Camera module

By setting up an air escape structure and a sealing structure on the IR bracket, the problem of the fixed-focus camera module being unable to escape due to size limitations is solved, the internal pressure of the module is stabilized, and production efficiency and yield are improved.

CN223437108UActive Publication Date: 2025-10-14SHINE OPTICS TECH CO LTD
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Patent Information

Application Number
CN202422150867.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-03
Publication Date
2025-10-14
Estimated Expiration
2034-09-03

AI Technical Summary

Technical Problem

In the production of fixed-focus camera modules, air escape holes cannot be designed due to size limitations at the four corners of the lens mount. This causes internal pressure to increase during the baking process, impacting product performance and reliability.

Method used

A first gas escape structure and a second gas escape structure are provided on the IR bracket, which are used for gas escape above and below the IR bracket respectively. A sealing structure is provided between the IR bracket and the circuit board to ensure smooth gas discharge and stable pressure inside the module.

Benefits of technology

It effectively solves the problem of gas not being able to escape due to size limitations, prevents gas expansion from damaging the module, improves production efficiency and yield rate, and protects the integrity of the confined space.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a camera module, comprising a circuit board, a photosensitive chip, an IR support, an infrared filter and a lens which are sequentially arranged from an image space to an object space along an optical axis direction, and also comprising a lens seat which is arranged above the IR support and is used for assembling the lens, the baking device is characterized in that the IR support is provided with a first gas escape structure which is used for escaping expanded gas above the IR support when the camera module is baked. According to the utility model, the first gas escape structure is arranged on the IR bracket, so that the spatial layout in the module is fully utilized, and the problem that gas escape holes cannot be formed in four corners of the lens base due to the limitation of the boundary dimension of the sealed camera module is ingeniously solved; when the camera module is baked, the first gas escape structure escapes gas which is heated to expand above the IR bracket, so that the camera module can be prevented from being damaged due to the fact that glue is burst open after the gas expands, the stability of the internal pressure of the module is ensured, and the production efficiency and the yield of products are improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of camera technology, in particular to a camera module. Background Art

[0002] In the camera module production process, assembly and curing are critical steps to ensure product performance and quality. Traditionally, the circuit board, chip, and IR bracket are precisely assembled, followed by a baking process to cure the glue connecting the components. During this baking step, the rising temperature causes the gas beneath the IR bracket to expand and escape effectively through pre-designed vents, preventing internal pressure buildup and damage to the module structure.

[0003] After sealing the vent holes below the IR bracket, the lens (including the lens mount) is mounted on the IR bracket, forming the core of the camera module. To ensure a secure connection between the lens and the IR bracket, the module is baked again to cure the glue. However, during this stage, the gas above the IR bracket will also expand due to the heat, requiring an effective vent structure to prevent internal pressure from increasing.

[0004] For most camera modules, traditional practice is to create vent holes at the four corners of the lens mount to allow gases above the IR bracket to escape smoothly during the baking process. However, in the production of some fixed-focus camera modules with strict size restrictions, the four corners of the lens mount are often not designed with vent holes for baking gas due to size limitations. This limitation poses a challenge to the production of fixed-focus camera modules, as the lack of an effective vent path can cause internal module pressure to increase during baking, thereby affecting product performance and reliability. Utility Model Content

[0005] In view of the above-mentioned deficiencies in the prior art, the technical problem to be solved by the present invention is to provide a camera module that is compatible with the upper and lower baking and escaping of the IR bracket when the camera module is limited by size.

[0006] In order to solve the above technical problems, a technical solution adopted by the present invention is: to provide a camera module, including a circuit board, a photosensitive chip, an IR bracket, an infrared filter and a lens arranged in sequence from the image side to the object side along the optical axis, and also including a lens holder arranged above the IR bracket for assembling the lens, and a first gas escape structure is provided on the IR bracket for escaping the gas expanded above the IR bracket when the camera module is baked.

[0007] Furthermore, the lens holder is provided with an assembly hole extending along the optical axis, the lens is placed in the assembly hole and the side wall of the lens and the inner wall of the assembly hole are sealed with glue to form a sealed lens, and a first enclosed space is formed between the bottom of the sealed lens and the IR bracket and the infrared filter; the first air escape structure includes a first through hole provided on the IR bracket and connected to the first enclosed space, and a first notch provided on the side of the IR bracket and connected to the first through hole.

