Multi-power-source heat dissipation structure of mini-host

Abstract

The utility model relates to the field of thermal management of electronic equipment, in particular to a multi-power-source heat dissipation structure of a mini-host. The microcomputer comprises a computer body, a heat dissipation system and a shell, the heat dissipation system is arranged on the surface of a mainboard, the shell covers the heat dissipation system and the computer body, the shell comprises an air inlet and an air outlet, the air inlet is located in the bottom face of the shell, and the air outlet is located in the side face of the shell. When the microcomputer dissipates heat, the heat dissipation system sucks cold air through the air inlet, and the heat dissipation system exhausts hot air through the air outlet. By means of the structural design, the circulation speed of air flow in the microcomputer is effectively increased, heat can be rapidly discharged, the heat dissipation efficiency is improved, and the service life of equipment is prolonged.

Description

Technical Field

[0001] The present application relates to the field of thermal management of electronic equipment, and in particular to a multi-power source heat dissipation structure of a mini host. Background Art

[0002] Microcomputers are widely used in a variety of electronic devices. With technological advancements, their performance continues to improve while their size continues to shrink. However, high-performance computing generates higher heat, placing higher demands on the microcomputer's cooling system. Efficient heat dissipation not only ensures stable operation and extends the computer's lifespan, but also improves the user experience and reduces the risk of failures caused by high temperatures. Therefore, developing an efficient and reliable cooling system has become a key issue in microcomputer design.

[0003] Currently, the heat dissipation and air duct design of microcomputers on the market all take in cold air from the left and right sides, and blow hot air out from the front and back of the microcomputer through the radiator fan to bring out the heat inside the microcomputer. This structural design of left and right air intake and front and back air outlet can easily cause hot air to accumulate in the host, forming local high-temperature areas. Especially when running at high load for a long time, the heat dissipation efficiency decreases. Finally, large temperature differences may occur in local areas, affecting the overall hardware stability and life. Utility Model Content

[0004] The purpose of this application is to overcome the above technical problems and provide a multi-power source heat dissipation structure for a mini host.

[0005] A multi-power source heat dissipation structure for a mini host, comprising:

[0006] A computer body, the computer body comprising a mainboard;

[0007] A heat dissipation system is provided on the surface of the mainboard, and

[0008] The shell covers the heat dissipation system and the computer body, and the shell includes an air inlet and an air outlet. The air inlet is located on the bottom surface of the shell, and the air outlet is located on the side of the shell. The system fan is facing the air inlet. The heat dissipation system draws in cold air through the air inlet and discharges hot air through the air outlet.

[0009] By adopting the above solution, the system fan draws cold air from the outside into the casing to dissipate heat for the motherboard, while pushing the hot air toward the cooling fan. The cooling fan pushes the hot air out of the casing, speeding up the air circulation and improving the circulation efficiency of the cooling system. In addition, the bottom air intake design can usually utilize natural air flow, making it easier to obtain cooler air, especially when the host is placed on a desktop or on the ground. The air flow at the bottom is usually smoother and is not easily obstructed by the top or sides.

[0010] In one embodiment, the computer body further includes a central processing unit and a memory bar, wherein the central processing unit and the memory bar are respectively fixed on both sides of the mainboard, and the cooling fan and the system fan are respectively located on the surface of the central processing unit and the memory bar.

[0011] By adopting the above solution, the components of the microcomputer are arranged on both sides of the motherboard, and the internal space is reasonably distributed to prevent local excessive temperature and airflow blockage, which would lead to poor heat dissipation effect.

[0012] In one embodiment, the computer body further includes a solid-state drive, which is fixed to the motherboard and located on a side of the memory bar away from the air outlet, and a heat sink is provided on the surface of the solid-state drive.

[0013] By adopting the above solution, the airflow guided by the system fan can pass through the solid-state drive. At the same time, a heat sink is provided on the surface of the solid-state drive strip, and the airflow can also flow through the heat sink, thereby enhancing the heat dissipation effect of the solid-state drive.

[0014] In one embodiment, a contact surface between the heat sink and the memory stick is provided with a receiving groove that cooperates with the memory stick.

[0015] By adopting the above solution, the contact area between the heat sink and the memory strip is increased, thereby increasing the heat conduction area of ​​the heat sink and improving the heat conduction efficiency of the heat sink.

[0016] In one embodiment, the system fan includes a fan support, and the fan support includes a fan accommodating portion and an air guide channel. One end of the air guide channel is connected to the fan accommodating portion, and the other end extends to both sides of the heat sink and is connected to the heat sink.

[0017] By adopting the above solution, the flow direction of the airflow sucked in by the system fan is guided so that the airflow can flow towards the heat sink.

[0018] In one embodiment, the fan accommodating portion surrounds a fan body of the system fan and has air guide grooves distributed in a circumferential array on the sidewall, and the air guide grooves are in contact with the surface of the memory module.

