Wafer clamping device and horizontal electroplating equipment

Abstract

The utility model discloses a wafer clamping device and horizontal electroplating equipment, and the clamping device comprises a clamping unit which comprises a clamping seat, a sealing ring, a conducting ring and a pressing part, the clamping seat forms an opening matched with a to-be-electroplated area on the bottom surface of a wafer from the bottom, and the sealing ring and the conducting ring are respectively arranged on the clamping seat; wherein the sealing ring and the conducting ring sequentially surround a to-be-plated area from inside to outside and abut against the bottom face of a wafer, and the wafer is pressed by the pressing component from top to bottom; and the driving unit comprises a lifting driving part. According to the utility model, on one hand, the sealing ring and the conductive ring are kept in a compressed state by arranging the auxiliary component, so that deviation caused by ring deformation of the sealing ring and the conductive ring is eliminated, and conductivity and sealing performance are effectively improved; on the other hand, through cooperation of the first rotation driving part, the second rotation driving part and the lifting driving part, the wafer enters the electrolyte in an inclined posture on the basis that the wafer keeps rotating around the center line of the wafer, the discharge rate of bubbles in the to-be-plated area of the wafer is effectively increased, and the electroplating quality is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductors, and in particular relates to a wafer clamping device, and also relates to wafer horizontal electroplating equipment. Background Art

[0002] A wafer is a silicon wafer used to make silicon semiconductor circuits. The starting material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon seed crystals, and then slowly pulled out to form a cylindrical single crystal. The silicon ingot is ground, polished, and sliced ​​to form a silicon wafer. Furthermore, a conductive metal layer is electroplated on the wafer and processed to create conductive circuits.

[0003] At present, wafer electroplating processes are mainly divided into vertical electroplating and horizontal electroplating, that is, electroplating is carried out when the wafer is in a vertical state and a horizontal state respectively. In the horizontal wafer electroplating process, the wafer is usually loaded horizontally on a fixture with the bottom surface to be plated exposed, and the electroplating tank is located below. The fixture is then driven by a power mechanism to drive the wafer to be immersed from top to bottom in the electrolyte in the electroplating tank below for electroplating. The traditional wafer horizontal electroplating fixture mainly includes an upper clamping plate and a lower clamping plate provided with a conductive ring and a sealing ring. The upper and lower clamping plates directly clamp the wafer up and down so that the edge of the wafer contacts the sealing ring and the conductive ring from the inside to the outside in turn to form a seal and conduction.

[0004] However, in actual production, the existing technology is prone to the following defects:

[0005] 1. Conventional conductive rings and sealing rings are prone to aging and deformation after long-term clamping and use (mainly manifested in thinning), resulting in loosening or displacement of the conductive rings and sealing rings. When clamping the wafer, poor contact is likely to occur, resulting in poor sealing and conductivity.

[0006] 2. The existing wafer fixture drives the wafer to be immersed in the electrolyte from top to bottom in a horizontal posture. Bubbles are easily generated on the bottom surface of the wafer and cannot be discharged smoothly, affecting the electroplating quality. Summary of the Invention

[0007] The technical problem to be solved by the utility model is to overcome the deficiencies of the prior art and provide an improved wafer clamping device;

[0008] At the same time, a wafer-level electroplating device is also provided.

[0009] In order to solve the above technical problems, the technical solutions adopted by the present invention are as follows:

[0010] A wafer clamping device comprising:

[0011] The clamping unit includes a clamping seat with an opening formed at the bottom to match the area to be plated on the bottom surface of the wafer, a sealing ring and a conductive ring respectively arranged on the clamping seat, and a pressing component, wherein the sealing ring and the conductive ring surround the area to be plated from the inside to the outside in sequence and contact the bottom surface of the wafer, and the pressing component presses the wafer from top to bottom;

[0012] The driving unit includes a lifting driving component for driving the clamping seat to move up and down.

