Host structure with simple design

Abstract

The utility model relates to the technical field of vehicle-mounted equipment, and discloses a host structure simple in design. The host structure comprises a top cover and a bottom shell which are fixedly connected, the top cover and the bottom shell are integrally formed, a circuit board is fixed between the top cover and the bottom shell, and a plurality of communication interfaces are formed in the connecting position of the top cover and the bottom shell; a plurality of heat dissipation columns are arranged on the top cover in a protruding mode. The top cover and the bottom shell are integrally formed, the types and the number of materials can be reduced, the assembling procedure is simplified, the production efficiency is improved, and therefore the material cost and the production and assembling cost are saved. The heat dissipation structure is changed into a cylinder from fins, air can reach the surface of each heat dissipation column from any direction, the heat dissipation efficiency is improved, meanwhile, other spaces of the top cover can be used for arranging other parts, and the space utilization rate of the top cover is improved.

Description

Technical Field

[0001] The present application relates to the technical field of vehicle-mounted equipment, and in particular to a host structure with a simple design. Background Art

[0002] With the rapid development of the automotive industry and computer technology, cars are increasingly equipped with in-car entertainment systems, allowing users to listen to music, navigate, and perform other functions while driving, enhancing the convenience of car use. Existing in-car entertainment system consoles consist of a U-frame, bottom shell, front and rear fenders, and other components. These components are numerous and complex to assemble, resulting in high material management and production costs. Furthermore, components can be easily missed during assembly, impacting the console's usability. Utility Model Content

[0003] The technical problem to be solved by this application is to optimize the existing system host to streamline the types and quantities of materials, save material costs and production and assembly costs, simplify the assembly process, and improve production efficiency.

[0004] In order to solve the above problems, the present application provides a host structure with a simple design, including a top cover and a bottom shell fixedly connected, the top cover and the bottom shell are respectively integrally formed, the circuit board is fixed between the top cover and the bottom shell, and several communication interfaces are provided at the connection between the top cover and the bottom shell; the top cover is protruding with several heat dissipation columns.

[0005] Preferably, the side walls facing each other of the top cover are respectively provided with a first abutting portion, and the side walls facing each other of the bottom shell are respectively provided with a first limiting portion. When the top cover is connected to the bottom shell, the outer wall of the first abutting portion abuts against the inner wall of the first limiting portion.

[0006] Preferably, the first abutting portion is provided with a chamfer.

[0007] Preferably, the other opposite side wall of the top cover is respectively provided with a second limiting portion, and the other opposite side wall of the bottom shell is respectively provided with a second abutting portion. When the top cover is connected to the bottom shell, the outer wall of the second abutting portion abuts against the inner wall of the second limiting portion.

[0008] Preferably, the bottom shell is provided with a protruding first supporting portion, and the first supporting portion abuts against the circuit board.

[0009] Preferably, the bottom shell is further provided with a second supporting portion, the second supporting portion is in contact with the circuit board, and the second supporting portion is provided with a connecting hole for a screw to pass through.

[0010] Preferably, a bending process hole is provided at the connection between the bottom wall and the side wall of the bottom shell.

[0011] Preferably, a mounting groove is provided on the side wall of the bottom shell.

[0012] Preferably, a side wall of the top cover is provided with a clearance groove, and the position of the clearance groove corresponds to the installation groove.

[0013] Compared with the prior art, this application has at least one of the following beneficial technical effects:

[0014] The top cover and bottom case are integrally molded, reducing the number and type of materials, simplifying the assembly process, and improving production efficiency, thereby saving material and assembly costs. The heat dissipation structure has been changed from fins to cylinders, allowing air to reach the surface of each heat sink from any direction, improving heat dissipation efficiency. Furthermore, the remaining space on the top cover can be used to accommodate other components, improving space utilization. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0016] Figure 1 This is a schematic diagram of the overall structure of the host structure in the embodiment of the present application;

[0017] Figure 2 This is a partial cross-sectional view of the host structure in an embodiment of the present application;

[0018] Figure 3 A cross-sectional view of the host structure from another perspective in an embodiment of the present application;

[0019] Figure 4 for Figure 3 Enlarged view of part A;

[0020] Figure 5 This is a structural diagram of the host structure from another perspective in an embodiment of the present application.

