Laser projector with water-cooling heat dissipation function

Abstract

The utility model relates to the technical field of projectors, in particular to a water-cooling heat dissipation laser projector which comprises a bottom plate. The host is mounted on the bottom plate; the host is mounted on the bottom plate in a suspended manner through the angle adjusting mechanism; the water cooling device comprises a water cooling copper pipe, a liquid storage device, a first pump body, a cooling liquid conveying pipe and a cooling liquid return pipe, the water cooling copper pipe is laid in the host in a bent shape, the water cooling copper pipe is provided with a first heat dissipation area and a second heat dissipation area, the first heat dissipation area is tightly attached to the circuit board, and the second heat dissipation area is tightly attached to the laser source heat dissipation plate. The refrigerating device is installed in the liquid storage device, the liquid storage device is fixed to the bottom plate, the first pump body is installed on the liquid storage device, the first pump body is communicated with the interior of the liquid storage device, the first pump body is communicated with the water-cooling copper pipe through a cooling liquid conveying pipe, and the cooling liquid backflow pipe is communicated with the water-cooling copper pipe and the liquid storage device. The projector is higher in heat dissipation efficiency and lower in noise, and dust cannot enter the host.

Description

Technical Field

[0001] The present application relates to the technical field of projectors, and in particular to a water-cooled laser projector. Background Art

[0002] Laser projectors are widely used in commercial displays and home theaters due to their high brightness, wide color gamut, and long lifespan. However, laser light sources generate a significant amount of heat during operation. Improper heat dissipation can not only affect the lifespan and stability of the laser, but can also lead to a decline in overall system performance. Currently, most common laser projectors use air cooling, which removes heat through forced convection from fans. However, as the power of laser light sources continues to increase, traditional air cooling solutions are gradually becoming increasingly limited. First, the heat dissipation efficiency is low, making it difficult to meet the cooling requirements of high-power lasers. Second, the use of multiple fans generates considerable noise, impacting the user experience. Third, dust can easily enter the optical system through the airflow, reducing optical performance. Summary of the Invention

[0003] The present application aims to solve at least one of the above-mentioned technical problems in the prior art to a certain extent. To this end, the present application provides a water-cooled laser projector, which has higher heat dissipation efficiency, lower noise, and prevents dust from entering the main unit.

[0004] A water-cooled laser projector comprising:

[0005] base plate;

[0006] A host computer, mounted on the bottom plate;

[0007] An angle adjustment mechanism, wherein the host is suspended on the base plate through the angle adjustment mechanism, and the angle adjustment mechanism is used to adjust the pitch angle of the host relative to the base plate;

[0008] The water cooling device includes a water-cooling copper tube, a liquid storage device, a first pump body, a coolant delivery pipe and a coolant return pipe. The water-cooling copper tube is laid in a bent shape inside the main unit. The water-cooling copper tube is provided with a first heat dissipation area and a second heat dissipation area. The first heat dissipation area is arranged close to the circuit board, and the second heat dissipation area is arranged close to the laser source heat sink. A refrigeration device is installed inside the liquid storage device. The liquid storage device is used to store coolant. The liquid storage device is fixed on the base plate. The first pump body is installed on the liquid storage device. The water suction port of the first pump body is connected to the inside of the liquid storage device. The water outlet of the first pump body is connected to the water-cooling copper tube through the coolant delivery pipe. The coolant return pipe is connected to the water-cooling copper tube and the liquid storage device. The coolant delivery pipe and the coolant return pipe are both hose structures.

[0009] In an optional or preferred embodiment, a heat dissipation fin is provided on the top of the host.

[0010] In an optional or preferred embodiment, heat dissipation grilles are provided on the left and right sides of the host.

[0011] In an optional or preferred embodiment, the refrigeration device includes a plurality of semiconductor refrigeration plates arranged inside the liquid storage device, and the semiconductor refrigeration plates are arranged at intervals along the length direction of the liquid storage device.

