Optoelectronic device

Abstract

An optoelectronic device comprises an optical engine chip and an optical fiber connector arranged on the optical engine chip, and the optical fiber connector is provided with a body and a supporting part connected with the body. Therefore, an adhesive layer for fixing the optical fiber connector and the optical engine chip can be accommodated in a space enclosed by the body and the supporting part, and the optical fiber connector can be stably and vertically arranged on the optical engine chip through the supporting part.

Description

Technical Field

[0001] The utility model relates to a semiconductor element, in particular to a photoelectric device. Background Art

[0002] With the booming electronics industry, electronic products are increasingly becoming more multifunctional and high-performance. Currently, the application of fifth-generation (5G) communication technology has expanded to areas such as the Internet of Things (IoT), the Industrial Internet of Things (IIoT), the cloud, artificial intelligence (AI), autonomous vehicles, and healthcare. This expansion of applications will generate enormous amounts of data that require efficient transmission, computation, and storage. Consequently, the demand for data transmission within large data centers and cloud servers has surged in recent years, prompting the industry to enter the field of optical communications, using light instead of electricity as the carrier for data transmission. Against this backdrop, co-packaged optical components have become a trend in future semiconductor and packaging technologies.

[0003] In existing co-packaging processes for optical components, the distance between the fiber optic receptacle and the optical engine chip (OE chip) is typically controlled using ultraviolet (UV) adhesive. UV adhesive not only secures these components but also controls the gap height. However, UV adhesive has limitations in terms of uniformity and rheological properties, which can easily lead to inaccurate gap control, causing fiber optic connector misalignment and compromising light transmission efficiency.

[0004] How to overcome the above-mentioned various problems of the prior art has become a topic that needs to be solved urgently in the industry. Utility Model Content

[0005] The utility model provides an optoelectronic device, comprising: an optical engine chip having a first side and a second side opposite to each other; and an optical fiber connector disposed on the second side of the optical engine chip, wherein the optical fiber connector includes a body and a support portion disposed on the body, the body having a first surface and a second surface opposite to each other, and the support portion extending outward from the first surface of the body so that the optical fiber connector can be erected on the optical engine chip via the support portion.

[0006] The present invention also provides a method for manufacturing an optoelectronic device, including: providing an optical engine chip having a first side and a second side opposite to each other; and setting an optical fiber connector on the second side of the optical engine chip, wherein the optical fiber connector includes a body and a support portion provided on the body, the body having a first surface and a second surface opposite to each other, and the support portion extending outward from the first surface of the body so that the optical fiber connector can be uprightly set on the optical engine chip by means of the support portion.

[0007] In the aforementioned optoelectronic device and its manufacturing method, the optical fiber connector is fixed to the optical engine chip via an adhesive layer disposed between the first surface of the body and the second side of the optical engine chip.

[0008] In the aforementioned optoelectronic device and its manufacturing method, the adhesive layer is disposed in the space enclosed by the main body and the supporting portion.

[0009] In the aforementioned optoelectronic device and its manufacturing method, the main body is formed with an opening penetrating the first surface and the second surface to serve as a light channel.

[0010] In the aforementioned optoelectronic device and its manufacturing method, the optical engine chip integrates an electronic integrated circuit and a photonic integrated circuit.

[0011] In the aforementioned optoelectronic device and its manufacturing method, the support portion is disposed on both side edges of the first surface of the body.

[0012] In the aforementioned optoelectronic device and its manufacturing method, the support portion is disposed between the center of the body and the two side edges of the first surface.

[0013] In the aforementioned optoelectronic device and its manufacturing method, the support portion is disposed at a corner of the first surface of the body.

[0014] In the aforementioned optoelectronic device and its manufacturing method, the support portion is disposed on the side edge of the first surface of the body.

[0015] The aforementioned optoelectronic device and its manufacturing method further include a plurality of conductive elements disposed on the first side of the optical engine chip.

