Integrated independent small board, mainboard and connecting line

Abstract

The utility model discloses an integrated independent small board, a main board and a connecting line. The utility model belongs to the technical field of electronic circuits. The circuit comprises a first substrate and a PIN (Personal Identification Number) arranged on the first substrate, the PIN comprises a power supply section and a signal section; the power supply section comprises a power supply receiving pin; the signal section comprises a signal transmission pin; wherein the total number of the PINs is 68. By adopting the technical scheme, interfaces with different functions such as an HDMI IN, a USB, a power supply and the like can be integrated on the same small board and share one wire harness to carry out signal transmission with a mainboard, so that the influence on internal wiring of equipment caused by redundant and miscellaneous wire harnesses is avoided. Meanwhile, the scheme adopts a mode of separately arranging the power supply and the information, so that the interference of the power supply on the signal in the signal transmission process can be avoided, and the anti-interference capability of signal transmission is improved.

Description

[0001] This application is a divisional application of the following application: the application date is October 23, 2023, the application number is 202322854761.0, and the name of the invention is: A complete independent small board, main board and connecting line. Technical Field

[0002] The present application belongs to the field of electronic circuit technology, and specifically relates to a self-contained independent small board, a main board and connecting wires. Background Art

[0003] With the development of technology, large-screen display devices have been widely used due to their advantages such as rich display information and convenient interaction. As one of the large-screen display devices, the demand for commercial LCDs is increasing, and the requirements for their internal structure are also gradually increasing.

[0004] Commercial LCD monitors often use a small front-end board that includes multiple interfaces such as HDMI IN, Type C, USB, and a light sensor. Each interface typically requires a corresponding wiring harness to connect to the mainboard to transmit its own electrical signal data. This requires multiple bases and supporting cables to connect the mainboard and the front-end board. However, this connection method not only makes the overall wiring of the entire machine complicated, but also increases costs.

[0005] Therefore, how to simplify the wiring harness for signal transmission between the small board and the main board without interfering with the transmission accuracy of each signal is a technical problem that needs to be solved urgently by those skilled in the art. Utility Model Content

[0006] The purpose of the embodiments of the present application is to provide a self-contained independent small board, main board, and connecting cable that can integrate interfaces with different functions, such as HDMI IN, USB, and power, on the same small board. This allows for a common wiring harness to transmit signals to the main board, thus avoiding redundant wiring harnesses that may affect the internal wiring of the device. Furthermore, the separate layout of power and information on the self-contained small board can prevent power interference with the signal during transmission, thereby improving the anti-interference capability of signal transmission.

[0007] In a first aspect, an embodiment of the present application provides a self-contained independent small board, the self-contained independent small board comprising:

[0008] A first substrate, a PIN pin provided on the first substrate; the PIN pin includes a power section and a signal section;

[0009] The power section includes a power receiving pin;

[0010] The signal section includes a signal transmission pin;

[0011] The total number of PIN pins is 68.

[0012] Further:

[0013] Pin 11 is HDMI_INF_RXCKN, pin 12 is HDMI_INF_RXCKP, pin 14 is DMI_INF_RX0N, pin 15 is HDMI_INF_RX0P, pin 17 is HDMI_INF_RX1N, pin 18 is HDMI_INF_RX1P, pin 20 is HDMI_INF_RX2N, pin 21 is HDMI_INF_RX2P, pin 23 is HDMI_INF_SCL, pin 24 is HDMI_INF_SDA, pin 25 is HDMI_INF_5V, pin 26 is HDMI_INF_HPD, and pin 27 is CEC_IO.

[0014] Further:

[0015] Pin 29 is INF_USB3.0_DP, pin 30 is INF_USB3.0_DM, pin 32 is INF_USB3.0_RXP, pin 33 is INF_USB3.0_RXN, pin 35 is INF_USB3.0_TXP, and pin 36 is INF_USB3.0_TXN;

[0016] Pins 47-51 are 5V_INFUSB.

[0017] Further:

[0018] Pin 42 is LED R;

[0019] Pin 43 is LED G / B;

[0020] Pin 44 is KEY 0;

[0021] Pin 45 is IR IN;

[0022] Pin 46 is a 5V STB.

[0023] Further:

[0024] Pins 61-68 are 18V_T;

[0025] Pins 52-60 are GND.

[0026] Further:

[0027] 2 pins are EXTOUT_DP,

[0028] Pin 3 is EXTOUT_DM,

[0029] Pin 5 is EXTOUT_TXP,

[0030] Pin 6 is EXTOUT_TXN,

[0031] 8 pins are EXTOUT_RXP,

[0032] Pin 9 is EXTOUT_RXN.

[0033] Furthermore: the EXTOUT_RXN, EXTOUT_RXP, GND, EXTOUT_TXN and EXTOUT_TXP pins of the first substrate are respectively connected to the IN4, IN3, G1, IN2 and IN1 pins on the left side of the TVS tube DU31, and the OUT4, OUT3, G2, OUT2 and OUT1 pins on the right side of the TVS tube DU31 are respectively connected to the EXTOUT_RXN, EXTOUT_RXP, GND, EXTOUT_TXN and EXTOUT_TXP pins of the external USB interface.

