Transfer device for transfer printing of chip inductor
By introducing an anti-drop and buffer mechanism into the transfer device and using a drive motor and rubber pad to protect the chip inductor, the problem of dropping caused by insufficient suction of the pneumatic suction cup is solved, and the safe movement of the chip inductor and the protection of the device are achieved.
Patent Information
- Application Number
- CN202422992955.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-05
- Publication Date
- 2025-09-30
- Estimated Expiration
- 2034-12-05
AI Technical Summary
During the pad printing process of chip inductors, the insufficient suction force of the pneumatic suction cup can easily cause the chip inductors to fall and cause damage.
A transfer device including an anti-drop mechanism and a buffer mechanism was designed. A driving motor was used to drive the collection frame to flip over to form a closed space for buffering protection. Rubber pads were used to buffer the chip inductor. Dampers and springs were used to limit and buffer the collection frame to avoid collision.
It effectively prevents chip inductors from falling and being damaged, protects the safe movement of chip inductors, and avoids collision damage between device components.
Smart Images
Figure CN223397049U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of electronic component equipment, in particular to a transfer device for pad printing of patch inductors. Background Art
[0002] Chip inductors are a type of passive component widely used in electronic devices. During their production process, they need to be pad printed, moving the chip inductor from one location to another for printing. The pneumatic suction cup is driven downward by a hydraulic cylinder to adsorb the chip inductor, and then moved to another location for printing. When the chip inductor is adsorbed and moved, the pneumatic suction cup may lack suction due to age or other factors, which may cause the chip inductor to fall and easily damage the chip inductor.
[0003] In order to solve the above problems, a transfer device for pad printing of chip inductors is developed. Utility Model Content
[0004] In order to overcome the disadvantage that when the chip inductor is adsorbed and moved, the pneumatic suction cup may have insufficient suction due to age or other factors, which may cause the chip inductor to fall and easily cause damage to the chip inductor, the utility model provides a transfer device for chip inductor pad printing.
[0005] The technical solution of the present utility model is: a transfer device for patch inductor pad printing, including a connecting part, hydraulic cylinders are installed on the left and right parts of the connecting part, a pneumatic suction cup is connected between the telescopic ends of the hydraulic cylinder, anti-drop mechanisms are provided on the front and rear sides of the pneumatic suction cup, the anti-drop mechanism includes a drive motor, the drive motor is installed on the front and rear sides of the middle part of the pneumatic suction cup, and a collection frame is connected to the output shaft of the drive motor.
[0006] In one embodiment, a buffer mechanism is further included, and the buffer mechanism includes a connecting block. The left and right parts of the pneumatic suction cup are connected to the connecting blocks that are symmetrical in front and back. The connecting blocks are connected to dampers, and the dampers are connected to springs inside.
[0007] In one embodiment, a rubber pad is further included, and the inside of the collection frame is connected to the rubber pad.
[0008] In one embodiment, the maximum flip angle of the collection frame is 90 degrees.
[0009] In one embodiment, the collection frames are all half-frame structures, and two collection frames enclose a closed space.
[0010] In one embodiment, the damper acts as a buffer for the adjacent collecting frame.
[0011] By adopting the above technical solution, the beneficial effects of the utility model are:
[0012] The utility model is provided with an anti-drop mechanism, which uses a driving motor to drive the collection frame to flip inward. The semi-frame structure of the collection frame will cause the two collection frames to flip inward to form a closed space. The rubber pad buffers and protects the chip inductors that fall into the collection frame, thereby preventing the chip inductors from falling and causing damage. At the same time, the buffer mechanism limits and buffers the collection frame when the collection frame flips outward and resets, thereby preventing the collection frame from colliding with the pneumatic suction cup and causing damage when resetting. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model.
[0014] Figure 2 This is a schematic diagram of the first three-dimensional structure of the anti-drop mechanism of the utility model.
[0015] Figure 3 This is a schematic diagram of the second three-dimensional structure of the anti-drop mechanism of the utility model.
[0016] Figure 4 It is a three-dimensional structural diagram of the buffer mechanism of the utility model.
[0017] Markings in the figure are: 1-connecting part, 2-hydraulic cylinder, 3-pneumatic suction cup, 4-anti-drop mechanism, 41-driving motor, 42-collection frame, 43-rubber pad, 5-buffer mechanism, 51-connecting block, 52-damper, 53-spring. DETAILED DESCRIPTION
[0018] The present invention will be further described below with reference to the embodiments shown in the accompanying drawings.