[0019] By adopting the above solution, the airflow sucked by the fan can be closely attached to the memory module, thus preventing the airflow from flowing irregularly inside the computer and improving the heat dissipation efficiency.

[0020] In one embodiment, the heat dissipation fan includes a fan protection shell, which covers the fan body of the heat dissipation fan and is connected to the air outlet.

[0021] By adopting the above solution, the hot air flow pushed by the cooling fan is guided to be discharged out of the microcomputer, thereby improving the exhaust efficiency of the cooling fan.

[0022] In one embodiment, the heat dissipation fan includes a plurality of arc-shaped blades, and a connecting piece is connected between the distal ends of adjacent blades, and the connecting piece is inclined from the upper end of one blade to the lower end of another blade.

[0023] By adopting the above solution, the direction in which the blades of the heat dissipation fan push the air is the direction of the air outlet, thereby improving the air circulation efficiency. At the same time, the connecting piece enhances the rigidity of the fan and makes the fan structure more stable.

[0024] In one embodiment, the side panel of the housing (3) on which the air outlet (32) is arranged is made of a material with low thermal conductivity.

[0025] By adopting the above solution, the internal temperature of the microcomputer is kept stable and the air outlet is not overheated.

[0026] In summary, this application includes at least one of the following beneficial technical effects:

[0027] 1. By setting the system fan at the air inlet and the cooling fan at the air outlet, the system fan draws cool air from the outside into the casing to dissipate heat for the motherboard, while pushing hot air toward the cooling fan. The cooling fan pushes the hot air out of the casing, speeding up the air circulation and improving the circulation efficiency of the cooling system. In addition, the bottom air intake design can usually utilize natural air flow, making it easier to obtain cooler air, especially when the host is placed on a table or on the ground. The air flow at the bottom is usually smoother and less likely to be obstructed by the top or sides.

[0028] 2. By placing components such as the CPU and memory modules on both sides of the motherboard, and placing the cooling fan and system fan on the surface of the CPU and memory modules respectively, the internal space is reasonably allocated to prevent local overheating and airflow blockage, which lead to poor heat dissipation. The CPU and memory modules are easily affected by temperature. Placing the cooling fan and system fan directly on the surface of the CPU and memory modules directly dissipates heat from the heat-generating parts inside the computer, thereby improving the computer's heat dissipation efficiency.

[0029] 3. By setting up air guide channels and air guide grooves on the fan support, the flow direction of the air inhaled by the system fan is guided so that the airflow can flow toward the heat sink. At the same time, the air inhaled by the system fan can be close to the memory module, preventing the airflow from flowing irregularly inside the computer, thereby improving the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1This is a structural diagram of a multi-power source heat dissipation structure of a mini host provided by the first embodiment of the present application.

[0031] Figure 2 This is an exploded view of a multi-power source heat dissipation structure of a mini host provided in the first embodiment of the present application.

[0032] Figure 3 It is a schematic diagram of the heat sink structure.

[0033] Figure 4 This is a schematic diagram of the connection relationship between the fan support and the heat sink in the second embodiment of the present application.

[0034] Figure 5 It is a schematic diagram of the fan body and connecting piece structure of the cooling fan.

[0035] Explanation of the accompanying symbols: 1. Computer body; 11. Motherboard; 12. Central processing unit; 13. Memory stick; 14. Solid-state drive; 2. Cooling system; 21. Cooling fan; 211. Fan protective case; 212. Connecting piece; 22. System fan; 221. Fan support; 2211. Fan accommodating portion; 2212. Air guide channel; 2213. Air guide groove; 3. Outer casing; 31. Air inlet; 32. Air outlet; 4. Heat sink; 41. Accommodating groove; 42. Heat sink. DETAILED DESCRIPTION

[0036] Therefore, it is necessary to provide a microcomputer with smooth internal air flow.

[0037] See also Figure 1-2 , Figure 1 This is a schematic structural diagram of a multi-power source heat dissipation structure of a mini host provided in this application, including a computer body 1, a heat dissipation system 2 and a casing 3.

[0038] The computer body 1 includes a motherboard 11, a central processing unit 12 and a memory module 13 are respectively fixed on both sides of the motherboard 11. The memory module 13 and the solid-state drive 14 are located on the same side of the motherboard 11. Other components inside the microcomputer are also located on both sides of the motherboard 11, which reasonably distributes the internal space and prevents local overheating and airflow blockage, resulting in poor heat dissipation effect.

