Multilayer composite ceramic substrate

Abstract

The utility model discloses a multilayer composite ceramic substrate, and relates to the field of ceramic substrates, the multilayer composite ceramic substrate comprises a first substrate and a second substrate, the top of the second substrate is provided with a plurality of circular through holes in a penetrating manner, the plurality of circular through holes are arranged in a filling equidistant manner, the bottoms of the plurality of circular through holes are correspondingly provided with rectangular through holes, and the rectangular through holes are communicated with the first substrate and the second substrate. The length value of the rectangular through hole is larger than the diameter value of the circular through hole, the rectangular through hole penetrates through the bottom of the second base plate, and the first base plate and the second base plate are detachably connected. According to the device, during copper foil bonding, a copper foil part enters the circular through hole and the rectangular through hole, the contact area of the copper foil and the second substrate is increased, and the copper foil is embedded into the second substrate, so that the copper foil and the second substrate are connected more tightly, and the copper foil and the ceramic substrate are bonded more tightly; and the basic separation possibility of the copper foil and the ceramic is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of ceramic substrates, in particular to a multi-layer composite ceramic substrate. BACKGROUND

[0002] The ceramic substrate refers to a special process board in which a copper foil is directly bonded to the surface of an alumina or aluminum nitride ceramic substrate at high temperature. The ultra-thin composite substrate has excellent electrical insulation performance, high thermal conductivity, excellent solderability and high adhesion strength, and can be etched into various patterns like a PCB board, and has a large current carrying capacity. Therefore, the ceramic substrate has become a basic material for power electronic circuit structure technology and interconnection technology.

[0003] The existing ceramic substrate is usually directly bonded with a copper foil to the surface of the ceramic substrate, and the surface of the ceramic substrate is relatively smooth. The bonded copper foil wire is prone to separation from the ceramic substrate, which can cause damage to the process board during use. Meanwhile, the ceramic plate is also prone to breakage during use, which can cause the copper foil wire to be stretched after breaking, affecting subsequent use. CONTENT OF THE UTILITY MODEL

[0004] In order to solve the problem that the surface of the ceramic substrate is relatively smooth and the copper foil wire after bonding is prone to separation from the ceramic substrate, the present application provides a multi-layer composite ceramic substrate.

[0005] The multi-layer composite ceramic substrate provided by the present application adopts the following technical scheme: a first substrate and a second substrate, a plurality of circular through holes are formed through the top of the second substrate, the plurality of circular through holes are arranged in a filled equidistant manner, a rectangular through hole is formed corresponding to the bottom of each of the plurality of circular through holes, the length of the rectangular through hole is greater than the diameter of the circular through hole, the rectangular through hole penetrates the bottom of the second substrate, and the first substrate and the second substrate are detachably connected.

[0006] By adopting the above technical scheme, the rectangular through hole can be conveniently formed in the bottom of the second substrate during processing, improving the overall convenience.

[0007] Preferably, a vertical placement groove is formed through one side of the first substrate, a plurality of vertical placement grooves are arranged, the plurality of vertical placement grooves are arranged in a horizontal transverse equidistant manner, and a vertical connecting rib is fixed in each of the plurality of vertical placement grooves.

[0008] By adopting the above technical scheme, a vertical connecting rib is fixed in each of the plurality of vertical placement grooves, and the vertical crack resistance of the first substrate is increased by arranging a plurality of vertical connecting ribs in the middle of the first substrate.

[0009] Preferably, the first substrate is provided with transverse placement slots at one end, and the transverse placement slots are arranged horizontally and vertically equidistantly, and the transverse placement slots are fixed with transverse connecting ribs.

[0010] By adopting the above technical scheme, the transverse placement slots are fixed with transverse connecting ribs, and the transverse connecting ribs are arranged above the middle part of the first substrate, thereby increasing the transverse crack resistance of the first substrate.

[0011] Preferably, the top of the transverse placement slot and the top of the vertical placement slot are mutually penetrated, and the transverse placement slots are fixed with the vertical connecting ribs.

[0012] By adopting the above technical scheme, the transverse connecting ribs and the vertical connecting ribs penetrate the first substrate, and form a network protection in the first substrate, thereby maintaining the integrity when the first substrate cracks.

[0013] Preferably, the top of the transverse placement slot and the top of the vertical placement slot are mutually penetrated, and the transverse placement slots are fixed with the vertical connecting ribs.

[0014] By adopting the above technical scheme, the elastic rod has elasticity, and when the first substrate and the second substrate are connected, the elastic rod and the second clamping block are inserted into the clamping slot, and the inclined second clamping block extrudes the elastic rod.

[0015] Preferably, the first substrate is provided with clamping slots around the top, and the first clamping block is fixed to the top away from the middle part of the first substrate, and the first clamping block and the second clamping block are used in pairs.

