Simple device for manufacturing solid epoxy resin adhesive film

Abstract

The utility model relates to a simple device for manufacturing a solid epoxy resin adhesive film, which comprises a temperature control heating workbench provided with a heating platform capable of being adjusted to be horizontal. A bearing film is laid on the heating platform; a resin height limiting groove is formed in the bearing film; the resin height limiting groove is fixed with the heating platform through a fixing bolt; the simple device further comprises a metal scraping plate which is used for being pressed on the top face of the resin height limiting groove, assisting resin heated and melted by the heating platform to be fully distributed in the resin height limiting groove and further used for scraping redundant resin out of the resin height limiting groove. The simple device for manufacturing the solid epoxy resin adhesive film has the advantages of being simple in structure, convenient to use, low in cost, small in occupied area and small in minimum feeding amount. The prepared adhesive film has the advantages of high surface flatness and stable and controllable thickness.

Description

Technical Field

[0001] The utility model relates to the technical field of manufacturing equipment for solid epoxy resin films, in particular to a simple device for manufacturing solid epoxy resin films. Background Art

[0002] In the mass production process of solid epoxy resin films, coating machines are generally used to prepare epoxy resin films. Due to the high price of coating machines, the large space they occupy, and the excessively large minimum feed amount required, they are difficult to meet the needs of small-scale tests in some research institutes and resin manufacturers. Therefore, manual brushing processes are often used to produce solid epoxy resin films. The manual brushing process to prepare the film is to first heat and melt the solid epoxy resin in an oven, then pour the resin onto release paper, and use a brush or scraper to smooth the resin. However, it has the following two defects: First, because the solid epoxy resin needs to be preheated and melted before brushing, the viscosity of the resin will increase due to cooling during the brushing process, making it difficult to brush and level; second, the thickness of the brushed resin film is difficult to control because the resin flows freely during the flowable stage. Utility Model Content

[0003] In order to solve the above technical problems, the utility model provides a simple device for making solid epoxy resin film, which has a simple structure and is easy to use. The manufactured film has good surface flatness and uniform thickness.

[0004] The technical solution adopted by the utility model to solve its technical problems is: a simple device for making solid epoxy resin film, including a temperature-controlled heating workbench, the temperature-controlled heating workbench has a heating platform with adjustable level; a carrier film is laid on the heating platform; a resin height limiting groove is placed on the carrier film; the resin height limiting groove is fixed to the heating platform by fixing bolts; the simple device also includes a metal scraper, the metal scraper is used to press on the top surface of the resin height limiting groove, assist the resin melted by heating on the heating platform to fill the resin height limiting groove, and is also used to scrape excess resin out of the resin height limiting groove.

[0005] The temperature-controlled heating workbench also has a temperature control device arranged below the heating platform; the temperature control device is electrically connected to the heating platform and is used to control the heating temperature of the heating platform.

[0006] The heating platform is equipped with two level gauges in the vertical and horizontal directions; level adjustment feet are respectively provided at the four corners of the heating platform; the four level adjustment feet are used to adjust the heating platform to a horizontal level under the guidance of the level gauge.

[0007] The carrier film is made of release paper.

[0008] The depth of the resin height limiting groove is set according to the thickness of the adhesive film to be prepared.

[0009] The beneficial effects of the utility model are as follows: the utility model provides a simple device for making solid epoxy resin film. Compared with the existing coating machine, the utility model has the advantages of simple structure, easy use, low cost, small footprint, and small minimum material input; compared with the existing manual brushing process, the heating workbench can directly heat and melt the resin in the resin height limit groove to fill the resin height limit groove, and the excess resin can be scraped off by a metal scraper. After the resin is cooled, the prepared film has the advantages of high surface flatness and stable and controllable thickness. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 Schematic diagram of a simple device for making a solid epoxy resin film according to an embodiment;

[0011] Among them, 1-temperature control device, 2-heating platform, 3-level adjustment foot, 4-level meter, 5-carrying film, 6-resin height limit groove, 7-fixing bolt, 8-metal scraper. DETAILED DESCRIPTION

[0012] In order to deepen the understanding of the present invention, the present invention will be described in further detail below with reference to the accompanying drawings and embodiments. The embodiments are only used to explain the present invention and do not limit the scope of protection of the present invention.

[0013] Example

[0014] Please refer to Figure 1 As shown, this embodiment provides a simple device for making solid epoxy resin film, including a temperature-controlled heating workbench, the temperature-controlled heating workbench has a heating platform 2 with an adjustable level; a carrier film 5 is laid on the heating platform 2; a resin height limiting groove 6 is placed on the carrier film 5; the resin height limiting groove 6 is fixed to the heating platform 2 by a fixing bolt 7; the simple device also includes a metal scraper 8, the metal scraper 8 is used to press on the top surface of the resin height limiting groove 6, to assist the resin melted by the heating platform 2 to cover the resin height limiting groove 6, and is also used to scrape excess resin out of the resin height limiting groove 6.

