Camera module and electronic equipment

Abstract

The utility model relates to a camera module and electronic equipment. The camera module comprises a light intensity detection assembly, a switch assembly, a deformation memory assembly and an image sensor, the light intensity detection assembly, the deformation memory assembly and the image sensor are sequentially arranged in the light transmission direction. The output end of the light intensity detection assembly is electrically connected with the control end of the switch assembly. The switch assembly is connected in series to a loop where the deformation memory assembly is located. When the loop where the deformation memory assembly is located is conducted, the deformation memory assembly is in an extended state and shields the light receiving surface of the image sensor in the light transmission direction; when the loop where the deformation memory assembly is located is disconnected, the deformation memory assembly is in a folded state and exposes the light receiving surface of the image sensor in the light transmission direction. Thus, the switch assembly controls the on-off state of the loop where the deformation memory assembly is located according to the detection result of the light intensity detection assembly, then the deformation memory assembly generates adaptive deformation, an image sensor does not need to participate in operation processing, and the overall power consumption is reduced.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of image acquisition, and particularly relates to a camera module and electronic equipment. BACKGROUND

[0002] With the development of society and the progress of science and technology, more and more electronic devices have a shooting function, such as a mobile phone, a computer, etc., which usually has a camera module to realize the shooting function, so as to improve the user experience.

[0003] At present, the mainstream camera module on the market includes an image sensor, a variable aperture and a processor. Since the image sensor has weak resistance to common high-energy light sources such as laser and sunlight, when the image sensor is exposed to high-energy light sources, the image sensor is often damaged and fails. Therefore, the image sensor needs to continuously read the external light intensity through the processor, and when the read light intensity is higher than a certain threshold, the variable aperture is controlled to close, so as to reduce the light intensity received by the image sensor. However, this protection method needs to supply power to the image sensor for a long time so that it can perform the above operation and processing, resulting in high overall power consumption. UTILITY MODEL CONTENT

[0004] In order to solve the above technical problems, the present disclosure provides a camera module and electronic equipment.

[0005] The present disclosure provides a camera module, comprising: a light intensity detection assembly, a switch assembly, a deformation memory assembly and an image sensor.

[0006] The light intensity detection assembly, the deformation memory assembly and the image sensor are sequentially arranged along the light transmission direction; the output end of the light intensity detection assembly is electrically connected with the control end of the switch assembly, and the switch assembly is connected in series in the loop where the deformation memory assembly is located.

[0007] The light intensity detection assembly is used for detecting the light intensity received by the camera module; the switch assembly is used for controlling the on-off of the loop where the deformation memory assembly is located based on the detection result of the light intensity detection assembly; when the loop where the deformation memory assembly is located is turned on, the deformation memory assembly is in an extended state and shields the light receiving surface of the image sensor along the light transmission direction; when the loop where the deformation memory assembly is located is turned off, the deformation memory assembly is in a folded state and exposes the light receiving surface of the image sensor along the light transmission direction.

[0008] Optionally, the light intensity detection assembly comprises a photosensitive element and a voltage comparator; the voltage comparator comprises a first input end, a second input end and an output end.

[0009] The first input end of the voltage comparator is connected to a voltage division collection end of the photosensitive element, and the second input end of the voltage comparator is connected to a reference voltage signal; and an output end of the voltage comparator is electrically connected to a control end of the switch assembly.

[0010] Optionally, the light intensity detection assembly further comprises a voltage division resistor, and the voltage division resistor is connected in series with the photosensitive element.

[0011] Optionally, the camera module further comprises a processor.

[0012] The processor is connected to an output end of the voltage comparator, and the processor is configured to output a prompt information based on an opening potential of the switch assembly and a potential of the output end of the voltage comparator.

[0013] Optionally, the processor is further electrically connected to a second input end of the voltage comparator, and configured to provide the reference voltage signal.

[0014] Optionally, the photosensitive element comprises a negative temperature coefficient photosensitive resistor, and the switch assembly comprises an N-type MOS tube.

[0015] Optionally, the photosensitive element comprises a positive temperature coefficient photosensitive resistor, and the switch assembly comprises a P-type MOS tube.

