5G communication CPE equipment with good heat dissipation performance

Abstract

The utility model discloses 5G communication CPE equipment with good heat dissipation performance. The 5G communication CPE equipment comprises a bottom shell, a top cover, a circuit board, a main control chip, a 5G module, a heat dissipation copper sheet, a radiator and an antenna assembly, an accommodating space is formed between the top cover and the bottom shell, and the circuit board is transversely arranged in the middle of the accommodating space to divide the accommodating space into an upper-layer space and a lower-layer space; the main control chip is arranged at the top of the circuit board, the heat dissipation copper sheet is arranged on the main control chip, heat dissipation fins are arranged on the upper end face of the top cover, the 5G module is arranged at the bottom of the circuit board, the heat dissipation device is arranged on the 5G module, and ventilation holes are formed in the bottom shell and used for discharging airflow generated by the heat dissipation device from the lower-layer space. According to the utility model, the circuit board is transversely arranged in the accommodating space, and the accommodating space can be divided into the upper-layer space and the lower-layer space, so that the mounting positions of the main control chip and the 5G module high-heating element are separated, heat is prevented from being concentrated in the same space, heat accumulation in equipment is reduced, and heat dissipation pressure is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to CPE equipment field especially relates to a 5G communication CPE equipment that good heat dissipation. BACKGROUND

[0002] With the rapid development and popularization of 5G technology, 5G communication CPE equipment as user terminal equipment is a kind of mobile signal access equipment receiving mobile signal and forwarding out with wireless WIFI signal, can support multiple mobile terminal equipment simultaneously online;CPE equipment can save a lot of laying of wired network, not only easy to install and be convenient for moving, and applicability is strong, is widely used in family, office and industrial environment, provides high speed, low delay network connection for user.

[0003] In prior art, 5G communication CPE equipment generally relies on heat dissipation hole to carry out passive heat dissipation, resulting in low heat dissipation efficiency, and the core elements such as main control chip and 5G module built-in CPE equipment are generally arranged on the same face of circuit board, and the two high-power, high-heat elements will generate a large amount of heat when high-load running, and the heat is accumulated in the internal of CPE equipment, which is easy to cause the internal temperature of CPE equipment to be too high, not only will affect the use performance stability of CPE equipment, and even will shorten the service life of equipment.

[0004] Therefore, the prior art has defects and needs to be improved. INVENTION CONTENT

[0005] The utility model solves the technical problem that provides a 5G communication CPE equipment that good heat dissipation, practicality is strong, can prolong the service life of equipment.

[0006] To achieve this purpose, the utility model adopts the following technical scheme: a 5G communication CPE equipment that good heat dissipation, including bottom shell, top cover, circuit board, main control chip, 5G module, heat dissipation copper sheet, radiator and antenna assembly;

[0007] The top cover is connected with the bottom shell through bolt, and the accommodating space is formed between the top cover and the bottom shell, and the circuit board is horizontally arranged in the middle part of the accommodating space to separate the accommodating space into upper space and lower space;

[0008] The side baffle vertically downward extends on both sides of the top cover, the limit clamp block is arranged on the side baffle, and the clamping opening for connecting with the side wall of the circuit board is arranged on the limit clamp block;

[0009] The main control chip is arranged on the top of the circuit board, the heat dissipation copper sheet is arranged on the main control chip, the upper end surface of the top cover is provided with heat dissipation fin, and the heat dissipation fin is used to transfer the heat of the upper space to the external environment;

[0010] The 5G module is arranged at the bottom of the circuit board, the heat sink is arranged on the 5G module, the bottom shell is provided with a ventilation hole, and the ventilation hole is used for discharging airflow generated by the heat sink from the lower space.

[0011] The antenna assembly passes through the bottom shell and is connected with the circuit board, the antenna assembly is arranged to be rotatable relative to the bottom shell, and the antenna assembly is used for receiving and transmitting wireless signals.

[0012] In the 5G communication CPE device with good heat dissipation, the heat sink comprises a heat-conducting base and a heat dissipation fan.

[0013] The heat-conducting base is provided with a plurality of heat dissipation grooves in the circumferential direction, the back surface of the heat-conducting base is provided with a heat-conducting plane in contact with the 5G module, the front surface of the heat-conducting base is provided with a receiving groove, and the heat dissipation fan is arranged in the receiving groove and used for generating heat exchange airflow.

