SIP-based X-band radio frequency transceiver assembly

Abstract

The utility model discloses an X wave band radio frequency transmit-receive assembly based on SIP, which relates to the radio frequency transmit-receive field and comprises a radio frequency transmit-receive unit and a packaging unit. The radio frequency transceiving unit comprises a transmitting module, a receiving module, a driving module and a wave control module; each packaging unit comprises a substrate, a box dam, a partition wall and a cover plate; the base plate and the cover plate are fixedly arranged at the bottom and the top of the box dam respectively, and the partition wall is arranged on the inner side of the box dam and integrally formed with the box dam. And the inner side of the partition wall, the substrate and the cover plate enclose an accommodating cavity of the radio frequency transceiver unit. According to the component, the wave control module is connected with the transmitting module and the receiving module to realize the functions of transmitting and receiving control, logic control, phase shift attenuation control and the like, SIP packaging is used, so that the size of the component is reduced, and miniaturization and low profile are realized; meanwhile, the partition wall integrated with the box dam is adopted to reduce interference between radio frequency chip channels, transmission is carried out at the packaging bottom in a BGA mode, and the reliability and wide applicability of the assembly are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of radio frequency transceiver, in particular to an X-band radio frequency transceiver component based on SIP. Background Art

[0002] As a symbol of the radar field, phased array radar plays a huge role in satellite-borne, missile-borne, airborne and ground-based early warning. The RF transceiver component, as its core part, determines the performance of the phased array radar, such as accuracy, sensitivity and reliability.

[0003] With the rapid development of electronic technology and packaging technology, RF transceiver components are developing towards miniaturization, high reliability and low cost. However, the characteristics of traditional brick-type transceiver components such as large size, low integration and high cost can no longer meet the development needs of the current era. Utility Model Content

[0004] In response to the above problems and technical requirements, the inventors have proposed an X-band RF transceiver component based on SIP. The technical solution of the utility model is as follows:

[0005] A SIP-based X-band RF transceiver assembly includes a RF transceiver unit and a packaging unit; the RF transceiver unit includes a transmitting module, a receiving module, a wave control module and a driving module; the packaging unit includes a substrate, a dam, a partition wall and a cover plate; the substrate and the cover plate are respectively fixed to the bottom and top of the dam, the partition wall is arranged on the inner side of the dam and is integrally formed with the dam; the inner side of the partition wall, the substrate and the cover plate form a receiving cavity for the RF transceiver unit.

[0006] A further technical solution is that the transmitting module includes multiple transmitting end circuits, and the receiving module includes multiple transmitting end circuits; the multiple transmitting end circuits correspond one to one with the multiple receiving end circuits.

[0007] A further technical solution is that a wave control module connects the transmitting end circuit and the receiving end circuit; multiple transmitting end circuits and multiple receiving end circuits share one wave control module.

[0008] A further technical solution is that the wave control module includes a CMOS multi-function chip and a ceramic capacitor.

[0009] A further technical solution is that the transmitting end circuit includes a power amplifier and a DC blocking capacitor.

[0010] A further technical solution is that the receiving end circuit includes a limiter and a low noise amplifier.

[0011] A further technical solution is that the driving module includes a plurality of driving circuits, and the driving circuits include MOS drivers and PMOS drivers; and the plurality of driving circuits are connected to the plurality of transmitting end circuits in a one-to-one correspondence.

[0012] A further technical solution is that the radio frequency transceiver unit also includes an antenna port for signal transmission and signal reception.

[0013] A further technical solution is to provide a ball grid array at the bottom of the packaging unit.

[0014] A further technical solution is that the packaging unit has a square structure with dimensions of 16mm*16mm*2.1mm.

[0015] The beneficial technical effects of the utility model are:

[0016] The present application discloses an X-band RF transceiver component based on SIP. The component realizes functions such as transceiver control, logic control, and phase shift attenuation control by connecting a wave control module to a transmitting module and a receiving module. The use of SIP packaging reduces the volume of the component, achieving miniaturization and low profile. At the same time, a partition wall integrated with the dam is used to reduce interference between RF chip channels. The bottom of the package adopts BGA transmission, which improves the reliability and wide applicability of the component. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a cross-sectional view of the radio frequency transceiver component of the present application.

[0018] Figure 2 It is a top view of the radio frequency transceiver component of this application.

[0019] Figure 3 This is a bottom view of the radio frequency transceiver assembly of the present application.

[0020] Figure 4 This is a circuit diagram of the radio frequency transceiver unit in the radio frequency transceiver assembly of the present application. DETAILED DESCRIPTION

[0021] The specific implementation of the present utility model will be further described below with reference to the accompanying drawings.

[0022] In one embodiment, Figure 1-4 As shown, an X-band RF transceiver component based on SIP is provided. Figure 1-3 The cross-sectional view, top view and bottom view of the RF transceiver assembly of this embodiment are shown. The RF transceiver assembly adopts SIP packaging, and the packaging unit includes a substrate 1, a dam 2, a partition wall 3 and a cover plate 4; the substrate 1 and the cover plate 4 are respectively fixed to the bottom and top of the dam 2, and the partition wall 3 is arranged on the inner side of the dam 2 and is integrally formed with the dam 2; the inner side of the partition wall 3, the substrate 1 and the cover plate 4 enclose a housing cavity for the RF transceiver unit, and the RF transceiver unit is arranged in the housing cavity.

[0023] Specifically, the substrate 1 is made of alumina ceramic material, and the dam 2, partition wall 3 and cover plate 4 are made of kovar material.