[0013] The conductive ring and the sealing ring are stacked up and down, and the clamping unit also includes an auxiliary component arranged on the clamping seat and driving the conductive ring and the sealing ring to keep pressing up and down;

[0014] The driving unit also includes a rotation driving component, which includes a first rotation driving component that drives the clamping seat and drives the wafer to rotate around its own center line direction, and a second rotation driving component that drives the clamping seat to rotate around the horizontal direction and drives the wafer to keep tilting up and down. As the clamping seat moves, the wafer can tilt up and down and keep rotating around its own center line direction and immerse downward in the electrolyte.

[0015] According to one specific embodiment and preferred aspect of the present invention, the auxiliary component includes an adjustment ring stacked above the conductive ring and an auxiliary pressure block fixed relative to the clamping seat and pressed against the adjustment ring. The thickness of the adjustment ring is proportional to the deformation of the conductive ring and / or the sealing ring. The adjustment ring is selected with a thickness corresponding to the actual deformation of the conductive ring and the sealing ring, thereby simplifying operation, being convenient, and providing greater flexibility.

[0016] Preferably, the center lines of the adjustment ring, the conductive ring and the sealing ring are arranged to coincide with each other; and / or the inner ring radii of the adjustment ring, the conductive ring and the sealing ring increase step by step from top to bottom.

[0017] Preferably, the auxiliary pressing block is annular, and an extension portion extending downward is formed from the inner side of the auxiliary pressing block, wherein the lower end of the extension portion abuts against the adjustment ring.

[0018] Specifically, the inner wall of the extension is equipped with multiple guide blocks distributed circumferentially around the wafer. The inner wall of each guide block extends inward and tilts downward from top to bottom. The lower ends of the guide blocks form a positioning area that matches the wafer. When the wafer is within the positioning area, it contacts the conductive ring and the sealing ring simultaneously. This facilitates precise positioning of the wafer during clamping, ensuring accurate contact between the wafer, the conductive ring, and the sealing ring.

[0019] According to another specific embodiment and preferred aspect of the present invention, the clamping base includes an annular base body with an opening, a side base body extending upward from the edge of the base body, and an upper cover disposed on top of the side base body. The base body has an inner wall formed with an outwardly extending mounting groove, and the adjustment ring, conductive ring, and sealing ring are mounted within the mounting groove with the inner ring edge extending inwardly out of the groove. This provides a simple structure and facilitates installation and implementation.

[0020] According to another specific embodiment and preferred aspect of the present invention, the clamping component includes a cylinder fixed relative to the clamping seat and a pressure plate fixedly connected to the telescopic end of the cylinder, wherein the bottom surface of the pressure plate is formed with multiple grooves. When clamping, the pressure plate presses against the top surface of the wafer from the bottom surface and is hung on the auxiliary pressure block from the top. Here, the cooperation between the upper part of the pressure plate and the auxiliary pressure block forms a limit on the movement of the pressure plate, thereby preventing the auxiliary pressure block from exerting excessive pressure on the wafer and causing damage to the wafer. At the same time, the grooves formed on the bottom surface of the pressure plate can be arranged side by side, can be arranged in a crisscross pattern, or can be arranged in an annular shape and arranged sequentially from the inside to the outside, so as to prevent the wafer from being adsorbed on the bottom surface of the pressure plate.

[0021] Preferably, the first rotating drive member includes a first motor, and the second rotating drive member includes a second motor and a rotating seat connected to the output shaft of the second motor, wherein the first motor is fixedly arranged on the rotating seat and the output shaft is fixedly connected to the clamping component. When clamping, the first motor drives the clamping component and drives the clamping seat and the wafer to rotate synchronously.

[0022] According to another specific implementation and preferred aspect of the present invention, the drive unit further includes a transverse drive component, the transverse drive component includes a horizontally extending slide rail, a slide seat slidably disposed on the slide rail, a second rotary drive member slidably disposed on the slide seat, and a lifting drive component drives the second rotary drive member to slide up and down. As the wafer tilts up and down, the slide seat synchronously slides along the slide rail and drives the projection position of the center of the wafer on the horizontal plane to remain unchanged. Here, when the wafer descends and tilts into the electrolyte, the center axis of the wafer is guaranteed to remain unchanged, thereby achieving a closer size of the electroplating electrolyte surface and the wafer, ensuring a more balanced electroplating electric field on the front of the wafer.

