Cold stamping die with buffering and damping functions
By introducing a buffer and shock-absorbing component consisting of an elastic buffer layer, a shock-absorbing pad and a buffer pillar into the cold stamping die, the problem of damage to the die caused by impact and vibration is solved, higher stability and precision are achieved, the die life is extended and production costs are reduced.
Patent Information
- Application Number
- CN202421691366.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-17
- Publication Date
- 2025-09-26
- Estimated Expiration
- 2034-07-17
AI Technical Summary
Existing cold stamping dies have deficiencies in cushioning and shock absorption, which leads to damage and deformation of the dies, affecting product quality and precision, and shortening their service life.
A buffer and shock absorption component including an elastic buffer layer, a shock absorbing pad and a buffer pillar is designed. It absorbs vibration energy through elastic deformation and medium, and cooperates with the guide rod and limit block structure to form an integrated buffer and shock absorption system.
It improves the stability and service life of the mold, reduces mold wear, improves product precision and quality, and reduces production costs.
Smart Images
Figure CN223382401U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of molds, in particular to a cold stamping mold with buffering and shock-absorbing functions. Background Art
[0002] Cold stamping die refers to a special process equipment that processes various materials (metal or non-metal) into various parts (or semi-finished products) during the cold stamping process.
[0003] In industrial production, cold stamping dies are widely used in the manufacture of various parts. However, during the use of cold stamping dies, the processing operations often generate large impact forces and vibrations, which can damage and deform the dies, shorten their service life, and even cause vibrations in the finished product, resulting in errors and affecting product quality and precision. Existing dies have certain shortcomings in terms of cushioning and shock absorption, and cannot effectively address these issues. Therefore, there is a need for improved dies with cushioning and shock absorption functions. Utility Model Content
[0004] The purpose of the utility model is to provide a mold with a buffering and shock absorbing function, so as to effectively solve the problem of insufficient buffering and shock absorbing capacity of the existing mold.
[0005] The utility model is achieved through the following technical solutions:
[0006] A cold stamping die with a buffering and shock-absorbing function comprises an upper die, a lower die, and a buffering and shock-absorbing assembly. A circle of protrusions is arranged around the stamping areas of the upper die and the lower die, and a buffering and shock-absorbing assembly is fixed on the protrusions. The buffering and shock-absorbing assembly comprises an elastic buffer layer, a shock-absorbing pad, and a buffering pillar. The elastic buffer layer is tightly fitted to the relative surfaces of the upper die base and the lower die base, the shock-absorbing pad is located inside the elastic buffer layer, and the buffering pillars are evenly distributed in the elastic buffer layer.
[0007] Further,
[0008] The upper mold is connected to the upper mold base through a power rod. Guide rods connected to the upper mold base are provided on both sides of the upper mold. Guide rings are sleeved on the guide rods. Both sides of the upper mold are connected to the guide rings through connecting rods.
[0009] Further,
[0010] The other end of the guide rod is connected to the lower die base, and a groove is provided on the upper end surface of the lower die base. A slidable limit block is connected to the inside of the groove, and a shock-absorbing spring is fixedly connected to the bottom of the limit block. The lower end of the shock-absorbing spring is connected to the inner bottom wall of the groove.
[0011] Further,
[0012] Fixed blocks are provided on the inner and outer sides of the protrusion in four directions, and the buffer and shock-absorbing components are fixed on the protrusion through the fixed blocks.
[0013] Further,
[0014] Sealing gaskets are also provided around the peripheries of the upper mold and the lower mold.
[0015] Further,
[0016] The interior of the shock-absorbing pad is filled with gas or liquid.
[0017] Further,
[0018] The elastic buffer layer is made of at least one of rubber and polyester.
[0019] Further,
[0020] The buffer pillar includes at least one of a spring buffer pillar and a rubber buffer pillar.
[0021] The utility model has the following beneficial effects:
[0022] The utility model discloses a cold stamping die with a buffering and shock absorbing function. The buffering and shock absorbing component is composed of an elastic buffer layer, a shock absorbing pad, and a buffer pillar. The three form an integrated structure, so that the elastic buffering and pillar supporting functions in the buffering and shock absorbing component are better coordinated, thereby improving the overall stability of the die, achieving a smoother force transmission path, and achieving better buffering and supporting effects.
[0023] During the use of the mold, the shock-absorbing component absorbs the vibration generated by impact and collision, which reduces the impact and wear of the mold during use and extends the service life of the mold.
[0024] Because the vibration buffer component weakens the vibration, the workpiece is no longer dislocated due to vibration when it hits the mold, which makes the workpiece less accurate. This improves the processing accuracy and quality of the product to a certain extent, saves materials, and reduces production costs.
[0025] The cold stamping die has a simple structure, is easy to manufacture and maintain, and is suitable for a wide range of applications. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] The accompanying drawings described herein are used to provide a further understanding of the embodiments of the present invention, constitute a part of this application, and do not constitute a limitation of the embodiments of the present invention. In the accompanying drawings:
[0027] Figure 1 This is a schematic structural diagram of the utility model.