[0021] Explanation of the accompanying drawings: 1. Top cover; 11. Heat dissipation column; 12. First abutment portion; 121. Chamfer; 13. Second limiting portion; 14. Makeshift groove; 15. Battery slot; 2. Bottom shell; 21. First limiting portion; 22. Second abutment portion; 23. First supporting portion; 24. Second supporting portion; 241. Connecting hole; 25. Mounting slot; 3. Circuit board; 4. Communication interface; 5. Bending process hole. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0023] It will be understood that when used in this specification and the appended claims, the terms “comprises” and “comprising” indicate the presence of described features, integers, steps, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof.

[0024] It should also be understood that the terms used in this specification are only for the purpose of describing specific embodiments and are not intended to limit the present application. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms unless the context clearly indicates otherwise.

[0025] It should be further understood that the term "and / or" used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.

[0026] Please refer to Figures 1 to 5 The present invention provides a simple host structure that can be used in a car to allow people to listen to music, navigate, and perform other operations while driving, thereby improving the functionality and ease of use of the car. In other embodiments, the host structure can also be applied to other electronic devices.

[0027] Specifically, the host structure includes a top cover 1 and a bottom shell 2 that are fixedly connected. The top cover 1 and the bottom shell 2 are respectively integrally formed by sheet metal molds, which is less expensive than traditional die-casting molds. At the same time, the bottom shell 2 can add or subtract sheet metal materials according to different configurations to reduce the need to change the heat sink due to the addition or subtraction of configurations in the later stage. The circuit board 3 is fixed between the top cover 1 and the bottom shell 2, and the top cover 1, the circuit board 3 and the bottom shell 2 are fixedly connected by screws; a number of communication interfaces 4 are provided at the connection between the top cover 1 and the bottom shell 2, and the communication interface 4 is used to connect external devices. A number of heat dissipation columns 11 are protruding from the top wall of the top cover 1, and the heat dissipation columns 11 are used to dissipate heat from the host structure.

[0028] Here, the top cover 1 and bottom shell 2 are integrally formed, reducing the number and type of materials, simplifying the assembly process, and improving production efficiency, thereby saving material and assembly costs. The heat dissipation structure has been changed from fins to cylinders, allowing air to reach the surface of each heat dissipation column 11 from any direction, improving heat dissipation efficiency. Furthermore, the remaining space in the top cover 1 can be used to accommodate other components, improving space utilization.

[0029] In this embodiment, the main unit structure is a cube, and thus, the top wall of the top cover 1 and the bottom wall of the bottom shell 2 are both square. In other embodiments, the main unit structure can also be other shapes that meet actual needs, and thus, the shapes of the top cover 1 and the bottom shell 2 can also be changed accordingly.

[0030] Please refer to Figure 2 In one embodiment, the opposing side walls of the top cover 1 are each provided with a first abutting portion 12, and the opposing side walls of the bottom shell 2 are each provided with a first limiting portion 21. When the top cover 1 and the bottom shell 2 are connected, the outer wall of the first abutting portion 12 abuts the inner wall of the first limiting portion 21 to limit the opposing side walls of the top cover 1 and the bottom shell 2. Furthermore, the first abutting portion 12 is provided with a chamfer 121 on the side adjacent to the first limiting portion 21 to facilitate assembly of the first limiting portion 21 with the first abutting portion 12.

[0031] Please refer to Figure 3 and Figure 4 In one embodiment, the other opposing sidewalls of the top cover 1 are each provided with a second stopper 13, and the other opposing sidewalls of the bottom case 2 are each provided with a second abutment 22. When the top cover 1 and the bottom case 2 are connected, the outer walls of the second abutment 22 abut against the inner walls of the second stopper 13 to limit the position of the other opposing sidewalls of the top cover 1 and the bottom case 2. The top cover 1, circuit board 3, and bottom case 2 are then fixed together using screws, thereby improving the assembly precision of the host structure.