[0034] Furthermore, the EXTOUT_DP and EXTOUT_DM pins of the first substrate are connected to the GND ground line through the Schottky diode DU1, and are also connected to the external USB3.0_OUT_B_DP connector and USB3.0_OUT_B_DM connector through LU8 and thick film resistors RU49 and RU50, respectively, as a protection circuit for the USB3.0 output interface.

[0035] Furthermore: the INF_USB3.0_RXP, INF_USB3.0_RXN, GND, INF_USB3.0_TXP and INF_USB3.0_TXN pins of the first substrate are respectively connected to the IN4, IN3, G1, IN2 and IN1 pins on the left side of the TVS tube DU32, and the OUT4, OUT3, G2, OUT2 and OUT1 pins on the right side of the TVS tube DU31 are respectively connected to the INF_USB3.0_RXP, INF_USB3.0_RXN, GND, INF_USB3.0_TXP and INF_USB3.0_TXN pins of the external USB interface.

[0036] Furthermore, the INF_USB3.0_DP and INF_USB3.0_DM pins of the first substrate are connected to the GND ground line through the Schottky diode DU2, and are also connected to the external INF_USB3.0_DP_C connector and INF_USB3.0_DM_C connector through LU9, serving as a protection circuit for the USB3.0 input interface.

[0037] Further: the HDMI_INF_SCL pin of the first substrate is connected to the first end of the thick film resistor RH61, the thick film resistor RH63 and the ceramic capacitor CH29, the HDMI_INF_SDA pin is connected to the first end of the thick film resistor RH60, the thick film resistor RH64 and the ceramic capacitor CH28, the HDMI_INF_5V pin is connected to the first end of the Schottky diode DH18, the second ends of the thick film resistor RH60 and the thick film resistor RH61 are connected to the second end of the Schottky diode DH18, the second ends of the ceramic capacitor CH28 and the ceramic capacitor CH29 are connected to the GND ground line, and the second ends of the thick film resistor RH63 and the thick film resistor RH64 are respectively connected to the HDMI_C_SCL_IN_IC connector and the HDMI_C_SDA_IO_IC connector.

[0038] Furthermore: the HDMI_INF_5V pin of the first substrate is connected to the first end of the thick film resistor RH43, the thick film resistor RH62 and the ceramic capacitor CH31, the second ends of the thick film resistor RH62 and the ceramic capacitor CH31 are connected to the GND ground line, and the second end of the thick film resistor RH43 is connected to the HDMI_C_DET_IN_IC connector.

[0039] Further: the HDMI_INF_HPD pin of the first substrate is connected to the first end of the ceramic capacitor CH14, the thick film resistor R57, the thick film resistor RH19 and the collector of the universal transistor QH3, the HDMI_INF_5V pin is connected to the second end of the thick film resistor RH19, the thick film resistor RH21, the second end of the ceramic capacitor CH14, the thick film resistor R57 and the emitter of the universal transistor QH3 are connected to the GND ground line, the base of the universal transistor QH3 is connected to the first end of the thick film resistor RH40, the second end of the thick film resistor RH40 is connected to the first end of the thick film resistor RH21 and the HDMI_C_HPD_OUT_IC connector.

[0040] Furthermore: the CEC-IO pin of the first substrate is connected to the first end of the ceramic capacitor CH30 and the thick film resistor R17, the second end of the ceramic capacitor CH30 is connected to the GND ground line, and the second end of the thick film resistor R17 is connected to the HDMI_CEC_IO pin.

[0041] Furthermore: the 18V_T pin of the first substrate is connected to the GND ground line via two parallel ceramic capacitors C63 and C64.

[0042] In a second aspect, an embodiment of the present application provides a mainboard, comprising:

[0043] A second substrate, and PIN pins provided on the second substrate;

[0044] The PIN pin includes a power section and a signal section;

[0045] The power section includes a power supply pin;

[0046] Among them, the total number of PIN pins is 68, and they are arranged corresponding to the self-assembled independent small board as described in the first aspect.

[0047] In a third aspect, an embodiment of the present application provides a connecting wire, the connecting wire comprising: a first connector, a lead wire, and a second connector;

[0048] The first connector is used to connect to the PIN pin of the assembled independent small board;

[0049] The second connector is used to connect to the PIN pin of the mainboard.

[0050] Furthermore, the connecting wire is made of FFC material or FPC material and has a preset number of channels.

[0051] In a fourth aspect, an embodiment of the present application provides an electronic device, comprising the above-mentioned self-contained independent small board, a main board and connecting cables.

