Welding head device of die bonder

Abstract

The utility model discloses a chip mounter welding head device which comprises a machine frame, a driving module, a welding head module, an electromagnetic valve and a spiral negative pressure pipe, the driving module, the welding head module, the electromagnetic valve and the spiral negative pressure pipe are arranged on the machine frame, the welding head module is installed on the machine frame in a sliding mode through a sliding block in the Y-axis direction, a suction nozzle is arranged at the lower end of the welding head module, and a first connector communicated with the suction nozzle is arranged at the upper end of the welding head module. The electromagnetic valve and the welding head module are distributed at intervals in the Y-axis direction, a second connector is formed in the electromagnetic valve, the two ends of the spiral negative pressure pipe communicate with the first connector and the second connector correspondingly, and a distance B is kept between the spiral negative pressure pipe and the sliding block. The spiral negative pressure pipe elastically contracts or elastically stretches in the Y-axis direction, the spiral negative pressure pipe is adopted, the characteristic that the spiral negative pressure pipe can elastically contract and stretch is utilized, friction between the spiral negative pressure pipe and the sliding block is prevented, meanwhile, the spiral negative pressure pipe is prevented from being damaged, and frequent replacement is not needed.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit chip mounters, in particular to a chip mounter welding head device. Background Art

[0002] A chip loader is an automated equipment used for chip production. It is equipped with a welding head device. The welding head device has a frame and a driving module and a welding head module arranged on the frame. The welding head module is linearly slidably connected to the frame through a slider. The welding head module is provided with a suction nozzle and an interface connected to the suction nozzle. The interface is connected to a negative pressure tube, and the negative pressure tube is connected to the negative pressure device. When working, the driving module drives the welding head module to move linearly. After the suction nozzle sucks the chip, the welding head module mounts the chip onto the lead frame.

[0003] However, since the traditional negative pressure tube is a linear negative pressure tube, when the welding head module drives the linear negative pressure tube to move, the friction between the linear negative pressure tube and the slider will cause dust and oil to fall onto the chip, causing the chip to be dirty; at the same time, the linear negative pressure tube will be damaged due to long-term friction, resulting in insufficient negative pressure and the chip cannot be sucked, and the linear negative pressure tube needs to be replaced frequently. Utility Model Content

[0004] The utility model aims to address the deficiencies in the prior art and provides a wafer loading machine welding head device, which adopts a spiral negative pressure tube and utilizes the elastic contraction and expansion characteristics of the spiral negative pressure tube to prevent friction between the screw and the slider, while avoiding damage to the spiral negative pressure tube and eliminating the need for frequent replacement.

[0005] In order to achieve the above purpose, the present invention adopts the following technical solutions:

[0006] A wafer loading machine welding head device includes a frame, and a driving module, a welding head module, a solenoid valve, and a spiral negative pressure tube arranged on the frame. The welding head module is slidably installed on the frame along the Y-axis direction through a slider. The lower end of the welding head module is provided with a suction nozzle that can suck chips, and the upper end of the welding head module is provided with a first interface connected to the suction nozzle. The solenoid valve and the welding head module are spaced apart along the Y-axis direction. The solenoid valve is provided with a second interface. The two ends of the spiral negative pressure tube are respectively connected to the first interface and the second interface. A spacing B is maintained between the spiral negative pressure tube and the slider. When the driving module drives the welding head module to move toward or away from the solenoid valve along the Y-axis direction, the spiral negative pressure tube elastically contracts or elastically stretches along the Y-axis direction.

[0007] By setting up a wafer loading machine welding head device consisting of a frame, a driving module, a welding head module, a solenoid valve, and a spiral negative pressure tube, the solenoid valve and the welding head module are spaced apart along the Y-axis direction, one end of the spiral negative pressure tube is connected to the first interface on the welding head module, and the other end of the spiral negative pressure tube is connected to the second interface on the solenoid valve, and a distance B is maintained between the spiral negative pressure tube and the slider. When the driving module drives the welding head module to move toward or away from the solenoid valve along the Y-axis direction, the spiral negative pressure tube elastically contracts or elastically stretches along the Y-axis direction, thereby utilizing the elastic contraction and extension characteristics of the spiral negative pressure tube to prevent friction between the screw and the slider, avoid dust and oil falling onto the chip, and avoid damage to the spiral negative pressure tube, without the need for frequent replacement.

[0008] As a preferred solution, the spacing B is ≥ 50 mm.

[0009] As a preferred solution, the minimum length L of the spiral negative pressure tube that can be elastically contracted along the Y-axis direction is 60 mm, and the maximum length L of the spiral negative pressure tube that can be elastically extended along the Y-axis direction is 600 mm.