[0012] In an optional or preferred embodiment, the angle adjustment mechanism includes a support plate and a telescopic cylinder, the two sides of the main engine are connected to the support plate via a rotating shaft, the support plate is fixed to the base plate, the cylinder body of the telescopic cylinder is hinged to the base plate, the piston rod of the telescopic cylinder is hinged to the side of the main engine, and the telescopic cylinder is located in front of the support plate.

[0013] In an optional or preferred embodiment, fixed suction cups are installed at the four corners of the base plate.

[0014] In an optional or preferred embodiment, the fixed suction cup is connected to the base plate via an adjusting liquid capsule, a second pump body is installed on the liquid storage device, and the second pump body is connected to the adjusting liquid capsule and the liquid storage device.

[0015] In an optional or preferred embodiment, a level is provided on the liquid storage device.

[0016] In an optional or preferred embodiment, a plurality of buffer plates are provided inside the liquid storage device, and the buffer plates are staggered along the length direction of the liquid storage device.

[0017] In an optional or preferred embodiment, through holes are provided at two diagonal positions on the bottom of the main unit, the coolant delivery pipe and the coolant return pipe pass through the two through holes respectively and are connected to both ends of the water-cooled copper pipe, and sealing rings are installed at the through holes.

[0018] Based on the above technical solution, the embodiments of the present application have at least the following beneficial effects: the refrigeration device in the liquid storage device cools the coolant, and during the cooling process of the host, the first pump body extracts the coolant and transports it to the water-cooled copper tube through the coolant delivery pipe. The coolant takes away the heat of the host when passing through the water-cooled copper tube, and then returns to the liquid storage device through the coolant return pipe. This laser projector takes away the heat from the main heating element circuit board and laser source inside the host through the water-cooled copper tube, achieving water-cooled heat dissipation. Compared with the traditional air cooling method, its heat dissipation efficiency is higher, the noise is lower, and it will not cause dust to enter the host. When the host needs to be used, the pitch angle of the host is adjusted through the angle adjustment mechanism to adjust the angle of the host to the accurate position. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The present application is further described below with reference to the accompanying drawings and embodiments;

[0020] Figure 1 This is a schematic structural diagram of a water-cooled laser projector provided in an embodiment of the present application;

[0021] Figure 2 yes Figure 1 A schematic structural diagram of the embodiment shown in another perspective;

[0022] Figure 3 yes Figure 1 A partial enlarged view of point A in the middle;

[0023] Figure 4 yes Figure 1 A schematic diagram of the bottom of the host in the embodiment shown;

[0024] Figure 5 yes Figure 1 A schematic diagram of a portion of the structure of the liquid storage device in the illustrated embodiment;

[0025] Figure 6 yes Figure 1 A schematic diagram of the bottom of the bottom plate in the illustrated embodiment;

[0026] Figure 7 yes Figure 6 A partial enlarged view of point B in the middle;

[0027] Figure 8 yes Figure 6 Schematic diagram of the connection relationship between the second pump body, the delivery tube and the regulating liquid sac. DETAILED DESCRIPTION

[0028] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0029] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0030] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0031] In this application, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0032] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0033] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0034] Laser projectors are widely used in commercial displays and home theaters due to their high brightness, wide color gamut, and long lifespan. However, laser light sources generate a significant amount of heat during operation. Improper heat dissipation can not only affect the lifespan and stability of the laser, but can also lead to a decline in overall system performance. Currently, most common laser projectors use air cooling, which removes heat through forced convection from fans. However, as the power of laser light sources continues to increase, traditional air cooling solutions are gradually becoming increasingly limited. First, the heat dissipation efficiency is low, making it difficult to meet the cooling requirements of high-power lasers. Second, the use of multiple fans generates considerable noise, impacting the user experience. Third, dust can easily enter the optical system through the airflow, reducing optical performance.

[0035] Reference Figures 1 to 8 The present application provides a laser projector that uses water cooling for heat dissipation, including a base plate 100, a host 200, an angle adjustment mechanism 300 and a water cooling device 400.