[0023] Another technical solution of the present invention is a wafer horizontal electroplating device, which adopts the above-mentioned wafer clamping device.

[0024] Due to the implementation of the above technical solution, the utility model has the following advantages compared with the prior art:

[0025] In the prior art, conventional conductive rings or sealing rings are prone to aging and deformation (thickness becomes thinner) after long-term clamping and use, resulting in loosening or displacement. When clamping the wafer, poor contact is likely to occur, resulting in poor sealing and conductivity. At the same time, the existing wafer clamp drives the wafer to be immersed in the electrolyte from top to bottom in a horizontal posture, and bubbles are easily generated on the bottom surface of the wafer, which cannot be discharged smoothly, affecting the electroplating quality. The present application comprehensively designs the structure of the wafer clamping device and the horizontal electroplating equipment, cleverly solving the shortcomings and defects of the prior art. After adopting the wafer clamping device, the wafer is first placed horizontally on the clamping seat, so that the sealing ring and the conductive ring are sequentially arranged from the inside to the outside. It surrounds the area to be plated and contacts the bottom surface of the wafer to form a seal and conductivity respectively; then the clamping component presses the wafer from top to bottom to complete the clamping of the wafer, wherein the sealing ring and the conductive ring are kept in a clamped state up and down by auxiliary components according to the deformation of the sealing ring and the conductive ring in actual use; then the lifting drive component drives the clamping seat and drives the wafer to move downward, and at the same time, the first rotary drive component drives the clamping seat and drives the wafer to rotate around its own center line direction, and the second rotary drive component drives the clamping seat to rotate around the horizontal direction and drives the wafer to keep tilting up and down, so that the wafer tilts up and down synchronously with the movement of the clamping seat and keeps rotating around its own center line direction and immersed downward in the electrolyte. Therefore, compared with the prior art, the present invention, on the one hand, provides auxiliary components to keep the sealing ring and the conductive ring in a compressed state, so as to eliminate the deviation caused by the deformation of the sealing ring and the conductive ring, thereby effectively improving the conductivity and sealing; on the other hand, through the cooperation of the first and second rotating drive components and the lifting drive components, based on the wafer keeping rotating around its own center line, the wafer enters the electrolyte in an inclined posture, effectively improving the discharge rate of bubbles in the wafer to be plated area and improving the electroplating quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of the three-dimensional structure of the wafer-level electroplating equipment of the present invention;

[0027] Figure 2 for Figure 1 A schematic diagram of the local structure decomposition and enlargement;

[0028] Figure 3 for Figure 1 A half-section diagram of the local structure;

[0029] Figure 4 for Figure 3 A magnified schematic diagram of the local structure;

[0030] Wherein: A, clamping device; 1, clamping unit; 10, clamping seat; 100, seat body; c, mounting groove; 101, side seat body; 102, upper cover; 11, sealing ring; 12, conductive ring; 13, pressing component; 130, cylinder; 131, pressure plate; 14, auxiliary component; 140, adjustment ring; 141, auxiliary pressure block; 1410, extension portion; 1411, guide block; 2, driving unit; 21, rotary driving component; 211, first rotary driving component; a, first motor; 212, second rotary driving component; b0, second motor; b1, rotary seat; 22, transverse driving component; 220, slide rail; 221, slide seat;

[0031] B. Electroplating tank;

[0032] Y. Wafer. DETAILED DESCRIPTION

[0033] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0034] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0035] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0036] In this application, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0037] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0038] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0039] like Figures 1 to 4 As shown, the wafer-level electroplating equipment of this embodiment includes a clamping device A and an electroplating tank B.

[0040] Specifically, the clamping device A includes a clamping unit 1 and a driving unit 2 .