[0016] By adopting the above technical scheme, when the second clamping block is completely inserted into the clamping slot and the top of the second clamping block is located at the bottom of the first clamping block, the elastic rod is reset, so that the second clamping block is clamped with the first clamping block, and the first substrate and the second substrate are connected.

[0017] In summary, the present application has the following at least beneficial technical effects:

[0018] 1. The present application bonds the copper foil, and part of the copper foil enters the circular through hole and the rectangular through hole during bonding, the contact area of the copper foil with the second substrate is increased, and the copper foil is embedded in the second substrate, so that the connection between the copper foil and the second substrate is more closely, thereby achieving the effect of more closely bonding the copper foil and the ceramic substrate, and reducing the possibility of separation of the copper foil and the ceramic substrate.

[0019] 2. The application increases the vertical crack resistance of the first substrate by providing a plurality of vertical connecting ribs in the middle part of the first substrate, increases the horizontal crack resistance of the first substrate by providing a plurality of horizontal connecting ribs above the middle part of the first substrate, penetrates the first substrate through the plurality of horizontal connecting ribs and the plurality of vertical connecting ribs, forms a network protection inside the first substrate, and still maintains the integrity when the first substrate cracks, so as to achieve the effect that the copper foil will not be affected after the ceramic substrate breaks and can continue to be used. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall structure of the multi-layer composite ceramic substrate of the embodiment of the application.

[0021] Figure 2 It is a schematic diagram of the split structure of the first substrate and the second substrate of the embodiment of the application.

[0022] Figure 3 It is an enlarged schematic diagram of the A part structure of Figure 2

[0023] Figure 4 It is a schematic diagram of the top structure of the first substrate of the embodiment of the application.

[0024] Figure 5 It is a schematic diagram of the bottom structure of the first substrate of the embodiment of the application.

[0025] Reference signs: 1, first substrate; 11, horizontal placement groove; 12, vertical placement groove; 13, horizontal connecting rib; 14, vertical connecting rib; 15, clamping groove; 16, first clamping block; 2, second substrate; 21, circular through hole; 22, rectangular through hole; 23, elastic rod; 24, second clamping block. DETAILED DESCRIPTION

[0026] The following will be described in detail in combination with the accompanying Figures 1-5 The application will be further described in detail.

[0027] The embodiment of the application discloses a multi-layer composite ceramic substrate, which comprises a first substrate 1 and a second substrate 2. The top of the second substrate 2 is provided with a plurality of circular through holes 21. The plurality of circular through holes 21 are arranged in a filling equidistant manner. The bottom of the plurality of circular through holes 21 is provided with a rectangular through hole 22. When bonding, the copper foil part enters the circular through hole 21 and the rectangular through hole 22, the contact area of the copper foil and the second substrate 2 is increased, the length value of the rectangular through hole 22 is greater than the diameter value of the circular through hole 21, the rectangular through hole 22 penetrates the bottom of the second substrate 2, the first substrate 1 and the second substrate 2 can be connected in a detachable manner, the first substrate 1 and the second substrate 2 can be split, and the rectangular through hole 22 can be opened in the bottom of the second substrate 2 more conveniently during processing. After the opening is completed, the first substrate 1 and the second substrate 2 can be connected. ​

[0028] The first base plate 1 is provided with a vertical placement slot 12 at one side, and the vertical placement slot 12 is provided with a plurality of horizontal transverse equidistant arrangements, and the plurality of vertical placement slots 12 are fixed with vertical connecting ribs 14 inside, and the vertical connecting ribs 14 are arranged in the middle of the first base plate 1 to increase the vertical crack resistance of the first base plate 1.

[0029] The first base plate 1 is provided with a horizontal placement slot 11 at one end, and the horizontal placement slot 11 is provided with a plurality of horizontal transverse equidistant arrangements, and the plurality of horizontal placement slots 11 are fixed with horizontal connecting ribs 13 inside, and the horizontal connecting ribs 14 are arranged above the middle of the first base plate 1 to increase the horizontal crack resistance of the first base plate 1.

[0030] The top of the horizontal placement slot 11 and the top of the vertical placement slot 12 are mutually penetrated, the plurality of horizontal placement slots 11 are respectively fixed with the plurality of vertical connecting ribs 14, the plurality of horizontal connecting ribs 14 and the plurality of vertical connecting ribs 13 penetrate the first base plate 1, and the net-shaped protection is formed in the first base plate 1, and the integrity can be maintained when the first base plate 1 is cracked.

[0031] The second base plate 2 is fixed with an elastic rod 23 at the bottom of the four sides, and the four 23 are fixed with a second clamping block 24 away from the middle of the second base plate 2, the thickness value of the bottom of the second clamping block 24 is less than that of the top of the second clamping block 24, the elastic rod 23 has elasticity, and when the first base plate 1 and the second base plate 2 are connected, the elastic rod 23 and the second clamping block 24 are inserted into the clamping slot 15, and the inclined second clamping block 24 extrudes the elastic rod 23.