[0015] In this embodiment of a simplified device for producing a solid epoxy resin film, the temperature-controlled heating workbench further comprises a temperature control device 1 disposed below a heating platform 2. Temperature control device 1 is electrically connected to heating platform 2 and is used to control the heating temperature of heating platform 2. The temperature control range of control device 1 is between 50°C and 150°C, with an accuracy of ±0.5°C. This device can heat and melt the solid epoxy resin at a constant temperature, ensuring the film's leveling properties without altering the resin's properties due to overheating.

[0016] In a simple device for making a solid epoxy resin film in this embodiment, two level meters 4 are installed on the heating platform 2 in the vertical and horizontal directions; level adjustment feet 3 are respectively provided at the four corners of the heating platform 2; the four level adjustment feet 3 are used to adjust the heating platform 2 to a horizontal level under the guidance of the level meter 4, thereby ensuring the thickness uniformity of the prepared film in different directions.

[0017] In the simple device for manufacturing a solid epoxy resin film of this embodiment, the carrier film 5 is made of release paper.

[0018] In the simple device for making a solid epoxy resin film of this embodiment, the depth of the resin height limiting groove 6 is set according to the thickness of the film to be prepared; the excess resin in the resin height limiting groove 6 is scraped off by a metal scraper to ensure the thickness of the film.

[0019] The present embodiment provides a simple device for making a solid epoxy resin film. First, the four level adjustment feet at the bottom of the heating platform are adjusted, and the heating platform is made horizontal by observing the spirit level in the vertical and horizontal directions; then, release paper is laid on the heating platform as a carrier film for the film; a resin height limit groove is placed on the release paper, and the resin height limit groove is tightly fixed to the heating platform with fixing bolts; after a weighed and slightly excessive amount of solid epoxy resin is placed in the resin height limit groove, the heating function of the heating platform is turned on; according to the melting temperature of the solid epoxy resin used, the temperature of the heating platform is adjusted by a temperature control device until the resin melts and fills the resin height limit groove; a metal scraper is pressed on the resin height limit groove, and excess resin is scraped out of the resin height limit groove from one side of the resin height limit groove; the heating platform stops heating, and after waiting for the resin to cool and solidify, the resin height limit groove is removed and the prepared film is taken out.

[0020] The simple device for making solid epoxy resin film in this embodiment has the advantages of simple structure, easy use, low cost, small footprint and small minimum material requirement compared with the existing coating machine; compared with the existing manual brushing process, the heating workbench can directly heat and melt the resin in the resin height limit groove to fill the resin height limit groove, and the excess resin can be scraped off by a metal scraper. After the resin cools, the prepared film has the advantages of high surface flatness and stable and controllable thickness.

[0021] The above embodiments should not limit the present invention in any way, and any technical solutions obtained by equivalent replacement or equivalent conversion fall within the protection scope of the present invention.

Claims

1. A simple device for making a solid epoxy resin film, characterized by: The invention comprises a temperature-controlled heating workbench, wherein the temperature-controlled heating workbench has a heating platform (2) with adjustable level; a carrier film (5) is laid on the heating platform (2); a resin height-limiting groove (6) is placed on the carrier film (5); the resin height-limiting groove (6) is fixed to the heating platform (2) via a fixing bolt (7); the simple device further comprises a metal scraper (8), wherein the metal scraper (8) is used to press on the top surface of the resin height-limiting groove (6), assist the resin heated and melted by the heating platform (2) to cover the resin height-limiting groove (6), and is also used to scrape excess resin out of the resin height-limiting groove (6).

2. The simple device for producing a solid epoxy resin film according to claim 1, characterized in that: The temperature-controlled heating workbench further comprises a temperature control device (1) disposed below the heating platform (2); the temperature control device (1) is electrically connected to the heating platform (2) and is used to control the heating temperature of the heating platform (2).

3. The simple device for producing a solid epoxy resin film according to claim 1, characterized in that: Two level meters (4) are installed on the heating platform (2); level adjustment feet (3) are respectively provided at the four corners of the heating platform (2); the four level adjustment feet (3) are used to adjust the heating platform (2) to a horizontal position under the indication of the level meter (4).

4. The simplified device for producing a solid epoxy resin film according to claim 1, characterized in that: The carrier film (5) is made of release paper.

5. The simple device for producing a solid epoxy resin film according to claim 1, characterized in that: The depth of the resin height limiting groove (6) is set according to the thickness of the adhesive film to be prepared.

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