Sensor element package and image display device including the same

Abstract

The utility model provides a sensor element packaging piece and an image display device comprising the same, and the sensor element packaging piece comprises a sensor element which comprises a touch sensing electrode and an antenna unit; and a circuit board bonded to the sensor element, the circuit board including: a core layer including a first surface and a second surface facing each other; the first conductive layer comprises a first touch sensor signal wire and a first antenna signal wire which are distributed on the first surface of the core layer and on the same level; the second conductive layer comprises a second touch sensor signal wiring and a second antenna signal wiring which are distributed on the second surface of the core layer at the same level; an antenna via structure penetrating the core layer and connecting the first antenna signal wiring and the second antenna signal wiring to each other; and a touch sensor via hole structure penetrating through the core layer and connecting the first touch sensor signal wiring and the second touch sensor signal wiring to each other.

Description

Technical Field

[0001] The utility model relates to a sensor element package and an image display device including the same. More specifically, it relates to a sensor element package including a sensor element and a circuit board and an image display device including the same. Background Art

[0002] Recently, with the development of the information society, wireless communication technologies such as Wi-Fi and Bluetooth are combined with image display devices and implemented in the form of, for example, smartphones, etc. In this case, an antenna may be coupled to the image display device to perform a communication function.

[0003] Recently, with the evolution of mobile communication technology, for example, an antenna for performing communication in a high frequency or ultra-high frequency band corresponding to 3G to 5G or higher may be incorporated into the image display device.

[0004] On the other hand, electronic devices are being developed that combine a touch panel or touch sensor, which serves as an input device that allows a user to input a command by selecting an indication displayed on a screen with a hand or an object, with an image display device to simultaneously realize an image display function and an information input function. For example, as disclosed in Korean Patent Publication No. 2014-0092366, a touch screen panel is being developed in which a touch sensor is combined with various image display devices.

[0005] When the antenna structure is configured together with the touch sensor, signal interference may occur between the antenna and the touch sensing electrodes. In addition, mutual signal interference may also occur in the circuit structures used to respectively supply power to the antenna structure and the touch sensor.

[0006] For example, Korean Patent Laid-Open No. 2003-0095557 discloses an antenna structure built into a portable terminal, but fails to consider compatibility with other electronic components such as a touch sensor. Utility Model Content

[0007] An object of the present invention is to provide a sensor element package with improved signal transmission and reception reliability and efficiency.

[0008] An object of the present invention is to provide an image display device including a sensor element package having improved signal transmission and reception reliability and efficiency.

[0009] The technical solutions of the present invention for solving the above-mentioned problems are as follows.

[0010] The sensor element package of the present invention includes: a sensor element, which includes a touch sensing electrode and an antenna unit; and a circuit board, which is bonded to the sensor element, the circuit board including: a core layer, which includes a first surface and a second surface facing each other; a first conductive layer, which includes a first touch sensor signal wiring and a first antenna signal wiring distributed at the same level on the first surface of the core layer; a second conductive layer, which includes a second touch sensor signal wiring and a second antenna signal wiring distributed at the same level on the second surface of the core layer; an antenna via structure, which passes through the core layer and connects the first antenna signal wiring and the second antenna signal wiring to each other; and a touch sensor via structure, which passes through the core layer and connects the first touch sensor signal wiring and the second touch sensor signal wiring to each other, respectively.

[0011] In which, the sensor element also includes a touch sensor pad electrically connected to the touch sensing electrode, and an antenna pad electrically connected to the antenna unit, the first touch sensor signal wiring of the circuit board is respectively connected to the touch sensor pads, and the first antenna signal wiring of the circuit board is connected to the antenna pad.

[0012] The touch sensor pad and the antenna pad are arranged at one end of the sensor element to form a single pad row.

[0013] The sensor element further includes: a blocking pad included in the single pad row and inserted between adjacent touch sensor pads among the touch sensor pads, or a protective pad configured at an end of the single pad row.

[0014] The sensor element further includes: a routing line connecting the touch sensing electrode and the touch sensor pad; and a blocking line extending from the blocking pad between adjacent routing lines.

[0015] The sensor element further includes a ring-shaped protection line extending from the protection pad and surrounding the periphery of the touch sensing electrode.

[0016] The sensor element package further includes an anisotropic conductive film that bonds the single pad row to the first conductive layer of the circuit board.

[0017] The antenna unit includes a radiator and a transmission line extending from the radiator and connected to the antenna pad.

[0018] The plurality of antenna units are arranged in a row direction, and the antenna pad is independently connected to each of the antenna units.

[0019] The transmission lines connected to the respective antenna units of the plurality of antenna units have a zigzag shape and have the same length.

[0020] At least one of the touch sensor pads is configured between the antenna pads connected to adjacent antenna units among the antenna units.

[0021] The sensor element package also includes: a touch sensor drive circuit / touch sensor connection structure, which is electrically connected to the second touch sensor signal wiring on the second surface of the core layer; and an antenna drive circuit / antenna connection structure, which is electrically connected to the second antenna signal wiring on the second surface of the core layer.

[0022] The antenna driving circuit / antenna connection structure includes an antenna driving integrated circuit chip or an antenna connector, and the touch sensor driving circuit / touch sensor connection structure includes a touch sensor driving integrated circuit chip or a touch sensor connector.

[0023] The circuit board further includes a middle ground layer, which is arranged between the first conductive layer and the second conductive layer in the core layer.

[0024] The antenna via structure and the touch sensor via structure are electrically separated from the middle ground layer and pass through the middle ground layer.

[0025] The sensor element further includes a substrate layer, and the touch sensing electrodes and the antenna unit are arranged together at the same level on an upper surface of the substrate layer.

[0026] The substrate layer includes an active area where the touch sensing electrodes are distributed, and a peripheral area surrounding the active area, and the antenna unit is partially configured on the active area.

