Imaging lens module, camera module and electronic device

Abstract

The utility model provides an imaging lens module, a camera module and an electronic device. The imaging lens module is provided with an optical axis and comprises an optical element, an assembling element and a low-reflection film, the optical axis passes through the optical element, and the assembling element is used for being assembled with the optical element. The low-reflection film is arranged on a part of the surface of the assembly element and comprises a nano-structure layer and a nano-structure matching layer. The nanostructure layer includes a plurality of ridge-shaped protrusions, wherein the ridge-shaped protrusions are arranged in an irregular form. The nanostructure matching layer is arranged between the assembly element and the nanostructure layer and comprises at least two optically thinner dielectric layers and at least one optically denser dielectric layer. The at least one optically denser dielectric layer is stacked between the at least two optically thinner dielectric layers. Therefore, the environmental tolerance can be improved, and stray light can be reduced.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to an imaging lens module and a camera module, and particularly to an imaging lens module and a camera module applied to a portable electronic device. BACKGROUND

[0002] In recent years, portable electronic devices, such as smart electronic devices and tablet computers, have been widely used in modern people's lives, and camera modules and imaging lens modules loaded on portable electronic devices have also developed rapidly. However, as technology continues to advance, users have increasingly high quality requirements for imaging lens modules. Therefore, developing an imaging lens module that can improve environmental tolerance and reduce stray light has become an important and urgent problem in the industry. SUMMARY

[0003] The present disclosure provides an imaging lens module, a camera module, and an electronic device, which can reduce the generation of stray light by using a low-reflection film, thereby improving environmental tolerance.

[0004] According to an embodiment of the present disclosure, an imaging lens module having an optical axis is provided, which includes an optical element, an assembly element, and a low-reflection film. The optical axis passes through the optical element, and the assembly element is configured to be assembled with the optical element. The low-reflection film is disposed on a portion of a surface of the assembly element and includes a nanostructure layer and a nanostructure matching layer. The nanostructure layer includes a plurality of ridge-shaped protrusions arranged in a random form. The nanostructure matching layer is disposed between the assembly element and the nanostructure layer and includes at least two layers of low-refraction medium layers and at least one layer of high-refraction medium layer. The at least one layer of high-refraction medium layer is stacked between the at least two layers of low-refraction medium layers. The thickness of the at least two layers of low-refraction medium layers is greater than 40 nm and less than 100 nm, the thickness of the at least one layer of high-refraction medium layer is greater than 1 nm and less than 33 nm, and the height of the plurality of ridge-shaped protrusions is greater than 80 nm and less than 300 nm.

[0005] According to the imaging lens module of the preceding embodiment, the thickness of the at least two layers of low-refraction medium layers can be greater than 45 nm and less than 95 nm.

[0006] According to the imaging lens module of the preceding embodiment, the thickness of the at least two layers of low-refraction medium layers can be greater than 48 nm and less than 85 nm.

[0007] According to the imaging lens module of the preceding embodiment, the thickness of the at least one layer of high-refraction medium layer can be greater than 3 nm and less than 28 nm.

[0008] According to the imaging lens module of the embodiment described in the preceding paragraph, the thickness of the at least one optically dense dielectric layer may be greater than 3 nm and less than 25 nm.

[0009] According to the imaging lens module of the embodiment described in the preceding paragraph, the optical element may be assembled on the assembly element, and the optical element and the assembly element may be in physical contact.

[0010] In the imaging lens module according to the embodiment described in the previous paragraph, the assembly element may be a light-proof plastic element for absorbing light incident on the assembly element.

[0011] According to the imaging lens module of the embodiment described in the previous paragraph, one of the at least two optically sparse dielectric layers may be a silicon monoxide layer.

[0012] According to the imaging lens module of the embodiment described in the preceding paragraph, at least one optically dense dielectric layer may be a titanium oxide layer.

[0013] In the imaging lens module according to the embodiment described in the preceding paragraph, one of the plurality of ridge-shaped protrusions may be an aluminum oxide ridge-shaped protrusion.

[0014] The imaging lens module according to the embodiment described above may further include an adhesive element, wherein the adhesive element may be disposed on the assembly element to assemble the imaging lens module, and the adhesive element may not be in direct physical contact with the low-reflection film.

[0015] According to the imaging lens module of the embodiment described in the previous paragraph, the optical reflectivity of the low-reflection film in the visible light band is R, which can meet the following condition: 0.0%≤R≤0.6%.

[0016] According to the imaging lens module of the embodiment described in the previous paragraph, the optical reflectivity R of the low-reflection film in the visible light band can satisfy the following condition: 0.0%≤R≤0.4%.

[0017] According to the imaging lens module of the embodiment described in the previous paragraph, the optical reflectivity of the low-reflection film in the visible light band is R, which can meet the following condition: 0.0%≤R≤0.3%.