[0019] A transfer device for patch inductor pad printing, such as Figure 1-Figure 3 As shown, it includes a connecting part 1, and hydraulic cylinders 2 are installed on the left and right parts of the connecting part 1. A pneumatic suction cup 3 is connected between the telescopic ends of the hydraulic cylinder 2, and anti-drop mechanisms 4 are provided on the front and back sides of the pneumatic suction cup 3. The anti-drop mechanism 4 includes a driving motor 41, and driving motors 41 are installed on the front and back sides of the middle part of the pneumatic suction cup 3. A collecting frame 42 is connected to the output shaft of the driving motor 41. The maximum flip angle of the collecting frame 42 is 90 degrees. The collecting frames 42 are all half-frame structures. The two collecting frames 42 enclose a closed space, and the inside of the collecting frame 42 is connected to a rubber pad 43.
[0020] like Figure 1 、 Figure 2 and Figure 4As shown, a buffer mechanism 5 is also included, and the buffer mechanism 5 includes a connecting block 51. The left and right parts of the pneumatic suction cup 3 are connected to the front and rear symmetrical connecting blocks 51, and the connecting blocks 51 are connected to dampers 52. The dampers 52 have a buffering effect on the adjacent collection frames 42, and the dampers 52 are connected to springs 53.
[0021] It should be noted that the chip inductor is a passive component widely used in electronic devices. During its production process, it needs to be pad printed and moved from one position to another for printing. The hydraulic cylinder 2 is started, and the telescopic end of the hydraulic cylinder 2 drives the pneumatic suction cup 3 to move downward, thereby adsorbing the chip inductor, and then moving it to another position for printing. When the chip inductor is adsorbed and moved, the chip inductor may fall due to insufficient suction of the pneumatic suction cup 3. The drive motor 41 can be started, and the rotation of the output shaft of the drive motor 41 will drive the collection frame 42 Flipping inward, the semi-frame structure of the collection frame 42 will cause the two collection frames 42 to flip inward to form a closed space. The rubber pad 43 cushions and protects the chip inductor that falls into the collection frame 42, thereby avoiding damage caused by the chip inductor falling. When the movement is completed, the drive motor 41 drives the collection frame 42 to flip outward and reset, so that the pneumatic suction cup 3 can perform the transfer operation again. When the collection frame 42 flips outward and resets, the damper 52 and the spring 53 can limit and buffer the collection frame 42 to avoid damage caused by collision with the pneumatic suction cup 3 when the collection frame 42 is reset.
[0022] The above embodiments are intended only to illustrate the technical concepts and features of the present invention. Their purpose is to enable those familiar with the art to understand the contents of the present invention and implement them accordingly. They are not intended to limit the scope of protection of the present invention. Any equivalent changes or modifications based on the spirit of the present invention are intended to be included in the scope of protection of the present invention.
Claims
1. A transfer device for pad printing of chip inductors, characterized in that: The invention comprises a connecting member (1), wherein the left and right parts of the connecting member (1) are both equipped with hydraulic cylinders (2), a pneumatic suction cup (3) is connected between the telescopic ends of the hydraulic cylinder (2), and anti-drop mechanisms (4) are provided on both the front and rear sides of the pneumatic suction cup (3), and the anti-drop mechanism (4) comprises a driving motor (41), and the driving motor (41) is installed on both the front and rear sides of the middle part of the pneumatic suction cup (3), and a collection frame (42) is connected to the output shaft of the driving motor (41).
2. The transfer device for pad printing of chip inductors according to claim 1, characterized in that: The invention also includes a buffer mechanism (5), wherein the buffer mechanism (5) includes a connecting block (51), the left and right parts of the pneumatic suction cup (3) are both connected to the connecting blocks (51) which are symmetrical in front and back, the connecting blocks (51) are both connected to dampers (52), and the dampers (52) are both connected to springs (53) inside.
3. The transfer device for pad printing of chip inductors according to claim 1, characterized in that: It also includes a rubber pad (43), and the inside of the collection frame (42) is connected to the rubber pad (43).
4. The transfer device for pad printing of chip inductors according to claim 1, characterized in that: The maximum flip angle of the collection frame (42) is 90 degrees.
5. The transfer device for pad printing of chip inductors according to claim 1, characterized in that: The collecting frames (42) are all half-frame structures, and two collecting frames (42) enclose a closed space.
6. The transfer device for pad printing of chip inductors according to claim 2, characterized in that: The damper (52) has a buffering effect on the adjacent collecting frame (42).