[0027] According to another aspect of the present invention, an image display device is provided, comprising: a display panel; and the above-mentioned sensor element package.

[0028] The effects of the utility model are as follows.

[0029] According to the embodiments of the present invention, the radiator and the sensing electrode are arranged together in the active area of ​​the sensor element, thereby improving space efficiency. In addition, the touch sensor pad and the antenna pad are arranged together in the bonding area, so that power supply and signal transmission can be performed through a single circuit board.

[0030] In an exemplary embodiment, the circuit board may have a multilayer structure including a first conductive layer and a second conductive layer, and each of the first conductive layer and the second conductive layer may include antenna signal wiring and touch signal wiring. By connecting the first conductive layer and the second conductive layer to each other through an antenna via structure and a touch via structure, the reliability and efficiency of power supply to the antenna pad and the touch sensor pad can be improved through a single circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 is a schematic plan view showing a sensor element of an exemplary embodiment.

[0032] Figure 2 FIG. 1 is a schematic cross-sectional view illustrating a touch sensing electrode structure of a sensor element according to an exemplary embodiment.

[0033] Figure 3 and Figure 4 is a schematic cross-sectional view illustrating a sensor element package according to an exemplary embodiment.

[0034] Figure 5 is a schematic partially enlarged plan view showing a sensor element package according to an exemplary embodiment.

[0035] Figure 6 and Figure 7 is a schematic cross-sectional view illustrating a sensor element package according to an exemplary embodiment.

[0036] Figure 8 and Figure 9 They are respectively a schematic plan view and a cross-sectional view illustrating an image display device according to an exemplary embodiment.

[0037] Reference numerals

[0038] 100: Base material layer, 110: First sensing electrode, 115: Merging portion, 130: Second sensing electrode, 135: Bridge electrode, 140: Trace, 142: First trace, 144: Second trace, 150: Touch sensor pad, 152: First touch sensor pad, 154: Second touch sensor pad, 180: Joint intermediate structure, 200: Antenna unit, 210: Radiator, 220: Transmission line, 250: Antenna pad, 300: Circuit board, 310: Core layer, 320: First Conductive layer, 322: First antenna signal wiring, 324: Antenna via structure, 325: First touch sensor signal wiring, 327: Touch sensor via structure, 330: Second conductive layer, 332: Second antenna signal wiring, 335: Second touch sensor signal wiring, 340: Antenna conductive intermediate structure, 350: Antenna drive circuit / antenna connection structure, 360: Touch sensor conductive intermediate structure, 370: Touch sensor drive circuit / touch sensor connection structure, 390: Middle ground layer. DETAILED DESCRIPTION

[0039] An embodiment of the present invention provides a sensor element package, comprising: a sensor element including an antenna unit and a sensing electrode; and a circuit board. In addition, an image display device including the sensor element package is also provided.

[0040] The antenna unit may be, for example, a microstrip patch antenna fabricated in the form of a transparent film. A sensor element including the antenna unit may be used, for example, in a communication device for high-frequency or ultra-high-frequency (e.g., 3G, 4G, 5G, or higher) mobile communications. However, the use of the sensor element is not limited to image display devices; the sensor element may also be applied to various structures such as vehicles, household appliances, and buildings.

[0041] The following is a more detailed description of the embodiments of the present invention with reference to the accompanying drawings. However, the following drawings attached to this specification illustrate preferred embodiments of the present invention and, together with the above-mentioned contents of the present invention, serve to further understand the technical concept of the present invention. Therefore, the present invention should not be limited to the matters described in such drawings.

[0042] The terms "first", "second", "one side", "the other side", "one end", "the other end", "top surface", "bottom surface", "upper part", "lower part", "column direction", "row direction", etc. used in this specification do not limit the absolute position or order, but are used as relative meanings to distinguish different components or parts from each other.

[0043] The term "row direction" used in this specification may correspond to the width direction parallel to the active surface or display surface of a sensor element or image display device. The term "column direction" may be the length direction parallel to the active surface or display surface, or may be a direction perpendicular to the row direction.

[0044] Figure 1 is a schematic plan view showing a sensor element of an exemplary embodiment. Figure 2 FIG. 1 is a schematic cross-sectional view illustrating a touch sensing electrode structure of a sensor element according to an exemplary embodiment. Figure 2 It is along Figure 1 A cross-sectional view taken along the thickness direction along the II' line.

[0045] Reference Figure 1 and Figure 2 The sensor element may include a substrate layer 100 , touch sensing electrodes 110 and 130 (hereinafter referred to as sensing electrodes) configured on the substrate layer 100 , and an antenna unit 200 .

[0046] The substrate layer 100 may include a support layer, an interlayer insulating layer, or a film-type substrate for forming the sensing electrodes 110 and 130 and the antenna unit 200. For example, the substrate layer 100 may be provided as a dielectric layer of the antenna unit 200.

[0047] For example, the substrate layer 100 may include a transparent resin film, which includes: polyester resins such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate, and polybutylene terephthalate; cellulose resins such as diacetyl cellulose and triacetyl cellulose; polycarbonate resins; acrylic resins such as polymethyl (meth)acrylate and polyethyl (meth)acrylate; styrene resins such as polystyrene and acrylonitrile-styrene copolymer; polyolefin resins such as polyethylene, polypropylene, polyolefins with a ring system or norbornene structure, and ethylene-propylene copolymer; vinyl chloride resins; amide resins such as nylon and aromatic polyamide; imide resins; polyethersulfone resins; sulfone resins; polyetheretherketone resins; polyphenylene sulfide resins; vinyl alcohol resins; vinylidene chloride resins; vinyl butyral resins; allyl resins; polyoxymethylene resins; epoxy resins; polyurethane or acrylic polyurethane resins; silicone resins, etc. These can be used alone or in combination of two or more.