[0018] According to the imaging lens module of the embodiment described in the preceding paragraph, the assembly component has a surface provided with a low-reflection film, wherein the CIELAB spectrum space value of the surface can be L*a*b*, where L* is the spectrum brightness, a* is the spectrum redness and greenness, and b* is the spectrum yellowness and blueness, which can satisfy the following conditions: 0.2 <L*<2.7;-1.5<a*<2.0;以及-4.0<b*<2.5。

[0019] According to one embodiment of the present disclosure, a camera module is provided, comprising the imaging lens module according to the aforementioned embodiment and an electronic photosensitive element, wherein the electronic photosensitive element is disposed on an imaging surface of the imaging lens module.

[0020] According to one embodiment of the present disclosure, an electronic device is provided, including the camera module according to the aforementioned embodiment. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] FIG. 1A FIG2 is a schematic diagram illustrating a camera module according to a first embodiment of the present disclosure;

[0022] FIG. 1B Drawing in accordance with FIG. 1A Schematic diagram of the low-reflection film and assembly components in the first embodiment;

[0023] FIG. 2 FIG2 is a schematic diagram illustrating a camera module according to a second embodiment of the present disclosure;

[0024] FIG. 3 FIG2 is a schematic diagram illustrating a camera module according to a third embodiment of the present disclosure;

[0025] FIG. 4 FIG2 is a schematic diagram illustrating a camera module according to a fourth embodiment of the present disclosure;

[0026] FIG. 5 FIG2 is a schematic diagram illustrating a camera module according to a fifth embodiment of the present disclosure;

[0027] FIG. 6A A schematic diagram illustrating an electronic device according to a sixth embodiment of the present disclosure is shown;

[0028] FIG. 6B Drawing in accordance with FIG. 6A Another schematic diagram of the electronic device according to the sixth embodiment;

[0029] FIG. 6C Draw according to FIG. 6A Schematic diagram of an image captured by an electronic device in a sixth embodiment;

[0030] FIG. 6D Draw according to FIG. 6A A schematic diagram of another image captured by the electronic device in the sixth embodiment;

[0031] FIG. 6E Draw according to FIG. 6A A schematic diagram of another image captured by the electronic device in the sixth embodiment;

[0032] FIG. 7 A schematic diagram illustrating an electronic device according to a seventh embodiment of the present disclosure is shown;

[0033] FIG. 8A A schematic view illustrating a camera module according to an eighth embodiment of the present disclosure applied to a vehicle;

[0034] FIG. 8B A schematic view illustrating a camera module according to an eighth embodiment of the present disclosure applied to a vehicle; FIG. 8A A schematic view illustrating a camera module according to an eighth embodiment of the present disclosure applied to a vehicle;

[0035] FIG. 8C A schematic view illustrating a camera module according to an eighth embodiment of the present disclosure applied to a vehicle; FIG. 8A A schematic view illustrating a camera module according to an eighth embodiment of the present disclosure applied to a vehicle;

[0036]

Symbol Description

[0037] 10, 20: electronic device

[0038] 100, 200, 300, 400, 500, 31: camera module

[0039] 11: user interface

[0040] 110, 210, 310, 410, 510: electronic photosensitive element

[0041] 12, 22a, 22b: ultra-wide camera module

[0042] 120, 220, 320, 420, 520: optical element

[0043] 13: high-pixel camera module

[0044] 130, 230, 330, 430, 530: assembly element

[0045] 131, 231, 331: first assembly part

[0046] 132, 232, 332: second assembly part

[0047] 14, 24a, 24b, 24c, 24d: telephoto camera module

[0048] 140, 240, 340, 440, 540: low-reflection film

[0049] 141: nanostructure layer

[0050] 142: nanostructure matching layer

[0051] 143: ridge protrusion

[0052] 15: imaging signal processing element

[0053] 151, 152, 251, 252, 351, 352, 353, 450, 550: adhesive element

[0054] 23a, 23b: Wide-angle camera module

[0055] 26:TOF module

[0056] 27: Flash module

[0057] 30: Vehicle

[0058] 321: First optical component

[0059] 322: Second optical component

[0060] 333: The third assembly part

[0061] 334: Fourth assembly part

[0062] X: Optical axis

[0063] θ: viewing angle

[0064] I1, I2, I3, I4: External space information DETAILED DESCRIPTION

[0065] The present disclosure provides an imaging lens module having an optical axis, comprising an optical element, an assembly element, and a low-reflection film. The optical axis passes through the optical element, and the assembly element is configured to be assembled with the optical element. The low-reflection film is disposed on a portion of the surface of the assembly element and comprises a nanostructured layer and a nanostructured matching layer. The nanostructured layer comprises a plurality of ridges arranged in a random pattern. The nanostructured matching layer is disposed between the assembly element and the nanostructured layer and comprises at least two optically sparse dielectric layers and at least one optically dense dielectric layer. The at least one optically dense dielectric layer is stacked between the at least two optically sparse dielectric layers. The thickness of the at least two optically sparse dielectric layers is greater than 40 nm and less than 100 nm, the thickness of the at least one optically dense dielectric layer is greater than 1 nm and less than 33 nm, and the height of the plurality of ridges is greater than 80 nm and less than 300 nm. The nanostructured matching layer improves the refractive index matching between the assembly element and the nanostructured layer, enabling light to more easily enter the assembly element from the outermost nanostructured layer, thereby maintaining low optical reflectivity. Furthermore, the nanostructured layer, through its irregularly arranged ridges, can reduce stray light. Specifically, the stacked design of an optically sparse dielectric layer, an optically dense dielectric layer, and a nanostructured layer provides a low-reflection film with high environmental tolerance.

