Circuit for realizing power supply crosstalk noise suppression by using ear amplifier chip

Abstract

The utility model discloses a circuit for realizing power supply crosstalk noise suppression by using an ear amplifier chip. The circuit comprises an output equipment end, an ear amplifier chip circuit and an audio processing unit, the ear amplifier chip circuit is electrically connected with the output equipment end and the audio processing unit respectively; the audio processing unit is used for processing an input audio signal and outputting the audio signal to the ear amplifier chip circuit; the ear amplifier chip circuit is used for receiving the audio signal processed by the audio processing unit and performing power amplification; the output equipment end is used for receiving the audio signal amplified by the ear amplifier chip circuit, converting the audio signal into sound and outputting the sound; the ear amplifier chip circuit comprises an ear amplifier chip and a decoupling unit. And the decoupling unit is electrically connected with the corresponding end of the ear amplifier chip and is used for suppressing crosstalk noise in the power supply circuit. According to the utility model, crosstalk noise caused by power supply interference can be effectively reduced or eliminated, and clearer audio output can be provided.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic equipment, and in particular to a circuit for suppressing power supply crosstalk noise by using an earphone amplifier chip. Background Art

[0002] In the design and manufacturing of audio devices, particularly those related to headphone amplifier chips, a long-standing challenge is how to effectively suppress power supply crosstalk noise. Power supply crosstalk noise is caused by interference in the power supply line. This interference can be caused by a variety of factors, such as power supply fluctuations, electromagnetic interference (EMI), and internal circuit noise. If this noise is not properly addressed, it will directly affect the quality of the audio signal, resulting in reduced sound quality and a poor user experience.

[0003] Traditional headphone amplifier chip designs may not fully consider the suppression of power supply crosstalk noise, or use complex circuits and expensive components to reduce noise. This not only increases costs but also complicates circuit design, hindering large-scale production and application. In addition, these designs may also require higher operating voltages and greater power consumption, which is particularly detrimental to extending battery life and device portability in mobile and portable devices. Utility Model Content

[0004] In view of the problems existing in the prior art, the utility model provides a circuit that uses an earphone amplifier chip to suppress power supply crosstalk noise.

[0005] In order to achieve the above object, the present invention provides a circuit for suppressing power supply crosstalk noise using an earphone amplifier chip, which is characterized by comprising:

[0006] Output device end, headphone amplifier chip circuit, audio processing unit;

[0007] The headphone amplifier chip circuit is electrically connected to the output device end and the audio processing unit respectively;

[0008] The audio processing unit is used to process the input audio signal and output it to the headphone amplifier chip circuit;

[0009] The headphone amplifier chip circuit is used to receive the audio signal processed by the audio processing unit and perform power amplification;

[0010] The output device end is used to receive the audio signal amplified by the headphone amplifier chip circuit and convert it into sound output;

[0011] The headphone amplifier chip circuit includes a headphone amplifier chip and a decoupling unit; the decoupling unit is electrically connected to the corresponding end of the headphone amplifier chip and is used to suppress crosstalk noise in the power supply line.

[0012] Preferably, the model of the headphone amplifier chip is TK0450D.

[0013] Preferably, the decoupling unit includes C30, capacitor C39, capacitor C40, capacitor C41, capacitor C42, capacitor C43, capacitor C44, and inductor L1; pin 9 of the headphone amplifier chip is electrically connected to pin 1 and pin 13 of the headphone amplifier chip, capacitor C39, capacitor C40, and the first end of the inductor L1; the second end of the circuit L1 is connected to the VCC power supply terminal; pin 9 of the headphone amplifier chip is electrically connected to pin 6 of the headphone amplifier chip, the second end of capacitor C39, the second end of capacitor C40, the first end of capacitor C43, the first end of capacitor C44, and the second end of the inductor L1; the second end of the capacitor C43 is connected to pin 5 of the headphone amplifier chip; the second end of the capacitor C44 is connected to pin 11 of the headphone amplifier chip.

[0014] Preferably, the AUDIO_IN_L port of the audio processing unit is connected to the 12th pin and the 14th pin of the headphone amplifier chip respectively;

[0015] The AUDIO_IN_R port of the audio processing unit is connected to the 10th pin and the 8th pin of the headphone amplifier chip respectively.

[0016] Preferably, the audio processing unit includes an audio processing chip, and the model of the audio processing chip is AB1571D.