[0048] In some embodiments, the substrate layer 100 may include an adhesive film such as an optically clear adhesive (OCA), an optically clear resin (OCR), or the like.

[0049] In some embodiments, the base material layer 100 may include an inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride, glass, or the like.

[0050] In one embodiment, the substrate layer 100 may be provided as a substantially single layer.

[0051] In one embodiment, the substrate layer 100 may include a multilayer structure of at least two layers. For example, the substrate layer 100 may include a lower substrate and a dielectric layer, and may include an adhesive layer located between the lower substrate and the dielectric layer.

[0052] The substrate layer 100 can form an impedance or inductance for the antenna unit 200 to adjust the frequency band that the antenna unit 200 can drive or sense. In some embodiments, the dielectric constant of the substrate layer 100 can be adjusted to a range of approximately 1.5 to 12. When the dielectric constant exceeds approximately 12, the driving frequency is excessively reduced, and driving in a high frequency band may not be achieved.

[0053] In one embodiment, a ground layer (not shown) may be disposed below the bottom surface of the base material layer 100 .

[0054] In one embodiment, a conductive component of an image display device or a display panel to which the sensor element is applied may be provided as the ground layer.

[0055] For example, the conductive member may include electrodes or wirings such as gate electrodes, source / drain electrodes, pixel electrodes, common electrodes, data lines, scan lines, etc. included in a thin film transistor (TFT) array panel.

[0056] In one embodiment, a metal member such as a SUS plate arranged on the rear surface portion of the image display device, a sensor component such as a digitizer, a heat sink, etc. may be provided as the ground layer.

[0057] The upper surface of the substrate layer 100 may include an active area AA and a peripheral area PA around the active area AA. The sensing electrodes 110 and 130 and the antenna unit 200 may be arranged on the active area AA of the substrate layer 100.

[0058] Sensing electrodes 110 and 130 may be disposed on the upper surface of substrate layer 100 in the active area AA. When a user touches the active area AA, a capacitance change may occur due to sensing electrodes 110 and 130. Accordingly, the physical touch is converted into an electrical signal, thereby performing the intended sensing function.

[0059] The sensing electrodes 110 and 130 may include a first sensing electrode 110 and a second sensing electrode 130. The first sensing electrode 110 and the second sensing electrode 130 may be arranged in a direction intersecting each other. The first sensing electrode 110 and the second sensing electrode 130 may be located on the same layer or at the same level on the upper surface of the substrate layer 100.

[0060] For example, the first sensing electrodes 110 may be arranged along a column direction (eg, a Y direction). The first sensing electrodes 110 may be connected along the column direction by merging portions 115. The merging portions 115 may be integrally connected to the first sensing electrodes 110 and may be provided as a substantially single component.

[0061] The plurality of first sensing electrodes 110 are connected by the merging portion 115 , thereby defining a sensing channel column extending along the column direction. In addition, the plurality of sensing channel columns may be arranged along the row direction (eg, the X direction).

[0062] The second sensing electrodes 130 may be arranged along the row direction. Each second sensing electrode 130 may have a spaced-apart island pattern. Second sensing electrodes 130 adjacent to each other in the second direction may be electrically connected to each other via a bridge electrode 135 .

[0063] For example, a pair of second sensing electrodes 130 adjacent to each other across a merging portion 115 included in the sensing channel column may be electrically connected to each other via a bridge electrode 135. Accordingly, a sensing channel row may be defined by the second sensing electrodes 130 and bridge electrodes 135 connected in the row direction. Furthermore, a plurality of sensing channel rows may be arranged along the column direction.

[0064] like Figure 2 As shown, an interlayer insulating layer 120 is formed to cover the first sensing electrodes 110 and the second sensing electrodes 130 , and the bridge electrode 135 can penetrate the interlayer insulating layer 120 to connect adjacent second sensing electrodes 130 .

[0065] In some embodiments, a protective layer 190 covering the bridge electrode 135 may be formed on the interlayer insulating layer 120. The interlayer insulating layer 120 and the protective layer 190 may include the aforementioned resin material or inorganic insulating material and may together cover the sensing electrodes 110 and 130 and the antenna unit 200. The interlayer insulating layer 120 and the protective layer 190 may be removed from the bonding area BA to expose the pad.

[0066] Although Figure 1The diagram shows that the sensing electrodes 110 and 130 each have a diamond pattern shape, but the shapes of the sensing electrodes 110 and 130 can be appropriately changed in consideration of pattern density, compatibility with the optical characteristics of the image display device, and the arrangement of the antenna unit 200. For example, the sensing electrodes 110 and 130 can be formed to have a wavy outline.

[0067] Although Figure 1 The column direction sensing electrodes are shown as being integrally connected through the merging portion, and the row direction sensing electrodes are connected through the bridge electrode, but the column direction and row direction are used relatively to refer to two different intersecting directions and are not intended to limit specific directions.

[0068] In addition, for Figure 1 For ease of description, only a portion of the number of sensing channel rows and sensing channel columns, as well as the number of sensing electrodes included therein, are shown and may be expanded according to the area of ​​the active area AA.

[0069] The area of ​​the upper surface of the substrate layer 100 excluding the active area AA can be defined as a peripheral area PA. The peripheral area PA can be defined as an area at least partially surrounding the active area A. The peripheral area PA can include a frame area of ​​the image display device and can include a bonding area BA where pads are arranged. The active area AA can overlap with the display area of ​​the image display device.

[0070] The sensor element may further include traces 140 and touch sensor pads 150 .

[0071] Routes 140 may branch from each sensing channel row and column and extend over the peripheral area PA. Routes 140 may include first routes 142 branching from sensing channel columns and second routes 144 branching from sensing channel rows. Routes 140 may include conductive materials and / or stacked structures that are substantially the same as or similar to those of sensing electrodes 110 and 130.

[0072] In some embodiments, the second traces 144 may be arranged in a double-routing manner and may be alternately distributed along the row direction on both sides of the peripheral area PA.