[0066] Specifically, the surface appearance of the assembled components coated with a low-reflection film is less susceptible to damage from external environmental factors. Furthermore, the optically sparse dielectric layer and the optically dense dielectric layer in the nanostructure matching layer can be stacked in combination with SiO2, MgF2, TiO2, Ta2O5, Cr2O3, HfO2, ZnO, AlN, Al2O3, Y2O3, CaF2, SiC, MgO, and ZrO2, which can improve the tolerance of the low-reflection film to volatile substances and optimize the process. The refractive index of the optically dense dielectric layer is greater than that of the optically sparse dielectric layer. The element ratios of the above compounds are not limited to the disclosed values ​​and may vary due to differences in process conditions. In addition, the multiple ridge-like protrusions will have non-uniform heights, and the heights of the ridge-like protrusions may be different.

[0067] Furthermore, the optical element may be an optical lens element or an optical prism element, but is not limited thereto. The assembly element may be a lens barrel, a lens carrier, a fixing element, or a prism carrier, but is not limited thereto.

[0068] The thickness of the at least two optically sparse dielectric layers can each be greater than 45 nm and less than 95 nm. Thus, stacking an optically sparse dielectric layer with an optically dense dielectric layer of a specific thickness can enhance the anti-reflection performance of the low-reflection film. Furthermore, the thickness of the at least two optically sparse dielectric layers can each be greater than 48 nm and less than 85 nm.

[0069] The thickness of the at least one optically dense dielectric layer can be greater than 3 nm and less than 28 nm. Thus, stacking an optically sparse dielectric layer with an optically dense dielectric layer of a specific thickness can enhance the anti-reflection performance of the low-reflection film. Furthermore, the thickness of the at least one optically dense dielectric layer can be greater than 3 nm and less than 25 nm.

[0070] The optical element can be assembled on the assembly element, and the optical element and the assembly element can have physical contact, thereby reducing the probability of non-imaging light generated between the optical element and the assembly element.

[0071] The assembly element can be made of an opaque plastic material to absorb light incident on the assembly element, thereby helping to improve the optical image quality of the imaging lens module.

[0072] At least two optically thin dielectric layers may include silicon oxide (Si x O y ) material, wherein the ratios of silicon and oxygen are x and y, respectively, which may vary depending on process conditions. This provides a more stable process step to ensure mass production of the product.

[0073] At least one optically dense dielectric layer may include titanium oxide (Ti x O y) material, wherein the ratios of titanium and oxygen are x and y, respectively, which can vary depending on process conditions. This provides an optical thin film material with a higher refractive index, helping to reduce the complexity of film layer design.

[0074] The ridges may comprise aluminum oxide (Al x O y ) material, wherein the ratios of aluminum and oxygen are x and y, respectively, which may vary depending on process conditions. This improves the durability and structural stability of the low-reflection film, thereby increasing product yield.

[0075] The imaging lens module may further include an adhesive element, wherein the adhesive element may be disposed on the assembly element to assemble the imaging lens module, and the adhesive element and the low-reflection film may not be in direct physical contact. This improves the assembly efficiency of the imaging lens module and provides a more stable assembly.

[0076] The optical reflectivity R of the low-reflection film in the visible light band can meet the following conditions: 0.0% ≤ R ≤ 0.6%. This provides a low-reflection film with a higher manufacturing yield. Furthermore, the optical reflectivity R of the low-reflection film in the visible light band can meet the following conditions: 0.0% ≤ R ≤ 0.4%. This further improves the efficiency of the assembled component in absorbing stray light. Furthermore, the optical reflectivity R of the low-reflection film in the visible light band can meet the following conditions: 0.0% ≤ R ≤ 0.3%. This provides a low-reflection film with higher environmental tolerance and reduces the generation of stray light.

[0077] The assembly component is provided with a surface of a low-reflection film, wherein the value of the CIELAB spectrum space of the surface can be L*a*b*, where L* is the spectrum brightness, a* is the spectrum redness and greenness, and b* is the spectrum yellowness and blueness, which can meet the following conditions: 0.2 <L*<2.7;-1.5<a*<2.0;以及-4.0<b*<2.5。借此,提供组装元件表面光学性质的稳定度。

[0078] The various technical features of the imaging lens module disclosed above can be configured in combination to achieve corresponding effects.

[0079] The present disclosure provides a camera module, which includes the aforementioned imaging lens module and an electronic photosensitive element, wherein the electronic photosensitive element is disposed on an imaging surface of the imaging lens module.

[0080] The present disclosure provides an electronic device including the aforementioned camera module.

[0081] Based on the above implementation manner, specific embodiments are presented below and described in detail with reference to the accompanying drawings.