[0028] Figure 2This is a schematic diagram of the structure of the buffer and shock-absorbing assembly on the upper mold.
[0029] Figure 3 This is a schematic diagram of the structure of the buffer and shock-absorbing component on the lower mold.
[0030] Figure 4 This is a bottom view of the upper mold.
[0031] Figure 5 This is a top view of the lower mold.
[0032] Markings and corresponding parts names in the accompanying drawings:
[0033] 1-upper mold, 2-buffer shock-absorbing assembly, 3-lower mold, 31-support column, 21-elastic buffer layer, 22-shock-absorbing pad, 23-buffer pillar, 4-upper mold base, 5-connecting rod, 6-power rod, 7-lower mold base, 71-groove, 72-limiting block, 73-shock-absorbing spring, 8-guide rod, 9-guide ring, 10-stamping area, 11-fixed block, 12-protrusion. DETAILED DESCRIPTION
[0034] The present invention will be further described in detail below in conjunction with the embodiments and drawings, but the implementation manner of the present invention is not limited thereto.
[0035] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "longitudinal", "lateral", "horizontal", "inside", "outside", "front", "back", "top", "bottom", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, or are the orientation or position relationship in which the utility model product is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.
[0036] In the description of the present invention, it should also be noted that, unless otherwise expressly specified or limited, the terms "disposed," "opened," "installed," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to mechanical connections or electrical connections; they may refer to direct connections or indirect connections through an intermediate medium; and they may refer to internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances. Example
[0037] See also Figures 1 to 5 :
[0038] A mold with a buffering and shock-absorbing function includes an upper mold 1, a lower mold 3, and a buffering and shock-absorbing component 2. There is a circle of protrusions 12 around the stamping area 10 of the upper mold 1 and the lower mold 3, and the buffering and shock-absorbing component 2 is fixed on the protrusion 12. The impact and shock-absorbing component 2 includes an elastic buffer layer 21, a shock-absorbing pad 22, and a buffering pillar 23. The elastic buffer layer 21 is tightly fitted on the relative surfaces of the upper mold base 4 and the lower mold base 7. The shock-absorbing pad 22 is located inside the elastic buffer layer 21, and the buffering pillars 23 are evenly distributed in the elastic buffer layer 21.
[0039] Further,
[0040] The upper mold 1 is connected to the upper mold base 4 through a power rod 6. Guide rods 8 connected to the upper mold base 4 are provided on both sides of the upper mold 1. Guide rings 9 are sleeved on the guide rods 8. Both sides of the upper mold 1 are connected to the guide rings 9 through connecting rods 5. The guide rods 8 can make the upper mold 1 correspond to the lower mold 3.
[0041] Further,
[0042] The other end of the guide rod 8 is connected to the lower die base 7. A groove 71 is provided on the upper end surface of the lower die base 7. A slidable limit block 72 is connected to the inside of the groove 71. A shock-absorbing spring 73 is fixedly connected to the bottom of the limit block 72. The lower end of the shock-absorbing spring 73 is connected to the inner bottom wall of the groove 71.
[0043] Further,
[0044] A support column 31 is provided below the lower mold 3 , and the support column 31 corresponds to the groove 71 provided on the upper end surface of the lower mold base 71 , and the lower end of the support column 31 extends into the interior of the groove 71 and is fixedly connected to the top of the limit block 72 .
[0045] Further,
[0046] The protrusion 10 is provided with fixing blocks 11 on the inner and outer sides in four directions, and the buffer and shock absorbing assembly 2 is fixed on the protrusion 10 through the fixing blocks 11 .
[0047] Further,
[0048] Sealing gaskets are also provided around the upper mold 1 and the lower mold 3 to prevent dust and other impurities from entering the buffer and shock-absorbing components and affecting their performance. At the same time, the sealing gaskets can also play a role in partial shock absorption.
[0049] Further,
[0050] The elastic buffer layer 21 is made of at least one of rubber and polyester.
[0051] Further,
[0052] The buffer pillar 23 includes at least one of a spring buffer pillar and a rubber buffer pillar.
[0053] The principle of this utility model is:
[0054] When mold processing is being performed, the power rod 6 gives power to the upper mold 1, and moves along the guide rod 8 with the guide ring 9 toward the lower mold 3. When the upper mold 1 and the lower mold 3 collide, the impact force and vibration generated will first act on the elastic buffer layer 21 in the buffer and shock-absorbing component 2. The elastic buffer layer 21 undergoes elastic deformation, absorbs part of the energy, weakens the vibration intensity, and increases the service life of the mold. At the same time, it also avoids the upper mold 1 from directly colliding with the processed object, reducing the noise generated during processing.