[0052] In this solution, the assembled independent small board includes: a first substrate, a preset number of PIN pins arranged on the first substrate; the PIN pins include a power section and a signal section; the power section includes a power receiving pin; the signal section includes a signal transmission pin for transmitting at least two of HDMI signals, USB signals, key signals, remote control signals and light-sensing signals. By adopting this technical solution, interfaces with different functions such as HDMIIN, USB and power can be integrated on the same small board, and a common wiring harness is used to transmit signals with the main board, avoiding the redundancy of the wiring harness affecting the internal wiring of the device. The separate layout of power and information can avoid the interference of power on the signal during signal transmission and improve the anti-interference ability of signal transmission. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] Figure 1 This is a schematic structural diagram of the self-contained independent small board device provided in Example 1 of the present application;

[0054] Figure 2 This is the pin distribution diagram of the first substrate provided in Example 1 of the present application;

[0055] Figure 3 This is a schematic diagram of the USB3.0_OUT circuit connection provided in Example 1 of the present application;

[0056] Figure 4 This is a schematic diagram of the protection circuit of the USB 3.0 output interface provided in Example 1 of the present application;

[0057] Figure 5 This is a schematic diagram of the USB3.0_IN circuit connection provided in Example 1 of the present application;

[0058] Figure 6 This is a schematic diagram of the protection circuit of the USB 3.0 input interface provided in Example 1 of the present application;

[0059] Figure 7 This is a partial structural diagram of the self-contained independent small board and functional protection circuit provided in Example 2 of the present application;

[0060] Figure 8 This is a partial structural diagram of the functional protection circuit provided in Example 2 of the present application;

[0061] Figure 9 This is a partial structural diagram of the functional protection circuit provided in Example 2 of the present application;

[0062] Figure 10 This is a partial structural diagram of the functional protection circuit provided in Example 2 of the present application;

[0063] Figure 11 This is a partial structural diagram of the functional protection circuit provided in Example 2 of the present application;

[0064] Figure 12 This is a partial structural diagram of the functional protection circuit provided in Example 2 of the present application;

[0065] Figure 13 This is a structural diagram of the mainboard device provided in Example 3 of the present application;

[0066] Figure 14 This is the pin distribution diagram of the second substrate provided in Example 3 of the present application;

[0067] Figure 15 This is a schematic diagram of the USB3.0_IN circuit connection provided in the third embodiment of the present application;

[0068] Figure 16 This is a schematic diagram of the protection circuit of the USB 3.0 input interface provided in the third embodiment of the present application;

[0069] Figure 17 This is a partial structural diagram of the mainboard and functional protection circuit provided in the fourth embodiment of the present application;

[0070] Figure 18 This is a partial structural diagram of the functional protection circuit provided in Example 4 of the present application;

[0071] Figure 19 This is a structural diagram of the electronic device provided in Example 5 of the present application. DETAILED DESCRIPTION

[0072] In order to make the purpose, technical solutions and advantages of the present application clearer, the specific embodiments of the present application are further described in detail below in conjunction with the accompanying drawings. It is understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application. It should also be noted that, for ease of description, only parts related to the present application, not all of the contents, are shown in the accompanying drawings. Before discussing the exemplary embodiments in more detail, it should be mentioned that some exemplary embodiments are described as processes or methods depicted as flow charts. Although the flow charts describe each operation (or step) as a sequential process, many of the operations therein can be implemented in parallel, concurrently or simultaneously. In addition, the order of the operations can be rearranged. The process can be terminated when its operation is completed, but can also have additional steps not included in the accompanying drawings. The process can correspond to a method, function, procedure, subroutine, subprogram, etc.

[0073] The following will be combined with the accompanying drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of this application.

[0074] The terms "first," "second," and the like in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of this application can be implemented in an order other than that illustrated or described herein, and that the objects distinguished by "first," "second," and the like are generally of the same type, and do not limit the number of objects; for example, the first object can be one or more. In addition, the term "and / or" in the specification and claims refers to at least one of the connected objects, and the character " / " generally indicates that the objects connected are in an "or" relationship.

[0075] Below, in conjunction with the accompanying drawings, the self-contained independent small board, main board and connecting wires provided in the embodiment of the present application are described in detail through specific embodiments and their application scenarios.

[0076] Example 1

[0077] Figure 1 This is a schematic diagram of the structure of the self-contained independent small board device provided in the embodiment of the present application. Figure 1 As shown, the self-assembled independent small board includes:

[0078] a first substrate, and a preset number of PIN pins disposed on the first substrate;

[0079] The PIN pin includes a power section and a signal section;

[0080] The power section includes a power receiving pin;

[0081] The signal section includes signal transmission pins for transmitting at least two of HDMI signals, USB signals, key signals, remote control signals and light sensing signals.

[0082] Wherein, the PIN pins are arranged on the same side of the first substrate;

[0083] The first substrate is also provided with physical contacts for connecting at least two of the following: an HDMI interface, a USB interface, a key entity, a remote control signal receiver, and a light sensing signal receiver.

[0084] The application scenario of this solution is that when one or more external devices need to transmit signals with the mainboard of the display device through the external interface, the independent small board can be connected to the mainboard of the display device to realize the transmission of various signals such as HDMI signals, USB signals, button signals, remote control signals and light sensing signals, thereby realizing the connection between the external interface and the mainboard and the information transmission scenario.

[0085] In this solution, the display device may be an electronic device with a display function, for example, a commercial LCD display device such as an LCD advertising machine, a touch-integrated machine, and a smart conference tablet.