[0082] <First embodiment>

[0083] Please refer to FIG. 1A , which illustrates a schematic diagram of a camera module 100 according to the first embodiment of the present disclosure. FIG. 1A As can be seen, the camera module 100 includes an imaging lens module (not shown) and an electronic photosensitive element 110, wherein the electronic photosensitive element 110 is disposed on an imaging surface (not shown) of the imaging lens module. The imaging lens module has an optical axis X and includes an optical element 120, an assembly element 130, and a plurality of low-reflection films 140. The optical axis X passes through the optical element 120, and the assembly element 130 is configured to be assembled with the optical element 120. Specifically, the optical element 120 can be assembled on the assembly element 130, and the optical element 120 and the assembly element 130 can be in physical contact. In addition, the assembly element 130 can be made of an opaque plastic material to absorb light incident on the assembly element 130.

[0084] Furthermore, assembly element 130 may include a first assembly component 131 and a second assembly component 132, wherein first assembly component 131 surrounds and positions optical element 120, and second assembly component 132 may be a fixed ring located on the image side of optical element 120. The imaging lens module may further include two adhesive components 151 and 152, wherein adhesive component 151 may be disposed on first assembly component 131 of assembly element 130 to assemble the imaging lens module, and adhesive component 151 may not be in direct physical contact with low-reflection film 140. Adhesive component 152 is used to position second assembly component 132 within first assembly component 131 and on the image side of optical element 120.

[0085] Specifically, the optical element 120 can be an optical lens element or an optical prism element, but is not limited thereto. The assembly element 130 can be a lens barrel, a lens carrier, a fixing element, or a prism carrier, but is not limited thereto.

[0086] Please refer to FIG. 1B , FIG. 1B Drawing in accordance with FIG. 1A Schematic diagram of the low reflection film 140 and the assembly element 130 in the first embodiment. FIG. 1A and FIG. 1BIt can be seen that the low-reflection film 140 is disposed on a portion of the surface of the assembly element 130, namely, multiple surfaces facing the object side and a surface facing the image side of the first assembly component 131. Each low-reflection film 140 includes a nanostructure layer 141 and a nanostructure matching layer 142. The nanostructure layer 141 includes a plurality of ridge-like protrusions 143, wherein the ridge-like protrusions 143 are arranged in a random manner. In addition, the nanostructure matching layer 142 is disposed between the assembly element 130 and the nanostructure layer 141, and includes at least two optically sparse dielectric layers and at least one optically dense dielectric layer, and the at least one optically dense dielectric layer is stacked between the at least two optically sparse dielectric layers. The thickness of each optically sparse dielectric layer is greater than 40nm and less than 100nm, the thickness of the optically dense dielectric layer is greater than 1nm and less than 33nm, and the height of each ridge-like protrusion 143 is greater than 80nm and less than 300nm.

[0087] Specifically, the thickness of each optically sparse dielectric layer can be greater than 45 nm and less than 95 nm. Furthermore, the thickness of each optically sparse dielectric layer can be greater than 48 nm and less than 85 nm. Furthermore, the thickness of the optically dense dielectric layer can be greater than 3 nm and less than 28 nm. Furthermore, the thickness of the optically dense dielectric layer can be greater than 3 nm and less than 25 nm. Furthermore, the optically sparse dielectric layer can comprise silicon oxide, the optically dense dielectric layer can comprise titanium oxide, and the ridge-shaped protrusions 143 can comprise aluminum oxide. Specifically, the parameters satisfy the conditions in Table 1 below. Table 1 lists the materials and thicknesses of the nanostructured matching layer 142 in the first example of the first embodiment. The values ​​in Table 1 represent the thicknesses of each optically sparse dielectric layer and the thickness of the optically dense dielectric layer, respectively.

[0088]

[0089] Specifically, the optical reflectivity R of the low-reflection film 140 in the visible light band may satisfy the following conditions: 0.0% ≤ R ≤ 0.6%. Furthermore, the optical reflectivity R of the low-reflection film 140 in the visible light band may satisfy the following conditions: 0.0% ≤ R ≤ 0.4%. Furthermore, the optical reflectivity R of the low-reflection film 140 in the visible light band may satisfy the following conditions: 0.0% ≤ R ≤ 0.3%.

[0090] The assembly element 130 is provided with a surface of the low-reflection film 140, wherein the value of the CIELAB spectrum space of the surface can be L*a*b*, where L* is the spectrum brightness, a* is the spectrum redness and greenness, and b* is the spectrum yellowness and blueness, which can meet the following conditions: 0.2 <L*<2.7;-1.5<a*<2.0;以及-4.0<b*<2.5。所述参数满足下列表2条件,表2为第一实施方式的第一实施例的CIELAB频谱空间的数值。

[0091]

[0092] Please refer to Table 3 below, which shows the thickness of each layer of the nanostructured matching layer 142 in the second example of the first embodiment. Specifically, the materials of each layer of the nanostructured matching layer 142 in the second example of the first embodiment are the same or similar to those in the first example of the first embodiment, with the difference being the thickness of each optically sparse dielectric layer and optically dense dielectric layer.