[0014] In the 5G communication CPE device with good heat dissipation, the heat dissipation fins are arranged in a U-shaped structure.

[0015] In the 5G communication CPE device with good heat dissipation, the temperature sensor is arranged at the bottom of the circuit board, the temperature sensor is electrically connected with the heat dissipation fan, and the temperature sensor is used for collecting the temperature in the lower space.

[0016] In the 5G communication CPE device with good heat dissipation, the front surface of the bottom shell is provided with a first panel, and the back surface of the bottom shell is provided with a second panel.

[0017] The first panel is provided with a power supply interface, a SIM card slot, a USB interface, a fiber interface and a reset button, and the second panel is provided with a plurality of Ethernet interfaces.

[0018] In the 5G communication CPE device with good heat dissipation, the radio frequency module is arranged at the bottom of the circuit board.

[0019] In the 5G communication CPE device with good heat dissipation, the number of antenna assemblies is two.

[0020] In the 5G communication CPE device with good heat dissipation, the bottom shell and the top cover are both made of aluminum alloy material.

[0021] In the 5G communication CPE device with good heat dissipation, the two sides of the bottom shell are provided with a plurality of positioning holes.

[0022] Compared with the prior art, the utility model has the following beneficial effects:

[0023] The utility model discloses the circuit board is transversely placed in the containing space, can form upper space and lower space with the containing space interval, thereby separating the installation position of main control chip and 5G module high heat generating element, avoid heat concentration in the same space, reduce the heat accumulation in the equipment interior, reduce the heat dissipation pressure, the heat dissipation fin on the top cover cooperates the heat dissipation copper sheet, can quickly transfer the heat generated by main control chip to the outside environment, through setting the radiator on 5G module, can through the form of active heat dissipation and export the high temperature generated by 5G module from lower space through the action of airflow, make the equipment maintain efficient heat dissipation effect when processing high frequency band signal and big data transmission, avoid that the temperature is too high and influences the use performance of equipment. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the technical scheme in the embodiment of the utility model or prior art, the following will briefly introduce the drawing needed to be used in the embodiment or prior art description, obviously, the drawing in the following description only some embodiments of the utility model, for ordinary skilled person in the art, under the premise of not paying the creative labor, still can obtain other drawings according to these drawings.

[0025] The structure, proportion, size etc. shown in the drawings of the specification are only used to cooperate the content disclosed in the specification, for the person skilled in the art to understand and read, and not to limit the limiting conditions that the utility model can be implemented, so it does not have the technical essence, any modification of structure, change of proportion relationship or adjustment of size, under the condition that does not influence the effect and the purpose that the utility model can produce, should still fall in the range that the technical content disclosed by the utility model can cover.

[0026] Figure 1 It is the explosion structure schematic diagram of the utility model;

[0027] Figure 2 It is another perspective explosion structure schematic diagram of the utility model;

[0028] Figure 3 It is the overall front structure schematic diagram of the utility model;

[0029] Figure 4 It is the overall back structure schematic diagram of the utility model;

[0030] Figure 5 It is the radiator back structure schematic diagram of the utility model. DETAILED DESCRIPTION

[0031] In order to make the purpose, features, and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described below are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0032] In the description of the present invention, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of the present invention and simplify the description. They are not intended to indicate or imply that the devices or elements referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally located component.

[0033] The technical solution of the present invention will be further described below with reference to the accompanying drawings and through specific implementation methods.

[0034] like Figures 1 to 5 As shown, the embodiment of the present utility model provides a 5G communication CPE device with good heat dissipation, including a bottom shell 1, a top cover 2, a circuit board 3, a main control chip, a 5G module, a heat dissipation copper sheet 4, a radiator 5 and an antenna assembly 6;

[0035] The top cover 2 is connected to the bottom shell 1 by bolts. An accommodating space is formed between the top cover 2 and the bottom shell 1. The circuit board 3 is horizontally arranged in the middle of the accommodating space to separate the accommodating space into an upper space and a lower space, thereby providing sufficient independent space for different functional modules, avoiding the heat generated by high-heat-generating components from accumulating in the same space, and reducing the heat dissipation pressure.