[0041] The clamping unit 1 includes a clamping seat 10 with an open opening k formed from the bottom to match the area to be plated on the bottom surface of the wafer Y, a sealing ring 11 and a conductive ring 12 respectively arranged on the clamping seat 10, a clamping component 13, and an auxiliary component 14, wherein the sealing ring 11 and the conductive ring 12 surround the area to be plated from the inside to the outside in sequence and contact the bottom surface of the wafer, the clamping component 13 presses the wafer Y from top to bottom, the conductive ring 12 and the sealing ring 11 are stacked up and down, and the auxiliary component 14 is arranged on the clamping seat 10 and drives the conductive ring 12 and the sealing ring 11 to keep pressed up and down.

[0042] In some specific embodiments, the clamping seat 10 includes an annular seat body 100 formed with an open opening k, a side seat body 101 extending upward from the edge of the seat body 100, and an upper cover 102 arranged on the top of the side seat body 101, wherein the inner wall of the seat body 100 is formed with an outwardly extending annular mounting groove c.

[0043] The clamping component 13 includes a cylinder 130 fixed relative to the clamping base 10, and a pressure plate 131 fixedly connected to the telescopic end of the cylinder 130. The bottom surface of the pressure plate 131 is formed with multiple grooves. The grooves formed on the bottom surface of the pressure plate can be arranged side by side, arranged in a crisscross pattern, or arranged in a circular pattern from the inside to the outside to prevent the wafer from being adsorbed on the bottom surface of the pressure plate. In this embodiment, the cylinder 130 is fixedly connected to the base body 100. The connection method is conventional and will not be detailed here.

[0044] The auxiliary component 14 includes an adjustment ring 140 stacked above the conductive ring 12, and an auxiliary pressure block 141 fixed relative to the clamping seat 10 and pressed on the adjustment ring 140, wherein the thickness of the adjustment ring 140 is proportional to the deformation of the conductive ring 12 and / or the sealing ring 11. That is to say, according to the actual deformation of the conductive ring and the sealing ring, an adjustment ring of corresponding thickness is selected so that the conductive ring and the sealing ring are pressed tightly on the clamping seat to keep them fixed and avoid loosening and displacement. The operation is simple, convenient and flexible.

[0045] For ease of implementation, the adjustment ring 140, the conductive ring 12, and the sealing ring 11 are installed in the mounting groove c with their inner edges extending inwardly from the mounting groove c. The inner edges of the conductive ring 12 and the sealing ring 11 are bent upward and contact the wafer. The center lines of the adjustment ring 140, the conductive ring 12, and the sealing ring 11 are arranged to coincide with each other, and the inner ring radii of the adjustment ring 140, the conductive ring 12, and the sealing ring 11 increase step by step from top to bottom.

[0046] At the same time, the auxiliary pressure block 141 is annular and fixedly connected to the top of the seat body 100, and the auxiliary pressure block 141 is formed with an extension portion 1410 extending downward from the inner side and fitting against the inner wall of the seat body 100, wherein the lower end of the extension portion 1410 abuts against the adjustment ring 140; the inner wall of the extension portion 1410 is also provided with a plurality of guide blocks 1411 distributed circumferentially around the wafer Y, wherein the inner wall of each guide block 1411 extends from top to bottom and inwardly, and a positioning area matching the wafer Y is formed between the lower ends of the plurality of guide blocks 1411, when the wafer is in the positioning area, the wafer is synchronously abutted against the conductive ring 12 and the sealing ring 11, and when pressed, the pressure plate 131 is pressed from the bottom to the top surface of the wafer Y and is hung on the auxiliary pressure block 141 from the top. Here, the cooperation between the upper part of the pressure plate and the auxiliary pressure block limits the movement of the pressure plate, thereby preventing the auxiliary pressure block from exerting excessive pressure on the wafer and causing damage to the wafer.

[0047] In this example, the drive unit 2 includes a lifting drive component, a rotation drive component 21, and a transverse drive component 22, wherein the lifting drive component drives the clamping seat 10 to drive the wafer to move up and down; the rotation drive component 21 is used to drive the clamping seat 10 to drive the wafer to rotate around its own center line direction and keep it tilted up and down, so that the wafer can tilt up and down and keep rotating around its own center line direction and immerse downward in the electrolyte.

