Display device

Abstract

A display device is provided. The display device includes: an emission element layer disposed on a display area of a substrate, the substrate further having a non-display area; an opposing substrate, the opposing substrate facing the substrate; a color filter layer disposed on a substrate facing surface of the opposing substrate, in which the color filter layer includes a first color filter, a second color filter, and a third color filter transmitting different light; and a sealing member disposed between the substrate and the opposing substrate and coupling the substrate and the opposing substrate, in which each of the first color filter, the second color filter, and the third color filter includes an opening in the non-display area.

Description

TECHNICAL FIELD

[0001] The disclosure relates to a display device including a color filter layer having an opening to prevent moisture permeating through the color filter layer from reaching a sealing member of the display device, thereby preventing a peeling defect of the sealing member. BACKGROUND

[0002] As the information society develops, various demands for display devices are increasing. For example, display devices are being adopted by various electronic devices such as smart phones, digital cameras, notebook computers, navigation devices, and smart TVs.

[0003] The display device can be a flat panel display device such as a liquid crystal display device, a field emission display device, and a light emitting display device. The light emitting display device includes an organic light emitting display device including an organic light emitting element, an inorganic light emitting display device including an inorganic light emitting element such as an inorganic semiconductor, and a micro light emitting display device including a micro light emitting element.

[0004] The organic light emitting element can include two opposite electrodes and an emission layer interposed between the two opposite electrodes. Electrons and holes supplied from the two opposite electrodes recombine in the emission layer to generate excitons, and the generated excitons relax from an excited state to a ground state, thereby light can be emitted.

[0005] The organic light emitting display device including the organic light emitting element does not require a separate light source such as a backlight unit, and thus it consumes less power and is capable of being made light and thin, and exhibits high quality characteristics such as a wide viewing angle, high brightness and contrast, and a fast response speed. Accordingly, the organic light emitting display device is being highlighted as a next generation display device. SUMMARY

[0006] Aspects of the disclosure provide a display device that can reduce defects by preventing moisture from permeating from the outside.

[0007] It should be noted that the objects of the disclosure are not limited to the above-mentioned objects, and other objects of the disclosure will be apparent to those skilled in the art from the following description.

[0008] According to aspects of the disclosure, a display device includes an emission element layer disposed on a display area of a substrate having a display area and a non-display area, an opposite substrate facing the substrate, a color filter layer disposed on a surface of the opposite substrate facing the substrate, the color filter layer including first, second, and third color filters transmitting different light, and a sealing member disposed between the substrate and the opposite substrate and coupling the substrate and the opposite substrate, wherein each of the first, second, and third color filters includes an opening in the non-display area.

[0009] In an embodiment, the first color filter can be disposed on a surface of the opposite substrate, the second color filter can be disposed on a surface of the first color filter, and the third color filter can be disposed on a surface of the second color filter.

[0010] In an embodiment, the first color filter can include a first opening, the second color filter can include a second opening, and the third color filter can include a third opening.

[0011] In an embodiment, each of the first opening, the second opening, and the third opening can have a closed loop shape around the display area.

[0012] In an embodiment, the third opening can surround the display area, the second opening can surround the third opening, and the first opening can surround the second opening.

[0013] In an embodiment, the first opening can be disposed adjacent to a side surface of the opposite substrate, the third opening can be disposed adjacent to the display area, and the second opening can be disposed between the first opening and the third opening.

[0014] In an embodiment, the first opening, the second opening, and the third opening can not overlap each other in a thickness direction of the display device.

[0015] In an embodiment, the first opening can expose a surface of the opposite substrate, the second opening can expose a surface of the first color filter and fill the first opening, and the third opening can expose a surface of the second color filter and fill the second opening.

[0016] In an embodiment, two of the first opening, the second opening, and the third opening can overlap each other in a thickness direction of the display device.

[0017] In an embodiment, each of the plurality of openings can have a width in a range of about 10 µm to about 20 µm.

[0018] In an embodiment, when viewed from the top, the openings can be spaced apart from each other by about 10 µm to about 100 µm.

[0019] In an embodiment, the display device can further include a low-refraction layer disposed on a surface of the color filter layer, a first capping layer disposed on a surface of the low-refraction layer, a wavelength conversion layer disposed on a surface of the first capping layer, a second capping layer disposed on a surface of the wavelength conversion layer, and a spacer layer disposed on a surface of the second capping layer.

[0020] In an embodiment, the low-refraction layer can cover one of the plurality of openings of the color filter layer.

[0021] In an embodiment, the opening of the color filter layer can be disposed between the side surface of the opposite substrate and the sealing member.