[0010] As a preferred solution, the opening of the first interface faces upward, and the second interface is arranged on a side of the solenoid valve close to the second interface.

[0011] As a preferred solution, the outer diameter d1 of the spiral negative pressure tube is 5 mm-7 mm.

[0012] As a preferred solution, the outer diameter d1 of the spiral negative pressure tube is 6 mm.

[0013] As a preferred solution, the wall thickness h of the spiral negative pressure tube is 1mm-2mm.

[0014] As a preferred solution, the wall thickness h of the spiral negative pressure tube is 1.5 mm.

[0015] As a preferred solution, the spiral negative pressure tube has a plurality of spiral coils, and the outer diameter d2 of the coils is 45 mm-50 mm.

[0016] As a preferred solution, the outer diameter d2 of the ring portion is 47 mm.

[0017] Compared with the prior art, the utility model has obvious advantages and beneficial effects. Specifically, by setting a wafer loading machine welding head device composed of a frame, a driving module, a welding head module, a solenoid valve, and a spiral negative pressure tube, the solenoid valve and the welding head module are spaced apart along the Y-axis direction, one end of the spiral negative pressure tube is connected to the first interface on the welding head module, and the other end of the spiral negative pressure tube is connected to the second interface on the solenoid valve, and a spacing B is maintained between the spiral negative pressure tube and the slider. When the driving module drives the welding head module to move toward or away from the solenoid valve along the Y-axis direction, the spiral negative pressure tube elastically contracts or elastically stretches along the Y-axis direction, thereby utilizing the elastic contraction and extension characteristics of the spiral negative pressure tube to prevent friction between the screw and the slider, avoid dust and oil falling onto the chip, and avoid damage to the spiral negative pressure tube, without the need for frequent replacement.

[0018] In order to more clearly illustrate the structural features, technical means and specific purposes and functions achieved by the present invention, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments: BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a front view schematic diagram of the assembly structure of an embodiment of the utility model;

[0020] Figure 2 This is a schematic front view of a spiral negative pressure tube according to an embodiment of the present invention;

[0021] Figure 3 2 is a schematic side view of a spiral negative pressure tube according to an embodiment of the present invention.

[0022] Description of the accompanying drawings:

[0023] 10-frame; 11-slider; 20-welding head module; 21-suction nozzle; 22-first interface; 30-solenoid valve; 31-second interface; 40-spiral negative pressure tube; 41-ring portion. DETAILED DESCRIPTION

[0024] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the position or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the present invention.

[0025] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of these terms in this utility model based on the specific circumstances.

[0026] like Figure 1-3 As shown, the utility model discloses a wafer mounting machine welding head device, including a frame 10, and a driving module (not shown) arranged on the frame 10, a welding head module 20, a solenoid valve 30, and a spiral negative pressure tube 40.

[0027] The welding head module 20 is slidably installed on the frame 10 along the Y-axis direction through the slider 11. The lower end of the welding head module 20 is provided with a suction nozzle 21 for sucking chips, and the upper end of the welding head module 20 is provided with a first interface 22 connected to the suction nozzle 21. The solenoid valve 30 and the welding head module 20 are spaced apart along the Y-axis direction. The solenoid valve 30 is provided with a second interface 31. The two ends of the spiral negative pressure tube 40 are respectively connected to the first interface 22 and the second interface 31. The spiral negative pressure tube 40 is connected to an external negative pressure device (not shown) through the solenoid valve 30. A distance B is maintained between the spiral negative pressure tube 40 and the slider 11. When the driving module drives the welding head module 20 to move toward or away from the solenoid valve 30 along the Y-axis direction, the spiral negative pressure tube 40 elastically contracts or elastically stretches along the Y-axis direction.

[0028] The spacing B is ≥50mm; by setting the spacing B between the spiral negative pressure tube 40 and the slider 11 to be ≥50mm, it is ensured that when the spiral negative pressure tube 40 elastically contracts or elastically stretches along the Y-axis direction, the spiral negative pressure tube 40 is prevented from rubbing against the slider 11, and the spiral negative pressure tube 40 is prevented from generating debris and dust that falls onto the chip surface, and the assembly between the welding head module 20, the spiral negative pressure tube 40 and the solenoid valve 30 is more compact and occupies less space.

[0029] The minimum length L of the spiral negative pressure tube 40 that can be elastically contracted along the Y-axis direction is 60 mm, and the maximum length L of the spiral negative pressure tube 40 that can be elastically extended along the Y-axis direction is 600 mm; by setting the elastic contraction range of the spiral negative pressure tube 40 along the Y-axis direction to be between 60 mm and 600 mm, the welding head module 20 has a sufficient working range, which is beneficial for the welding head module 20 to take materials and weld.