[0024] Optionally, a ball grid array is provided at the bottom of the package unit; the package unit is a square structure with a size such as Figure 1-2 As shown, the preferred length L is 16 mm, the width W is 16 mm, and the height H is 2.1 mm.

[0025] The component adopts SIP packaging technology, and ceramic blocks are used inside the packaging unit to transfer RF signals and control signals, which significantly reduces the size of the component and achieves miniaturization and low profile. Furthermore, the partition wall 3 integrated with the dam 2 is used to reduce the interference between RF chip channels. At the same time, the bottom of the packaging unit is Figure 3 As shown, a ball grid array, that is, a BGA method is used for signal transmission, which improves the speed and stability of signal transmission, thereby greatly improving the reliability and wide applicability of the component; further, the use of BGA in SIP packaging not only improves the electrical performance of the package, but also simplifies the package structure and reduces production costs.

[0026] Figure 4 The circuit diagram of the radio frequency transceiver unit in the radio frequency transceiver assembly of this embodiment is shown. The radio frequency transceiver unit includes a transmitting module, a receiving module, a beam control module and a driving module.

[0027] Preferably, the transmitting module includes multiple transmitting end circuits, the receiving module includes multiple transmitting end circuits, and the multiple transmitting end circuits correspond one-to-one to the multiple receiving end circuits; the wave control module connects the transmitting end circuit and the receiving end circuit; the multiple transmitting end circuits and the multiple receiving end circuits share one wave control module; the driving module includes multiple driving circuits, and the multiple driving circuits are connected one-to-one to the multiple transmitting end circuits.

[0028] Specifically, in this embodiment, there are four transmitter circuits, four receiver circuits, and four driver circuits. The transmitter circuit is used to amplify the RF transmission signal output by the beam control circuit; the receiver circuit is used to amplify the received RF signal and input it into the beam control circuit; the beam control module connects the transmitter circuit and the receiver circuit and performs functions such as transmission and reception control, logic control, and phase shift and attenuation control; and the driver circuit is used to drive the transmitter circuit.

[0029] Optionally, the radio frequency transceiver unit also includes an antenna port for signal transmission and signal reception.

[0030] Specifically in this embodiment, each transmitting-end circuit and each receiving-end circuit is connected to an antenna port, that is, a total of 8 antenna ports are provided.

[0031] Optionally, the wave control module includes a CMOS multifunctional chip and a ceramic capacitor; the transmitting end circuit includes a power amplifier and a DC blocking capacitor; the receiving end circuit includes a limiter and a low noise amplifier; and the driving circuit includes a MOS driver and a PMOS.

[0032] Specifically, the CMOS multi-function chip is developed based on the CMOS process and adopts a fully differential architecture design; the power amplifier is manufactured using the GaN HEMT process; the limiter and low-noise amplifier are manufactured using the GaAs pHEMT process; the MOS driver is manufactured using the BICMOS silicon process, and the PMOS is manufactured using the SGT silicon process.

[0033] The above description is only a preferred embodiment of the present application, and the present invention is not limited to the above embodiments. It is understood that other improvements and variations directly derived or imagined by those skilled in the art without departing from the spirit and concept of the present invention should be considered to be included in the scope of protection of the present invention.

Claims

1. An X-band radio frequency transceiver component based on SIP, characterized in that: It includes a radio frequency transceiver unit and a packaging unit; the radio frequency transceiver unit includes a transmitting module, a receiving module, a wave control module and a driving module; the packaging unit includes a substrate, a dam, a partition wall and a cover plate; the substrate and the cover plate are respectively fixed to the bottom and top of the dam, and the partition wall is arranged on the inner side of the dam and is integrally formed with the dam; the inner side of the partition wall and the substrate and the cover plate form a accommodating cavity for the radio frequency transceiver unit.

2. The radio frequency transceiver assembly according to claim 1, characterized in that: The transmitting module includes a plurality of transmitting end circuits, and the receiving module includes a plurality of transmitting end circuits; the plurality of transmitting end circuits correspond one to one with the plurality of receiving end circuits.

3. The radio frequency transceiver assembly according to claim 2, characterized in that: The beam control module is connected to the transmitting end circuit and the receiving end circuit; the multiple transmitting end circuits and the multiple receiving end circuits share one beam control module.

4. The radio frequency transceiver assembly according to claim 1, characterized in that: The wave control module includes a CMOS multifunctional chip and a ceramic capacitor.

5. The radio frequency transceiver assembly according to claim 2, characterized in that: The transmitting end circuit includes a power amplifier and a DC blocking capacitor.

6. The radio frequency transceiver assembly according to claim 2, characterized in that: The receiving end circuit includes a limiter and a low noise amplifier.

7. The radio frequency transceiver assembly according to claim 2, characterized in that: The driving module includes a plurality of driving circuits, and the driving circuits include MOS drivers and PMOS drivers; the plurality of driving circuits are connected to the plurality of transmitting end circuits in a one-to-one correspondence.

8. The radio frequency transceiver assembly according to claim 1, characterized in that: The radio frequency transceiver unit also includes an antenna port for signal transmission and signal reception.

9. The radio frequency transceiver assembly according to any one of claims 1 to 8, characterized in that: A ball grid array is arranged at the bottom of the packaging unit.

10. The radio frequency transceiver assembly according to any one of claims 1 to 8, characterized in that: The packaging unit is a square structure with a size of 16mm*16mm*2.1mm.

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