[0093]

[0094] Furthermore, Table 4 shows the values ​​of the CIELAB spectrum space of the second example of the first embodiment, wherein the definitions of the parameters are the same as those of the first example of the first embodiment, and are not further described here.

[0095]

[0096] Please refer to Table 5 below, which shows the thickness of each layer of the nanostructured matching layer 142 of the third example of the first embodiment. Specifically, the materials of each layer of the nanostructured matching layer 142 of the third example of the first embodiment are the same or similar to those of the first example of the first embodiment, with the difference being the thickness of each optically sparse dielectric layer and optically dense dielectric layer.

[0097]

[0098] Furthermore, Table 6 shows the values ​​of the CIELAB spectrum space of the third example of the first embodiment, wherein the definitions of the parameters are the same as those of the first example of the first embodiment, and are not further described here.

[0099]

[0100] Please refer to Table 7 below, which shows the thickness of each layer of the nanostructured matching layer 142 in the fourth example of the first embodiment. Specifically, the fourth example of the first embodiment uses the same or similar materials as the first example of the first embodiment, with the difference being the thickness ranges of the optically sparse and optically dense dielectric layers.

[0101]

[0102] Furthermore, Table 8 shows the values ​​of the CIELAB spectrum space of the fourth example of the first embodiment, wherein the definitions of the parameters are the same as those of the first example of the first embodiment, and are not further described here.

[0103]

[0104] In addition, the second embodiment of the first embodiment, the third embodiment of the first embodiment, and the fourth embodiment of the first embodiment have the same component structures and configuration relationships as the first embodiment of the first embodiment, and will not be further described here.

[0105] <Second embodiment>

[0106] Please refer to FIG. 2 , which is a schematic diagram illustrating a camera module 200 according to a second embodiment of the present disclosure. FIG. 2 As can be seen, the camera module 200 includes an imaging lens module (not shown) and an electronic photosensitive element 210, wherein the electronic photosensitive element 210 is disposed on an imaging surface (not shown) of the imaging lens module. The imaging lens module has an optical axis X and includes an optical element 220, an assembly element 230, and a plurality of low-reflection films 240. The optical axis X passes through the optical element 220, and the assembly element 230 is assembled with the optical element 220.

[0107] Furthermore, assembly element 230 may include a first assembly component 231 and a second assembly component 232, wherein first assembly component 231 surrounds and positions optical element 220, and second assembly component 232 may be a fixed ring located on the image side of optical element 220. The imaging lens module may further include two adhesive components 251 and 252, wherein adhesive component 251 may be disposed on first assembly component 231 to assemble the imaging lens module, and adhesive component 251 may not be in direct physical contact with low-reflection film 240. Adhesive component 252 is used to position second assembly component 232 within first assembly component 231 and on the image side of optical element 220. Furthermore, low-reflection film 240 is disposed on portions of the surface of assembly element 230, including a surface of first assembly component 231 facing the object side and a surface of second assembly component 232 facing the image side.

[0108] The remaining component structures and configuration relationships of the second embodiment are the same or similar to those of the first embodiment and will not be further described herein.

[0109] <Third embodiment>

[0110] Please refer to FIG. 3 , which illustrates a schematic diagram of a camera module 300 according to a third embodiment of the present disclosure. FIG. 3As shown in FIG. 1, the camera module 300 includes an imaging lens module (not shown) and an electronic photosensitive element 310. The electronic photosensitive element 310 is disposed on an imaging surface (not shown) of the imaging lens module. The imaging lens module has an optical axis X, which passes through an optical element 320. The imaging lens module also includes an assembly element 330 and a plurality of low-reflection films 340. The assembly element 330 is configured to assemble with the optical element 320.

[0111] Further, the optical element 320 can include a first optical component 321 and a second optical component 322. The assembly element 330 can include a first assembly component 331, a second assembly component 332, a third assembly component 333, and a fourth assembly component 334. The first assembly component 331 surrounds the first optical component 321. The second assembly component 332 is a fixed ring disposed on an image side of the first optical component 321. The third assembly component 333 is configured to position the first optical component 321 and the second optical component 322. The fourth assembly component 334 is disposed on an image side of the second optical component 322. The imaging lens module can further include three adhesive elements 351, 352, and 353. The adhesive element 351 is disposed on the first assembly component 331. The adhesive element 352 is configured to position the second assembly component 332 in the first assembly component 331 and on the image side of the first optical component 321. The adhesive element 353 is disposed on the fourth assembly component 334. The imaging lens module is assembled by the adhesive elements 351, 352, and 353. The adhesive elements 351 and 353 are not in direct physical contact with the low-reflection films 340. Furthermore, the low-reflection films 340 are disposed on a portion of the surface of the assembly element 330, i.e., a surface of the first assembly component 331 facing the image side, a surface of the second assembly component 332 facing the image side, a surface of the third assembly component 333 facing the image side, and a surface of the fourth assembly component 334 facing the object side.

[0112] The third embodiment has the same element structures and configuration relationships as the first embodiment, and thus will not be described again.