[0008] Furthermore, the IR bracket includes a supporting frame and a light-transmitting hole formed in the supporting frame, the inner circumference of the supporting frame is provided with a supporting portion for supporting the infrared filter, and the infrared filter is supported on the supporting portion; a fixed block is provided on the side of the supporting frame facing the image side, and the fixed block is provided with a first groove that is recessed toward the object side, the first groove penetrates the supporting frame toward the outer side surface of the supporting frame to form the first notch, and the first through hole penetrates the bottom surface of the first groove and a side surface of the supporting frame facing the object side vertically along the optical axis direction.

[0009] Furthermore, the supporting frame includes a vertical frame distributed along the optical axis and a horizontal frame arranged on one end of the vertical frame facing the object side, and the light-transmitting hole is arranged in the horizontal frame; the fixed block is arranged on a side of the horizontal frame facing the image side and is integrated with the inner side surface of the vertical frame, and the first groove penetrates the vertical frame toward the outer side surface of the vertical frame to form the first notch, and the first groove and the first notch divide the fixed block into a U-shaped block structure.

[0010] Furthermore, a second enclosed space is formed between the IR bracket carrying the infrared filter and the circuit board, and a first sealing structure for protecting the second enclosed space is provided between the IR bracket and the circuit board.

[0011] Furthermore, the first sealing structure includes a first glue layer arranged between the vertical frame and the circuit board and a second glue layer arranged between the fixed block and the circuit board. The first glue layer and the second glue layer are connected end to end to form a concave sealing structure that isolates the first escape structure.

[0012] Furthermore, the IR bracket is provided with a second gas escape structure for escaping the gas expanded under the IR bracket when the circuit board, the photosensitive chip and the IR bracket are assembled together and baked.

[0013] Furthermore, the second air escape structure is configured as a second through hole arranged on the IR bracket, the second through hole includes a first hole segment with equal cross-sectional area and a second hole segment whose cross-sectional area at the lower end of the first hole segment gradually decreases from top to bottom, and the first hole segment and the second hole segment are coaxially arranged.

[0014] Furthermore, a plurality of reinforcing members for preventing the middle portion of the horizontal frame from collapsing are provided on the horizontal frame at positions close to the vertical frame, and the reinforcing members are formed by protruding from the horizontal frame toward the image side.

[0015] Furthermore, it also includes a second sealing structure for sealing the first gap when the camera module is baked, and a protective shell arranged above the lens for protecting the lens, and the protective shell covers the lens holder.

[0016] The camera module of the present invention has at least the following beneficial effects: the present invention not only fully utilizes the spatial layout inside the module by arranging a first air escape structure on the IR bracket, but also cleverly solves the problem that the sealed camera module cannot have air escape holes at the four corners of the lens holder due to size limitations; the first air escape structure is used to escape the gas that expands due to heat above the IR bracket when the camera module is baked, which can prevent the glue from being washed away after the gas expands, thereby damaging the camera module; the second air escape structure is used to escape the gas that expands due to heat below the IR bracket, so as to achieve the air escape requirements above and below the IR bracket, ensure the stability of the internal pressure of the module, and improve the production efficiency and yield of the product; the first sealing structure is provided between the IR bracket and the circuit board, so as to prevent water and dust from entering the second enclosed space enclosed between the IR bracket and the circuit board through the first air escape structure when the IR bracket is flushed, thereby protecting the second enclosed space. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0018] Figure 1 A schematic structural diagram of an embodiment of a camera module of the present invention.

[0019] Figure 2 It is a cross-sectional view of an embodiment of the camera module of the present invention.

[0020] Figure 3 Schematic diagram of the structure of the lens holder in one embodiment of the camera module of the present invention.

[0021] Figure 4 This is a structural diagram of an IR bracket in one embodiment of the camera module of the present invention.

[0022] Figure 5 This is a structural schematic diagram of an IR bracket from another perspective in one embodiment of the camera module of the present invention.

[0023] Figure 6 This is an assembly diagram of the IR bracket and the first sealing structure in one embodiment of the camera module of the present invention.

[0024] The meanings of the reference numerals in the accompanying drawings are:

[0025] Circuit board 100; Photosensitive chip 200;

[0026] IR bracket 300, supporting frame 310, vertical frame 311, horizontal frame 312, fixing block 3121, first groove 31211, reinforcement member 3122, light-transmitting hole 320, bearing portion 330, first air escape structure 340, first through hole 341, first notch 342, second air escape structure 350, first hole section 351, second hole section 352;

[0027] Infrared filter 400; lens 500;

[0028] Mirror holder 600, base 610, support shoulder 611, protrusion 620, assembly hole 630;

[0029] Protective shell 700, second groove 710;

[0030] First sealing structure 800, first glue layer 810, second glue layer 820; second sealing structure 900;

[0031] The first enclosed space A100; the second enclosed space A200. DETAILED DESCRIPTION

[0032] The present invention will be further described below with reference to the accompanying drawings.