[0016] Optionally, the camera module further comprises a lens assembly.

[0017] The lens assembly is located on a light transmission path between the shape memory assembly and the image sensor.

[0018] Optionally, the camera module further comprises a power supply.

[0019] The light intensity detection assembly and the shape memory assembly are both connected to the power supply.

[0020] The present disclosure also provides an electronic device comprising any of the camera modules.

[0021] Compared with the prior art, the technical scheme provided by the embodiments of the present disclosure has the following advantages:

[0022] The camera module provided by the embodiment of the present disclosure includes: a light intensity detection component, a switch component, a deformation memory component and an image sensor; the light intensity detection component, the deformation memory component and the image sensor are arranged in sequence along the direction of light transmission; the output end of the light intensity detection component is electrically connected to the control end of the switch component, and the switch component is connected in series to the circuit where the deformation memory component is located; the light intensity detection component is used to detect the intensity of light received by the camera module; the switch component is used to control the on-off of the circuit where the deformation memory component is located based on the detection result of the light intensity detection component; when the circuit where the deformation memory component is located is turned on, the deformation memory component is in an extended state and blocks the light-receiving surface of the image sensor along the direction of light transmission; when the circuit where the deformation memory component is located is turned off, the deformation memory component is in a retracted state and exposes the light-receiving surface of the image sensor along the direction of light transmission. In this way, the switch component controls the on-off of the circuit where the deformation memory component is located according to the detection result of the light intensity detection component, thereby causing the deformation memory component to undergo adaptive deformation, without the image sensor participating in the calculation and processing, thereby reducing overall power consumption. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0024] In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0025] Figure 1 A schematic structural diagram of a camera module provided in an embodiment of the present disclosure;

[0026] Figure 2 A schematic structural diagram of a protection principle of a camera module provided in an embodiment of the present disclosure;

[0027] Figure 3 A schematic structural diagram of the protection principle of another camera module provided in an embodiment of the present disclosure;

[0028] Figure 4 A schematic structural diagram of another camera module provided in an embodiment of the present disclosure;

[0029] Figure 5 A schematic diagram of the top view of an electronic device provided in an embodiment of the present disclosure.

[0030] Wherein, 01, first input end; 02, second input end; 03, voltage division acquisition end; 04, control end; 110, light intensity detection assembly; 111, photosensitive element; 112, voltage comparator; 113, voltage division resistor; 120, switch assembly; 130, deformation memory assembly; 140, image sensor; 150, processor; 160, lens assembly; 170, power supply. DETAILED DESCRIPTION

[0031] In order to enable the above-mentioned purposes, features and advantages of the present disclosure to be more clearly understood, the schemes of the present disclosure will be further described below. It should be noted that the embodiments of the present disclosure and the features in the embodiments can be combined with each other without conflict.

[0032] In the following description, a large number of specific details are set forth in order to facilitate a thorough understanding of the present disclosure, but the present disclosure can also be implemented in other manners different from those described herein; obviously, the embodiments described in the specification are only a part of the embodiments of the present disclosure, and not all the embodiments.

[0033] The camera module and the electronic device provided by the embodiments of the present disclosure will be exemplarily described below with reference to the accompanying drawings.

[0034] Figure 1 A structural schematic diagram of a camera module provided by the embodiments of the present disclosure, Figure 2 A structural schematic diagram of a protection principle of a camera module provided by the embodiments of the present disclosure, Figure 3 A structural schematic diagram of another protection principle of a camera module provided by the embodiments of the present disclosure. Refer to Figures 1 to 3 The camera module comprises: a light intensity detection assembly 110, a switch assembly 120, a deformation memory assembly 130 and an image sensor 140; the light intensity detection assembly 110, the deformation memory assembly 130 and the image sensor 140 are sequentially arranged along a light transmission direction (see the direction indicated by the arrow); the output end of the light intensity detection assembly 110 is electrically connected with the control end 04 of the switch assembly 120, and the switch assembly 120 is connected in series in the loop where the deformation memory assembly 130 is located.