[0073] For example, the second traces 144 may be alternately arranged at the two side portions along the column direction. The second traces 144 may branch from one end of one of the sensing channel rows, and may branch from the other end of the sensing channel row adjacent to the one sensing channel row.

[0074] This dual wiring arrangement reduces the area of ​​the peripheral area PA on both sides while ensuring a sufficient active area AA. Furthermore, by reducing the variation in the length of the second trace 144, resistance / sensing uniformity can be improved. Furthermore, by distributing the conductive lines on both sides, the stress generated by the folding of the sensor element can be evenly distributed.

[0075] In some embodiments, the first traces 142 may branch off from one end of the sensing channel column adjacent to the bonding area BA. Accordingly, the length of the first traces 142 may be shortened to increase sensing / signal transmission speed.

[0076] In one embodiment, a portion of the first trace 142 may branch from the other end of the sensing channel row and extend to the bonding area BA.

[0077] like Figure 1 and Figure 2 As shown, the sensing electrodes 110 and 130 may be arranged in a mutual capacitance manner.

[0078] In some embodiments, the sensing electrodes 110 and 130 can be arranged in a self-capacitance arrangement. In this case, each sensing electrode 110 and 130 can have an independent island pattern, and the trace 140 can branch from each sensing electrode 110 and 130 having an island pattern. Furthermore, the merging portion 115 and the bridge electrode 135 can be omitted.

[0079] The traces 140 may extend over the peripheral area PA and gather in the bonding area BA. The touch sensor pads 150 connected to the end portions of the traces 140 may be disposed within the bonding area BA.

[0080] The touch sensor pads 150 may include: a first touch sensor pad 152 electrically connected to each of the sensing channel columns through the first traces 142 ; and a second touch sensor pad 154 electrically connected to each of the sensing channel rows through the second traces 144 .

[0081] In some embodiments, the blocking pads 151 and the guard pads 153 may be disposed adjacent to the touch sensor pads 150. The blocking pads 151 and the guard pads 153 may not be electrically or physically connected to the traces 140. The blocking pads 151 and the guard pads 153 may be independently arranged and not connected to the touch sensing electrodes 110 and 130, the first touch sensor pads 152, and the second touch sensor pads 154, but may be disposed as components that improve the reliability of touch sensing / driving.

[0082] The blocking pad 151 can be disposed between adjacent first touch sensor pads 152 and second touch sensor pads 154. For example, a plurality of first touch sensor pads 152 can be arranged along the row direction to form a first touch pad row, and a plurality of second touch sensor pads 154 can be arranged along the row direction to form a second touch pad row. The blocking pad 151 can be inserted between the first touch pad row and the second touch pad row.

[0083] The blocking pads 151 improve the independence of currents and signals in the sensing channel rows and the sensing channel columns, and prevent mutual interference between the driving current and the receiving current.

[0084] The protection pad 153 may be disposed at an end of a pad row provided in the bonding area BA. For example, the protection pad 153 may be an outermost pad included in the pad row.

[0085] In some embodiments, protection pads 153 may be disposed at both ends of the pad row.

[0086] According to an exemplary embodiment, the blocking line 141 and the protection line 143 may be respectively connected to the blocking pad 151 and the protection pad 153. The blocking line 141 and the protection line 143 may extend from the blocking pad 151 and the protection pad 153 within the peripheral area PA.

[0087] like Figure 1 As shown, the area where the first trace 142 extends along the row direction and the area where the second trace 144 extends along the row direction can be distinguished by the blocking line 141. The blocking line 141 prevents signal conflict between the first trace 142 and the second trace 144, and prevents mutual interference between the driving current and the receiving current.

[0088] The shield line 143 can extend to at least partially surround the active area AA. For example, the shield line 143 can extend continuously between the shield pads 153 arranged at the two ends of the pad row to form a loop. Accordingly, the mutual interference between the touch signal in the active area AA and external noise can be reduced or shielded as a whole.

[0089] The antenna unit 200 may include a radiator 210 and a transmission line 220 .

[0090] For example, the radiator 210 may have a polygonal plate shape.

[0091] For example, the transmission line 220 may have a smaller width than the radiator 210 and may be connected to one end portion or one side of the radiator 210. The radiator 210 and the transmission line 220 may be formed as a single member integrally connected to each other.

[0092] The target resonant frequency of the antenna unit 200 can be adjusted according to the shape and size of the radiator 210. For example, the radiator 210 can be designed to radiate in 3G, 4G, 5G, or higher high-frequency / ultra-high-frequency bands. For example, the radiator 210 can achieve radiation bands above approximately 0.5 GHz, above approximately 1 GHz, above approximately 10 GHz, above approximately 20 GHz, above approximately 30 GHz, or above approximately 40 GHz.

[0093] The antenna pad 250 may be arranged in the bonding area BA together with the touch sensor pad 150 . An antenna power supply / driving signal for the antenna unit 200 may be transmitted from the antenna pad 250 to the transmission line 220 .

[0094] In some embodiments, transmission line 220 may have a variable width. Figure 1 As shown, the transmission line 220 may include an expanded line portion 225 having a larger width at an end portion adjacent to the radiator 210. The expanded line portion 225 can suppress signal loss from the antenna pad 250 to the radiator 210 and facilitate impedance matching with the radiator 210.

[0095] Each transmission line 220 has a zigzag shape, and the antenna pads 250 can be effectively gathered within the bonding area BA. For example, the transmission lines 220 can each include two bends.

[0096] In some embodiments, the lengths of the transmission lines 220 of the antenna units 200 may be substantially the same. In this case, the phase of the signal applied to each antenna unit 200 can be uniformed. Therefore, phase interference can be suppressed, and radiation in a desired frequency band can be achieved with high reliability.