[0033] See also Figure 1 and Figure 2 The camera module of the present invention includes a circuit board 100, a photosensitive chip 200, an IR bracket 300, an infrared filter 400 and a lens 500, which are arranged in sequence from the image side to the object side along the optical axis. The side of the camera module facing the object when shooting is called the object side, and the side where the image is formed is called the image side. The camera module also includes a lens holder 600 arranged above the IR bracket 300 for assembling the lens. The lens 500 and the lens holder 600 form a sealed lens. Therefore, when the camera module is baked and vented, a special venting structure needs to be provided for venting.

[0034] Referring to Figure 2 and Figure 3 In the embodiment, the lens holder 600 has a base 610 and a protrusion 620 integrally formed on the base 610 near the object side. The lens holder 600 has an assembly hole 630 extending through the base 610 and the protrusion 620 along the axial direction. The lens 500 is placed in the assembly hole 630, and the side wall of the lens 500 is sealed with the inner side wall of the assembly hole 630 by glue to form a sealed lens. In order to prevent dust and protect the lens 500, a protective shell 700 is arranged above the lens 500 as a preferred embodiment. The side near the image side of the protective shell 700 is recessed to form a second recess 710 towards the object side, and the second recess 710 is matched with the protrusion 620. The four corners of the protrusion 620 are chamfered, so that the four corners of the base 610 are exposed to form support shoulders 611. When the protective shell 700 is covered on the lens holder 600, the side near the image side of the protective shell 700 is placed on the support shoulders 611 of the base 610.

[0035] Referring to Figure 2 , Figure 4 and Figure 5 The IR holder 300 is bonded to the side near the image side of the lens holder 600. The IR holder 300 includes a support frame 310 and a light-transmitting hole 320 formed in the support frame 310. The support frame 310 includes vertical frames 311 distributed along the optical axis direction and a horizontal frame 312 arranged on one end of the vertical frames 311 towards the object side. The vertical frames 311 are protruded towards the image side from the four peripheral edges of the horizontal frame 312. The horizontal frame 312 is provided with a groove matched with the infrared filter 400. The groove is recessed from the side near the object side of the horizontal frame 312 towards the image side. A light-transmitting hole 320 is arranged in the center of the bottom wall of the groove. One end of the light-transmitting hole 320 penetrates the bottom wall of the groove along the optical axis direction, and the other end penetrates the side near the image side of the horizontal frame 312 along the optical axis direction. The size of the light-transmitting hole 320 is smaller than that of the groove, thereby forming a bearing part 330 for bearing the infrared filter 400. The side near the image side of the bearing part 330 is higher than the side near the image side of the horizontal frame 312, thereby forming a bearing groove with an L-shaped cross section. The infrared filter 400 is bonded to the side near the object side of the bearing part 330 by glue to be borne at the bearing part 330. Thus, a first sealed space A100 is formed between the sealed lens formed by the lens 500 and the lens holder 600 and the IR holder 300 and the infrared filter 400.

[0036] The IR support 300 is provided with a first escape structure 340 for escaping the gas expanded in the first closed space A100 above the IR support 300 when the camera module is baked. The first escape structure 340 includes a first through hole 341 provided on the horizontal frame 312 and communicating with the first closed space A100, and a first notch 342 provided on the side wall of the vertical frame 311 and communicating with the first through hole 341. When baking escapes, the gas expanded by heating in the first closed space A100 overflows into the external air through the first through hole 341 and the first notch 342 in turn. A fixing block 3121 is provided on the side of the horizontal frame 312 facing the image side, and the fixing block 3121 is integrated with the inner side of the vertical frame 311. A first groove 31211 recessed toward the object side is provided at the fixing block 3121. The first through hole 341 vertically penetrates the groove bottom surface of the first groove 31211 and the side of the horizontal frame 312 facing the object side along the optical axis direction. It should be noted that in order to avoid escape disorder, the size of the first through hole 341 is designed to be as large as possible, but the shape of the first through hole 341 is not limited, and the cross section of the first through hole 341 can be a polygon such as a rectangle. In this embodiment, the cross section of the first through hole 341 is circular. The first groove 31211 penetrates the vertical frame 311 to form the first notch 342 toward the outer side of the vertical frame 311. The first groove 31211 and the first notch 342 divide the fixing block 3121 into a U-shaped block structure.