[0036] Side baffles 21 extend vertically downward on both sides of the top cover 2, and a limiting clamp 22 is provided on the side baffle 21. The limiting clamp 22 is provided with a clamping opening 220 for connecting with the side wall of the circuit board 3; the setting of the limiting clamp 22 and the clamping opening 220 allows the circuit board 3 to be conveniently installed and clamped, effectively improving the assembly efficiency of the CPE equipment.

[0037] The main control chip is arranged on the top of the circuit board 3, the heat dissipation copper sheet 4 is arranged on the main control chip, the upper end surface of the top cover 2 is provided with heat dissipation fins 20, and the heat dissipation fins 20 are used for transferring heat in the upper space to the external environment; the heat dissipation copper sheet 4 arranged on the main control chip can quickly transfer the heat generated by the main control chip from the surface of the main control chip to the upper space, and the heat dissipation fins 20 on the top cover 2 can quickly transfer the heat to the external environment by increasing the heat dissipation surface area.

[0038] The 5G module is arranged on the bottom of the circuit board 3, the heat sink 5 is arranged on the 5G module, the bottom shell 1 is provided with a ventilation hole 10, and the ventilation hole 10 is used for discharging the airflow generated by the heat sink 5 from the lower space; the 5G module is responsible for sending and receiving 5G signals, especially millimeter wave communication in a high frequency band and high bandwidth transmission of large data, and a large amount of heat will be generated under these high load operating conditions, and the heat sink 5 can quickly dissipate the heat of the 5G module by active heat dissipation.

[0039] The antenna assembly 6 penetrates the bottom shell 1 and is connected with the circuit board 3, the antenna assembly 6 is rotatably arranged relative to the bottom shell 1, and the antenna assembly 6 is used for receiving and transmitting wireless signals. The CPE device will be installed in various positions such as a desktop, a wall or a windowsill, and the rotatable antenna assembly 6 can conveniently adjust the orientation of the antenna assembly 6 according to the installation position of the device, so as to improve the receiving effect of the wireless signal. It should be noted that the number of the antenna assembly 6 is two.

[0040] As shown in Figure 2 and Figure 5 Further, the heat sink 5 includes a heat conduction base 51 and a heat dissipation fan 52, the heat conduction base 51 is provided with a plurality of heat dissipation grooves 510 in the circumferential direction, the back surface of the heat conduction base 51 is provided with a heat conduction plane 511 in contact with the 5G module, the front surface of the heat conduction base 51 is provided with a receiving groove 500, and the heat dissipation fan 52 is arranged in the receiving groove 500 and used for generating heat exchange airflow. The heat conduction plane 511 is arranged to quickly transfer the heat generated by the 5G module to the heat conduction base 51 by direct contact, the plurality of heat dissipation grooves 510 arranged in the circumferential direction of the heat conduction base 51 can increase the surface area of the heat conduction base 51, thereby enhancing the heat dissipation efficiency, and the heat dissipation fan 52 can generate heat exchange airflow to quickly dissipate the heat on the heat conduction base 51.

[0041] As shown in Figure 1 Further, the heat dissipation fins 20 are arranged in a U-shaped structure. Compared with straight fins or other shapes, the heat dissipation fins 20 in a U-shaped structure can increase the overall heat dissipation surface area through the curved structure, thereby accelerating the heat dissipation.

[0042] As Figure 2 Further, a temperature sensor 53 is arranged at the bottom of the circuit board 3, and the temperature sensor 53 is electrically connected with the cooling fan 52, and the temperature sensor 53 is used for collecting the temperature in the lower space, and when the temperature sensor detects that the temperature in the lower space reaches a certain threshold value, the fan can be automatically started or the rotating speed of the fan is adjusted, so that the working state of the cooling fan 52 is dynamically adjusted according to the actual load of the device, and it is ensured that the fan can timely dissipate heat at high temperature, and the fan is stopped or the rotating speed of the fan is reduced at low temperature, and the energy consumption is saved.