[0035] The light intensity detection assembly 110 is used to detect the light intensity received by the camera module. Exemplarily, the light intensity detection assembly 110 can receive the incident light and sense the light intensity, convert the light intensity into a voltage signal, a current signal or other forms of signals, so as to determine the intensity of the incident light, obtain the detection result, and the conversion form of the light intensity can be set according to the actual detection requirement, which is not limited herein.

[0036] The switch assembly 120 is configured to control the on-off of the loop in which the shape memory assembly 130 is located based on the detection result of the light intensity detection assembly 110. Specifically, if the light intensity detection assembly 110 detects that the intensity of the incident light is large, the switch assembly 120 controls the loop in which the shape memory assembly 130 is located to be turned on. Conversely, if the light intensity detection assembly 110 detects that the intensity of the incident light is small, the switch assembly 120 controls the loop in which the shape memory assembly 130 is located to be turned off.

[0037] The shape memory assembly 130 is a structure with shape memory performance and can generate shape memory effect. When heated, the temperature of the shape memory assembly 130 rises to a certain high temperature, such as 60°C, and the shape memory assembly 130 can assume a high-temperature phase (austenite phase) shape. When cooled, the temperature of the shape memory assembly 130 drops to a certain low temperature, such as 55°C, and the shape memory assembly 130 can assume a low-temperature phase (martensite phase) shape. The above process can be repeated, indicating that the shape memory assembly 130 has the ability to remember the original shape in both cold and hot states.

[0038] The material of the shape memory assembly 130 includes a shape memory material. The shape memory material can include a shape memory alloy, a shape memory ceramic, a shape memory polymer material, etc. The shape memory alloy can be a two-way shape memory alloy. The shape of the shape memory assembly 130 can be long hair-shaped, square-shaped, circular-shaped, or other shapes, as long as the shape memory assembly 130 can achieve the shape change effect as described above. The specific design parameters of the shape memory assembly 130 are not limited herein.

[0039] Specifically, when the loop in which the shape memory assembly 130 is located is turned on, the shape memory assembly 130 flows through the current. According to the heat calculation formula Q = I 2 R, Q represents the heat generated by the current flowing through the shape memory assembly 130, I represents the current flowing through the shape memory assembly 130, and R represents the resistance of the shape memory assembly 130. It can be seen that the current flowing through the shape memory assembly 130 will be converted into heat. Compared with the way of using only the incident light to slowly heat the shape memory assembly 130 to accumulate and cause corresponding shape change, the heating effect of the shape memory assembly 130 is enhanced, and then the shape memory assembly 130 can quickly be in an extended state (such as Figure 2 ) and block the light receiving surface of the image sensor 140 along the light transmission direction, avoiding that the strong light directly irradiates the image sensor 140 and damages the image sensor, and achieving timely protection of the image sensor.

[0040] Correspondingly, when the loop in which the shape memory assembly 130 is located is turned off, no current flows through the shape memory assembly 130, which is equivalent to cooling the shape memory assembly 130, and then the shape memory assembly 130 can be in a folded state (such as Figure 3) and exposes the light-receiving surface of the image sensor along the direction of light transmission, allowing weaker light to illuminate the image sensor 140 for subsequent imaging. For example, after the weaker light is projected onto the surface of the image sensor, the image sensor first converts it into an electrical signal, then performs analog-to-digital conversion on the electrical signal to form a digital image signal, which is then processed to display an image.

[0041] The camera module provided by the disclosed embodiments includes: a light intensity detection component 110, a switch component 120, a shape memory component 130, and an image sensor 140; the light intensity detection component 110, the shape memory component 130, and the image sensor 140 are arranged sequentially along the direction of light transmission; the output end of the light intensity detection component 110 is electrically connected to the control end 04 of the switch component 120, and the switch component 120 is connected in series with the circuit containing the shape memory component 130. In this way, the switch component 120 controls the on / off state of the circuit containing the shape memory component 130 based on the detection results of the light intensity detection component 110, thereby causing the shape memory component 130 to undergo adaptive deformation, eliminating the need for the image sensor 140 to participate in the calculation process, thereby reducing overall power consumption.