[0086] Optionally, in the pin definition of the first substrate and the second substrate, a layout method in which high-speed signal pins are separated from power pins can be adopted, which is conducive to reducing interference during signal transmission.

[0087] The first substrate, as the main body of the assembled independent small board, is used to connect with at least two of the DMI interface, USB interface, key entity, remote control signal receiver and light sensing signal receiver, and transmit the received signal through the PIN pin.

[0088] The preset number may be the number of PIN pins preset according to the usage requirements of the signal transmission interface.

[0089] The PIN pins can be connected to the peripheral circuit from the first substrate. In this solution, the PIN pins are located on the same side of the first substrate to facilitate the connection of the leads.

[0090] The power section may include a power receiving pin for connecting to an external power source and transmitting electrical energy. For example, a specific pin distribution diagram of the first substrate is given in this embodiment, such as Figure 2As shown: the power receiving pin 18V_T is used to power the TYPE C PD, with a maximum of 18V / 4A, which can fully meet the 65W power supply requirements of the PD on the independent small board; the pin 5V_INF USB is used to power the USB base and HUB on the board, and the TYPE C to HDMI chip is also provided by this voltage after conversion; the pin 5V_STB provides standby power to power modules that need to work in standby mode, such as IR, KEY, etc.

[0091] The signal segment may include signal transmission pins for transmitting at least two of HDMI signals, USB signals, key signals, remote control signals, and light-sensing signals. HDMI signals may be high-definition multimedia signals such as digitized video and audio. USB signals may be serial transmission port signals that can connect to a variety of peripherals. Key signals may be signals transmitted during normal use of an external keyboard device. Remote control signals may be command signals generated to the mainboard during normal use of an external remote control device. Light-sensing signals may be signals received by a light-sensing signal receiver, such as a light intensity sensor, that describes the light intensity and range.

[0092] The physical contact may be a signal transmission lead in the first substrate for docking with at least two of the DMI interface, the USB interface, the key entity, the remote control signal receiver, and the light-sensing signal receiver.

[0093] For example, a USB 3.0 interface is connected to corresponding physical contacts. When the USB 3.0 interface is used to connect an external device for signal transmission, the external device's signal is transmitted through the physical contacts to the corresponding PIN pins: INF_USB3.0_TXN, INF_USB3.0_TXP, INF_USB3.0_RXN, and INF_USB3.0_RXP. The USB signals from these pins are then transmitted to the corresponding pins on the mainboard, such as CHL_INF_USB3.0_TXN, CHL_INF_USB3.0_TXP, CHL_INF_USB3.0_RXN, and CHL_INF_USB3.0_RXP, on the second substrate. These pins then transmit the USB signals to the corresponding locations on the mainboard for processing.

[0094] In this embodiment, the following USB signal transmission processing procedure is provided for reference:

[0095] #pragma data_alignment=1

[0096] typedef struct_USB_Token_t{

[0097] uint8_t bPID; / / 0xE1,OUT(0001B);

[0098] 0x69,IN(1001B);

[0099] 0x2D,SETUP(1101B);

[0100] uint16_t b7Addr:7; / / Device address to be accessed

[0101] uint16_t b4Endpoint:4; / / Endpoint number to be accessed

[0102] uint16_t b5CRC:5; / / CRC check code of wFrameID field (11 bits)

[0103] }USB_Token_t;

[0104] In this embodiment, the following circuit design of connecting a self-contained independent board to a USB 3.0 interface is provided for reference:

[0105] like Figure 3 As shown in the USB3.0_OUT circuit connection diagram, the EXTOUT_RXN, EXTOUT_RXP, GND, EXTOUT_TXN, and EXTOUT_TXP pins of the first substrate are respectively connected to the IN4, IN3, G1, IN2, and IN1 pins on the left side of the TVS tube DU31. The OUT4, OUT3, G2, OUT2, and OUT1 pins on the right side of the TVS tube DU31 are respectively connected to the EXTOUT_RXN, EXTOUT_RXP, GND, EXTOUT_TXN, and EXTOUT_TXP pins of the external USB port.

[0106] like Figure 4 As shown, the EXTOUT_DP and EXTOUT_DM pins on the first substrate are connected to the GND line via Schottky diode DU1. They are also connected to the external USB3.0_OUT_B_DP and USB3.0_OUT_B_DM connectors via LU8 and thick-film resistors RU49 and RU50, respectively. This serves as a protection circuit for the USB3.0 output interface. LU8 is normally short-circuited, meaning that breakpoints 1 and 2, and breakpoints 3 and 4 are connected via wires. To filter noise, breakpoints 1 and 2, and breakpoints 3 and 4 can be connected via common-mode inductors to filter the signal.

[0107] like Figure 5As shown in the USB3.0_IN circuit connection diagram, the INF_USB3.0_RXP, INF_USB3.0_RXN, GND, INF_USB3.0_TXP, and INF_USB3.0_TXN pins of the first substrate are respectively connected to the IN4, IN3, G1, IN2, and IN1 pins on the left side of the TVS tube DU32. The OUT4, OUT3, G2, OUT2, and OUT1 pins on the right side of the TVS tube DU31 are respectively connected to the INF_USB3.0_RXP, INF_USB3.0_RXN, GND, INF_USB3.0_TXP, and INF_USB3.0_TXN pins of the external USB port.