[0037] After the camera module is baked, a second sealing structure 900 is provided at the first notch 342 for sealing the first notch 342. In this embodiment, the second sealing structure 900 is defined as a glue strip with a right triangle cross section formed by drawing glue, and among the two mutually perpendicular sides of the glue strip, one side is pasted with the outer side of the vertical frame 311 where the first notch 342 is located, and the other side is pasted with the circuit board 100.

[0038] In order to prevent the middle part of the horizontal frame 312 from collapsing, as a preferred embodiment, a plurality of reinforcing members 3122 are provided on the horizontal frame 312 near the vertical frame 311. The reinforcing members 3122 are protruded from the horizontal frame 312 toward the image side, and the reinforcing members 3122 are integrated with the inner side of the vertical frame 311.

[0039] The IR bracket 300 is provided with a second air escape structure 350 for escaping the gas expanding below the IR bracket 300. The second air escape structure 350 is configured as a second through hole provided on the IR bracket 300; the second through hole includes a first hole segment 351 having equal cross-sectional areas and a second hole segment 352 at the lower end of the first hole segment 351, the cross-sectional area of ​​which gradually decreases from top to bottom; the first hole segment 351 is cylindrical, and the second hole segment 352 is funnel-shaped, and the first hole segment 351 and the second hole segment 352 are coaxially arranged; the end of the first hole segment 351 close to the object side passes through the side of the horizontal frame 312 facing the object side, and the end of the second hole segment 352 close to the image side passes through the side of the horizontal frame 312 facing the image side.

[0040] See also Figure 2 and Figure 6 A photosensitive chip 200 is mounted on the circuit board 100 at a position corresponding to the IR bracket 300. The photosensitive chip 200 is glued to the object-facing side of the circuit board 100. The IR bracket 300 is positioned above the circuit board 100. A second enclosed space A200 is enclosed between the IR bracket 300, which carries the infrared filter 400, and the circuit board 100. When the circuit board 100, photosensitive chip 200, and IR bracket 300 are assembled and baked, the gas in the second enclosed space A200 expands due to the heat and escapes through the second air escape structure 350. After baking and escaping, glue is dispensed onto the second air escape structure 350 to seal it. To prevent water or dust from entering the second enclosed space A200 through the first air escape structure 340, in this embodiment, a first sealing structure 800 is provided between the IR bracket 300 and the circuit board 100 to protect the second enclosed space A200. The first sealing structure 800 includes a first glue layer 810 disposed between the vertical frame 311 and the circuit board 100, and a second glue layer 820 disposed between the fixing block 3121 and the circuit board 100. The second glue layer 820 is U-shaped, and the first glue layer 810 and the second glue layer 820 are connected end to end to form a concave sealing structure that isolates the first air escape structure 340. It should be noted that because the glue layer may overflow, in order to prevent the second glue layer 820 from overflowing into the first through hole 341 and affecting air escape, in this embodiment, the size of the first groove 31211 is designed to be larger than the size of the first through hole 341.

[0041] The assembling mode of the camera module of the embodiment is as follows: firstly, the circuit board 100 and the photosensitive chip 200 are fixed by drawing glue, and the photosensitive chip 200 is fixed at the center of the circuit board 100; secondly, the infrared filter 400 and the IR support 300 are fixed by drawing glue, and the infrared filter 400 and the side facing the object of the bearing part 330 are bonded together; thirdly, the assembly after the infrared filter 400 and the IR support 300 are fixed and the circuit board 100 are fixed by drawing glue, and the first glue layer 810 and the second glue layer 820 formed by the drawing glue constitute a first sealing structure 800; fourthly, the assembled assembly is placed in an oven for baking to solidify the glue, and the gas below the IR support 300 expands and escapes from the second escape structure 350 after being heated; fifthly, after the escape is completed, the second escape structure 350 is sealed by glue dispensing; sixthly, the surface of the IR support 300 is flushed; seventhly, the lens 500 and the lens seat 600 are fixed together by glue dispensing to form a sealed lens; eighthly, the lens seat 600 and the IR support 300 are fixed by drawing glue, so that the sealed lens is assembled on the IR support 300; ninthly, the assembled assembly is placed in an oven for baking to solidify the glue, and the gas above the IR support 300 expands and escapes from the first escape structure 340 after being heated; tenthly, after the escape is completed, the first escape structure 340 is sealed by drawing glue; finally, the protective shell 700 is bonded to the lens seat 600 by the adhesion of the protective shell 700 to protect the lens 500.