[0055] When external vibration or pressure acts on the shock-absorbing pad 22, the gas or liquid inside is compressed. By utilizing the characteristics of the gas or liquid medium, the gas has a certain compressibility and can deform when impacted, absorbing and dispersing energy, thereby achieving a shock-absorbing effect; the liquid can have a certain damping effect when it flows under impact, and can evenly disperse the pressure, making the shock-absorbing effect more stable and continuous.
[0056] The buffer pillar 23 expands and contracts under the action of impact force, providing a stable buffering effect and also limiting a pressure limit value for the buffer shock-absorbing component 2 to prevent the shock-absorbing pad 22 from breaking, causing air or liquid leakage, and causing the shock-absorbing pad 22 to lose its function.
[0057] The elastic buffer layer 21, the shock-absorbing pad 22, and the buffer pillar 34 form an integrated structure. The integrated structure can ensure better synergy between the elastic buffer layer and the buffer pillar, improve the overall stability of the mold, and also achieve a smoother force transmission path, making the buffering and support effects better.
[0058] At the same time, the impact force exerted on the lower mold 3 acts on the shock-absorbing spring 73 in the lower mold base 7 through the support column 31, and the shock-absorbing spring 73 undergoes expansion and contraction deformation, further cushioning the lower mold 3, reducing the impact force exerted on the lower mold 3 and increasing its service life.
[0059] After stamping is completed, the shock-absorbing spring 73, no longer under the action of force, returns to its original position. During the recovery process, it generates an upward force, which pushes the limit block 71 and the support column 31 to restore the lower mold 3. This combined buffering and shock-absorbing method greatly reduces the impact force and vibration on the mold, protects the structural integrity of the mold, and improves the quality and precision of the product.
[0060] In the present invention, the elastic buffer layer may be made of other materials besides rubber, such as a highly elastic plastic polyurethane.
[0061] In addition to the spring buffer pillar and the rubber buffer pillar, the buffer pillar in the utility model can also be made of other materials, such as a polyurethane buffer pillar.
[0062] The specific implementation methods described above further illustrate the purpose, technical solutions and beneficial effects of the utility model in detail. It should be understood that the above description is only a specific implementation method of the utility model and is not intended to limit the scope of protection of the utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the utility model should be included in the scope of protection of the utility model.
Claims
1. A cold stamping die with a buffering and shock absorbing function, comprising an upper die (1) and a lower die (3), characterized in that: The invention also includes a buffering and shock absorbing component (2), wherein a circle of protrusions (12) are arranged around the stamping area (10) of the upper mold (1) and the lower mold (3), and a buffering and shock absorbing component (2) is fixed on the protrusion (12), and the buffering and shock absorbing component (2) includes an elastic buffer layer (21), a shock absorbing pad (22), and a buffering pillar (23), wherein the elastic buffer layer (21) is tightly fitted on the relative surfaces of the upper mold base (4) and the lower mold base (7), the shock absorbing pad (22) is located inside the elastic buffer layer (21), and the buffering pillars (23) are evenly distributed in the elastic buffer layer (21).
2. The cold stamping die with a buffering and shock absorbing function according to claim 1, characterized in that: The upper mold (1) is connected to the upper mold base (4) through a power rod (6). Guide rods (8) connected to the upper mold base (4) are provided on both sides of the upper mold (1). Guide rings (9) are sleeved on the guide rods (8). Both sides of the upper mold (1) are connected to the guide rings (9) through connecting rods (5).
3. The cold stamping die with a buffering and shock absorbing function according to claim 2, characterized in that: The other end of the guide rod (8) is connected to the lower die base (7), and the upper end surface of the lower die base (7) is provided with a groove (71). The interior of the groove (71) is connected to a slidable limit block (72), and the bottom of the limit block (72) is fixedly connected to a shock-absorbing spring (73), and the lower end of the shock-absorbing spring (73) is connected to the inner bottom wall of the groove (71).
4. The cold stamping die with a buffering and shock absorbing function according to claim 3, characterized in that: A support column (31) is provided below the lower mold (3), and the support column (31) corresponds to a groove (71) provided on the upper end surface of the lower mold base (7), and the lower end of the support column (31) extends into the interior of the groove (71) and is fixedly connected to the top of the limit block (72).
5. The cold stamping die with a buffering and shock absorbing function according to claim 1, characterized in that: The protrusion (12) is provided with fixing blocks (11) on the inner and outer sides in four directions, and the buffer shock absorbing component (2) is fixed on the protrusion (12) via the fixing blocks (11).
6. The cold stamping die with a buffering and shock absorbing function according to claim 1, characterized in that: Sealing gaskets are also provided around the upper mold (1) and the lower mold (3).
7. The cold stamping die with a buffering and shock absorbing function according to claim 2, characterized in that: The shock-absorbing pad (22) is filled with gas or liquid.
8. The cold stamping die with a buffering and shock absorbing function according to claim 2, characterized in that: The elastic buffer layer (21) is made of at least one of rubber and polyester.
9. The cold stamping die with a buffering and shock absorbing function according to claim 2, characterized in that: The buffer pillar includes at least one of a spring buffer pillar and a rubber buffer pillar.