[0097] According to an exemplary embodiment, the touch sensor pads 150 and the antenna pads 250 may form a single pad row at one end of the sensor element, and the single pad row may include a blocking pad 151 and a guard pad 153 .

[0098] The sensing electrodes 110, 130, the trace 140, and / or the antenna unit 200 may include silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), tin (Sn), or an alloy containing at least one of these. These may be used alone or in combination of two or more.

[0099] In one embodiment, to achieve low resistance and fine line width, the sensing electrodes 110, 130, the traces 140 and / or the antenna unit 200 may include silver (Ag) or a silver alloy (e.g., a silver-palladium-copper (APC) alloy), or copper (Cu) or a copper alloy (e.g., a copper-calcium (CuCa) alloy).

[0100] In some embodiments, the sensing electrodes 110 , 130 , traces 140 and / or the antenna unit 200 may include transparent conductive oxides such as indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (ITZO), zinc oxide (ZnOx).

[0101] In some embodiments, the sensing electrodes 110, 130, traces 140, and / or antenna unit 200 may include a stacked structure of a transparent conductive oxide layer and a metal layer, such as a two-layer structure of a transparent conductive oxide layer and a metal layer, or a three-layer structure of a transparent conductive oxide layer, a metal layer, and a transparent conductive oxide layer. In this case, while the metal layer improves flexibility, signal transmission speed can be increased by reducing resistance, and the transparent conductive oxide layer can improve corrosion resistance and transparency.

[0102] The sensing electrodes 110, 130, traces 140 and / or antenna unit 200 may include blackened portions, thereby reducing the reflectivity on the surfaces of the sensing electrodes 110, 130, traces 140 and / or antenna unit 200, thereby reducing light reflections that make the pattern visible.

[0103] In one embodiment, the surface of the metal layer included in the sensing electrodes 110, 130, the trace 140, and / or the antenna unit 200 can be converted into a metal oxide or metal sulfide to form a black layer. In one embodiment, a black layer such as a black material coating or plating can be formed on the sensing electrodes 110, 130, the trace 140, and / or the antenna unit 200 or the metal layer. The black material or plating can include silicon, carbon, copper, molybdenum, tin, chromium, molybdenum, nickel, cobalt, or oxides, sulfides, alloys containing at least one of these.

[0104] The composition and thickness of the blackened layer can be adjusted in consideration of the reflectivity reduction effect and antenna radiation characteristics.

[0105] In one embodiment, the sensing electrodes 110 and 130 and the radiator 210 may include a mesh structure, and accordingly, the sensing electrodes 110 and 130 and the radiator 210 may be prevented from being visually visible to the user in the active area AA.

[0106] In one embodiment, at least a portion of the transmission line 220 may include a solid structure formed of the above metal or alloy. Accordingly, an increase in resistance between the antenna unit 200 and the antenna pad 250 may be suppressed, and power supply efficiency may be improved.

[0107] The antenna unit 200 may be disposed in the active area AA and partially disposed in the peripheral area PA. For example, the transmission line 220 may be disposed in the peripheral area PA. In one embodiment, the transmission line 220 may extend throughout the active area AA and the peripheral area PA.

[0108] In one embodiment, the transmission line 220 may also share the mesh structure. The transmission line 220 may have a partially solid structure.

[0109] In one embodiment, the sensing electrodes 110 and 130 and / or the radiator 210 may include a solid thin-film transparent metal structure, thereby further improving the sensing sensitivity and radiation performance.

[0110] The touch sensor pad 150 and the antenna pad 250 may have a solid structure formed of the above metal or alloy, and accordingly, the bonding resistance with the circuit board 300 may be reduced.

[0111] In an exemplary embodiment, the sensing electrodes 110 and 130 and the antenna unit 200 may be disposed on the same layer or at the same level. For example, the sensing electrodes 110 and 130 and the radiator 210 may be formed together on the same layer in a mesh structure through the same patterning process.

[0112] In some embodiments, the antenna unit 200 and the trace 140 may be formed on the same layer.

[0113] According to an exemplary embodiment, the touch sensor pads 150 and the antenna pads 250 may be arranged on the same layer. Accordingly, as will be described later, antenna bonding and touch-air sensor bonding may be implemented together through one circuit board 300 .

[0114] In some embodiments, the antenna unit 200 and the antenna pad 250 may be directly connected to each other on the same layer, thereby reducing the antenna power supply resistance and suppressing the antenna signal loss.

[0115] In some embodiments, the sensing electrodes 110 and 130 , the traces 140 , and the touch sensor pads 150 may be directly connected to each other on the same layer, thereby reducing the resistance of the sensing channel and improving the touch sensing sensitivity.

[0116] like Figure 1As shown, a plurality of antenna units 200 may be arranged in an array at one end portion adjacent to the bonding area BA of the active area AA.

[0117] The sensing electrodes 110 and 130 adjacent to the radiator 210 of the antenna unit 200 may have a smaller area than the other sensing electrodes 110 and 130. Accordingly, the mutual independence of touch-to-air sensing and antenna radiation can be maintained while ensuring the arrangement space of the antenna unit 200. For example, the sensing electrodes 110 and 130 adjacent to the radiator 210 may include an etched groove in a manner such that the radiator 210 is partially inserted.

[0118] In some embodiments, the touch sensor pads 150 (eg, the first touch sensor pads 152) may be disposed between adjacent antenna pads 250. For example, a plurality of antenna pad units may be repeatedly arranged along the row direction with the touch sensor pads 150 interposed therebetween.

[0119] In some embodiments, an antenna ground pad (not shown) may be further configured around the antenna pad 250. The antenna ground pad can improve the independence and reliability of antenna power supply / radiation and touch sensing through the sensing electrodes 110 and 130.

[0120] In some embodiments, multiple touch sensor pads 150 may be disposed between adjacent antenna pads 250. For example, multiple first touch sensor pads 152 may be disposed between adjacent antenna pads 250. In this case, multiple first traces 142 may be disposed between adjacent antenna units 200.