[0113] <Fourth Embodiment>

[0114] Referring to FIG. 4, a schematic diagram of a camera module 400 according to the fourth embodiment of the present disclosure is shown. As shown in FIG. 4, the camera module 400 includes an imaging lens module (not shown) and an electronic photosensitive element 410. The electronic photosensitive element 410 is disposed on an imaging surface (not shown) of the imaging lens module. The imaging lens module has an optical axis X, which passes through an optical element 420. The imaging lens module also includes an assembly element 430 and a plurality of low-reflection films 440. The assembly element 430 is configured to assemble with the optical element 420. FIG. 4 FIG. 4 ​As can be seen, the camera module 400 includes an imaging lens module (not shown) and an electronic photosensitive element 410, wherein the electronic photosensitive element 410 is disposed on an imaging surface (not shown) of the imaging lens module. The imaging lens module has an optical axis X and includes an optical element 420, an assembly element 430, and a low-reflection film 440. The optical axis X passes through the optical element 420, and the assembly element 430 is assembled with the optical element 420. Furthermore, the imaging lens module may further include an adhesive element 450, wherein the adhesive element 450 can be disposed on the assembly element 430 to assemble the imaging lens module, and the adhesive element 450 and the low-reflection film 440 may not be in direct physical contact. Furthermore, the low-reflection film 440 is disposed on a portion of the surface of the assembly element 430, which is a surface of the assembly element 430 facing the object side.

[0115] The component structures and configurations of the fourth embodiment are the same as those of the first embodiment, and will not be further described here.

[0116] <Fifth embodiment>

[0117] Please refer to FIG. 5 , which is a schematic diagram of a camera module 500 according to the fifth embodiment of the present disclosure. FIG. 5 As can be seen, the camera module 500 includes an imaging lens module (not shown) and an electronic photosensitive element 510, wherein the electronic photosensitive element 510 is disposed on an imaging surface (not shown) of the imaging lens module. The imaging lens module has an optical axis X and includes an optical element 520, an assembly element 530, and a low-reflection film 540. The optical axis X passes through the optical element 520, and the assembly element 530 is assembled with the optical element 520. Furthermore, the imaging lens module may further include an adhesive element 550, wherein the adhesive element 550 can be disposed on the assembly element 530 to assemble the imaging lens module, and the adhesive element 550 and the low-reflection film 540 may not be in direct physical contact. Furthermore, the low-reflection film 540 is disposed on a portion of the surface of the assembly element 530, which is a surface of the assembly element 530 facing the object side.

[0118] The component structures and configurations of the fifth embodiment are the same as those of the first embodiment, and will not be further described here.

[0119] <Sixth embodiment>

[0120] Please refer to FIG. 6A and FIG. 6B , FIG. 6A FIG. 1 is a schematic diagram illustrating an electronic device 10 according to a sixth embodiment of the present disclosure. FIG. 6B Drawing in accordance with FIG. 6A Another schematic diagram of the electronic device 10 according to the sixth embodiment. FIG. 6A andFIG. 6B As can be seen, electronic device 10 is a smartphone and includes a camera module and a user interface 11. The camera module includes an imaging lens module (not shown) and an electronic photosensitive element (not shown). The electronic photosensitive element is disposed on an imaging surface (not shown) of the imaging lens module. The imaging lens module includes an optical element, an assembly element, and a low-reflection film. Specifically, the camera modules are an ultra-wide-angle camera module 12, a high-pixel camera module 13, and a telephoto camera module 14, and user interface 11 is a touch screen, but this is not limited to this. Specifically, each camera module can be any of the camera modules provided in the first to fifth embodiments described above, but this disclosure is not limited thereto.

[0121] The user enters shooting mode via the user interface 11, which displays the image and allows for manual adjustment of the shooting angle to switch between different camera modules. The camera module focuses imaging light onto the electronic photosensitive element and outputs an electronic signal related to the image to the image signal processor (ISP) 15.

[0122] Depend on FIG. 6B It can be seen that, depending on the camera specifications of the electronic device 10, the electronic device 10 may further include an optical image stabilization component (not shown). Furthermore, the electronic device 10 may further include at least one focus assist module (not shown) and at least one sensor element (not shown). The focus assist module may be a flash module (not shown) that compensates for color temperature, an infrared ranging element, a laser focus module, etc. The sensor element may have the function of sensing physical momentum and actuation energy, such as an accelerometer, a gyroscope, or a Hall Effect Element, to detect shaking and vibration imposed by the user's hand or the external environment. This, in turn, facilitates the autofocus function and optical image stabilization component configured in the camera module of the electronic device 10 to achieve good image quality. This helps the electronic device 10 according to the present disclosure to have multiple shooting modes, such as optimized selfies, low-light HDR (High Dynamic Range) imaging, and high-resolution 4K video recording. In addition, the user can directly view the camera's shooting image through the user interface 11 and manually adjust the framing range on the user interface 11 to achieve a what-you-see-is-what-you-get auto-focus function.