[0108] like Figure 6 As shown, the INF_USB3.0_DP and INF_USB3.0_DM pins on the first substrate are connected to the GND ground line via Schottky diode DU2. They are also connected to the external INF_USB3.0_DP_C and INF_USB3.0_DM_C connectors via LU9, serving as a protection circuit for the USB3.0 input interface. LU9 is normally short-circuited, meaning that breakpoints 1 and 2, and breakpoints 3 and 4 are connected via wires. To filter out noise, breakpoints 1 and 2, and breakpoints 3 and 4 can be connected via common-mode inductors to filter the signal.

[0109] In this solution, the assembled independent small board includes: a first substrate, a preset number of PIN pins arranged on the first substrate; the PIN pins include a power section and a signal section; the power section includes a power receiving pin; the signal section includes a signal transmission pin for transmitting at least two of HDMI signals, USB signals, key signals, remote control signals and light-sensing signals. By adopting this technical solution, interfaces with different functions such as HDMIIN, USB and power can be integrated on the same small board, and a common wiring harness is used to transmit signals with the main board, avoiding the redundancy of the wiring harness affecting the internal wiring of the device. The separate layout of power and information can avoid the interference of power on the signal during signal transmission and improve the anti-interference ability of signal transmission.

[0110] Example 2

[0111] Figure 7 This is a partial structural diagram of the assembled independent small board and functional protection circuit provided in the embodiment of the present application. Figure 7 As shown, a functional protection circuit is provided between the physical contact and the corresponding signal transmission pin on the first substrate.

[0112] Functional protection circuit, in this embodiment, the functional protection circuit is composed of a resistor array and a TVS tube in series. Among them, the resistor array can be made by packaging together a number of resistors with exactly the same parameters, which has the advantages of easy assembly and high installation density. The TVS tube can be a new type of high-efficiency overvoltage and overcurrent protection component invented based on the Zener diode process. When a short circuit occurs in the circuit, the two ends of the TVS diode are subjected to a transient high-energy impact, and it is 10 -12 The impedance between the two ends is changed from high impedance to low impedance at a speed of seconds to absorb a momentary large current and clamp the voltage at both ends to a predetermined value, thereby protecting the subsequent precision components from the impact of transient high-voltage spike pulses.

[0113] Or, as Figure 8 As shown, the HDMI_INF_SCL pin of the first substrate is connected to the first end of thick-film resistors RH51 and RH63, and the ceramic capacitor CH29. The HDMI_INF_SDA pin is connected to the first end of thick-film resistors RH60 and RH64, and the ceramic capacitor CH28. The HDMI_INF_5V pin is connected to the first end of Schottky diode DH18. The second ends of thick-film resistors RH60 and RH61 are connected to the second end of Schottky diode DH18. The second ends of ceramic capacitors CH28 and CH29 are connected to the GND ground line. The second ends of thick-film resistors RH63 and RH64 are connected to the HDMI_C_SCL_IN_IC connector and the HDMI_C_SDA_IO_IC connector, respectively. The thick-film resistor can be a type of resistor material manufactured on a printed circuit board. The thick-film resistor forms a layer of ceramic film on the circuit board, which makes the thick-film resistor have a higher conductivity when compared to other resistors of the same resistance value. A Schottky diode is a semiconductor diode with a low forward voltage drop and very fast switching action. When current flows through a Schottky diode, there is a small voltage drop across the Schottky diode terminals. This lower voltage drop provides better system efficiency and higher switching speeds.

[0114] Or, as Figure 9 As shown, the HDMI_INF_5V pin of the first substrate is connected to the first end of the thick film resistor RH43, the thick film resistor RH62 and the ceramic capacitor CH31, the second end of the thick film resistor RH62 and the ceramic capacitor CH31 is connected to the GND ground line, and the second end of the thick film resistor RH43 is connected to the HDMI_C_DET_IN_IC connector.

[0115] Or, as Figure 10As shown, the HDMI_INF_HPD pin of the first substrate is connected to the first ends of the ceramic capacitor CH14, thick-film resistor R57, and thick-film resistor RH19, as well as the collector of the general-purpose transistor QH3. The HDMI_INF_5V pin is connected to the second ends of the thick-film resistors RH19 and RH21. The second ends of the ceramic capacitor CH14, thick-film resistor R57, and the emitter of the general-purpose transistor QH3 are connected to the GND ground line. The base of the general-purpose transistor QH3 is connected to the first end of the thick-film resistor RH40, and the second end of the thick-film resistor RH40 is connected to the first end of the thick-film resistor RH21 and the HDMI_C_HPD_OUT_IC connector. The general-purpose transistor can be a basic semiconductor component that can amplify weak signals into larger amplitude signals and can also be used as a contactless switch.