[0121] In some embodiments, a touch sensor pad 150 can be disposed between adjacent antenna pads 250. For example, a first touch sensor pad 152 can be disposed between adjacent antenna pad units. Accordingly, the number of touch sensor pads 150 sandwiched between the antenna pad units can be reduced while increasing the pad density within the pad row.

[0122] Figure 3 and Figure 4 is a schematic cross-sectional view illustrating a sensor element package according to an exemplary embodiment. Figure 5 is a schematic partially enlarged plan view showing a sensor element package according to an exemplary embodiment. Figure 5 It is a plan view showing an enlarged structure of the bonding region and the surrounding area of ​​the sensor element.

[0123] Figure 3 The connection between the antenna pad 250 and the antenna unit 200 via the circuit board 300 is shown. Figure 4FIG. 1 shows the connection between the touch sensor pad 150 and the sensing electrodes 110 and 130 of the touch sensor through the circuit board 300. Figure 3 and Figure 4 The sensor element package is shown separately. Figure 5 As shown, a single sensor element package can be realized by combining one circuit board 300 and one sensor element.

[0124] Reference Figures 3 to 5 The circuit board 300 may include a core layer 310 , a first conductive layer 320 , and a second conductive layer 330 .

[0125] The core layer 310 may include a flexible resin such as polyimide resin, MPI (Modified Polyimide), epoxy resin, polyester, cycloolefin polymer (COP), liquid crystal polymer (LCP), etc. In a preferred embodiment, the core layer 310 may include polyimide resin or MPI.

[0126] The conductive layers 320 and 330 of the circuit board 300 may include silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), tin (Sn), zinc (Zn), molybdenum (Mo), calcium (Ca), or an alloy containing at least one of these metals. In some embodiments, considering signal efficiency and grounding efficiency, the conductive layers 320 and 330 may include copper or a copper alloy.

[0127] In one embodiment, the circuit board 300 may be made of a copper clad laminate (CCL) and may be provided as a flexible printed circuit board (FPCB).

[0128] The core layer 310 may have a first surface 310a and a second surface 310b facing each other. For example, the first surface 310a and the second surface 310b may correspond to the bottom and top surfaces of the core layer 310, respectively. According to an exemplary embodiment, the first surface 310a may correspond to the bonding surface with the sensor element, and the second surface 310b may correspond to the mounting surface of the drive circuit / drive circuit connection structure.

[0129] The first conductive layer 320 and the second conductive layer 330 may be formed on the first side 310 a and the second side 310 b of the core layer 310 , respectively.

[0130] The first conductive layer 320 may include a first antenna signal wiring 322 and a first touch sensor signal wiring 325 . The second conductive layer 330 may include a second antenna signal wiring 332 and a second touch sensor signal wiring 335 .

[0131] The first antenna signal trace 322 and the first touch sensor signal trace 325 may be arranged together at the same level on the first side 310a of the core layer 310. The second antenna signal trace 332 and the second touch sensor signal trace 335 may be arranged together at the same level on the second side 310b of the core layer 310.

[0132] like Figure 3 As shown, the first antenna signal wiring 322 may be bonded and electrically connected to the antenna pad 250 via the bonding intermediate structure 180. According to an exemplary embodiment, the bonding intermediate structure 180 may include an anisotropic conductive film (ACF).

[0133] like Figure 1 As shown, multiple antenna units 200 may be arranged in an array. In this case, multiple first antenna signal traces 322 may be individually bonded or connected to the antenna pad 250 in a manner corresponding to each antenna unit.

[0134] Second antenna signal wiring 332 may be electrically connected to first antenna signal wiring 322 on second side 310b of core layer 310. For example, a plurality of second antenna signal wirings 332 may be arranged on second side 310b of core layer 310 corresponding to each of a plurality of first antenna signal wirings 322.

[0135] According to an exemplary embodiment, first antenna signal wiring 322 and second antenna signal wiring 332 may be electrically connected to each other through antenna via structure 324. Antenna via structure 324 may penetrate core layer 310 to connect first antenna signal wiring 322 and second antenna signal wiring 332.

[0136] For example, the antenna via structure 324 can be formed by forming an antenna via through the core layer 310 and filling the antenna via using an electroplating process (e.g., copper plating). The antenna via structure 324 can be formed of a conductor that is substantially integral with the first antenna signal trace 322 and the second antenna signal trace 332.

[0137] The second antenna signal wiring 332 can be electrically connected to the antenna drive circuit / antenna connection structure 350. In one embodiment, the antenna drive circuit / antenna connection structure 350 may include an antenna connector. The antenna connector may be, for example, a board-to-board (B2B) connector. In this case, the circuit board 300 can be coupled to the chip attach substrate via the antenna connector.

[0138] For example, the antenna driving circuit / antenna connection structure 350 may include an antenna driving integrated circuit (IC) chip. In this case, the antenna driving IC chip 350b may be directly mounted on the circuit board 300 via the antenna conductive intermediate structure 340. The antenna conductive intermediate structure 340 may include solder, conductive balls, conductive wires, etc.

[0139] like Figure 4 As shown, the first touch sensor signal wiring 325 may be bonded and electrically connected to the touch sensor pad 150 through the bonding intermediate structure 180 .

[0140] The plurality of first touch sensor signal wirings 325 may be individually bonded or connected to the touch sensor pads 150 in a manner corresponding to each trace 140 .

[0141] The second touch sensor signal wiring 335 can be electrically connected to the first touch sensor signal wiring 325 on the second side 310b of the core layer 310. For example, a plurality of second touch sensor signal wirings 335 can be arranged on the second side 310b of the core layer 310 in a manner corresponding to each of the plurality of first touch sensor signal wirings 325.