[0042] The first escape structure arranged on the IR support not only fully utilizes the space layout inside the module, but also ingeniously solves the problem that the sealed camera module cannot be provided with escape holes at four corners of the lens seat due to the limitation of the appearance size; the gas above the IR support which is expanded after being heated can be escaped through the first escape structure when the camera module is baked, so that the glue is prevented from being washed away by the expanded gas and the camera module is prevented from being damaged; the second escape structure arranged on the IR support is used for escaping the gas below the IR support which is expanded after being heated, so that the escape requirements of the upper and lower parts of the IR support are considered, the stability of the pressure inside the module is ensured, and the production efficiency and the yield of the product are improved; the first sealing structure arranged between the IR support and the circuit board is used for preventing water and dust from entering a second closed space enclosed by the IR support and the circuit board through the first escape structure when the IR support is flushed, and protecting the second closed space; the groove with a size larger than the first through hole arranged on the fixing block can prevent the second glue layer from overflowing to the first through hole during drawing glue, and affect the escape.

[0043] The above embodiments merely represent preferred embodiments of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the concept of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the present utility model patent shall be determined by the appended claims.

Claims

1. A camera module comprising a circuit board, a photosensitive chip, an IR bracket, an infrared filter, and a lens arranged in sequence along an optical axis from the image side to the object side, and further comprising a lens mount disposed above the IR bracket for mounting the lens, characterized in that: The IR bracket is provided with a first gas escape structure for escaping the gas expanded above the IR bracket when the camera module is baked; The lens holder is provided with an assembly hole extending along the optical axis. The lens is placed in the assembly hole and the side wall of the lens and the inner wall of the assembly hole are sealed with glue to form a sealed lens. A first enclosed space is formed between the bottom of the sealed lens and the IR bracket and the infrared filter. The first air escape structure includes a first through hole provided on the IR bracket and connected to the first enclosed space, and a first notch provided on the side of the IR bracket and connected to the first through hole.

2. The camera module according to claim 1, wherein: The IR bracket includes a supporting frame and a light-transmitting hole formed in the supporting frame, the inner circumference of the supporting frame is provided with a bearing portion for carrying the infrared filter, and the infrared filter is carried on the bearing portion; a fixing block is provided on the side of the supporting frame facing the image side, and the fixing block is provided with a first groove that is recessed toward the object side, the first groove penetrates the supporting frame toward the outer side surface of the supporting frame to form the first notch, and the first through hole penetrates the bottom surface of the first groove and a side surface of the supporting frame facing the object side vertically along the optical axis direction.

3. The camera module according to claim 2, wherein: The supporting frame includes a vertical frame distributed along the optical axis and a horizontal frame arranged on one end of the vertical frame facing the object side, and the light-transmitting hole is arranged in the horizontal frame; the fixed block is arranged on a side of the horizontal frame facing the image side and is integrated with the inner side surface of the vertical frame, and the first groove penetrates the vertical frame toward the outer side surface of the vertical frame to form the first notch, and the first groove and the first notch divide the fixed block into a U-shaped block structure.

4. The camera module according to claim 3, wherein: A second enclosed space is formed between the IR bracket carrying the infrared filter and the circuit board, and a first sealing structure for protecting the second enclosed space is provided between the IR bracket and the circuit board.

5. The camera module according to claim 4, wherein: The first sealing structure includes a first glue layer arranged between the vertical frame and the circuit board and a second glue layer arranged between the fixed block and the circuit board. The first glue layer and the second glue layer are connected end to end to form a concave sealing structure that isolates the first escape structure.

6. The camera module according to claim 1, wherein: The IR bracket is also provided with a second gas escape structure for escaping the gas expanded under the IR bracket when the circuit board, the photosensitive chip and the IR bracket are assembled together and baked.

7. The camera module according to claim 6, wherein: The second air escape structure is configured as a second through hole arranged on the IR bracket, the second through hole includes a first hole segment with equal cross-sectional area and a second hole segment at the lower end of the first hole segment with a cross-sectional area gradually decreasing from top to bottom, and the first hole segment and the second hole segment are coaxially arranged.

8. The camera module according to claim 3, wherein: A plurality of reinforcing members for preventing the middle portion of the horizontal frame from collapsing are provided on the horizontal frame at positions close to the vertical frame. The reinforcing members are formed by protruding from the horizontal frame toward the image side.

9. The camera module according to claim 1, wherein: It also includes a second sealing structure for sealing the first gap when the camera module is baked, and a protective shell arranged above the lens for protecting the lens, and the protective shell covers the lens base.