[0048] In some specific embodiments, the lifting drive component can be any conventional lifting power device; the rotating drive component 21 includes a first rotating drive component 211 that drives the clamping seat 10 and drives the wafer to rotate around its own center line direction, and a second rotating drive component 212 that drives the clamping seat 10 to rotate around the horizontal direction and drives the wafer to maintain an up and down tilt; the first rotating drive component 211 includes a first motor a, and the second rotating drive component 212 includes a second motor b0 and a rotating seat b1 connected to the output shaft of the second motor b0, wherein the first motor a is fixedly arranged on the rotating seat b1, and the output shaft of the first motor a is fixedly connected to the clamping component 13, that is, based on the fixed connection between the cylinder 130 in the clamping component 13 and the clamping seat 10, the clamping component 13, the clamping seat 10, and the wafer Y move synchronously.

[0049] The traverse drive assembly 22 includes a horizontally extending rail 220, a slide 221 slidably mounted on the rail 220, and a second rotary drive member 212 mounted on the slide 221. As wafer Y tilts up and down, the slide 221 synchronously slides along the rail 220, maintaining the horizontal projection of the center of wafer Y. As the wafer descends and tilts into the electrolyte, the central axis of the wafer remains unchanged, ensuring that the electroplating electrolyte level is closer to the wafer and a more balanced electric field is maintained on the front of the wafer during electroplating.

[0050] In addition, the plating tank B is set below the wafer clamping device A, and any conventional plating tank used for wafer horizontal electroplating equipment is used. It will not be described in detail here, and it is clearly feasible.

[0051] In summary, after adopting the wafer clamping device, the wafer is first placed horizontally on the clamping seat, so that the sealing ring and the conductive ring surround the area to be plated from the inside to the outside in turn and contact the bottom surface of the wafer to form sealing and conductivity respectively; then the clamping component presses the wafer from top to bottom to complete the clamping of the wafer, wherein according to the deformation of the sealing ring and the conductive ring in actual use, the sealing ring and the conductive ring are kept in a clamped state up and down by auxiliary components; then the lifting drive component drives the clamping seat and drives the wafer to move downward, and at the same time, the first rotary drive component drives the clamping seat and drives the wafer to rotate around its own center line direction, and the second rotary drive component drives the clamping seat to rotate around the horizontal direction and drives the wafer to keep tilting up and down, so that the wafer tilts up and down synchronously with the movement of the clamping seat and keeps rotating around its own center line direction and immerses downward in the electrolyte. Therefore, compared with the prior art, the present invention, on the one hand, sets auxiliary components to keep the sealing ring and the conductive ring in a compressed state, so as to eliminate the deviation caused by the deformation of the sealing ring and the conductive ring, and effectively improve the conductivity and sealing; on the other hand, through the cooperation of the first and second rotating drive parts and the lifting drive parts, based on the wafer keeping rotating around its own center line, the wafer enters the electrolyte in an inclined posture, effectively improving the discharge rate of bubbles in the wafer to be plated area and improving the electroplating quality; thirdly, according to the actual conductive ring and sealing ring variables, an adjustment ring of corresponding thickness is selected, which is simple, convenient and flexible to operate; fourthly, through the cooperation between the upper part of the pressure plate and the auxiliary pressure block, the movement of the pressure plate is limited to avoid the problem of excessive pressure on the wafer by the auxiliary pressure block and causing damage to the wafer; fifthly, when the wafer descends and tilts into the electrolyte, the center axis of the wafer is guaranteed to remain unchanged, so that the size of the electroplating electrolyte surface is closer to the wafer, and the electroplating electric field on the front of the wafer is guaranteed to be more balanced.

[0052] The above detailed description of the utility model is intended to enable people familiar with the technology in this field to understand the content of the utility model and implement it. It is not intended to limit the scope of protection of the utility model. Any equivalent changes or modifications made according to the spirit of the utility model should be included in the scope of protection of the utility model.