[0032] In one embodiment, a first support portion 23 is provided on the bottom wall of the bottom housing 2. The first support portion 23 is used to abut against the circuit board 3 and supports the circuit board 3 to improve the stability of the circuit board 3 during installation.

[0033] Please refer to Figure 5 In one embodiment, a plurality of second support portions 24 are provided along the bottom wall of the bottom housing 2, projecting inward from the outside along the edge. These second support portions 24 are spaced apart. The second support portions 24 are configured to abut against the circuit board 3. A screw hole 241 is defined through the middle of the second support portion 24 for passing a screw. The screw then passes through the screw hole 241 and the circuit board 3, securing the top cover 1.

[0034] Furthermore, a bending hole 5 is provided at the bend where the bottom wall of the bottom shell 2 connects to the side wall. During sheet metal processing, placing the bending hole 5 at the bend can disperse stress and prevent excessive stretching or compression of the material at the bend, thereby reducing the risk of deformation, cracking, and breakage of the bottom shell 2 and improving the processing quality of the bottom shell 2.

[0035] In one embodiment, the sidewall of the bottom case 2 defines a mounting slot 25, into which the SIM card can be inserted and connected to the circuit board 3. To facilitate SIM card removal, a clearance slot 14 is defined in the sidewall of the top cover 1. When the top cover 1 is connected to the bottom case 2, the position of the clearance slot 14 corresponds to the mounting slot 25 and is located directly above the mounting slot 25, allowing the user to remove the SIM card through the end of the SIM card that is located outside the main body structure.

[0036] In a specific embodiment, the top wall of the top cover 1 is further provided with a battery slot 15 for assembling batteries, eliminating the need to install batteries separately, further streamlining the types and quantities of materials, saving material costs and production and assembly costs, and further simplifying the assembly process.

[0037] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present application, and such modifications or substitutions should be included in the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of protection of the claims.

Claims

1. A host structure with a simple design, characterized by: It includes a top cover and a bottom shell that are fixedly connected. The top cover and the bottom shell are integrally formed. A circuit board is fixed between the top cover and the bottom shell. Several communication interfaces are provided at the connection between the top cover and the bottom shell. Several heat dissipation columns are protruded from the top cover.

2. A host structure with a simple design according to claim 1, characterized in that: The side walls facing each other of the top cover are respectively provided with a first abutting portion, and the side walls facing each other of the bottom shell are respectively provided with a first limiting portion. When the top cover is connected to the bottom shell, the outer wall of the first abutting portion abuts against the inner wall of the first limiting portion.

3. A host structure with a simple design according to claim 2, characterized in that: The first abutting portion is provided with a chamfer.

4. A host structure with a simple design according to claim 1 or 2, characterized in that: The other side wall opposite to the top cover is respectively provided with a second limiting portion, and the other side wall opposite to the bottom shell is respectively provided with a second abutting portion. When the top cover is connected to the bottom shell, the outer wall of the second abutting portion abuts against the inner wall of the second limiting portion.

5. A host structure with a simple design according to claim 1 or 2, characterized in that: The bottom shell is protruded with a first supporting portion, and the first supporting portion abuts against the circuit board.

6. A host structure with a simple design according to claim 5, characterized in that: The bottom shell is further provided with a second supporting portion, the second supporting portion is in contact with the circuit board, and the second supporting portion is provided with a connecting hole for screws to pass through.

7. A host structure with a simple design according to claim 1 or 2, characterized in that: A bending process hole is provided at the connection between the bottom wall and the side wall of the bottom shell.

8. A host structure with a simple design according to claim 1 or 2, characterized in that: The side wall of the bottom shell is provided with a mounting groove.

9. The host structure with a simple design according to claim 8, characterized in that: A side wall of the top cover is provided with a clearance groove, and the position of the clearance groove corresponds to the installation groove.

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