[0142] According to an exemplary embodiment, the first touch sensor signal wiring 325 and the second touch sensor signal wiring 335 may be electrically connected to each other through a touch sensor via structure 327. The touch sensor via structure 327 may penetrate the core layer 310 to connect the first touch sensor signal wiring 325 and the second touch sensor signal wiring 335.

[0143] For example, the touch sensor via structure 327 can be formed by forming a touch sensor via through the core layer 310 and filling the touch sensor via using an electroplating process (e.g., copper plating). The touch sensor via structure 327 can be formed of a conductor that is substantially integral with the first touch sensor signal wiring 325 and the second touch sensor signal wiring 335.

[0144] The second touch sensor signal wiring 335 can be electrically connected to the touch sensor drive circuit / touch sensor connection structure 370. In one embodiment, the touch sensor drive circuit / touch sensor connection structure 370 can include a touch sensor connector. The touch sensor connector can be, for example, a board-to-board (B2B) connector. In this case, the circuit board 300 can be coupled to the die attach substrate via the touch sensor connector.

[0145] For example, the touch sensor driver circuit / touch sensor connection structure 370 may include a touch sensor IC chip. In this case, the touch sensor driver IC chip 370b may be directly mounted on the circuit board 300 via the touch sensor conductive intermediate structure 360. The touch sensor conductive intermediate structure 360 ​​may include solder, conductive balls, conductive wires, etc.

[0146] According to the above exemplary embodiment, the touch sensor pads 150 and the antenna pads 250 may be arranged together in the bonding area BA of the sensor element, and power supply / signal transmission for the antenna and touch sensor may be performed simultaneously through one circuit board 300 .

[0147] Circuit board 300 is formed of a multilayer conductive structure including a first conductive layer 320 and a second conductive layer 330. The first conductive layer 320 and the second conductive layer 330 can be designed to include antenna signal wiring and touch signal wiring, respectively. By connecting the first conductive layer 320 and the second conductive layer 330 to each other through antenna via structures 324 and touch sensor via structures 327, the reliability and efficiency of power supply to antenna pads 250 and touch sensor pads 150 can be improved using a single circuit board 300.

[0148] In some embodiments, a reference potential or a ground potential may be applied to the blocking pad 151 and / or the protection pad 153. For example, the touch driving signal potential is applied to the touch sensor driving IC chip 370b (refer to FIG. Figure 9 ) is applied to the touch sensor pads 152, 154, and the reference potential or ground potential may be applied to the blocking pad 151 and / or the guard pad 153.

[0149] The reference potential or ground potential may be lower than each of the potential of the touch driving signal to the touch sensor pad 150 and the power supply potential to the signal pad 252. In one embodiment, the reference potential or ground potential may be substantially 0V.

[0150] In some embodiments, the touch sensor signal wirings 325 and 335 may include signal wirings connected to the blocking pads 151 and / or the guard pads 153 to apply the reference potential or the ground potential.

[0151] In some embodiments, the reference potential or ground potential may be applied to the antenna ground pad (not shown).

[0152] The above-mentioned reference potential / ground potential can improve the mutual independence of the antenna power supply / driving signal and the touch sensing signal.

[0153] Figure 6 and Figure 71 is a schematic cross-sectional view showing a sensor element package according to an exemplary embodiment. Figures 1 to 5 Detailed description of substantially the same or similar configurations and structures is omitted.

[0154] Reference Figure 6 and Figure 7 The circuit board 300 may further include a mid-ground layer 390 disposed between the first conductive layer 320 and the second conductive layer 330. In this case, the circuit board 300 may have a conductive layer structure with three or more layers.

[0155] The core layer 310 may be provided in the form of a plurality of interlayer insulating layers. According to an exemplary embodiment, a first interlayer insulating layer 312 may be disposed between the first conductive layer 320 and the middle ground layer 390 , and a second interlayer insulating layer 314 may be disposed between the middle ground layer 390 and the second conductive layer 330 .

[0156] The middle ground layer 390 can be electrically and physically separated from the antenna via structure 324 and the touch sensor via structure 327. In one embodiment, the middle ground layer 390 can include holes through which the antenna via structure 324 and the touch sensor via structure 327 pass.

[0157] In one embodiment, a blocking insulating layer 395 may be formed between the middle ground layer 390 and the via structures 324 and 327. Accordingly, the insulating separation between the middle ground layer 390 and the via structures 324 and 327 may be stably maintained.

[0158] The middle ground layer 390 improves the independence and efficiency of antenna signal transmission and touch sensor signal transmission through the first conductive layer 320 and the second conductive layer 330 , and can reduce overall signal / ground power loss.

[0159] Figure 8 and Figure 9 They are respectively a schematic plan view and a cross-sectional view illustrating an image display device according to an exemplary embodiment.

[0160] Figure 8 The front surface or window surface of an image display device 400, for example, manufactured in the form of a smartphone, is shown. The front surface of the image display device 400 may include a display area 430 (DA) and a non-display area 440 (NDA). The non-display area 440 may correspond to, for example, a light shielding portion or a frame portion of the image display device 400.

[0161] Reference Figure 8 and Figure 9 The image display device 400 may include a display panel 410 and the above-mentioned sensor element configured on the display panel 410.

[0162] The sensor element of the exemplary embodiment described above may be disposed toward the front of the image display device 400, for example, on a display panel. Accordingly, the antenna unit 200 included in the sensor element may be provided as an antenna on screen (AOD) antenna.

[0163] In some embodiments, the sensor element may be attached to the display panel in the form of a film. In some embodiments, the sensor element may be configured on the display area 430 and the non-display area 440 of the image display device 400 .

[0164] In some embodiments, the active area AA of the sensor element may overlap with the display area 430. In one embodiment, the sensing electrodes 110, 130 and / or the radiator 210 may at least partially overlap with the display area 430.