[0016] Therefore, the optoelectronic device and its manufacturing method of the present invention mainly make the optical fiber connector provided on the optical engine chip include a main body and a support portion, so that the adhesive layer used to fix the optical fiber connector and the optical engine chip can be accommodated in the space bounded by the main body and the support portion, and the optical fiber connector can be stably installed on the optical engine chip through the support portion. This solves the shortcomings of existing optical fiber connectors that are flat and cannot effectively control the consistency of the UV adhesive height, which easily causes the optical fiber connector to deviate and affects the efficiency of light transmission. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figures 1A to 1CIt is a three-dimensional schematic diagram of the manufacturing method of the optoelectronic device of the present invention.

[0018] Figures 2A to 2C Schematic diagrams of different embodiments of optical fiber connectors for optoelectronic devices of the present invention.

[0019] Figure 3 It is a cross-sectional schematic diagram of the photovoltaic device of the present invention.

[0020] Figure 4 It is a cross-sectional schematic diagram of the co-packaged optical components of the optoelectronic device using the present invention.

[0021] Description of Reference Numerals

[0022] 1 Photoelectric device

[0023] 11 Optical Engine Chip

[0024] 11a First side

[0025] 11b Second side

[0026] 12 Adhesive layer

[0027] 13 Fiber Optic Connectors

[0028] 130 opening

[0029] 131 Ontology

[0030] 131a first surface

[0031] 131b second surface

[0032] 132 Support

[0033] 14 Conductive elements

[0034] 2 Co-packaging optical components

[0035] 21 Circuit Board

[0036] 22 package modules. DETAILED DESCRIPTION

[0037] The following describes the implementation of the present invention by means of specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0038] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings attached to this specification are only used to match the contents disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the conditions for the implementation of the present invention. Therefore, they have no substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size should still fall within the scope of the technical content disclosed in the present invention without affecting the effects and objectives that can be achieved by the present invention. At the same time, terms such as "first", "second", "at least one", and "one" cited in this specification are only for the convenience of description and are not used to limit the scope of the implementation of the present invention. Changes or adjustments in their relative relationships should also be considered as the scope of the implementation of the present invention without substantially changing the technical content.

[0039] See also Figures 1A to 1C , which is a cross-sectional schematic diagram of the method for manufacturing the photovoltaic device of the present invention. Figure 1A As shown, an optical engine chip 11 is provided, which has a first side 11 a and a second side 11 b opposite to each other, and an adhesive layer 12 is formed on the second side 11 b of the optical engine chip 11 .

[0040] The optical engine chip 11 integrates, for example, an electronic integrated circuit (EIC) and a photonic integrated circuit (PIC), wherein the PIC is used to transmit and receive optical signals, and the electronic integrated circuit and the photonic integrated circuit are electrically connected to convert optical signals into electronic signals.

[0041] The adhesive layer 12 is, for example, UV glue or other fixing adhesives.

[0042] like Figure 1B As shown, an optical fiber connector 13 is provided, which includes a body 131 and a support portion 132 provided on the body 131. The body 131 is, for example, in the shape of a plate, and has a first surface 131a and a second surface 131b opposite to each other. An opening 130 is formed in the middle thereof, penetrating the first surface 131a and the second surface 131b, to serve as a light passage.

[0043] The support portion 132 extends outward from the first surface 131 a of the main body 131 . In one embodiment, the support portion 132 is disposed on both side edges of the first surface 131 a of the main body 131 .

[0044] Please also refer to Figures 2A to 2C In other embodiments, the support portion 132 may be optionally disposed between the center of the body 131 and the two side edges of the first surface 131a (eg Figure 2AAlternatively, the support portion 132 may be located at a corner of the first surface 131a of the main body 131 (e.g., Figure 2B ), or the support portion 132 may be optionally provided at the side edge of the first surface 131a of the body 131 (as shown in FIG. Figure 2C four side edges as shown).

[0045] like Figure 1C As shown, the optical fiber connector 13 is disposed on the optical engine chip 11 and fixed to the second side 11 b of the optical engine chip 11 through the adhesive layer 12 to manufacture the optoelectronic device 1 .

[0046] In this embodiment, the adhesive layer 12 can be accommodated in the space enclosed by the main body 131 and the support portion 132 (ie, the optical fiber connector 13 is formed with a groove structure), so that the optical fiber connector 13 can be stably placed on the optical engine chip 11 through the support portion 132.

