Panel structure and display device

Abstract

The utility model belongs to the field of display devices, and discloses a panel structure and a display device. The panel structure comprises an array substrate, a color film substrate and a sealing structure, the array substrate is provided with a source electrode side used for being electrically connected with a source electrode driver, the array substrate comprises a display area and a clearance area surrounding the display area, and the clearance area comprises a first clearance section arranged corresponding to the source electrode side; the color film substrate is arranged on the array substrate in an alignment manner; the sealing structure comprises a first fusion welding glue layer arranged between the array substrate and the color film substrate, and the first fusion welding glue layer is arranged corresponding to the first clearance section; wherein the first welding glue layer is formed by melting bonding glue. In the panel structure provided by the utility model, the array substrate and the color film substrate are bonded without welding and punching operation on the substrates, so that the width of the clearance area is reduced, and a narrower narrow frame design is realized.

Description

Technical Field

[0001] The utility model relates to the technical field of display devices, and in particular to a panel structure and a display device. Background Art

[0002] With the development of the display industry, display panels are moving towards narrow bezels. Narrower bezels require extreme design changes to the previous panel structure to achieve narrower bezels. In existing narrow bezel structural designs, substrates are often connected through laser welding. However, if the clearance area is too narrow, the width of the frame glue will be insufficient, making it difficult to ensure the panel's anti-peel strength. At the same time, welding with an overly narrow clearance area can easily burn the circuits on the substrate, making it impossible to further improve the narrow bezel design.

[0003] In summary, it is difficult to improve the narrow frame design of the display panel in the existing panel structure. Utility Model Content

[0004] The main purpose of the present invention is to provide a panel structure and a display device, aiming to solve the problem of difficulty in improving the narrow frame design of the display panel.

[0005] To achieve the above objectives, the present invention provides a panel structure, comprising:

[0006] An array substrate having a source side for electrically connecting to a source driver, the array substrate including a display area and a clearance area surrounding the display area, the clearance area including a first clearance segment provided corresponding to the source side;

[0007] a color filter substrate, positioned on the array substrate; and

[0008] A sealing structure, the sealing structure comprising a first welding adhesive layer provided between the array substrate and the color filter substrate, wherein the first welding adhesive layer is provided corresponding to the first clearance section;

[0009] Wherein, the first welding adhesive layer is formed by melting the adhesive.

[0010] Optionally, the clearance area further includes a second clearance section;

[0011] The sealing structure further includes a laser weld provided between the array substrate and the color filter substrate, and the laser weld is provided corresponding to the second clearance section.

[0012] Optionally, there are multiple laser welds, and the multiple laser welds are arranged at intervals.

[0013] Optionally, the sealing structure further includes a sealant layer provided between the array substrate and the color filter substrate, the sealant layer being provided corresponding to the clearance area and being located on a side of the first welding adhesive layer close to the display area;

[0014] Wherein, the sealant layer is formed by melting the sealing sealant.

[0015] Optionally, the clearance area further includes a second clearance section;

[0016] The sealing structure further includes a second fusing adhesive layer provided between the array substrate and the color filter substrate, the second fusing adhesive layer being provided corresponding to the second clearance section and being located on a side of the frame adhesive layer away from the display area;

[0017] The second welding adhesive layer is formed by melting the adhesive.

[0018] Optionally, the color filter substrate has a sealing portion corresponding to the second clearance section and extending to the outside of the array substrate;

[0019] The second welding adhesive layer is provided corresponding to the sealing portion.

[0020] Optionally, the array substrate further has an external pin side for electrically connecting to an external pin;

[0021] The panel structure further includes an anti-corrosion layer, which is disposed between the array substrate and the color filter substrate and is located corresponding to the outer pin side.

[0022] Optionally, the first welding adhesive layer includes the following raw materials in parts by weight:

[0023] 4-6 parts of dispersant, 15-25 parts of solvent, 20-25 parts of glass glue powder, 45-50 parts of glass powder.

[0024] The present invention also provides a display device, which includes the panel structure according to any one of the above items.

[0025] The present invention further provides a method for laser processing a panel structure, based on any one of the panel structures described above, characterized in that the method for laser processing a panel structure comprises the following steps:

[0026] Provide color filter substrates and array substrates;

[0027] Applying adhesive on the array substrate and curing it;

[0028] Aligning the color filter substrate and the array substrate;

[0029] Laser irradiation melts the adhesive to form a first fusion adhesive layer to seal the color filter substrate and the array substrate;

[0030] The color filter substrate and the array substrate are deflectively bound to form a panel.