[0116] Or, as Figure 11 As shown, the CEC_IO pin of the first substrate is connected to the first end of the ceramic capacitor CH30 and the thick film resistor R17, the second end of the ceramic capacitor CH30 is connected to the GND ground line, and the second end of the thick film resistor R17 is connected to the HDMI_CEC_IO pin.

[0117] Alternatively, it can be a protection circuit for the power port, such as Figure 12 As shown, the 18V_T pin of the first substrate is connected to the GND ground line via two parallel ceramic capacitors (C63 and C64).

[0118] The advantage of this arrangement is that a functional protection circuit can be set between the physical contacts and the corresponding signal transmission pins to prevent short circuits and other accidents when external devices are connected to the signal transmission circuit from damaging the entire independent board.

[0119] Example 3

[0120] Figure 13 This is a schematic diagram of the structure of the motherboard device provided in the embodiment of the present application. Figure 13 As shown, the main board includes:

[0121] a second substrate, and a preset number of PIN pins disposed on the second substrate;

[0122] The PIN pin includes a power section and a signal section;

[0123] The power section includes a power supply pin;

[0124] The signal section includes signal transmission pins for transmitting at least two of HDMI signals, USB signals, key signals, remote control signals and light sensing signals.

[0125] Wherein, the PIN pins are arranged on the same side of the second substrate.

[0126] The second substrate can be disposed on the main board to receive various signals from the first substrate and transmit them to a specific area of ​​the main board for signal processing. The preset number of the second substrates should not be less than the preset number of the first substrates.

[0127] PIN pins, the PIN pins of the second substrate have similar position distribution and function definition as the PIN pins of the first substrate, so that when receiving signals from PIN pins of different functions on the first substrate, there is a corresponding communication protocol for matching. The PIN pins in the second substrate are located on the same side of the second substrate. For example, a specific pin distribution diagram of the second substrate is given in this embodiment, as shown in FIG. Figure 14 As shown, combined Figure 14 Pinout for the first baseboard: The I2C_SDA and I2C_SCL pins of the second baseboard are connected to the Light_SDA and Light_SCL pins of the first baseboard for light sensor I2C signal transmission; the IR_IN_IC pin of the second baseboard is connected to the IR_IN pin of the first baseboard for remote control signal transmission; the KEY_IN pin of the second baseboard is connected to the KEYIN pin of the first baseboard for key signal transmission, etc. These are not listed here one by one.

[0128] In this embodiment, the following circuit design of connecting the motherboard to the USB 3.0 interface is provided for reference:

[0129] like Figure 15 As shown in the USB3.0_IN circuit connection diagram, the CHL_INF_USB3.0_RXP, CHL_INF_USB3.0_RXN, GND, CHL_INF_USB3.0_TXP, and CHL_INF_USB3.0_TXN pins of the second substrate are respectively connected to the IN4, IN3, G1, IN2, and IN1 pins on the left side of the TVS tube DU15. The OUT4, OUT3, G1, OUT2, and OUT1 pins on the right side of the TVS tube DU15 are respectively connected to the CHL_INF_USB3.0_RXP, CHL_INF_USB3.0_RXN, GND, CHL_INF_USB3.0_TXP, and CHL_INF_USB3.0_TXN pins of the external USB port.

[0130] like Figure 16As shown, the CHL_INF_USB3.0_DP and CHL_INF_USB3.0_DM pins on the second substrate are connected to the GND ground line via TVS diodes DU32 and DU33, respectively. They are also connected to the external CHL_INF_USB2.0_DP and CHL_INF_USB2.0_DM connectors via LU9, serving as a protection circuit for the USB 3.0 input interface. LU9 is normally short-circuited, meaning that breakpoints 1 and 2, and breakpoints 3 and 4, are connected via wires. To filter noise, breakpoints 1 and 2, and breakpoints 3 and 4, can be connected via common-mode inductors to filter the signal.

[0131] The advantage of this arrangement is that the second substrate pins of the motherboard can be functionally defined to match the first substrate pins, making the transmission of signals such as HDMI signals, remote control signals and light sensing signals more accurate and efficient.

[0132] Example 4

[0133] Figure 17 This is a partial structural diagram of the mainboard and functional protection circuit provided by the embodiment of the present application. Figure 17 As shown, a functional protection circuit is provided on the second substrate.

[0134] The functional protection circuit of the second substrate may include a TVS tube and a signal common-mode inductor. Among them, the TVS tube prevents overvoltage and overcurrent from damaging the circuit and components. The signal common-mode inductor can be a common-mode choke coil wound on the same iron core with the same number of turns and phase (winding in reverse). In this way, when the signal current in the circuit passes through the common-mode choke coil, the current generates reverse magnetic fields in the same coil, which cancel each other out. At this time, the normal signal current is mainly affected by the coil resistance (and the damping caused by a small amount of leakage); when the common-mode choke passes through the coil, due to the isotropic nature of the common-mode choke coil, a isotropic magnetic field will be generated in the coil, increasing the inductive reactance of the coil, making the coil appear as high impedance, and producing a strong damping effect, thereby attenuating the common-mode choke and achieving the purpose of filtering the signal current.