[0123] Furthermore, the camera module, optical image stabilization component, sensor element, and focus assist module can be disposed on a flexible printed circuit board (FPC) (not shown) and electrically connected to the imaging signal processing element 15 and other related components via a connector (not shown) to execute the shooting process. Current electronic devices such as smartphones tend to be thinner and lighter. Configuring the camera module and related components on a flexible printed circuit board and then integrating the circuit to the electronic device's mainboard via a connector can meet the requirements of the limited internal space of the electronic device for mechanical design and circuit layout and obtain greater margin. It also allows the autofocus function of the camera module to be more flexibly controlled through the touch screen of the electronic device. In the sixth embodiment, the electronic device 10 can include multiple sensor elements and multiple focus assist modules. The sensor elements and focus assist modules are disposed on the flexible printed circuit board and at least one other flexible printed circuit board (not shown), and are electrically connected to the imaging signal processing element 15 and other related components via corresponding connectors to execute the shooting process. In other embodiments (not shown), the sensor element and the auxiliary optical element may also be disposed on a mainboard or other types of carrier boards of the electronic device according to the requirements of the mechanical design and circuit layout.

[0124] In addition, the electronic device 10 may further include but is not limited to a display unit (Display), a control unit (Control Unit), a storage unit (Storage Unit), a random access memory (RAM), a read-only memory (ROM) or a combination thereof.

[0125] FIG. 6C Draw according to FIG. 6A Schematic diagram of an image captured by the electronic device 10 in the sixth embodiment. FIG. 6C It can be seen that the ultra-wide-angle camera module 12 can capture images in a wider range and has the function of accommodating more scenery.

[0126] FIG. 6D Draw according to FIG. 6A A schematic diagram of another image captured by the electronic device 10 in the sixth embodiment. FIG. 6D It can be seen that the high-pixel camera module 13 can capture images within a certain range and have high pixels, and has the function of high resolution and low distortion.

[0127] FIG. 6E Draw according to FIG. 6A A schematic diagram of another image captured by the electronic device 10 in the sixth embodiment. FIG. 6E It can be seen that the telephoto camera module 14 has a high-magnification function and can capture distant images and magnify them to a high magnification.

[0128] Depend on FIG. 6C to FIG. 6EIt can be seen that by using camera modules with different focal lengths to frame the image and combining them with image processing technology, the zoom function can be implemented in the electronic device 10 .

[0129] <Seventh embodiment>

[0130] Please refer to FIG. 7 , which is a schematic diagram of an electronic device 20 according to a seventh embodiment of the present disclosure. FIG. 7 As can be seen, electronic device 20 is a smartphone and includes a camera module, wherein the camera module includes an imaging lens module and an electronic photosensitive element. The electronic photosensitive element is disposed on an imaging surface of the imaging lens module, and the imaging lens module includes an optical element, an assembly element, and a low-reflection film. Specifically, the camera modules include ultra-wide-angle camera modules 22a, 22b, wide-angle camera modules 23a, 23b, telephoto camera modules 24a, 24b, 24c, 24d, and a Time-Of-Flight (TOF) module 26. The TOF module 26 can also be other types of camera modules and is not limited to this configuration. Specifically, each camera module can be the camera module provided in any of the first to fifth embodiments described above, but the present disclosure is not limited thereto.

[0131] Furthermore, the telephoto camera modules 24c and 24d are used to deflect the light path, but the present disclosure is not limited thereto.

[0132] Depending on the camera specifications of the electronic device 20, the electronic device 20 may further include an optical image stabilization component (not shown). Specifically, the electronic device 20 may further include at least one focus assist module (not shown) and at least one sensor element (not shown). The focus assist module may be a flash module 27 that compensates for color temperature, an infrared rangefinder, a laser focus module, or the like. The sensor element may be capable of sensing physical momentum and actuation energy, such as an accelerometer, a gyroscope, or a Hall effect element, to detect shaking and vibrations caused by the user's hand or the external environment. This facilitates the autofocus function and optical image stabilization component configured in the camera module of the electronic device 20, thereby achieving good image quality. This helps the electronic device 20 according to the present disclosure to have multiple shooting modes, such as optimized selfies, low-light HDR, and high-resolution 4K video recording.

[0133] In addition, the structures and configurations of the remaining elements of the seventh embodiment are the same as those of the sixth embodiment, and will not be further described here.

[0134] <Eighth embodiment>

[0135] Please refer to FIG. 8A to FIG. 8C , FIG. 8AFIG. 1 is a schematic diagram showing a camera module 31 according to an eighth embodiment of the present disclosure applied to a vehicle 30 . FIG. 8B Drawing in accordance with FIG. 8A A schematic diagram of a camera module 31 disposed on a vehicle 30 in an eighth embodiment. FIG. 8C Drawing in accordance with FIG. 8A Another schematic diagram of the eighth embodiment in which a camera module (not shown) is disposed on a vehicle 30. FIG. 8A to FIG. 8C As can be seen, the camera module 31 is applied to the vehicle 30. The camera module 31 includes an imaging lens module and an electronic photosensitive element. The electronic photosensitive element is disposed on an imaging surface of the imaging lens module. The imaging lens module also includes an optical element, an assembly element, and a low-reflection film. In the eighth embodiment, the number of camera modules 31 is six. The camera modules 31 are automotive camera modules. The camera modules can be any of the camera modules provided in the first to fifth embodiments, but the present disclosure is not limited thereto.