[0031] In the panel structure provided by the present invention, corresponding to the first clearance section, an adhesive is arranged between the array substrate and the color filter substrate, and the adhesive is melted by laser melting. After the adhesive is melted, the gap between the sealed color filter substrate and the array substrate is filled and sealed, and the array substrate and the color filter substrate are bonded without welding, which can prevent the laser from burning the circuit during the welding process. Therefore, there is no need to reserve a safety space, so as to facilitate the setting of a smaller clearance area. At the same time, since the adhesive is melted and bonded, there is no need to punch the substrate, which can further reduce the width of the clearance area, thereby achieving a narrower narrow frame design. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 This is a front view structural diagram of the panel structure provided by the embodiment of the present utility model;

[0033] Figure 2 yes Figure 1 A schematic side view of the first embodiment of the mid-panel structure;

[0034] Figure 3 yes Figure 1 A side view of the second embodiment of the mid-panel structure;

[0035] Figure 4 This is a front view structural diagram of a third embodiment of a panel structure provided by an embodiment of the present utility model;

[0036] Figure 5 yes Figure 4 A schematic top view of the structure of the third embodiment of the mid-plate structure;

[0037] Figure 6 It is a flowchart of the laser processing method of the panel structure provided by the embodiment of the present utility model.

[0038] Description of Figure Numbers:

[0039] Label name Label name 100 Panel structure 2 Color film substrate 1 array substrate 31 First welding adhesive layer 11 Display area 32 Laser welding 12 Clearance Area 33 Frame glue layer 121 First clearance section 34 Second welding adhesive layer 122 Second clearance section

[0040] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0041] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0042] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly.

[0043] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of such features. In addition, the meaning of "and / or" appearing throughout the text includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme in which A and B are satisfied at the same time. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0044] With the development of the display industry, display panels are moving towards narrow bezels. Narrower bezels require extreme design changes to the previous panel structure to achieve narrower bezels. In existing narrow bezel structural designs, substrates are often connected through laser welding. However, if the clearance area is too narrow, the width of the frame glue will be insufficient, making it difficult to ensure the panel's anti-peel strength. At the same time, welding with an overly narrow clearance area can easily burn the circuits on the substrate, making it impossible to further improve the narrow bezel design.

[0045] In summary, it is difficult to improve the narrow frame design of the display panel in the existing panel structure.

[0046] See also Figures 1 to 2The present invention provides a panel structure 100, including an array substrate 1, a color filter substrate 2 and a sealing structure; the array substrate 1 has a source side for electrically connecting to a source driver, the array substrate 1 includes a display area 11 and a clearance area 12 surrounding the display area 11, the clearance area 12 includes a first clearance segment 121 arranged corresponding to the source side; the color filter substrate 2 is aligned and arranged on the array substrate 1; the sealing structure includes a first welding adhesive layer 31 arranged between the array substrate and the color filter substrate, and the first welding adhesive layer 31 is arranged corresponding to the first clearance segment 121; wherein, the first welding adhesive layer 31 is formed by melting the adhesive.

[0047] In the panel structure 100 provided by the present invention, corresponding to the first clearance section 121, an adhesive is arranged between the array substrate 1 and the color filter substrate 2, and the adhesive is melted by laser melting. After the adhesive is melted, the gap between the sealed color filter substrate 2 and the array substrate 1 is filled and sealed, and the array substrate 1 and the color filter substrate 2 are bonded. No welding is required, which can prevent the laser from burning the circuit during the welding process. Therefore, there is no need to reserve a safety space, so as to facilitate the setting of a smaller clearance area 12. At the same time, since the adhesive is melted and bonded, there is no need to punch the substrate, which can further reduce the width of the clearance area 12, thereby achieving a narrower narrow frame design.

[0048] Furthermore, the clearance area 12 also includes a second clearance section 122; the sealing structure also includes a laser weld 32 provided between the array substrate 1 and the color filter substrate 2, and the laser weld 32 is provided corresponding to the second clearance section 122. In this embodiment, the clearance area 12 also includes the second clearance section 122. Since the second clearance section 122 is not provided on the source side, the risk of circuit burnout is low. Therefore, a laser welder can be used for welding to achieve a complete seal between the color filter substrate 2 and the array substrate 1, thereby enhancing the peel strength between the array substrate 1 and the color filter substrate 2.

[0049] It should be noted that the laser weld 32 is provided in the second clearance section 122 . In order to ensure the peeling strength between the array substrate 1 and the color filter substrate 2 , a plurality of laser welds 32 are provided, and the plurality of laser welds 32 are arranged at intervals.

[0050] In the first embodiment of the utility model, the clearance area 12 on the array substrate 1 includes a first clearance section 121 and a second clearance section 122; wherein, corresponding to the first clearance section 121, the array substrate 1 and the color film substrate 2 are connected through the first fusion adhesive layer 31 formed by laser fusion, corresponding to the second clearance section 122, the array substrate 1 and the color film substrate 2 are connected through the laser weld 32 formed by laser welding, corresponding to different clearance area positions, different connection modes are adopted, on the source side, the space occupied by the first clearance section 121 is reduced through the bonding mode, while on the rest of the clearance area positions, the connection is still carried out through the welding mode, the anti-peeling strength between the array substrate 1 and the color film substrate 2 is guaranteed, the narrow edge occupied space of the narrow frame is further reduced under the condition of guaranteeing the panel structure strength.