[0017] Preferably, the output device end is used to connect to headphones or other audio output devices.

[0018] The technical solution of the present invention has the following beneficial effects:

[0019] The utility model can effectively reduce or eliminate crosstalk noise caused by power supply interference and provide clearer audio output.

[0020] The earphone amplifier chip circuit of the utility model is designed to receive processed audio signals and perform power amplification to ensure that the audio signals maintain high fidelity during the amplification process.

[0021] The utility model adopts a simplified circuit design, which reduces the use of components and reduces manufacturing costs, while also simplifying the circuit layout and saving space.

[0022] The utility model can be applied to various audio output devices, such as headphones, speakers, etc., and has good versatility and adaptability; the audio processing unit is responsible for performing necessary processing on the input audio signal to improve the quality of the audio signal.

[0023] This utility model has a low-noise, high-definition audio experience: the end user can enjoy a low-noise, high-definition audio experience due to the effective suppression of power supply crosstalk noise. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is the circuit schematic diagram of the utility model;

[0025] Figure 1a 、 Figure 1b 、 Figure 1c 、 Figure 1d for Figure 1 A partially enlarged schematic diagram of . DETAILED DESCRIPTION

[0026] The following describes in detail embodiments of the present invention, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to explain the present invention, and should not be construed as limiting the present invention.

[0027] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0028] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, "plurality" means two or more, unless otherwise specifically defined.

[0029] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integral connection; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0030] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0031] Reference Figures 1 to 1d The utility model provides a circuit for suppressing power supply crosstalk noise using an earphone amplifier chip, comprising:

[0032] Output device terminal 300, headphone amplifier chip circuit 200, audio processing unit 100;

[0033] The headphone amplifier chip circuit 200 is electrically connected to the output device terminal 300 and the audio processing unit 100 respectively;

[0034] The audio processing unit 100 is used to process the input audio signal and output it to the headphone amplifier chip circuit 200; the audio processing unit 100 is responsible for performing necessary processing on the input audio signal, such as equalization, noise reduction, dynamic range compression, etc., to improve the quality of the audio signal.

[0035] The headphone amplifier chip circuit 200 is used to receive the audio signal processed by the audio processing unit 100 and perform power amplification, and amplify it to a level sufficient to drive the output device end 300, ensuring that the audio signal maintains high fidelity during the amplification process.

[0036] The output device end 300 is used to receive the audio signal amplified by the headphone amplifier chip circuit 200 and convert it into sound output; users can enjoy a low-noise, high-definition audio experience.

[0037] The headphone amplifier chip circuit 200 includes a headphone amplifier chip and a decoupling unit; the decoupling unit is electrically connected to the corresponding end of the headphone amplifier chip and is used to suppress crosstalk noise in the power supply line. By integrating the decoupling unit in the headphone amplifier chip circuit 200, the present invention can reduce or eliminate crosstalk noise caused by power supply interference, thereby providing clearer audio output; the model of the headphone amplifier chip is TK0450D.

[0038] Furthermore, the decoupling unit includes C30, capacitor C39, capacitor C40, capacitor C41, capacitor C42, capacitor C43, capacitor C44, and inductor L1; pin 9 of the headphone amplifier chip is electrically connected to pins 1 and 13 of the headphone amplifier chip, capacitor C39, capacitor C40, and the first end of the inductor L1; the second end of circuit L1 is connected to the VCC power supply terminal to provide a stable power supply for the circuit; pin 9 of the headphone amplifier chip is electrically connected to pin 6 of the headphone amplifier chip, the second end of capacitor C39, the second end of capacitor C40, the first end of capacitor C43, the first end of capacitor C44, and the second end of the inductor L1; the second end of capacitor C43 is connected to pin 5 of the headphone amplifier chip; the second end of capacitor C44 is connected to pin 11 of the headphone amplifier chip; the decoupling unit is connected to multiple pins of the headphone amplifier chip through capacitors C39 and C40, which can effectively reduce high-frequency noise on the power line and provide a stable power supply, thereby ensuring stable operation of the headphone amplifier chip. Capacitors C43 and C44 are connected to pins 5 and 11 of the headphone amplifier chip, which helps reduce noise on the signal line and improve the quality of the audio signal. Inductor L1 is connected to the VCC power supply terminal and multiple pins of the headphone amplifier chip to suppress electromagnetic interference and prevent interference signals from affecting audio quality.