[0135] Alternatively, the functional protection circuit can also be as follows Figure 18As shown, the HDMI_INF_CEC pin of the first substrate is connected to the GND ground line via a parallel TVS diode and a chip ceramic capacitor, which serves as a protection circuit for external devices connected to the pin. In addition, the HDMI_INF_CEC pin is connected to the HDMI_CEC_IO connector via a ferrite bead, enabling the transmission of HDMI signals. The ferrite bead can be a component composed primarily of ferrite made of an iron-magnesium alloy or an iron-nickel alloy, which has high magnetic permeability. At high frequencies, the ferrite bead exhibits resistive properties, equivalent to an inductor with a very low quality factor. Therefore, it can maintain a high impedance over a fairly wide frequency range, thereby improving high-frequency filtering efficiency.

[0136] The advantage of this arrangement is that a functional protection circuit can be set between other components of the mainboard and the pins of the second substrate to prevent external devices from being damaged by short circuits and other accidents when connected to the signal transmission circuit.

[0137] Example 5

[0138] Figure 19 Schematic diagram of the structure of the electronic device provided in the embodiment of the present application. Figure 19 As shown, the electronic device includes:

[0139] The self-assembled independent small board, main board and connecting wires in the above embodiment.

[0140] Wherein, the connecting line includes: a first connector, a lead wire and a second connector;

[0141] The first connector is used to connect to a PIN pin of the self-contained independent board as described in any one of the above embodiments;

[0142] The second connector is used to connect to a PIN pin of a mainboard as described in any one of the above embodiments.

[0143] Furthermore, the connecting wire is made of FFC material or FPC material and has a preset number of channels.

[0144] The connecting line can be a signal transmission line used to connect the assembled independent small board and the main board, including a first connector, a lead and a second connector. The first connector and the second connector are respectively connected to the pins of the first substrate and the second substrate, and the connector can be a connector, which is connected to the pins of the substrate through a male head and a female head. The lead can be a cable that can transmit signals, and its material can be FFC material or FPC material. FFC material can be a flexible flat cable made of a flat copper foil sandwiched between two layers of insulating foil. FPC material can be a flexible circuit board with different single-sided, double-sided and multi-layer structures obtained by chemically etching the flexible copper foil. The preset number of channels, independent signal transmission channels in the lead, can be determined according to the type of signal transmission and functional requirements.

[0145] The advantage of this arrangement is that the assembled independent small board can be connected to the main board through a connector and a lead, which makes the wiring of the whole machine simpler and reduces costs on the basis of completing the signal transmission between the assembled independent small board and the main board.

[0146] It should be noted that, in this article, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device comprising the element. In addition, it should be noted that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in the opposite order according to the functions involved. For example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0147] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of this application, ordinary technicians in this field can also make many forms without departing from the purpose of this application and the scope of protection of the claims, all of which are within the protection of this application.

[0148] The above are only preferred embodiments of the present application and the technical principles employed. The present application is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions that are possible for those skilled in the art will not depart from the scope of protection of the present application. Therefore, although the present application has been described in more detail through the above embodiments, the present application is not limited to the above embodiments and may include more other equivalent embodiments without departing from the concept of the present application. The scope of the present application is determined by the scope of the claims.

Claims

1. A self-contained independent small board, characterized in that: The self-assembled independent small board includes: A first substrate, and PIN pins provided on the first substrate; The PIN pin includes a power section and a signal section; The power section includes a power receiving pin; The signal section includes a signal transmission pin; The total number of PIN pins is 68. Among them, the HDMI_INF_SCL pin of the first substrate is connected to the first end of the thick film resistor RH61, the thick film resistor RH63 and the ceramic capacitor CH29, the HDMI_INF_SDA pin is connected to the first end of the thick film resistor RH60, the thick film resistor RH64 and the ceramic capacitor CH28, the HDMI_INF_5V pin is connected to the first end of the Schottky diode DH18, the second ends of the thick film resistor RH60 and the thick film resistor RH61 are connected to the second end of the Schottky diode DH18, the second ends of the ceramic capacitor CH28 and the ceramic capacitor CH29 are connected to the GND ground line, and the second ends of the thick film resistor RH63 and the thick film resistor RH64 are respectively connected to the HDMI_C_SCL_IN_IC connector and the HDMI_C_SDA_IO_IC connector.

2. The self-assembled independent small board according to claim 1, characterized in that: Pin 11 is HDMI_INF_RXCKN, Pin 12 is HDMI_INF_RXCKP, Pin 14 is DMI_INF_RX0N, Pin 15 is HDMI_INF_RX0P, Pin 17 is HDMI_INF_RX1N, Pin 18 is HDMI_INF_RX1P, Pin 20 is HDMI_INF_RX2N, Pin 21 is HDMI_INF_RX2P, Pin 23 is HDMI_INF_SCL, Pin 24 is HDMI_INF_SDA, Pin 25 is HDMI_INF_5V, Pin 26 is HDMI_INF_HPD, Pin 27 is CEC_IO.