[0036] The host 200 is installed on the base plate 100. The host 200 is suspended on the base plate 100 through an angle adjustment mechanism 300. The angle adjustment mechanism 300 is used to adjust the pitch angle of the host 200 relative to the base plate 100. The water cooling device 400 includes a water-cooling copper tube 410, a liquid storage device 420, a first pump body 430, a coolant delivery pipe 440 and a coolant return pipe 450. The water-cooling copper tube 410 is laid inside the host 200 in a bent shape. The water-cooling copper tube 410 is provided with a first heat dissipation area 411 and a second heat dissipation area 412. The first heat dissipation area 411 is provided close to the circuit board, and the second heat dissipation area 412 is provided. The second heat dissipation area 412 is arranged close to the heat dissipation plate of the laser source, and a refrigeration device 421 is installed inside the liquid storage device 420. The liquid storage device 420 is used to store coolant. The liquid storage device 420 is fixed on the base plate 100. The first pump body 430 is installed on the liquid storage device 420. The water suction port of the first pump body 430 is connected to the inside of the liquid storage device 420. The water outlet of the first pump body 430 is connected to the water-cooled copper pipe 410 through the coolant delivery pipe 440. The coolant return pipe 450 connects the water-cooled copper pipe 410 and the liquid storage device 420. The coolant delivery pipe 440 and the coolant return pipe 450 are both hose structures.

[0037] The refrigeration device 421 in the liquid storage device 420 cools the coolant. During the cooling process of the main unit 200, the first pump body 430 pumps the coolant through the coolant delivery pipe 440 and delivers it to the water-cooled copper pipe 410. As the coolant passes through the water-cooled copper pipe 410, it removes heat from the circuit board and laser source heat sink inside the main unit 200. The coolant then flows back to the liquid storage device 420 through the coolant return pipe 450, continuing the cooling cycle. This laser projector uses the water-cooled copper pipe 410 to remove heat from the main unit 200's main heating components, the circuit board and the laser source, achieving water-cooled heat dissipation. Compared to traditional air cooling methods, this method has higher heat dissipation efficiency, lower noise, and prevents dust from entering the main unit 200.

[0038] When the host 200 needs to be used, the pitch angle of the host 200 is adjusted through the angle adjustment mechanism 300 so that the angle of the host 200 is adjusted to an accurate position.

[0039] In this application, the water-cooled copper tube 410 is laid in a bent shape at the bottom of the host 200, as shown in FIG. Figure 4 As shown, the water-cooling copper tube 410 is densely bent at a location within the host 200 corresponding to the circuit board to form a first heat dissipation region 411. The first heat dissipation region 411 abuts against the bottom of the circuit board. The water-cooling copper tube 410 is densely bent at a location within the host 200 corresponding to the laser source heat sink to form a second heat dissipation region 412. The second heat dissipation region 412 abuts against the bottom of the laser source heat sink. In other embodiments, the cross-section of the water-cooling copper tube in the first heat dissipation region 411 can be configured as a flat square tube. This allows for better abutment against the bottom of the circuit board and maximizes heat removal. Similarly, the cross-section of the water-cooling copper tube in the second heat dissipation region 412 can be configured as a flat square tube. This also allows for abutment against the laser source heat sink, enhancing heat exchange.

[0040] In some embodiments, through holes are provided at two diagonal positions on the bottom of the host 200 , and the coolant delivery pipe 440 and the coolant return pipe 450 pass through the two through holes and are connected to both ends of the water-cooled copper pipe 410 .

[0041] In addition, a sealing ring is installed at the through hole to reduce dust from entering the interior of the host 200 through the through hole.

[0042] In some embodiments, a heat dissipation fin 210 is provided on the top of the host 200 to improve the heat dissipation performance of the host 200 .

[0043] In some embodiments, heat dissipation grilles 220 are provided on the left and right sides of the host 200 to further improve the heat dissipation performance of the host 200.

