device can have substantially the same technical effects as the circuit board described in the previous embodiment, the technical effects of the circuit board will not be repeatedly described here for the purpose of brevity.

[0182] The terms used in the embodiments of this application are only used to explain the embodiments of this application and are not intended to limit this application. Unless otherwise defined, the technical terms or scientific terms used in the embodiments of this application should have the common meaning understood by people with ordinary skills in the field to which this application belongs.

[0183] The terms used in the embodiments of this application are intended solely to illustrate the embodiments of this application and are not intended to limit this application. Unless otherwise defined, technical or scientific terms used in the embodiments of this application should have the same ordinary meaning as those understood by persons of ordinary skill in the art to which this application belongs. The terms "first," "second," "third," and similar terms used in this patent specification and claims do not denote any order, quantity, or importance, but are simply used to distinguish between different components. Similarly, terms such as "a" or "an" do not denote a limitation of quantity, but rather denote the presence of at least one. Terms such as "include" or "comprising" and similar terms mean that the elements or objects listed before "include" or "comprising" include the elements or objects listed after "include" or "comprising," and their equivalents, and do not exclude other elements or objects. Terms such as "connected" or "connected" are not limited to physical or mechanical connections but may include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used solely to indicate relative positions. When the absolute position of the described objects changes, the relative positions may also change accordingly.

[0184] The above description is merely an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A circuit board, characterized in that: The circuit board comprises: a first plate portion; a gold finger portion, the gold finger portion being located on one side of the first side edge of the first plate portion, the gold finger portion comprising a plurality of first touch gold fingers, a plurality of display gold fingers, and a plurality of second touch gold fingers spaced apart along an extending direction of the first side edge, the plurality of display gold fingers being located between the plurality of first touch gold fingers and the plurality of second touch gold fingers; a second plate portion, the second plate portion being located on a side of the gold finger portion away from the first side edge; A touch chip, wherein the touch chip is located on the first plate portion, and a distance between the touch chip and the plurality of second touch fingers is smaller than a distance between the touch chip and the plurality of first touch fingers; Touch traces, the touch traces comprising a plurality of first-type touch traces arranged corresponding to the plurality of first touch gold fingers, and a plurality of second-type touch traces arranged corresponding to the plurality of second touch gold fingers; one end of the first-type touch trace is connected to the first touch gold finger, the other end of the first-type touch trace extends from a side of the plurality of display gold fingers away from the plurality of first touch gold fingers to the first board portion and is connected to the touch chip, and a portion between the two ends of the first-type touch trace is located on the second board portion; one end of the second-type touch trace is connected to the second touch gold finger, and the other end is connected to the touch chip, and the second-type touch trace is located on the first board portion; and a display wiring, wherein the display wiring is located on the first board portion and is connected to the display gold finger; The orthographic projection of the display wiring on the first board portion and the orthographic projection of the touch wiring on the first board portion do not overlap.

2. The circuit board according to claim 1, wherein: One end of the second plate portion is connected to the first area of ​​the gold finger portion, the other end of the second plate portion is connected to the second area of ​​the gold finger portion, and a first hollow area is defined between the portion between the two ends of the second plate portion and the gold finger portion; The first area is an area where at least a portion of the first touch golden finger is located, and the second area is an area where at least a portion of the second touch golden finger is located.

3. The circuit board according to claim 1, wherein: The second plate portion further has a second hollow area; A portion of the first-type touch lines among the plurality of first-type touch lines is located between two ends on a first portion of the second hollow area of ​​the second plate portion close to the first plate portion; A portion between two ends of another portion of the plurality of first-type touch traces is located on a second portion of the second hollow area of ​​the second plate portion away from the first plate portion.

4. The circuit board according to any one of claims 1 to 3, characterized in that: The circuit board also includes: A connecting plate portion, the connecting plate portion being connected to the first plate portion, and the display wiring being further located on the connecting plate portion; and a connector, wherein the connector is located on a side of the connecting plate portion away from the first plate portion, and the connector is connected to the display wiring, and the connector is also used to connect the power supply component of the display module.