[0165] In some embodiments, the peripheral area PA of the sensor element may overlap with the non-display area 440. The trace 140 and / or the signal pad 230 of the antenna unit 200 may at least partially overlap with the non-display area 440. For example, a portion of the sensor element having a solid structure may overlap with the non-display area 440.

[0166] The sensor element can be powered or driven by the circuit board 300. Figure 3 and Figure 4 As shown, the circuit board 300 is electrically connected to the antenna drive circuit / antenna connection structure 350, which may include an antenna connector 350a and an antenna drive IC chip 350b. The touch sensor drive circuit / touch sensor connection structure 370 may include a touch sensor connector 370a and a touch sensor driver IC chip 370b.

[0167] For ease of illustration, the antenna connector 350a and the touch sensor connector 370a are Figure 9 Although shown as one connector, as described above, the antenna connector 350a and the touch sensor connector 370a can be mounted on the circuit board 300 as separate components. The antenna driver IC chip 350b and the touch sensor driver IC chip 370b can also be mounted on the die attach substrate 450 as separate chips.

[0168] The circuit board 300 may be bent toward the rear surface of the image display device 400 and connected to the driver IC chips 350 b and 370 b mounted on the die attach substrate 450 .

[0169] For example, the antenna unit 200 and the circuit board 300 can be electrically connected to the antenna driver IC chip 350b through the antenna connector 350a. The touch sensor sensing electrodes 110 and 130 and the circuit board 300 can be electrically connected to the touch sensor driver IC chip 370b through the touch sensor connector 370a.

[0170] The die attach substrate 450 may be a rigid printed circuit board, for example, a main board of the image display device 400 .

[0171] As reference Figure 3 and Figure 4 As illustrated, the antenna driver IC chip 350 b and the touch sensor driver IC chip 370 b can be directly mounted on the circuit board 300 .

[0172] According to an exemplary embodiment, the display panel 410 may further include an optical layer 420 . For example, the optical layer 420 may be a polarizing layer including a polarizer or a polarizing plate. In some embodiments, the sensor element may be configured on the optical layer 420 .

Claims

1. A sensor element package, characterized in that: include: a sensor element comprising a touch sensing electrode and an antenna unit; as well as a circuit board bonded to the sensor element, The circuit board comprises: a core layer comprising a first surface and a second surface facing each other; a first conductive layer comprising a first touch sensor signal wiring and a first antenna signal wiring distributed on the same level on the first surface of the core layer; a second conductive layer comprising a second touch sensor signal wiring and a second antenna signal wiring distributed on the same level on the second surface of the core layer; an antenna via structure that passes through the core layer and connects the first antenna signal wiring and the second antenna signal wiring to each other; and A touch sensor via structure penetrates the core layer and connects the first touch sensor signal wiring and the second touch sensor signal wiring to each other.

2. The sensor element package according to claim 1, wherein: The sensor element further includes a touch sensor pad electrically connected to the touch sensing electrode and an antenna pad electrically connected to the antenna unit. The first touch sensor signal wirings of the circuit board are respectively bonded to the touch sensor pads, and the first antenna signal wirings of the circuit board are bonded to the antenna pads.

3. The sensor element package according to claim 2, wherein: The touch sensor pads and the antenna pads are arranged at one end of the sensor element to form a single pad row.

4. The sensor element package according to claim 3, wherein: The sensor element further includes a blocking pad included in the single pad row and inserted between adjacent touch sensor pads among the touch sensor pads, or a protection pad disposed at an end of the single pad row.

5. The sensor element package according to claim 4, wherein: The sensor element further comprises: routing lines connecting the touch sensing electrodes and the touch sensor pads to each other; and A blocking line extends from the blocking pad between adjacent ones of the traces.

6. The sensor element package according to claim 4, wherein: The sensor element further includes a ring-shaped guard wire extending from the guard pad and surrounding a periphery of the touch sensing electrode.

7. The sensor element package according to claim 3, wherein: Also includes: An anisotropic conductive film bonds the single pad row to the first conductive layer of the circuit board.

8. The sensor element package according to claim 2, wherein: The antenna unit includes a radiator and a transmission line extending from the radiator and connected to the antenna pad.

9. The sensor element package according to claim 8, wherein: A plurality of antenna units are arranged in a row direction, and the antenna pad is independently connected to each of the antenna units.

10. The sensor element package according to claim 9, wherein: The transmission lines connected to the respective antenna units of the plurality of antenna units have a meander line shape and have the same length.

11. The sensor element package according to claim 9, wherein At least one of the touch sensor pads is disposed between the antenna pads connected to adjacent antenna units among the antenna units.

12. The sensor element package according to claim 1, wherein Also includes: a touch sensor drive circuit / touch sensor connection structure electrically connected to the second touch sensor signal wiring on the second surface of the core layer; as well as An antenna driving circuit / antenna connection structure is electrically connected to the second antenna signal wiring on the second surface of the core layer.

13. The sensor element package according to claim 12, wherein: The antenna driving circuit / antenna connection structure includes an antenna driving integrated circuit chip or an antenna connector, The touch sensor driving circuit / touch sensor connection structure includes a touch sensor driving integrated circuit chip or a touch sensor connector.

14. The sensor element package according to claim 1, wherein The circuit board further includes a middle ground layer, which is arranged between the first conductive layer and the second conductive layer in the core layer.

15. The sensor element package according to claim 14, wherein: The antenna via structure and the touch sensor via structure are electrically separated from the middle ground layer and pass through the middle ground layer.

16. The sensor element package according to claim 1, wherein The sensor element further comprises a substrate layer, The touch sensing electrodes and the antenna unit are arranged together at the same level on the upper surface of the substrate layer.

17. The sensor element package according to claim 16, wherein: The substrate layer includes an active area where the touch sensing electrodes are distributed, and a peripheral area surrounding the active area. The antenna unit is partially configured on the active area.

18. An image display device, characterized in that: include: Display panel; as well as The sensor element package according to claim 1.

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