[0042] In some embodiments, Figure 4 This is a structural diagram of another camera module provided by an embodiment of the present disclosure. Figures 1 to 3 Based on the reference Figure 4 The light intensity detection component 110 includes a photosensitive element 111 and a voltage comparator 112; the voltage comparator 112 includes a first input terminal 01, a second input terminal 02 and an output terminal; the first input terminal 01 of the voltage comparator 112 is connected to the voltage dividing acquisition terminal 03 of the photosensitive element 111, and the second input terminal 02 of the voltage comparator 112 is connected to the reference voltage signal; the output terminal of the voltage comparator 112 is electrically connected to the control terminal 04 of the switch component 120.

[0043] Photosensitive element 111 is a component used to convert optical signals into electrical signals or other forms of energy, and is capable of maintaining normal operation for extended periods of time even under direct illumination by high-energy light sources such as lasers and sunlight. For example, photosensitive element 111 can be a photodiode, phototransistor, or photoresistor, as long as it can sense and convert optical signals. The specific type of photosensitive element 111 is not limited herein.

[0044] The reference voltage signal is a signal for measuring the voltage of the first input terminal 01. The voltage comparator 112 determines the intensity of the light by measuring the relative size of the reference voltage signal and the voltage of the first input terminal 01, and further, in the case of strong light, the switch assembly 120 is turned on, or in the case of weak light, the switch assembly 120 is turned off. For example, the second input terminal 02 of the voltage comparator 112 can be connected to any element capable of providing a reference voltage signal, such as a processor, a voltage reference source, a transistor, an operational amplifier, a zener diode, etc., which is not limited here.

[0045] For example, the voltage dividing collection terminal 03 can be located between the photosensitive element 111 and the related voltage dividing element, such as a voltage dividing resistor (see below), which is used to divide the voltage of the photosensitive element 111 to prevent the voltage input to the first input terminal 01 of the voltage comparator 112 from being too large, thereby protecting the voltage comparator 112.

[0046] For example, Figure 4 The first input terminal 01 of the voltage comparator 112 is a negative input terminal, and the second input terminal 02 is a positive input terminal. For example, when the light intensity is negatively correlated with the voltage across the photosensitive element 111, when the light shines on the photosensitive element 111, the voltage across the photosensitive element 111 decreases, and if it is less than the reference voltage signal, the output voltage of the voltage comparator 112 changes from low to high, indicating that the current light is strong, otherwise, if the voltage across the photosensitive element 111 is greater than the reference voltage signal, it indicates that the current light is weak, thereby achieving the determination of the intensity of the light. It is not difficult to understand that when the reference voltage signal is small, it is easier to trigger the protection of the image sensor, and when the reference voltage signal is large, it is equivalent to delaying the protection time of the image sensor. As long as the image sensor can be protected in time, the specific value of the reference voltage signal is not limited here.

[0047] Therefore, the switch assembly 120 controls the on-off of the circuit in which the shape memory assembly 130 is located according to the determination result of the voltage comparator 112, so as to protect the image sensor based on the adaptive deformation of the shape memory assembly 130, which improves the protection response speed, and reduces the computational burden of the processor and saves the processing time of the processor without the processor performing the operation of reading the intensity of the light.

[0048] In other embodiments, the first input terminal 01 of the voltage comparator 112 can also be a positive input terminal, and the second input terminal 02 can be a negative input terminal, and the output voltage of the output terminal can be adaptively adjusted, as long as the function of determining the intensity of the light can be achieved, which is not limited here.

[0049] In some embodiments, with reference to Figure 4The light intensity detection assembly 110 further comprises a voltage dividing resistor 113, which is connected in series with the photosensitive element 111.

[0050] The voltage dividing resistor 113 is configured to divide voltage and limit current of the photosensitive element 111. Correspondingly, the voltage at the first input end 01 of the voltage comparator is obtained by voltage division of the photosensitive element 111 and the voltage dividing resistor 113. Specifically, by connecting the voltage dividing resistor 113 in series with the photosensitive element 111, a part of voltage drop on the path where the photosensitive element 111 is located is caused on the voltage dividing resistor 113, so as to ensure that the voltage across the photosensitive element 111 is within a reasonable and safe range, and prevent the photosensitive element 111 from being burned out due to excessive current on the path where the photosensitive element 111 is located, thereby protecting the photosensitive element 111.