[0047] Please also refer to Figure 1C and Figure 3 Through the above-mentioned manufacturing method, the present invention also provides an optoelectronic device 1, which includes an optical engine chip 11 and a fiber optic connector 13 provided on the optical engine chip 11.

[0048] The optical engine chip 11 has a first side 11 a and a second side 11 b opposite to each other.

[0049] The optical fiber connector 13 is disposed on the second side 11 b of the optical engine chip 11 , and includes a body 131 and a support portion 132 connected to the body 131 .

[0050] The main body 131 has a first surface 131 a and a second surface 131 b opposite to each other, and an opening 130 is formed through the first surface 131 a and the second surface 131 b to serve as a light passage.

[0051] The support portion 132 extends outward from the first surface 131a of the main body 131 so that the optical fiber connector 13 can be uprightly positioned on the optical engine chip 11 via the support portion 132, and the optical fiber connector 13 is fixed to the optical engine chip 11 via the adhesive layer 12 disposed between the first surface 131a of the main body 131 and the second side 11b of the optical engine chip 11.

[0052] In addition, a plurality of conductive elements 14 such as solder balls may be disposed on the first side 11 a of the optical engine chip 11 to facilitate subsequent connection of the optoelectronic device 1 to an external device.

[0053] See also Figure 4Subsequently, multiple optoelectronic devices 1 can be placed on a circuit board 21 using multiple conductive elements 14 on the first side 11a of the optical engine chip 11. A packaging module 22 is also provided in the center of the circuit board 21. The packaging module 22 can include active components such as a switch chip, a system-on-chip (SOC), a high-bandwidth memory (HBM) chip, or other functional chips, or passive components such as resistors, capacitors, or inductors. Multiple optoelectronic devices 1 (optical engine chips 11) are arranged around the packaging module 22 to form a commonly packaged optical element 2.

[0054] In summary, the optoelectronic device of the present invention primarily comprises a fiber optic connector mounted on an optical engine chip comprising a main body and a support portion, so that an adhesive layer for securing the fiber optic connector and the optical engine chip can be accommodated within the space bounded by the main body and the support portion, and the fiber optic connector can be stably mounted on the optical engine chip via the support portion. This overcomes the drawback of conventional fiber optic connectors, which are planar and unable to effectively control the consistency of UV adhesive height, thus easily causing the fiber optic connector to deviate and affecting the efficiency of light transmission.

[0055] The above embodiments are intended only to illustrate the principles and effects of the present invention and are not intended to limit the present invention. Persons skilled in the art may modify the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be as set forth in the claims.

Claims

1. A photoelectric device, characterized in that: include: An optical engine chip having a first side and a second side opposite to each other; as well as An optical fiber connector is disposed on the second side of the optical engine chip, wherein the optical fiber connector includes a body and a support portion disposed on the body, the body having a first surface and a second surface relative to each other, and the support portion extends outward from the first surface of the body so that the optical fiber connector can be uprightly disposed on the optical engine chip via the support portion.

2. The photovoltaic device according to claim 1, wherein The optical fiber connector is fixed on the optical engine chip through an adhesive layer arranged between the first surface of the body and the second side of the optical engine chip.

3. The photovoltaic device according to claim 2, wherein: The adhesive layer is accommodated in the space surrounded by the main body and the supporting portion.

4. The photovoltaic device according to claim 1, wherein The main body is formed with an opening penetrating the first surface and the second surface to serve as a light channel.

5. The photovoltaic device according to claim 1, wherein The optical engine chip integrates electronic integrated circuits and photonic integrated circuits.

6. The photovoltaic device according to claim 1, wherein The supporting portion is arranged on both side edges of the first surface of the body.

7. The photovoltaic device according to claim 1, wherein The supporting portion is arranged between the center of the body and two side edges of the first surface.

8. The photovoltaic device according to claim 1, wherein The supporting portion is arranged at a corner of the first surface of the main body.

9. The photovoltaic device according to claim 1, wherein The supporting portion is arranged on a side edge of the first surface of the body.

10. The photovoltaic device according to claim 1, wherein The optoelectronic device further includes a plurality of conductive elements disposed on the first side of the optical engine chip.

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