[0030] The opening of the first interface 22 faces upward, and the second interface 31 is arranged on the side of the solenoid valve 30 close to the second interface 31; by setting the first interface 22 upward and setting the second interface 31 on the side of the solenoid valve 30 close to the second interface 31, it is beneficial to connect the two ends of the spiral negative pressure tube 40 to the first interface 22 and the second interface 31 respectively, and make the spiral negative pressure tube 40 elastically contract or elastically stretch more smoothly along the Y-axis direction, so that the equipment works more stably.

[0031] The outer diameter d1 of the spiral negative pressure tube 40 is 5 mm to 7 mm.

[0032] The outer diameter d1 of the spiral negative pressure tube 40 is 6 mm.

[0033] The wall thickness h of the spiral negative pressure tube 40 is 1 mm to 2 mm.

[0034] The wall thickness h of the spiral negative pressure tube 40 is 1.5 mm.

[0035] The spiral negative pressure tube 40 has a plurality of spiral coils 41 , and the outer diameter d2 of the coils 41 is 45 mm to 50 mm.

[0036] The outer diameter d2 of the ring portion 41 is 47 mm.

[0037] To sum up, the utility model is provided with a wafer loading machine welding head device consisting of a frame 10, a driving module, a welding head module 20, a solenoid valve 30, and a spiral negative pressure tube 40. The solenoid valve 30 and the welding head module 20 are spaced apart along the Y-axis direction, one end of the spiral negative pressure tube 40 is connected to the first interface 22 on the welding head module 20, and the other end of the spiral negative pressure tube 40 is connected to the second interface 31 on the solenoid valve 30, and a spacing B is maintained between the spiral negative pressure tube 40 and the slider 11. When the driving module drives the welding head module 20 to move toward or away from the solenoid valve 30 along the Y-axis direction, the spiral negative pressure tube 40 elastically contracts or elastically stretches along the Y-axis direction, thereby utilizing the elastic contraction and extension characteristics of the spiral negative pressure tube 40 to prevent friction between the screw and the slider 11, avoid dust and oil falling onto the chip, and avoid damage to the spiral negative pressure tube 40, without the need for frequent replacement.

[0038] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Therefore, any modifications, equivalent replacements, improvements, etc. made to the above embodiments based on the technical practice of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A wafer bonding machine welding head device, characterized in that: It includes a frame, and a drive module, a welding head module, a solenoid valve, and a spiral negative pressure tube arranged on the frame; The welding head module is slidably installed on the frame along the Y-axis direction through a slider. The lower end of the welding head module is provided with a suction nozzle for sucking chips, and the upper end of the welding head module is provided with a first interface connected to the suction nozzle. The solenoid valve and the welding head module are spaced apart along the Y-axis direction. The solenoid valve is provided with a second interface. The two ends of the spiral negative pressure tube are respectively connected with the first interface and the second interface. A distance B is maintained between the spiral negative pressure tube and the slider. When the driving module drives the welding head module to move closer to or away from the solenoid valve along the Y-axis direction, the spiral negative pressure tube elastically contracts or elastically stretches along the Y-axis direction.

2. The wafer bonding machine welding head device according to claim 1, characterized in that: The spacing B is ≥50 mm.

3. The wafer bonding machine welding head device according to claim 1, characterized in that: The minimum length L of the spiral negative pressure tube that can be elastically contracted along the Y-axis direction is 60 mm, and the maximum length L of the spiral negative pressure tube that can be elastically extended along the Y-axis direction is 600 mm.

4. The wafer bonding machine welding head device according to claim 1, characterized in that: The opening of the first interface faces upward, and the second interface is arranged on a side of the solenoid valve close to the second interface.

5. The wafer bonding machine welding head device according to claim 1, characterized in that: The outer diameter d1 of the spiral negative pressure tube is 5 mm to 7 mm.

6. The wafer bonding machine welding head device according to claim 5, characterized in that: The outer diameter d1 of the spiral negative pressure tube is 6 mm.

7. The wafer bonding machine welding head device according to claim 1, characterized in that: The wall thickness h of the spiral negative pressure tube is 1mm-2mm.

8. The wafer bonding machine welding head device according to claim 7, characterized in that: The wall thickness h of the spiral negative pressure tube is 1.5 mm.

9. The wafer bonding machine welding head device according to claim 1, characterized in that: The spiral negative pressure tube has a plurality of spiral coils, and the outer diameter d2 of the coils is 45 mm to 50 mm.

10. The wafer bonding machine welding head device according to claim 9, characterized in that: The outer diameter d2 of the ring portion is 47 mm.

Images