5. The circuit board according to claim 4, characterized in that The connecting plate portion is connected to the second side of the first plate portion, and the second side and the first side are two different sides of the first plate portion; or The first plate portion has a third hollow area, the connecting plate portion and the connector are both located in the third hollow area, and the connecting plate portion is connected to a side edge of the third hollow area.

6. The circuit board according to claim 4, wherein: The shape of the orthographic projection of the connecting plate portion on the reference plane is a rectangle, an L-shape, or a curved shape; The reference plane is parallel to the surface of the connecting plate body on which the display wiring is arranged.

7. The circuit board according to any one of claims 1 to 3, characterized in that: The first plate portion includes a first shielding layer, a first insulating layer, a first conductive layer, a second insulating layer, a second conductive layer, a third insulating layer and a second shielding layer stacked in sequence; The touch wiring is located in the first conductive layer, and the display wiring is located in the second conductive layer; The circuit board further includes a grounding portion located in the first conductive layer and the second conductive layer. The grounding portion located in the first conductive layer and the touch wiring are spaced apart, and the grounding portion located in the second conductive layer and the display wiring are spaced apart.

8. The circuit board according to claim 7, wherein: The grounding portion located on the first conductive layer is connected to the first shielding layer through the via hole of the first insulating layer, and the grounding portion located on the second conductive layer is connected to the second shielding layer through the via hole of the third insulating layer.

9. The circuit board according to claim 7, wherein: The second plate portion includes a third shielding layer, a fourth insulating layer, a third conductive layer, a fifth insulating layer and a fourth shielding layer; the gold finger portion includes a fourth conductive layer and a sixth insulating layer; The first type of touch traces are further located in the third conductive layer, and the first touch gold finger, the plurality of display gold fingers, and the plurality of second touch gold fingers are all located in the fourth conductive layer; The third conductive layer and the fourth conductive layer are both located in the same layer as the first conductive layer.

10. The circuit board according to claim 9, wherein: The second plate portion further includes a fifth conductive layer and a seventh insulating layer located between the fifth insulating layer and the fourth shielding layer; The grounding portion is further located in the fifth conductive layer, and the fifth conductive layer and the second conductive layer are located in the same layer.

11. A display module, characterized in that: The display module comprises: a display panel, a driver chip and a circuit board according to any one of claims 1 to 10; The display panel has a display area and a peripheral area surrounding the display area, the peripheral area includes a bending area and a binding area, and the bending area is closer to the display area than the binding area; The driving chip is located between the bending area and the binding area, and is connected to the display panel; The gold finger portion of the circuit board is connected to the binding area of ​​the display panel, and the first board portion of the circuit board is farther away from the bending area than the second board portion.

12. The display module according to claim 11, wherein: The driving chip is located on a side of the second board portion of the circuit board away from the gold finger portion.

13. The display module according to claim 12, wherein: The display module further includes: a first buffer portion; The first buffer portion is located on a side of the second plate portion close to the driving chip and is located between the second plate portion and the display panel.

14. The display module according to claim 11, wherein: The orthographic projection of the driving chip on the display panel is located within the orthographic projection of a first hollow area between the second board portion and the first board portion of the circuit board on the display panel.

15. The display module according to claim 14, wherein: The display module further includes: a second buffer portion; The second buffer portion is located at a side of the first hollow area of ​​the second plate portion and between the second plate portion and the display panel.

16. The display module according to claim 11, wherein: The orthographic projection of the driving chip on the display panel is located within the orthographic projection of the second hollow area of ​​the second board portion of the circuit board on the display panel.

17. The display module according to claim 16, wherein: The display module further includes: a third buffer portion; The third buffer portion is located at a side of the second hollow area of ​​the second plate portion and between the second plate portion and the display panel.

18. A display device, characterized in that: The display device comprises: a power supply component, and a display module according to any one of claims 11 to 17; The power supply component is connected to the display module and is used to supply power to the display module.

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