[0039] Furthermore, the AUDIO_IN_L port of the audio processing unit is connected to the 12th pin and the 14th pin of the headphone amplifier chip respectively;

[0040] The audio processing unit's AUDIO_IN_R port connects to pins 10 and 8 of the headphone amplifier chip, respectively. The audio processing unit is responsible for performing necessary processing on the incoming audio signal, such as equalization, mixing, and noise cancellation. The processed signal is then transmitted to the headphone amplifier chip via the aforementioned connections for power amplification. The audio processing unit includes an audio processing chip, model AB1571D.

[0041] Furthermore, the output device terminal is used to connect to headphones or other audio output devices. The main function of the output device terminal 300 is to receive the audio signal amplified by the headphone amplifier chip circuit and convert it into sound output. The output device terminal is designed to connect to headphones or other audio output devices, such as speakers or sound systems, to achieve the final playback of the audio signal.

[0042] The utility model can effectively reduce or eliminate crosstalk noise caused by power supply interference and provide clearer audio output.

[0043] The earphone amplifier chip circuit of the utility model is designed to receive processed audio signals and perform power amplification to ensure that the audio signals maintain high fidelity during the amplification process.

[0044] The utility model adopts a simplified circuit design, which reduces the use of components and reduces manufacturing costs, while also simplifying the circuit layout and saving space.

[0045] The utility model can be applied to various audio output devices, such as headphones, speakers, etc., and has good versatility and adaptability; the audio processing unit is responsible for performing necessary processing on the input audio signal to improve the quality of the audio signal.

[0046] This utility model has a low-noise, high-definition audio experience: the end user can enjoy a low-noise, high-definition audio experience due to the effective suppression of power supply crosstalk noise.

[0047] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made by using the contents of the present invention specification and drawings under the utility model concept, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A circuit for suppressing power supply crosstalk noise using an earphone amplifier chip, characterized in that: include: Output device end, headphone amplifier chip circuit, audio processing unit; The headphone amplifier chip circuit is electrically connected to the output device end and the audio processing unit respectively; The audio processing unit is used to process the input audio signal and output it to the headphone amplifier chip circuit; The headphone amplifier chip circuit is used to receive the audio signal processed by the audio processing unit and perform power amplification; The output device is used to receive the audio signal amplified by the headphone amplifier chip circuit and convert it into sound output; The headphone amplifier chip circuit includes a headphone amplifier chip and a decoupling unit; the decoupling unit is electrically connected to the corresponding end of the headphone amplifier chip and is used to suppress crosstalk noise in the power supply line.

2. The circuit for suppressing power supply crosstalk noise using an earphone amplifier chip according to claim 1, characterized in that: The model of the headphone amplifier chip is TK0450D.

3. The circuit for suppressing power supply crosstalk noise using an earphone amplifier chip according to claim 1, characterized in that: The decoupling unit includes C30, capacitor C39, capacitor C40, capacitor C41, capacitor C42, capacitor C43, capacitor C44, and inductor L1; pin 9 of the headphone amplifier chip is electrically connected to pin 1 and pin 13 of the headphone amplifier chip, capacitor C39, capacitor C40, and the first end of the inductor L1; the second end of the circuit L1 is connected to the VCC power supply terminal; pin 9 of the headphone amplifier chip is electrically connected to pin 6 of the headphone amplifier chip, the second end of capacitor C39, the second end of capacitor C40, the first end of capacitor C43, the first end of capacitor C44, and the second end of the inductor L1; the second end of the capacitor C43 is connected to pin 5 of the headphone amplifier chip; the second end of the capacitor C44 is connected to pin 11 of the headphone amplifier chip.

4. The circuit for suppressing power supply crosstalk noise using an earphone amplifier chip according to claim 1, characterized in that: The AUDIO_IN_L port of the audio processing unit is connected to the 12th pin and the 14th pin of the headphone amplifier chip respectively; The AUDIO_IN_R port of the audio processing unit is connected to the 10th pin and the 8th pin of the headphone amplifier chip respectively.

5. The circuit for suppressing power supply crosstalk noise using an earphone amplifier chip according to claim 4, characterized in that: The audio processing unit includes an audio processing chip, and the model of the audio processing chip is AB1571D.

6. The circuit for suppressing power supply crosstalk noise using an earphone amplifier chip according to claim 1, characterized in that: The output device end is used to connect to headphones or other audio output devices.

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