[0051] It can be understood that if the voltage across the photosensitive element 111 decreases after irradiation of light, the voltage of the voltage dividing resistor 113 will increase, and vice versa. The voltage across the photosensitive element 111 has a one-to-one correspondence with the intensity of light. By obtaining the voltage across the photosensitive element 111, the intensity of light corresponding to the voltage can be determined, thereby achieving detection of the intensity of light. Figure 4 It is shown that the photosensitive element 111 is a photosensitive diode. In other embodiments, the photosensitive element 111 can also be a photosensitive resistor, a photosensitive triode, or other elements that change electrical properties due to different light intensities. The photosensitive element 111 can be set according to the light intensity detection requirement, which is not limited herein.

[0052] In some embodiments, referring to Figure 4 The camera module further comprises a processor 150 connected to the output end of the voltage comparator 112. The processor 150 is configured to output a prompt information based on the opening potential of the switch assembly 120.

[0053] The opening potential represents a potential for turning on the switch assembly 120. Specifically, after irradiation of light, if the switch assembly 120 is turned on according to the potential (i.e., output voltage) of the output end of the voltage comparator 112, it indicates that the intensity of light at this time is relatively strong, and the shape memory assembly 130 needs to be heated to form an extended state to timely shield the light receiving surface of the image sensor. When the switch assembly 120 is turned off according to the potential (i.e., output voltage) of the output end of the voltage comparator 112, it indicates that the intensity of light at this time is relatively weak, and the above protection operation of the image sensor is not needed.

[0054] Based on this, the processor 150 can connect the relevant monitoring pin, such as a general-purpose input / output pin (GPIO), to the output end of the voltage comparator 112, monitor whether the protection mechanism for the image sensor is triggered through the GPIO pin, such as: when it is monitored that the output voltage of the voltage comparator 112 can make the switch component 120 conductive, it is judged that the protection mechanism is triggered, and a prompt information is sent to the user, informing the user that the current light intensity is strong, and the protection operation on the image sensor is made. For example, the prompt information can be presented in the form of text on the screen of the user's electronic device, or it can also be sent to the user in the form of voice prompt, which can be set according to the user's needs, which is not limited here.

[0055] For example, the processor 150 includes but is not limited to a microcontroller unit (MCU), a central processing unit (CPU), etc.

[0056] In some embodiments, referring to Figure 4 , the processor 150 is also electrically connected to the second input end 02 of the voltage comparator 112 for providing a reference voltage signal.

[0057] For example, the processor 150 can include a digital-to-analog converter (DAC) for outputting an analog reference voltage signal, wherein the size of the reference voltage signal does not exceed the power supply voltage of the light intensity detection component 110, so as to avoid damaging related devices due to the too large value of the reference voltage signal. In other embodiments, other devices of the processor 150 can also be used to output the reference voltage signal, which is not limited here.

[0058] In this way, the second input end 02 and the output end of the voltage comparator 112 are connected to the processor 150 respectively, without the need to add other devices for outputting the reference voltage signal, which not only can reduce the number of devices used and reduce the hardware application cost of the camera module, but also can simplify the structure of the camera module, and facilitate the miniaturization design of the camera module.

[0059] In some embodiments, referring to Figure 4 , the photosensitive element 111 includes a negative temperature coefficient photosensitive resistor, and the switch component 120 includes an N-type MOS tube.

[0060] Wherein, the resistance value of the negative temperature coefficient photosensitive resistor decreases with the increase of temperature, in other words, the greater the light intensity, the lower the resistance value of the negative temperature coefficient photosensitive resistor, and the smaller the voltage across the two ends.