[0039] The cooling system 2 includes a cooling fan 21 and a system fan 22. The cooling fan 21 and the system fan 22 are located on either side of the motherboard 11, with both fans 22 and 21 facing the motherboard 11. The CPU 12 and the memory module 13 are relatively heat-prone components of the microcomputer. The cooling fan 21 is fixed to the surface of the CPU 12, directly cooling the CPU 12. The system fan 22 is fixed to the surface of the memory module 13, directly cooling the memory module 13. The system fan 22 draws cool air from the outside into the housing 3 to dissipate heat from the motherboard 11, while simultaneously pushing hot air toward the cooling fan 21. The cooling fan 21 pushes the hot air out of the housing 3, accelerating air circulation and improving the circulation efficiency of the cooling system 2.

[0040] The housing 3 includes an air inlet 31 and an air outlet 32. The air inlet 31 is located on the bottom surface of the housing 3, and the air outlet 32 ​​is located on the side surface of the housing 3. The design of the air inlet 31 and the air outlet 32 ​​can be adjusted according to the actual application scenario. For example, the air inlet 31 can be designed in a grid shape to increase the air inlet area and improve the air inlet efficiency. The air outlet 32 ​​can be designed in a louver shape to adjust the air outlet direction and improve the heat dissipation effect. In this solution, the material of the air outlet 32 ​​components is also changed to a plastic material with relatively low thermal conductivity to reduce the probability of the high-temperature air of the microcomputer working to reheat the structural components of the air outlet 32, thereby minimizing the temperature rise of the microcomputer host when it is working and better ensuring the stability of the microcomputer operation. The system fan 22 faces the air inlet 31, while the air outlet 32 ​​is located on the side of the motherboard 11 facing the cooling fan 21. This design allows air to flow more efficiently through the motherboard 11, removing more heat. By properly positioning the air inlet and outlet 32, effective heat dissipation is ensured without affecting the aesthetics and portability of the microcomputer. The side panels of the housing 3 where the air outlet 32 ​​is located are made of a low-thermal-conductivity material, such as polyurethane, polystyrene, and polytetrafluoroethylene. Other side panels without air outlets 32 can also be made of these same low-thermal-conductivity materials.

[0041] Please also refer to Figure 3 , Figure 3This is a schematic diagram of the heat sink structure. In the computer body 1, the solid-state drive 14 is fixed to the side of the memory module 13 facing away from the air outlet 32. A heat sink 4 is provided on the surface of the solid-state drive 14. The contact surface between the heat sink 4 and the memory module 13 is provided with a receiving slot 41 that mates with the memory module 13. This design increases the contact area between the heat sink 4 and the memory module 13, thereby increasing the heat transfer area of ​​the heat sink 4 and improving the heat transfer efficiency of the heat sink 4. The heat sink 4 can be modularly designed for easy replacement and maintenance. The thickness of the heat sink 4 can be adjusted according to actual cooling requirements to achieve optimal heat dissipation. An array of heat sink fins 42 is arranged on the side of the heat sink 4 facing away from the memory module 13. The fins 42 are perpendicular to the heat sink 4 and extend in the direction of the airflow driven by the system fan 22. The upper surface of the fins 42 abuts the air inlet 31 on the bottom surface of the housing 3. This design increases the contact area between the surface of the heat sink 4 and the airflow, and an airflow channel is formed between adjacent heat sinks 42. The airflow pushed by the system fan 22 can fully flow through the heat sink 42, thereby improving the overall heat dissipation efficiency of the heat sink 4.

[0042] The cooling fan 21 includes a fan protective housing 211. This housing covers the fan body of the cooling fan 21 and connects to the air outlet 32. This housing guides the hot air flow from the cooling fan 21 out of the microcomputer, improving the exhaust efficiency of the cooling fan 21. The fan protective housing 211 can be made of various materials, such as plastic or metal, to suit different operating environments. The shape of the fan protective housing 211 can be adjusted to meet actual cooling requirements to achieve optimal heat dissipation.

[0043] When in use, the system fan 22 draws in cold air from the outside of the microcomputer through the air inlet 31, directly cooling the memory stick 13. At the same time, the inhaled cold air flows through the heat dissipation channel formed between the heat sinks 42, cooling the heat sink 4 and the heat sink 42. The heat sink 4 and the heat sink 42 absorb the heat of the solid-state drive 14. The air inhaled by the system fan 22 passes through the heat sink 42 and flows into the other side of the motherboard 11. The cooling fan 21 pushes the airflow to dissipate heat from the central processing unit 12, and at the same time discharges the hot air from the air outlet 32.

[0044] Example 2

[0045] See also Figure 4 , Figure 4This is a schematic diagram of the connection between the fan support and the heat sink in the second embodiment of the present application. The second embodiment has essentially the same structure as the first embodiment, differing in that the system fan 22 includes a fan support 221, which includes a fan housing 2211 and an air guide channel 2212. The air guide channel 2212 connects to the fan housing 2211 at one end and extends to both sides of the heat sink 42 at the other end. The air guide channel 2212 guides the airflow drawn by the system fan 22 toward the heat sink 42, improving heat dissipation efficiency. The fan housing 2211 surrounds the fan body of the system fan 22 and has air guide grooves 2213 arranged in a circumferential array on its sidewalls. The air guide grooves 2213 are aligned with the surface of the memory module 13, ensuring that the airflow drawn by the fan is in close contact with the memory module 13, preventing irregular airflow within the computer and improving heat dissipation efficiency. The fan support 221 can be made of various materials, such as plastic or metal, to suit different usage environments.