[0051] Please refer to Figure 3 On the other hand, the sealing structure further includes a frame adhesive layer 33 arranged between the array substrate 1 and the color film substrate 2, the frame adhesive layer 33 is arranged corresponding to the clearance area and is located on the side of the first fusion adhesive layer 31 close to the display area; wherein the frame adhesive layer 33 is formed by sealing frame adhesive fusion. In the embodiment, the frame adhesive layer 33 is arranged between the array substrate 1 and the color film substrate 2, and the first fusion adhesive layer 31 is arranged on the outer side of the frame adhesive layer 33, the source side is sealed and aligned by the frame adhesive layer 33 and the first fusion adhesive layer 31 on the basis of the existing frame adhesive, the occupied space of the frame adhesive layer 33 and the first fusion adhesive layer 31 can be reduced simultaneously, meanwhile, the manufacturing process is simplified, the sealing can be completed by laser synchronous fusion, the production efficiency is improved on the basis of realizing the narrow frame.

[0052] Further, the clearance area further includes a second clearance section 122, the sealing structure further includes a second fusion adhesive layer 34 arranged between the array substrate and the color film substrate, the second fusion adhesive layer 34 is arranged corresponding to the second clearance section 122 and is located on the side of the frame adhesive layer 33 away from the display area. In the embodiment, the first fusion adhesive layer 31 and the second fusion adhesive layer are arranged on the outer side of the frame adhesive layer 33, the array substrate 1 and the color film substrate 2 are connected through the first fusion adhesive layer 31, the second fusion adhesive layer and the frame adhesive layer 33 simultaneously, the space size occupied by the first fusion adhesive layer 31, the second fusion adhesive layer and the frame adhesive layer 33 can be reduced simultaneously, and the anti-peeling strength between the array substrate 1 and the color film substrate 2 can be guaranteed, meanwhile, the process is simpler, the connection does not need to be carried out through the laser welding mode, when the laser irradiation is carried out, the bonding adhesive and the frame adhesive can be fused simultaneously, the first fusion adhesive layer 31, the second fusion adhesive layer 34 and the frame adhesive layer 33 can be formed conveniently.

[0053] In a second embodiment provided by the present invention, a sealing frame glue is coated on the array substrate 1, and the sealing frame glue is arranged corresponding to the clearance area 12, and an adhesive is coated on the outside of the sealing frame glue; the sealing frame glue and the adhesive glue are melted by laser irradiation to form the frame glue layer, the first welding glue layer and the second welding glue layer in the clearance area 12. On the basis of the existing frame glue, an adhesive glue is arranged on the outside of the frame glue layer. There is no need to change the existing panel connection structure, and the sealing frame glue and the adhesive glue can be melted synchronously, thereby improving production efficiency. At the same time, due to the joint connection method of the sealing frame glue and the adhesive glue, the peeling strength between the array substrate 1 and the color filter substrate 2 can be improved, and the space occupied by the frame glue layer, the first welding glue layer and the second welding glue layer can be reduced simultaneously. While achieving the same peeling strength, a narrower clearance area can be set.

[0054] See also Figures 4 and 5 Furthermore, in a third embodiment of the present invention, the color filter substrate 2 has a sealing portion corresponding to the second clearance section 122, extending to the outside of the array substrate 1; the second welding adhesive layer 32 is provided corresponding to the sealing portion. In this embodiment, the side edge of the color filter substrate 2 corresponding to the second clearance section 122 protrudes outside the array substrate 1, allowing direct application to existing mass-produced panels without requiring structural changes to the existing color filter substrate 2. By providing the second welding adhesive layer 32 on the protruding portion, the second welding adhesive layer 32 no longer needs to occupy space within the projection of the array substrate, freeing up space for the sealant layer 33, thereby reducing the space occupied by the second clearance section 122. Furthermore, adding the second welding adhesive layer 32 to the sealant layer 33 further enhances the sealing and peel strength between the color filter substrate 2 and the array substrate 1, thereby achieving a narrower bezel compared to existing panel structures.

[0055] On the other hand, the array substrate 1 further includes an external pin side for electrically connecting to external pins. The panel structure 100 also includes an anti-corrosion layer disposed between the array substrate 1 and the color filter substrate 2, corresponding to the external pin side. In this embodiment, the anti-corrosion layer protects the thin-film transistors from corrosion due to moisture and salt spray.

[0056] Specifically, in this embodiment, the anti-corrosion layer includes a UV adhesive layer and a resin adhesive layer, which has a good anti-corrosion effect, low cost, and mature technology.