[0044] The top of the entire host 200 of the present application dissipates heat through the heat dissipation fins 210, the left and right sides dissipate heat through the heat dissipation grilles 220, and the main heating elements inside dissipate heat through the water-cooled copper tubes 410, thereby achieving multi-directional heat dissipation and higher heat dissipation efficiency.

[0045] Reference Figure 5 In some embodiments, the cooling device 421 includes a plurality of semiconductor cooling chips disposed at the bottom of the liquid storage device 420. The semiconductor cooling chips are spaced apart along the length of the liquid storage device 420. These chips do not require any refrigerant, are compact, operate without vibration or noise, have a long lifespan, and are easy to install. These chips are current-converting chips that can achieve high-precision temperature control by controlling the input current.

[0046] In some embodiments, the angle adjustment mechanism 300 includes a support plate 310 and a telescopic cylinder 320. The support plate 310 is fixed on the base plate 100. The two sides of the main unit 200 are connected to the support plate 310 through a rotating shaft. The cylinder body of the telescopic cylinder 320 is hinged on the base plate 100. The piston rod of the telescopic cylinder 320 is hinged to the side of the main unit 200. The telescopic cylinder 320 is located in front of the support plate 310.

[0047] The telescopic cylinder 320 drives the piston rod to extend and retract, causing the main unit 200 to rotate relative to the support plate 310, thereby adjusting the pitch angle. It is understood that the telescopic cylinder 320 is located in front of the support plate 310. When the telescopic cylinder 320 drives the piston rod to extend and retract, the main unit 200 rotates about the hinge point of the support plate 310. Positioning the main unit 200's rotation hinge point at the rear allows for a wide range of pitch angle adjustment at the front of the main unit 200.

[0048] Reference Figures 6 to 8 In some embodiments, fixed suction cups 500 are installed at the four corners of the base plate 100. When the base plate 100 is placed on the table, the fixed suction cups 500 are adsorbed on the table, making the base plate 100 more stable.

[0049] In order to facilitate the adjustment of the levelness of the entire machine, in some embodiments, the fixed suction cup 500 is connected to the base plate 100 through the adjustment liquid capsule 600, and a second pump body 422 is installed on the liquid storage device 420, and the second pump body 422 connects the adjustment liquid capsule 600 and the liquid storage device 420.

[0050] Specifically, the second pump body 422 is connected to the regulating liquid capsule 600 through the delivery tube 610 .

[0051] When adjusting the levelness of the entire machine, the second pump body 422 pumps forward to extract the coolant in the liquid storage device 420 and transport it to the regulating liquid bag 600, thereby causing the regulating liquid bag 600 to swell, or the second pump body 422 pumps backward to extract the coolant in the regulating liquid bag 600, thereby causing the regulating liquid bag 600 to shrink.

[0052] In some embodiments, a level is provided on the liquid storage device 420 to facilitate workers to observe the levelness of the base plate 100 through the level.

[0053] Red pigment is added to the coolant inside the liquid storage device 420 , and an observation window 423 made of a transparent material is fixedly installed on the front outer surface of the liquid storage device 420 , and horizontal scale lines 424 are set on the left and right sides of the observation window 423 .

[0054] After the base plate 100 is fixed on the desktop by the fixed suction cup 500, the staff observes the red coolant in the liquid storage device 420 through the observation window 423, and judges the angle between the device and the horizontal plane with the help of the horizontal scale lines 424 on the left and right sides of the observation window 423, so as to judge whether the device has reached a horizontal state. If it has not reached a horizontal state, the second pump body 422 is turned on, so that the second pump body 422 transports the coolant in the liquid storage device 420 to the regulating liquid capsule 600 at the corresponding position through the delivery pipe 610, so that the corresponding regulating liquid capsule 600 expands, or the coolant in the regulating liquid capsule 600 is extracted, so that the corresponding regulating liquid capsule 600 shrinks, thereby achieving the purpose of leveling.

[0055] In this application, the regulating liquid capsules 600 on the left and right sides of the base plate 100 are respectively controlled by two second pump bodies 422, and a control valve 611 is installed on the delivery pipe 610. The regulating liquid capsules 600 on the same side are controlled by the control valve 611 to control whether to be filled with coolant.