[0046] Please also refer to Figure 5 , Figure 5 This is a schematic diagram of the fan body and connecting piece structure of the cooling fan. The cooling fan 21 includes multiple curved blades. The blades of the cooling fan 21 are perpendicular to the motherboard 11, and connecting pieces 212 are connected between the blades. This allows the blades of the cooling fan 21 to push air in the direction of the air outlet 32, thereby improving air circulation efficiency. The connecting piece 212 is located at the outer edge of the cooling fan 21 and is at a certain angle to the motherboard 11. The connecting piece 212 tilts from the upper end of one blade to the lower end of another blade. During the rotation of the cooling fan 21, the inclined surface formed by the connecting piece 212 pushes air toward the central processing unit 12, dissipating heat from the central processing unit 12. This allows the connecting piece 212 to also function as a fan, improving heat dissipation efficiency. The shape and angle of the connecting piece 212 can be adjusted according to actual heat dissipation requirements to achieve the best heat dissipation effect.

[0047] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A multi-power source heat dissipation structure for a mini host, characterized in that: include: A computer body (1), the computer body (1) comprising a mainboard (11); A heat dissipation system (2) is provided on the surface of the mainboard (11), and A housing (3) is provided for housing the heat dissipation system (2) and the computer body (1). The housing (3) includes an air inlet (31) and an air outlet (32). The air inlet (31) is located on the bottom surface of the housing (3), and the air outlet (32) is located on the side surface of the housing (3). The heat dissipation system (2) inhales cold air through the air inlet (31) and discharges hot air through the air outlet (32).

2. The multi-power source heat dissipation structure of a mini host according to claim 1, characterized in that: The heat dissipation system (2) comprises a heat dissipation fan (21) and a system fan (22). The heat dissipation fan (21) and the system fan (22) are respectively located on both sides of the mainboard (11). The wind directions of the system fan (22) and the heat dissipation fan (21) are both toward the mainboard (11).

3. The multi-power source heat dissipation structure of a mini host according to claim 2, characterized in that: The computer body (1) further comprises a central processing unit (12) and a memory bar (13), wherein the central processing unit (12) and the memory bar (13) are respectively fixed on both sides of the motherboard (11), and the cooling fan (21) and the system fan (22) are respectively located on the surface of the central processing unit (12) and the memory bar (13).

4. The multi-power source heat dissipation structure of a mini host according to claim 3, characterized in that: The computer body (1) further comprises a solid-state drive (14), the solid-state drive (14) being fixed to the motherboard (11) and located on a side of the memory bar (13) facing away from the air outlet (32), and a heat dissipation plate (4) being provided on a surface of the solid-state drive (14).

5. The multi-power source heat dissipation structure of a mini host according to claim 4, characterized in that: The contact surface between the heat dissipation plate (4) and the memory bar (13) is provided with a receiving groove (41) that matches the memory bar (13).

6. The multi-power source heat dissipation structure of a mini host according to claim 5, characterized in that: The system fan (22) includes a fan support (221), and the fan support (221) includes a fan accommodating portion (2211) and an air guide channel (2212). One end of the air guide channel (2212) is connected to the fan accommodating portion (2211), and the other end extends to both sides of the heat dissipation plate (4) and is connected to the heat dissipation plate (4).

7. The multi-power source heat dissipation structure of a mini host according to claim 6, characterized in that: The fan accommodating portion (2211) surrounds the fan body of the system fan (22) and has air guide grooves (2213) distributed in a circumferential array on the side wall, and the air guide grooves (2213) are in contact with the surface of the memory bar (13).

8. The multi-power source heat dissipation structure of a mini host according to claim 7, characterized in that: The heat dissipation fan (21) comprises a fan protection shell (211), wherein the fan protection shell (211) covers the fan body of the heat dissipation fan (21) and is connected to the air outlet (32).

9. The multi-power source heat dissipation structure of a mini host according to claim 8, characterized in that: The heat dissipation fan (21) comprises a plurality of arc-shaped blades, and a connecting piece (212) is connected between the distal ends of adjacent blades, and the connecting piece (212) is inclined from the upper end of one blade to the lower end of another blade.

10. The multi-power source heat dissipation structure of a mini host according to any one of claims 1 to 9, characterized in that: The side plate of the housing (3) on which the air outlet (32) is arranged is made of a material with low thermal conductivity.

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