3. The self-assembled independent small board according to claim 1, characterized in that: Pin 29 is INF_USB3.0_DP, Pin 30 is INF_USB3.0_DM, Pin 32 is INF_USB3.0_RXP, Pin 33 is INF_USB3.0_RXN, Pin 35 is INF_USB3.0_TXP, Pin 36 is INF_USB3.0_TXN; Pins 47-51 are 5V_INFUSB.

4. The self-assembled independent small board according to claim 1, characterized in that: Pin 42 is LED R; Pin 43 is LED G / B; Pin 44 is KEY 0; Pin 45 is IR IN; Pin 46 is a 5V STB.

5. The self-assembled independent small board according to claim 1, characterized in that: Pins 61-68 are 18V_T; Pins 52-60 are GND.

6. The self-assembled independent small board according to claim 1, characterized in that: 2 pins are EXTOUT_DP, 3 pins are EXTOUT_DM, Pin 5 is EXTOUT_TXP, Pin 6 is EXTOUT_TXN, 8 pins are EXTOUT_RXP, Pin 9 is EXTOUT_RXN.

7. The self-assembled independent small board according to claim 6, characterized in that: The EXTOUT_RXN, EXTOUT_RXP, GND, EXTOUT_TXN, and EXTOUT_TXP pins of the first substrate are respectively connected to the IN4, IN3, G1, IN2, and IN1 pins on the left side of the TVS tube DU31, and the OUT4, OUT3, G2, OUT2, and OUT1 pins on the right side of the TVS tube DU31 are respectively connected to the EXTOUT_RXN, EXTOUT_RXP, GND, EXTOUT_TXN, and EXTOUT_TXP pins of the external USB interface.

8. The self-contained independent small board according to claim 6, characterized in that: The EXTOUT_DP and EXTOUT_DM pins of the first substrate are connected to the GND ground line through the Schottky diode DU1, and are also connected to the external USB3.0_OUT_B_DP connector and USB3.0_OUT_B_DM connector through LU8 and thick film resistors RU49 and RU50 respectively, serving as a protection circuit for the USB3.0 output interface.

9. The self-assembled independent small board according to claim 3, characterized in that: The INF_USB3.0_RXP, INF_USB3.0_RXN, GND, INF_USB3.0_TXP and INF_USB3.0_TXN pins of the first substrate are respectively connected to the IN4, IN3, G1, IN2 and IN1 pins on the left side of the TVS tube DU32, and the OUT4, OUT3, G2, OUT2 and OUT1 pins on the right side of the TVS tube DU31 are respectively connected to the INF_USB3.0_RXP, INF_USB3.0_RXN, GND, INF_USB3.0_TXP and INF_USB3.0_TXN pins of the external USB interface.

10. The self-assembled independent small board according to claim 3, characterized in that: The INF_USB3.0_DP and INF_USB3.0_DM pins of the first substrate are connected to the GND ground line through the Schottky diode DU2, and are also connected to the external INF_USB3.0_DP_C connector and INF_USB3.0_DM_C connector through LU9, serving as a protection circuit for the USB3.0 input interface.

11. The self-assembled independent small board according to claim 2, characterized in that: The HDMI_INF_5V pin of the first substrate is connected to the first ends of the thick film resistors RH43 and RH62 and the ceramic capacitor CH31. The second ends of the thick film resistors RH62 and CH31 are connected to the GND ground line. The second end of the thick film resistor RH43 is connected to the HDMI_C_DET_IN_IC connector.

12. The self-assembled independent small board according to claim 2, characterized in that: The HDMI_INF_HPD pin of the first substrate is connected to the first end of the ceramic capacitor CH14, the thick film resistor R57, the thick film resistor RH19 and the collector of the universal transistor QH3. The HDMI_INF_5V pin is connected to the second end of the thick film resistor RH19 and the thick film resistor RH21. The second end of the ceramic capacitor CH14, the thick film resistor R57 and the emitter of the universal transistor QH3 are connected to the GND ground line. The base of the universal transistor QH3 is connected to the first end of the thick film resistor RH40. The second end of the thick film resistor RH40 is connected to the first end of the thick film resistor RH21 and the HDMI_C_HPD_OUT_IC connector.

13. The self-assembled independent small board according to claim 2, characterized in that: The CEC-IO pin of the first substrate is connected to the first end of the ceramic capacitor CH30 and the thick film resistor R17, the second end of the ceramic capacitor CH30 is connected to the GND ground line, and the second end of the thick film resistor R17 is connected to the HDMI_CEC_IO pin.

14. The self-assembled independent small board according to claim 5, characterized in that: The 18V_T pin of the first substrate is connected to the GND ground line via two parallel ceramic capacitors C63 and C64.

15. A motherboard, characterized in that: The mainboard includes: A second substrate, and PIN pins provided on the second substrate; The PIN pin includes a power section and a signal section; The power section includes a power supply pin; The total number of the PIN pins is 68, and they are arranged corresponding to the self-assembled independent small board as described in any one of claims 1-14.

16. A connecting line, characterized in that: The connecting line includes: a first connector, a lead and a second connector; The first connector is used to connect to the PIN pin of the self-contained independent board according to any one of claims 1 to 14; The second connector is used to connect to the PIN pin of the mainboard as claimed in claim 15.

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