[0061] Exemplarily, when the photosensitive element 111 is a negative temperature coefficient photosensitive resistor, the first input end 01 of the voltage comparator 112 can be set as a negative input end, and the second input end 02 can be set as a positive input end. After stronger light irradiates the photosensitive element 111, the voltage across the photosensitive element 111 is smaller. If the voltage across the photosensitive element 111 is smaller than the reference voltage signal, the output voltage of the voltage comparator 112 changes from low level to high level, and then the gate (i.e., the control end 04) of the N-type MOS tube controls the conduction of the channel between the source and the drain based on the output voltage.

[0062] In some embodiments, referring to Figure 4 , the photosensitive element 111 includes a positive temperature coefficient photosensitive resistor, and the switch assembly 120 includes a P-type MOS tube.

[0063] The resistance value of the positive temperature coefficient photosensitive resistor increases with the increase of temperature, in other words, the greater the light intensity, the higher the resistance value of the negative temperature coefficient photosensitive resistor, and the greater the voltage across the negative temperature coefficient photosensitive resistor.

[0064] Exemplarily, when the photosensitive element 111 is a positive temperature coefficient photosensitive resistor, the first input end 01 of the voltage comparator 112 can be set as a negative input end, and the second input end 02 can be set as a positive input end. After stronger light irradiates the photosensitive element 111, the voltage across the photosensitive element 111 is greater. If the voltage across the photosensitive element 111 is greater than the reference voltage signal, the output voltage of the voltage comparator 112 changes from high level to low level, and then the gate (i.e., the control end 04) of the P-type MOS tube controls the conduction of the channel between the source and the drain based on the output voltage.

[0065] In some embodiments, referring to Figures 2-3 The camera module further includes a lens assembly 160. The lens assembly 160 is located on the light transmission path between the shape memory assembly 130 and the image sensor 140.

[0066] The lens assembly 160 is used to converge light to the light receiving surface of the image sensor 140. Exemplarily, the lens assembly 160 can be composed of two glass lenses and two plastic lenses, which collect and focus the weak light incident from the outside to the image sensor 140 to form an image. In other embodiments, the lens assembly 160 can also be composed of other types of lenses, which are not limited and will not be described here.

[0067] In some embodiments, the camera module further includes a power supply VCC. The light intensity detection assembly 110 and the shape memory assembly 130 are both connected to the power supply VCC.

[0068] The power supply VCC is used to supply power to the light intensity detection component 110 and the shape memory component 130. For example, the light intensity detection component 110 and the shape memory component 130 can be connected to different power supplies VCC (for example, VCC1 and VCC2). Figure 4 ), and will not affect the power supply of the light intensity detection component 110 and the shape memory component 130. In other embodiments, the light intensity detection component 110 and the shape memory component 130 can be connected to the same power supply VCC for the purpose of simplifying the overall structure. The power supply can be set according to the power supply requirement, which is not limited herein.

[0069] It should be noted that when the light intensity detection component 110 detects that the light intensity is low, the loop in which the shape memory component 130 is located is disconnected. At this time, the power supply to the shape memory component 130 can be controlled by the processor 150 to be cut off. In this way, there is no charge accumulation on the shape memory component 130, and the heat of the shape memory component 130 can be quickly reduced, which is equivalent to enhancing the cooling effect of the shape memory component 130, thereby improving the speed of the shape memory component 130 to form a folded state, which is helpful for the camera module to quickly image.

[0070] In addition, when external light irradiates the camera module, even if the power supply to the light intensity detection component 110 and the shape memory component 130 is cut off, i.e., the system is powered off, since the shape memory component 130 has shape memory performance after being trained during production, the shape memory component 130 will still heat up under strong light irradiation. When the heat generated thereby causes the temperature of the shape memory component 130 to reach a set temperature, such as 60°C, the shape memory component 130 will automatically be in an extended state. Similarly, it can be known that under weak light irradiation, the heat generated by the shape memory component 130 is often not enough to cause the temperature of the shape memory component 130 to reach the set temperature. Therefore, the shape memory component 130 will automatically be in a folded state. In this way, based on the inherent shape deformation characteristics of the shape memory component 130, the shape memory component 130 can continuously protect the image sensor when the system is powered off, thereby enhancing the protection effect and prolonging the service life of the image sensor.