[0056] Reference Figure 5 In some embodiments, multiple buffer plates 425 are disposed within the liquid storage device 420 , with each buffer plate 425 staggered along the length of the liquid storage device 420 . The buffer plates 425 extend the flow path of the coolant within the liquid storage device 420 , enabling the refrigeration device 421 to achieve better cooling. Furthermore, the buffer plates 425 provide a buffer for the coolant within the liquid storage device 420 , preventing excessive inertia during the flow of the coolant within the liquid storage device 420 from causing the entire device to shake.

[0057] The embodiments of the present application are described in detail above in conjunction with the accompanying drawings, but the present application is not limited to the above embodiments. Various changes can be made within the scope of knowledge possessed by ordinary technicians in the technical field without departing from the purpose of the present application.

Claims

1. A water-cooled laser projector, characterized in that: include base plate; A host computer, mounted on the bottom plate; An angle adjustment mechanism, wherein the host is suspended on the base plate through the angle adjustment mechanism, and the angle adjustment mechanism is used to adjust the pitch angle of the host relative to the base plate; The water cooling device includes a water-cooling copper tube, a liquid storage device, a first pump body, a coolant delivery pipe and a coolant return pipe. The water-cooling copper tube is laid in a bent shape inside the main unit. The water-cooling copper tube is provided with a first heat dissipation area and a second heat dissipation area. The first heat dissipation area is arranged close to the circuit board, and the second heat dissipation area is arranged close to the laser source heat sink. A refrigeration device is installed inside the liquid storage device. The liquid storage device is used to store coolant. The liquid storage device is fixed on the base plate. The first pump body is installed on the liquid storage device. The water suction port of the first pump body is connected to the inside of the liquid storage device. The water outlet of the first pump body is connected to the water-cooling copper tube through the coolant delivery pipe. The coolant return pipe is connected to the water-cooling copper tube and the liquid storage device. The coolant delivery pipe and the coolant return pipe are both hose structures.

2. The water-cooled laser projector according to claim 1, characterized in that: The refrigeration device includes a plurality of semiconductor refrigeration plates arranged inside the liquid storage device, and the semiconductor refrigeration plates are arranged at intervals along the length direction of the liquid storage device.

3. The water-cooled laser projector according to claim 1, characterized in that: A heat dissipation fin is arranged on the top of the mainframe.

4. The water-cooled laser projector according to claim 3, characterized in that: Radiating grilles are provided on the left and right sides of the main unit.

5. The water-cooled laser projector according to any one of claims 1 to 4, characterized in that: The angle adjustment mechanism includes a support plate and a telescopic cylinder. The support plate is fixed to the base plate. The two sides of the main unit are connected to the support plate through a rotating shaft. The cylinder body of the telescopic cylinder is hinged to the base plate. The piston rod of the telescopic cylinder is hinged to the side of the main unit. The telescopic cylinder is located in front of the support plate.

6. The water-cooled laser projector according to any one of claims 1 to 4, characterized in that: The four corners of the bottom plate are equipped with fixed suction cups.

7. The water-cooled laser projector according to claim 6, characterized in that: The fixed suction cup is connected to the bottom plate through an adjusting liquid bag. A second pump body is installed on the liquid storage device, and the second pump body is connected to the adjusting liquid bag and the liquid storage device.

8. The water-cooled laser projector according to claim 7, characterized in that: A level is provided on the liquid storage device.

9. The water-cooled laser projector according to claim 1, characterized in that: A plurality of buffer plates are arranged inside the liquid storage device, and the buffer plates are staggered along the length direction of the liquid storage device.

10. The water-cooled laser projector according to claim 1, characterized in that: Through holes are provided at two diagonal positions on the bottom of the main unit. The coolant delivery pipe and the coolant return pipe pass through the two through holes and are connected to both ends of the water-cooled copper pipe respectively. Sealing rings are installed at the through holes.

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