Claims

1. A wafer clamping device, comprising: The clamping unit includes a clamping seat with an opening formed at the bottom to match the area to be plated on the bottom surface of the wafer, a sealing ring and a conductive ring respectively provided on the clamping seat, and a pressing component, wherein the sealing ring and the conductive ring sequentially surround the area to be plated from the inside to the outside and contact the bottom surface of the wafer, and the pressing component presses the wafer from top to bottom; A driving unit, comprising a lifting driving component for driving the clamping seat to move up and down, It is characterized by: The conductive ring and the sealing ring are stacked up and down, and the clamping unit further includes an auxiliary component arranged on the clamping seat and driving the conductive ring and the sealing ring to keep pressing up and down; The driving unit also includes a rotation driving component, which includes a first rotation driving component that drives the clamping seat and drives the wafer to rotate around its own center line direction, and a second rotation driving component that drives the clamping seat to rotate around the horizontal direction and drives the wafer to keep tilting up and down. As the clamping seat moves, the wafer can tilt up and down and keep rotating around its own center line direction and immerse downward in the electrolyte.

2. The wafer clamping device according to claim 1, wherein: The auxiliary component includes an adjustment ring stacked above the conductive ring and an auxiliary pressing block fixed relative to the clamping seat and pressed on the adjustment ring, wherein the thickness of the adjustment ring is proportional to the deformation of the conductive ring and / or sealing ring.

3. The wafer clamping device according to claim 2, wherein: The center lines of the adjustment ring, the conductive ring and the sealing ring are arranged to coincide with each other; and / or the inner ring radii of the adjustment ring, the conductive ring and the sealing ring increase step by step from top to bottom.

4. The wafer clamping device according to claim 2, wherein: The auxiliary pressing block is annular, and an extending portion extending downward is formed from the inner side of the auxiliary pressing block, wherein the lower end of the extending portion abuts against the adjusting ring.

5. The wafer holding device according to claim 4, wherein: The inner wall of the extension portion is also provided with a plurality of guide blocks distributed circumferentially around the wafer, wherein the inner wall of each guide block extends from top to bottom and inwardly, and a positioning area matching the wafer is formed between the lower ends of the plurality of guide blocks. When the wafer is in the positioning area, the wafer synchronously contacts the conductive ring and the sealing ring.

6. The wafer clamping device according to any one of claims 2 to 4, characterized in that: The clamping seat includes an annular seat body with the open opening, a side seat body extending upward from the edge of the seat body, and an upper cover arranged on the top of the side seat body, wherein the inner wall of the seat body is formed with an outwardly extending mounting groove, and the adjustment ring, conductive ring, and sealing ring are installed in the mounting groove and keep the inner ring edge extending inward from the mounting groove.

7. The wafer holding device according to claim 2, wherein: The clamping component includes a cylinder fixed relatively to the clamping seat and a pressure plate fixedly connected to the telescopic end of the cylinder, wherein a plurality of grooves are formed on the bottom surface of the pressure plate. When clamping, the pressure plate is pressed from the bottom surface on the top surface of the wafer and is hung on the auxiliary pressure block from the top.

8. The wafer holding device according to claim 7, wherein: The first rotating drive member includes a first motor, and the second rotating drive member includes a second motor and a rotating seat connected to the output shaft of the second motor, wherein the first motor is fixedly arranged on the rotating seat and the output shaft is fixedly connected to the clamping component. When clamping, the first motor drives the clamping component and drives the clamping seat and the wafer to rotate synchronously.

9. The wafer holding device according to claim 8, wherein: The driving unit also includes a transverse driving component, which includes a horizontally extending slide rail and a slide seat slidably arranged on the slide rail. The second rotary driving component is slidably arranged on the slide seat up and down. The lifting driving component drives the second rotary driving component to slide up and down. As the wafer tilts up and down, the slide seat slides synchronously along the slide rail and drives the projection position of the center of the wafer on the horizontal plane to remain unchanged.

10. A wafer level electroplating device, characterized in that: It adopts the wafer clamping device according to any one of claims 1 to 9.

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