[0071] In some embodiments, referring to Figure 4 , the photosensitive element 111, the voltage comparator 112, and the switch component 120 are all grounded (denoted by GND).

[0072] The embodiments of the present disclosure also provide an electronic device including any one of the camera modules provided by the above embodiments.

[0073] For example, the electronic device includes but is not limited to a mobile phone, a tablet computer, a notebook computer, a smart watch, etc., which is not limited herein.

[0074] For example, Figure 5 A top view structural schematic diagram of an electronic device provided by the embodiments of the present disclosure is shown. Referring to Figure 5The light intensity detection component 110, the deformation memory component 130, and the image sensor 140 are located on one side of the shell 180 of the electronic device, and the deformation memory component 130 is in a folded state.

[0075] For example, the body of the light intensity detection component 110 can be in a ring structure to surround the image sensor 140 and a lens component (not shown in the figure), to achieve all-around receiving and detecting of incident light; in addition, the geometric centers of the light intensity detection component 110, the deformation memory component 130, the image sensor 140, and the lens component can be arranged to coincide, to facilitate better imaging and protection of the image sensor 140.

[0076] It should be noted that, in this document, relational terms such as“first” and“second”, and the like, are used solely to distinguish one entity or action from another entity or action, without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms“comprises”,“comprising”, or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element preceded by“comprises... a” does not, without more constraints, foreclose the existence of additional identical elements in the process, method, article, or apparatus that comprises the recited element.

[0077] The above description is merely that of a specific implementation of the present disclosure, and enables those skilled in the art to understand or implement the present disclosure. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present disclosure. Accordingly, the present disclosure is not to be limited to the embodiments described herein but is to be accorded the broadest scope consistent with the principles and novel features disclosed herein.

Claims

1. A camera module, characterized in that: include: Light intensity detection component, switch component, shape memory component and image sensor; The light intensity detection component, the shape memory component and the image sensor are sequentially arranged along the light transmission direction; the output end of the light intensity detection component is electrically connected to the control end of the switch component, and the switch component is connected in series to the loop where the shape memory component is located; The light intensity detection component is used to detect the intensity of light received by the camera module; the switch component is used to control the on and off of the circuit where the deformation memory component is located based on the detection result of the light intensity detection component; when the circuit where the deformation memory component is located is turned on, the deformation memory component is in an extended state and blocks the light-receiving surface of the image sensor along the direction of light transmission; when the circuit where the deformation memory component is located is disconnected, the deformation memory component is in a retracted state and exposes the light-receiving surface of the image sensor along the direction of light transmission.

2. The camera module according to claim 1, wherein: The light intensity detection component includes a photosensitive element and a voltage comparator; the voltage comparator includes a first input terminal, a second input terminal and an output terminal; The first input end of the voltage comparator is connected to the voltage dividing collecting end of the photosensitive element, and the second input end of the voltage comparator is connected to the reference voltage signal; the output end of the voltage comparator is electrically connected to the control end of the switch component.

3. The camera module according to claim 2, wherein: The light intensity detection component further includes a voltage-dividing resistor; the voltage-dividing resistor is connected in series with the photosensitive element.

4. The camera module according to claim 2, wherein: Also includes processor; The processor is connected to the output end of the voltage comparator; the processor is used to output prompt information based on the potential of the output end of the voltage comparator being the turn-on potential of the switch component.

5. The camera module according to claim 4, wherein: The processor is also electrically connected to the second input terminal of the voltage comparator for providing the reference voltage signal.

6. The camera module according to claim 2, wherein: The photosensitive element includes a negative temperature coefficient photoresistor, and the switch component includes an N-type MOS tube.

7. The camera module according to claim 2, wherein: The photosensitive element includes a positive temperature coefficient photoresistor, and the switch component includes a P-type MOS tube.

8. The camera module according to claim 1, wherein: Also included is a lens assembly; The lens assembly is located on a light transmission path between the shape memory assembly and the image sensor.

9. The camera module according to claim 1, wherein: Also includes a power supply; The light intensity detection component and the shape memory component are both connected to the power supply.

10. An electronic device, characterized in that: A camera module comprising any one of claims 1-9.

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