[0057] On the other hand, the first welding adhesive layer 31 includes the following parts by weight: 4-6 parts raw material dispersant, 15-25 parts cosolvent, 20-25 parts glass adhesive powder, and 45-50 parts glass powder. In this embodiment, the first welding adhesive layer 31 obtained by mixing the raw materials in the corresponding proportions can achieve better sealing and bonding effects.

[0058] Specifically, in this embodiment, the optimal ratio of the first fusing adhesive layer 31 is: 50% glass powder, 25% glass adhesive powder, 20% solvent, and 5% dispersant.

[0059] Based on the above-mentioned panel structure 100, the present invention also provides a display device, including the above-mentioned panel structure 100, that is, having all the technical features of the above-mentioned panel structure 100, and therefore, also having the technical effects brought by all the above-mentioned technical features, which will not be described one by one here.

[0060] See also Figure 6 Based on the above panel structure 100, the present invention further provides a laser processing method for the panel structure, which is characterized by comprising the following steps:

[0061] S10, providing a color filter substrate and an array substrate;

[0062] S20, applying adhesive on the array substrate and curing it;

[0063] Among them, in this embodiment, an adhesive is provided on the array substrate, and the adhesive can fill and seal the color filter substrate and the array substrate after melting, without the need for welding, which can prevent the laser from burning the circuit during the welding process and without the need to reserve a safety space. Therefore, the space occupied by the clearance area is smaller, thereby achieving a narrower narrow frame design.

[0064] S30, aligning the color filter substrate and the array substrate;

[0065] S40, laser irradiation melts the adhesive to form a first welding adhesive layer, sealing the color filter substrate and the array substrate;

[0066] Among them, after the array substrate and the color filter substrate are aligned, the adhesive is melted by laser melting, so that the adhesive is bonded to the array substrate and the color filter substrate. No welding is required, and only the adhesive needs to be melted. No additional processes such as punching and grouting are required, which simplifies the installation process. At the same time, compared with laser welding and melting, the energy used by the laser is smaller, so as to save energy.

[0067] S50 , deflecting and binding the color filter substrate and the array substrate to form a panel.

[0068] In the laser processing method of the panel structure provided by the present invention, the adhesive is melted by laser melting. After the adhesive is melted, it fills the gap between the sealed color filter substrate 2 and the array substrate 1, and bonds the array substrate 1 and the color filter substrate 2. No welding is required, which can avoid the laser burning the circuit during the welding process. Therefore, there is no need to reserve a safety space, so as to set a smaller clearance area 12. At the same time, since the adhesive is melted and bonded, there is no need to punch the substrate, which can further reduce the width of the clearance area 12, thereby achieving a narrower narrow frame design.

[0069] The above are only preferred embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A panel structure, characterized in that: include: An array substrate having a source side for electrically connecting to a source driver, the array substrate including a display area and a clearance area surrounding the display area, the clearance area including a first clearance segment provided corresponding to the source side; a color filter substrate, positioned on the array substrate; and A sealing structure, the sealing structure comprising a first welding adhesive layer provided between the array substrate and the color filter substrate, wherein the first welding adhesive layer is provided corresponding to the first clearance section; Wherein, the first welding adhesive layer is formed by melting the adhesive.

2. The panel structure according to claim 1, characterized in that: The clearance area also includes a second clearance section; The sealing structure further includes a laser weld provided between the array substrate and the color filter substrate, and the laser weld is provided corresponding to the second clearance section.

3. The panel structure according to claim 2, characterized in that: There are multiple laser welds, and the multiple laser welds are arranged at intervals.

4. The panel structure according to claim 1, characterized in that: The sealing structure further includes a sealant layer provided between the array substrate and the color filter substrate, the sealant layer being provided corresponding to the clearance area and being located on a side of the first welding adhesive layer close to the display area; Wherein, the sealant layer is formed by melting the sealing sealant.

5. The panel structure according to claim 4, characterized in that: The clearance area also includes a second clearance section; The sealing structure further includes a second fusing adhesive layer provided between the array substrate and the color filter substrate, the second fusing adhesive layer being provided corresponding to the second clearance section and being located on a side of the frame adhesive layer away from the display area; The second welding adhesive layer is formed by melting the adhesive.

6. The panel structure according to claim 5, characterized in that: The color filter substrate has a sealing portion corresponding to the second clearance section extending to the outside of the array substrate; The second welding adhesive layer is provided corresponding to the sealing portion.

7. The panel structure according to claim 1, characterized in that: The array substrate further comprises an external pin side for electrically connecting to an external pin; The panel structure further includes an anti-corrosion layer, which is disposed between the array substrate and the color filter substrate and is located corresponding to the outer pin side.

8. A display device, characterized in that: The display device includes the panel structure according to any one of claims 1 to 7.

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