[0136] Depend on FIG. 8A and FIG. 8B As can be seen, the two camera modules 31 are located below the left and right rearview mirrors, respectively, and are used to capture image information within a certain viewing angle θ. Specifically, the viewing angle θ can satisfy the following condition: 40 degrees < θ < 90 degrees. This allows the capture of image information within the left and right lanes.

[0137] Depend on FIG. 8B As can be seen, the other two camera modules 31 can be installed in the interior space of the vehicle 30. Specifically, the two camera modules 31 are respectively installed near the interior rearview mirror and the rear window. Furthermore, the camera modules 31 can also be installed on the non-mirror surface of the left and right rearview mirrors of the vehicle 30, but this is not limited to this.

[0138] Depend on FIG. 8C As can be seen, two of the camera modules can be installed at the front and rear ends of vehicle 30. The placement of the camera modules at the front and rear ends of vehicle 30 and below the left and right rearview mirrors helps the driver obtain information about the external space outside the cockpit, such as, but not limited to, external space information I1, I2, I3, and I4. This provides more viewing angles, reduces blind spots, and thus helps improve driving safety. Furthermore, by placing camera modules around vehicle 30, road conditions outside vehicle 30 can be easily identified, thereby facilitating automated assisted driving.

[0139] Although the present invention has been disclosed above by way of implementation methods and examples, they are not intended to limit the present invention. Anyone with ordinary knowledge in the technical field may make slight changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. An imaging lens module, characterized in that: Having an optical axis, comprising: An optical element, through which the optical axis passes; An assembly element for assembling and configuring with the optical element; and A low-reflection thin film disposed on a partial surface of the assembly element, comprising: A nanostructure layer including a plurality of ridge-like protrusions, wherein the plurality of ridge-like protrusions are arranged in a random form; and A nanostructure matching layer disposed between the assembly element and the nanostructure layer, comprising: At least two layers of optically thinner dielectric layers; And At least one layer of optically denser dielectric layer stacked between the at least two layers of optically thinner dielectric layers; wherein, the thicknesses of the at least two layers of optically thinner dielectric layers are respectively greater than 40 nm and less than 100 nm, the thickness of the at least one layer of optically denser dielectric layer is greater than 1 nm and less than 33 nm, and the heights of the plurality of ridge-like protrusions are respectively greater than 80 nm and less than 300 nm.

2. The imaging lens module according to claim 1, wherein: The thicknesses of the at least two layers of optically thinner dielectric layers are respectively greater than 45 nm and less than 95 nm.

3. The imaging lens module according to claim 2, wherein: The thicknesses of the at least two layers of optically thinner dielectric layers are respectively greater than 48 nm and less than 85 nm.

4. The imaging lens module according to claim 1, wherein: The thickness of the at least one layer of optically denser dielectric layer is greater than 3 nm and less than 28 nm.

5. The imaging lens module according to claim 4, wherein: The thickness of the at least one layer of optically denser dielectric layer is greater than 3 nm and less than 25 nm.

6. The imaging lens module according to claim 1, wherein: The optical element is assembled on the assembly element, and the optical element is in physical contact with the assembly element.

7. The imaging lens module according to claim 1, wherein: The assembly element is an opaque plastic element for absorbing light incident on the assembly element.

8. The imaging lens module according to claim 1, wherein: One of the at least two layers of optically thinner dielectric layers is a silicon oxide layer.

9. The imaging lens module according to claim 1, wherein: The at least one layer of optically denser dielectric layer is a titanium oxide layer.

10. The imaging lens module according to claim 1, wherein: One of the plurality of ridge-like protrusions is an aluminum oxide ridge-like protrusion.

11. The imaging lens module according to claim 1, wherein: Further comprising: An adhesive element disposed on the assembly element for assembling the imaging lens module, and the adhesive element is not in direct physical contact with the low-reflection thin film.

12. The imaging lens module according to claim 1, wherein: The optical reflectance of the low-reflection thin film in the visible light band is R, which satisfies the following conditions: 0.0％≤R≤0.6％。 13. The imaging lens module according to claim 12, wherein: The optical reflectance of the low-reflection thin film in the visible light band is R, which satisfies the following conditions: 0.0％≤R≤0.4％。 14. The imaging lens module according to claim 13, wherein: The optical reflectance of the low-reflection thin film in the visible light band is R, which satisfies the following conditions: 0.0％≤R≤0.3％。 15. The imaging lens module according to claim 1, wherein: A surface of the assembly element where the low-reflection thin film is disposed; Wherein, the values in the CIELAB spectral space of the surface are L*a*b*, L* is the spectral luminance, a* is the spectral red-green degree, b* is the spectral yellow-blue degree, which satisfy the following conditions: 0.2<L*<2.7； -1.5 < a* < 2.0; and -4.0<b*<2.5。 16. A camera module, characterized in that: Comprising: The imaging lens module according to claim 1; and 17. An electronic device, characterized in that: An electronic photosensitive element disposed on an imaging surface of the imaging lens module. Comprising: The camera module according to claim 16.

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