Device capable of pasting interdigital electrode

The adhesive interdigital electrode device designed with conductive glue and connecting blocks solves the problems of uneven coating and damage, achieves uniform electrode adhesion and stable signal transmission, adapts to a variety of substrate materials, and enhances the reliability and safety of the electrode.

CN223436345UActive Publication Date: 2025-10-14HENAN AGRICULTURAL UNIVERSITY
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Patent Information

Application Number
CN202422817052.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-18
Publication Date
2025-10-14
Estimated Expiration
2034-11-18

AI Technical Summary

Technical Problem

Existing interdigital electrode devices are prone to unevenness and damage when applying materials, especially difficult to adhere to spinning materials, which affects signal transmission.

Method used

The adhesive interdigitated electrode device is designed with conductive glue and connecting blocks. The conductive glue makes the electrode fingers stick evenly to the substrate, and the connecting blocks fix the first and second electrodes to ensure stability and independence.

Benefits of technology

It achieves uniform sticking and firm attachment of electrodes, ensures signal transmission stability and independence of electrode performance, adapts to a variety of substrate materials, and improves the reliability and safety of electrodes.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of interdigital electrodes, and discloses a stickable interdigital electrode device which comprises a substrate material, connecting holes are formed in the left side and the right side of the lower portion of the substrate material, connecting blocks are connected into the connecting holes in a sliding mode, and second electrodes are fixedly connected to the rear sides of the connecting blocks. The front side of the connecting block is fixedly connected with a first electrode, the first electrode comprises electrode pins and electrode fingers, the electrode pins are fixedly connected to the front side of the connecting block, and the electrode fingers are evenly distributed on the upper portion of the front side of the substrate material in a crossed mode. According to the utility model, a user can freely select a substrate material and uniformly paste a self-made material on the substrate, and the electrode is provided with the conductive adhesive, so that the electrode can be firmly pasted and directly used after being placed on the material, the problem of non-uniform coating is solved, and the user can freely select the substrate material.
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Description

Technical Field

[0001] The utility model relates to the technical field of interdigital electrodes, in particular to an adhesive interdigital electrode device. Background Art

[0002] Interdigitated electrodes are widely used in many fields such as electronic communications, chemical testing, electrochemical sensors, and biosensors. Their substrate materials mainly include ceramics, plastics, silicon, and glass. However, the interdigitated electrodes on the market are integrated with the substrate material, and the material can only be applied to the electrode, which can easily cause uneven application and damage to the interdigitated fingers. In particular, for spinning materials, it is difficult to adhere to the electrode, which affects signal transmission. Therefore, a bondable interdigitated electrode device is needed. Utility Model Content

[0003] In order to make up for the above shortcomings, the present invention provides a sticky interdigital electrode device, which aims to improve the problem of uneven coating and damage to the interdigital fingers in the prior art interdigital electrode device when applying materials on the electrodes.

[0004] In order to achieve the above-mentioned purpose, the present invention adopts the following technical solution: an adhesive interdigital electrode device, including a base material, wherein connection holes are opened on the left and right sides of the lower part of the base material, a connection block is slidably connected inside the connection hole, a second electrode is fixedly connected to the rear side of the connection block, and a first electrode is fixedly connected to the front side of the connection block.

[0005] As a further description of the above technical solution:

[0006] The first electrode includes an electrode pin and electrode fingers, the electrode pin is fixedly connected to the front side of the connection block, and the electrode fingers are evenly and cross-distributed on the upper part of the front side of the base material.

[0007] As a further description of the above technical solution:

[0008] The number of the electrode fingers is twelve.

[0009] As a further description of the above technical solution:

[0010] The base material is a PI film, and the thickness of the base material is 0.2 mm.

[0011] As a further description of the above technical solution:

[0012] The thickness of the second electrode and the first electrode are both 15 μm, and the second electrode includes two other electrode pins.

[0013] As a further description of the above technical solution:

[0014] Conductive glue is provided on the outside of the electrode fingers.

[0015] As a further description of the above technical solution:

[0016] An electrostatic spinning material is provided on a side of the conductive adhesive away from the connecting block.

[0017] The utility model has the following beneficial effects:

[0018] In the present invention, users can freely choose the substrate material and evenly stick the homemade material on the substrate. Since the electrode comes with conductive glue, the electrode can be placed on the material and it can be firmly stuck and used directly. This solves the problem of uneven coating and gives users the freedom to choose the substrate material. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a front view of an adhesive interdigital electrode device proposed by the present invention;

[0020] Figure 2 This is a rear view of an adhesive interdigital electrode device proposed by the present invention;

[0021] Figure 3 This is an exploded view of an adhesive interdigital electrode device proposed by the present invention.

[0022] Legend:

[0023] 1. Base material; 2. Connection hole; 3. First electrode; 4. Electrode pin; 5. Electrode finger; 6. Connection block; 7. Second electrode; 8. Conductive adhesive; 9. Electrospinning material. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0025] Reference Figure 1-Figure 3The utility model provides an embodiment: an adhesive interdigital electrode device, comprising a base material 1, with connection holes 2 opened on both the left and right sides of the lower part of the base material 1, a connection block 6 being slidably connected inside the connection hole 2, a second electrode 7 being fixedly connected to the rear side of the connection block 6, a first electrode 3 being fixedly connected to the front side of the connection block 6, the first electrode 3 comprising an electrode pin 4 and an electrode finger 5, the electrode pin 4 being fixedly connected to the front side of the connection block 6, the electrode fingers 5 being evenly cross-distributed on the upper front side of the base material 1, the number of the electrode fingers 5 being twelve, the thickness of the second electrode 7 and the first electrode 3 being 15 μm, the second electrode 7 comprising two other electrode pins 4, and a conductive adhesive 8 being arranged on the outside of the electrode finger 5.