[0032] The first base plate 1 is provided with a clamping slot 15 at the top of the four sides, and the top of the clamping slot 15 away from the middle of the first base plate 1 is fixed with a first clamping block 16, and the first clamping block 16 and the second clamping block 24 are matched for use, when the second clamping block 24 is completely inserted into the clamping slot 15, and the top of the second clamping block 24 is located at the bottom of the first clamping block 16, the elastic rod 23 is reset, so that the second clamping block 24 is clamped with the first clamping block 16, and the first base plate 1 and the second base plate 2 are connected.

[0033] The implementation principle of the multi-layer composite ceramic substrate of the embodiment of the present application is as follows: first, in use, the first substrate 1 and the second substrate 2 are connected, the elastic rod 23 and the second clamping block 24 are inserted into the clamping groove 15, the second clamping block 24 in an inclined shape extrudes the elastic rod 23, when the second clamping block 24 completely enters the clamping groove 15 and the top of the second clamping block 24 is located at the bottom of the first clamping block 16, the elastic rod 23 resets, so that the second clamping block 24 is clamped with the first clamping block 16, the first substrate 1 and the second substrate 2 are connected, then the bonding of the copper foil is performed, when the bonding is performed, the copper foil part will enter the circular through hole 21 and the rectangular through hole 22, the contact area of the copper foil with the second substrate 2 is increased, and the copper foil is embedded in the second substrate 2, so that the connection of the copper foil with the second substrate 2 is more close, when the whole is impacted, the vertical connecting ribs 14 are fixed in the plurality of vertical placement grooves 12, the vertical crack resistance of the first substrate 1 is increased by arranging the plurality of vertical connecting ribs 14 in the middle part of the first substrate 1, the horizontal connecting ribs 13 are fixed in the plurality of horizontal placement grooves 11, the horizontal crack resistance of the first substrate 1 is increased by arranging the plurality of horizontal connecting ribs 14 above the middle part of the first substrate 1, the first substrate 1 is penetrated by the plurality of horizontal connecting ribs 14 and the plurality of vertical connecting ribs 13, a mesh protection is formed in the first substrate 1, when the first substrate 1 cracks, the integrity can still be maintained.

[0034] The above are preferred embodiments of the present application, and do not limit the protection scope of the present application, so that: equivalent changes made according to the structure, shape, principle of the present application should be covered in the protection scope of the present application.

Claims

1. A multilayer composite ceramic substrate comprising a first substrate (1) and a second substrate (2), characterized in that: A circular through hole (21) is provided through the top of the second substrate (2), and a plurality of the circular through holes (21) are provided. The plurality of circular through holes (21) are arranged in a filled and equidistant manner. A rectangular through hole (22) is provided corresponding to the bottom of the plurality of circular through holes (21). The length of the rectangular through hole (22) is greater than the diameter of the circular through hole (21). The rectangular through hole (22) passes through the bottom of the second substrate (2), and the first substrate (1) and the second substrate (2) can be detachably connected.

2. The multilayer composite ceramic substrate according to claim 1, wherein: A vertical placement groove (12) is provided on one side of the first substrate (1), and a plurality of the vertical placement grooves (12) are provided. The plurality of vertical placement grooves (12) are arranged horizontally and equidistantly, and vertical connecting ribs (14) are fixed inside the plurality of vertical placement grooves (12).

3. The multilayer composite ceramic substrate according to claim 2, wherein: A transverse placement groove (11) is provided through one end of the first substrate (1), and a plurality of the transverse placement grooves (11) are provided. The plurality of transverse placement grooves (11) are arranged equidistantly horizontally and vertically, and transverse connecting ribs (13) are fixed inside the plurality of transverse placement grooves (11).

4. The multilayer composite ceramic substrate according to claim 3, wherein: The top of the horizontal placement groove (11) and the top of the vertical placement groove (12) are interconnected, and the plurality of horizontal placement grooves (11) are respectively fixed to the plurality of vertical connecting ribs (14).

5. The multi-layer composite ceramic substrate according to claim 1, wherein: Elastic rods (23) are fixed to the bottom of the four sides of the second substrate (2), and second clamping blocks (24) are fixed to the four sides of the (23) away from the middle of the second substrate (2), and the thickness of the bottom of the second clamping block (24) is less than the thickness of the top of the second clamping block (24).

6. The multi-layer composite ceramic substrate according to claim 5, characterized in that: The top of the first substrate (1) is provided with card slots (15) on all sides, and a first card block (16) is fixed on the top of the card slot (15) away from the middle of the first substrate (1). The first card block (16) and the second card block (24) are used in conjunction with each other.

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