[0043] As Figure 3 and Figure 4 Further, the front surface of the bottom shell 1 is provided with a first panel 11, and the back surface of the bottom shell 1 is provided with a second panel 12, the first panel 11 is provided with a power interface 101, a SIM card slot 102, a USB interface 103, a fiber interface 104 and a reset button 105, and the second panel 12 is provided with a plurality of Ethernet interfaces 106. The plurality of Ethernet interfaces 106 are arranged on the second panel 12, so that the wiring of the wired network device is more unified and neat, and the cable is avoided from being messy.

[0044] As Figure 2 Further, a radio frequency module 81 is arranged at the bottom of the circuit board 3. By arranging the radio frequency module 81 at the bottom of the circuit board 3, the internal space can be more reasonably distributed, and the heat accumulation caused by the concentration of different modules on the same surface is avoided.

[0045] Further, the bottom shell 1 and the top cover 2 are made of aluminum alloy material. The aluminum alloy material has high heat conduction performance, and can quickly transfer the heat generated in the device to the external environment, and effectively improves the heat dissipation efficiency.

[0046] As Figure 3 Further, the bottom shell 1 is provided with a plurality of positioning holes 100 on both sides. The positioning holes 100 are arranged, so that the CPE device can be fixed in different installation positions such as a wall surface, a cabinet or a desktop by means of bolt connection.

[0047] The above-described embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can be modified, or some technical features can be replaced by equivalent ones; and these modifications or replacements do not make the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A 5G communication CPE device with good heat dissipation, characterized in that: Including bottom shell, top cover, circuit board, main control chip, 5G module, heat dissipation copper sheet, radiator and antenna assembly; The top cover and the bottom shell are connected by bolts, and a receiving space is formed between the top cover and the bottom shell. The circuit board is horizontally arranged in the middle of the receiving space to separate the receiving space into an upper space and a lower space. Side baffles are vertically extended downward on both sides of the top cover, and the side baffles are provided with limiting clamps, and the limiting clamps are provided with clamping openings for connecting with the side walls of the circuit board; The main control chip is arranged on the top of the circuit board, the heat dissipation copper sheet is arranged on the main control chip, and the upper end surface of the top cover is provided with heat dissipation fins, which are used to transfer the heat of the upper space to the external environment; The 5G module is arranged at the bottom of the circuit board, the radiator is arranged on the 5G module, and the bottom shell is provided with ventilation holes, which are used to discharge the airflow generated by the radiator from the lower space; The antenna assembly passes through the bottom shell and is connected to the circuit board. The antenna assembly can be rotatably arranged relative to the bottom shell. The antenna assembly is used to send and receive wireless signals.

2. The 5G communication CPE device with good heat dissipation according to claim 1, characterized in that: The radiator includes a heat-conducting base and a heat-dissipating fan; The heat-conducting base is provided with a plurality of heat dissipation grooves along the circumference, the back of the heat-conducting base is provided with a heat-conducting plane in contact with the 5G module, the front of the heat-conducting base is provided with a receiving groove, the heat dissipation fan is provided in the receiving groove, and the heat dissipation fan is used to generate a heat exchange airflow.

3. The 5G communication CPE device with good heat dissipation according to claim 1, characterized in that: The heat dissipation fins are arranged at intervals in a U-shaped structure.

4. The 5G communication CPE device with good heat dissipation according to claim 1, characterized in that: A temperature sensor is also included. The temperature sensor is arranged at the bottom of the circuit board, the temperature sensor is electrically connected to the cooling fan, and the temperature sensor is used to collect the temperature in the lower space.

5. The 5G communication CPE device with good heat dissipation according to claim 1, characterized in that: The front side of the bottom shell is provided with a first panel, and the back side of the bottom shell is provided with a second panel; The first panel is provided with a power interface, a SIM card slot, a USB interface, an optical fiber interface and a reset button, and the second panel is provided with several Ethernet interfaces.

6. The 5G communication CPE device with good heat dissipation according to claim 1, characterized in that: It also includes a radio frequency module, which is arranged at the bottom of the circuit board.

7. The 5G communication CPE device with good heat dissipation according to claim 1, characterized in that: The number of the antenna components is two.

8. The 5G communication CPE device with good heat dissipation according to claim 1, characterized in that: The bottom shell and the top cover are both made of aluminum alloy.

9. The 5G communication CPE device with good heat dissipation according to claim 1, characterized in that: A plurality of positioning holes are provided on both sides of the bottom shell.

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