[0026] By using the conductive glue 8, the design of the wearable adhesive interdigital electrode significantly improves the adhesion and uniformity between the electrode fingers 5 and the substrate material. The application of this conductive glue 8 enables the electrode fingers 5 to be directly and evenly adhered to various substrate materials, thereby effectively solving the problem of uneven application that may occur in traditional application methods. In actual use, the user only needs to place the interdigital electrode device on the selected substrate, and the conductive glue 8 can be quickly and firmly attached to ensure the conductive performance of the electrode and the stability of signal transmission. The design of the interdigital electrode allows the first electrode 3 and the second electrode 7 to be independent of each other, thereby achieving effective isolation of signal transmission. This design enhances the overall reliability of the electrode. , ensuring that the electrode performance will not be affected by material differences when used on different substrate materials. Whether used on flexible materials on the skin or in other industrial applications, the interdigitated electrodes can maintain stable performance and ensure the accuracy of data collection. In addition, the design of the connecting block 6 further improves the stability of the electrode in structure. By fixing the first electrode 3 and the second electrode 7 together, the connecting block 6 effectively prevents poor contact of the electrodes due to external force or movement during use. This stable connection design not only ensures the conductivity of the electrode, but also reduces the risk of failure caused by improper operation, ensuring the safety and reliability of users in various usage scenarios.

[0027] Reference Figure 1-Figure 3 The base material 1 is a PI film with a thickness of 0.2 mm. An electrospinning material 9 is provided on the side of the conductive adhesive 8 away from the connecting block 6 .

[0028] Adopt PI film as the base material 1, provide flexible foundation for the design of wearable pasteable interdigital electrode, PI film can effectively support the structure of the electrode due to its excellent mechanical properties and chemical stability, compatible with a variety of substrate materials, this design not only makes the electrode can maintain stable conductivity and good signal transmission in the process of use, also provides users with a variety of choices, users can choose a variety of substrate materials such as electrospinning material 9 according to specific needs, the degree of freedom of this choice greatly enhances the adaptability of the electrode, so that it can meet the requirements of different use environment and application scene, for example, electrospinning material 9 has excellent air permeability and comfort, suitable for long-term skin application; while other types of substrate materials may provide different adhesion properties or waterproof performance to meet specific use conditions.

[0029] Working principle: by using conductive glue 8, the electrode finger 5 can be directly and uniformly pasted on the substrate material, this design effectively solves the problem of uneven coating that may occur in traditional coating method, users only need to place the interdigital electrode device on the selected substrate, and the conductive glue 8 can quickly and firmly adhere, so as to ensure the conductivity of the electrode and the stability of signal transmission, by using PI film material for the base material 1, users can freely choose electrospinning material 9 or other substrate materials according to specific needs, this flexibility not only makes the electrode obtain good pasting effect in different scenes, but also meets the comfort and applicability requirements of specific users, the design of interdigital electrode allows the first electrode 3 and the second electrode 7 to be independent of each other, so that the signal transmission is not disturbed, this independence not only enhances the reliability of the electrode, but also ensures that the performance of the electrode will not be reduced due to the difference of the substrate material when used on a variety of substrate materials, the first electrode 3 and the second electrode 7 are fixed together by the connecting block 6, further improving the stability of the overall structure, ensuring that the electrode will not cause poor contact due to external force or movement in the process of use, this design ensures that the electrode can still maintain good conductivity and signal transmission when users choose different materials.

[0030] Finally, it should be pointed out that: the above only for the preferred embodiments of the present application, and not for limiting the present application, although the present application has been described in detail with reference to the foregoing embodiments, for those skilled in the art, it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features, any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application, shall be included in the protection scope of the present application.

Claims

1. A bondable interdigital electrode device comprising a substrate material (1), characterized in that: The base material (1) is provided with connection holes (2) on both the left and right sides of the lower part, a connection block (6) is slidably connected inside the connection hole (2), a second electrode (7) is fixedly connected to the rear side of the connection block (6), and a first electrode (3) is fixedly connected to the front side of the connection block (6).

2. The adhesive interdigital electrode device according to claim 1, characterized in that: The first electrode (3) comprises an electrode pin (4) and an electrode finger (5), the electrode pin (4) being fixedly connected to the front side of the connection block (6), and the electrode finger (5) being evenly cross-distributed on the upper part of the front side of the base material (1).

3. The adhesive interdigital electrode device according to claim 2, characterized in that: The number of the electrode fingers (5) is twelve.

4. The adhesive interdigital electrode device according to claim 1, characterized in that: The base material (1) is a PI film, and the thickness of the base material (1) is 0.2 mm.

5. The adhesive interdigital electrode device according to claim 2, characterized in that: The thickness of the second electrode (7) and the first electrode (3) are both 15 μm, and the second electrode (7) includes two other electrode pins (4).

6. The adhesive interdigital electrode device according to claim 2, characterized in that: Conductive glue (8) is provided on the outside of the electrode fingers (5).

7. The adhesive interdigital electrode device according to claim 6, characterized in that: An electrostatic spinning material (9) is provided on the side of the conductive adhesive (8) away from the connecting block (6).