[0022] According to an aspect of the disclosure, a display device includes a light emitting element layer disposed on a display area of a substrate including a display area and a non-display area, an opposite substrate facing the substrate, a color filter layer disposed on a surface of the opposite substrate facing the substrate, the color filter layer including first, second, and third color filters transmitting different light, and a sealing member disposed between the substrate and the opposite substrate and coupling the substrate and the opposite substrate, wherein, in the non-display area, the first color filter includes a first opening, the second color filter includes a second opening, and the third color filter includes a third opening, and wherein the first, second, and third openings each surround the display area and do not overlap each other in a thickness direction.

[0023] In an embodiment, the first color filter can be a blue color filter, the second color filter can be a red color filter, and the third color filter can be a green color filter, and wherein the first color filter can be disposed on the surface of the opposite substrate, the second color filter can be disposed on a surface of the first color filter, and the third color filter can be disposed on a surface of the second color filter.

[0024] In an embodiment, side surfaces of the first, second, and third color filters can be aligned with side surfaces of the opposite substrate.

[0025] In an embodiment, the first opening can be disposed adjacent to the side surface of the opposite substrate, the third opening can be disposed adjacent to the display area, and the second opening can be disposed between the first opening and the third opening.

[0026] In an embodiment, the first opening can be disposed adjacent to the side surface of the opposite substrate, the second opening can be disposed adjacent to the display area, and the third opening can be disposed between the first opening and the second opening.

[0027] In an embodiment, the second opening can be disposed adjacent to the side surface of the opposite substrate, the third opening can be disposed adjacent to the display area, and the first opening can be disposed between the second opening and the third opening.

[0028] According to an embodiment of the disclosure, a plurality of openings can be formed in the color filter layer in the non-display area of the display device, thereby blocking a penetration path of moisture through the color filter layer. Accordingly, peeling defects in the color filter layer can be reduced, and thus, blackness deterioration in the non-display area can be prevented. Furthermore, moisture that penetrates through the color filter layer can be prevented from reaching the sealing member, thereby preventing peeling defects of the sealing member.

[0029] It should be noted that the effects of the present disclosure are not limited to what has been described above and other advantages and effects that would be apparent to one of ordinary skill in the art are provided by the present disclosure as well. BRIEF DESCRIPTION OF DRAWINGS

[0030] In the drawings, the size, thickness, ratio, and the like of elements can be exaggerated for the sake of convenience or clarity. Like reference numbers and / or like reference symbols designate like elements throughout the specification. The above and other aspects, features and advantages of the present disclosure will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings, in which:

[0031] Figure 1 is a schematic plan view of a display device according to an embodiment, which is constructed according to the principles of the present disclosure.

[0032] Figure 2 is a view schematically showing a wire included in a display device according to an embodiment.

[0033] Figure 3 is a schematic view of an equivalent circuit of a sub-pixel according to an embodiment.

[0034] Figure 4 is a cross-sectional view schematically showing a display device according to an embodiment.

[0035] Figure 5 is a cross-sectional view schematically showing a display area of a display device according to an embodiment.

[0036] Figure 6 is a cross-sectional view schematically showing a display device according to an embodiment.

[0037] Figure 7 is a cross-sectional view schematically showing a non-display area of a display device according to an embodiment.

[0038] Figure 8 is Figure 7 a magnified view of area A of FIG.

[0039] Figure 9 is a plan view schematically showing a layout of openings of a display device according to an embodiment.

[0040] Figure 10 is a cross-sectional view schematically showing a moisture penetration path in a display device.

[0041] Figures 11 to 13 is a cross-sectional view schematically showing a display device according to other embodiments. DETAILED DESCRIPTION

[0042] A more complete understanding of the present disclosure can now be accomplished with reference to the following description, taken in conjunction with the accompanying drawings, in which like reference numerals indicate like parts throughout the several views. The present disclosure, however, can be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0043] It will also be understood that when a layer or substrate is referred to as being "on" another layer or substrate, it can be directly on the other layer or substrate, or intervening layers can also be present. In the description, same reference numerals are used to indicate same components throughout the several views.

[0044] It will be understood that, although the terms "first", "second", etc. can be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element discussed below could be termed a second element without departing from the teachings of the present disclosure. Similarly, a second element could be termed a first element.

[0045] The features of various embodiments of the present disclosure can be partially or wholly combined or combined with each other, and technically various interlocks and drives are possible. The various embodiments can be realized independently of each other or can be realized together in connection.

[0046] In the following description, for the purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of various embodiments or implementations of the present disclosure. As used herein, "embodiment" and "implementation" are interchangeable words that are non-limiting examples of the apparatus or method disclosed herein. It will be apparent, however, that the various embodiments can be practiced without these specific details, or with one or more equivalent arrangements. Herein, the various embodiments are not necessarily mutually exclusive, nor are they necessarily all inclusive of the present disclosure. For example, specific shapes, configurations, and characteristics of an embodiment can be used or implemented in another embodiment.

[0047] Unless otherwise specified, the illustrated embodiments are understood to provide illustrative features of the present disclosure. Thus, features, components, modules, layers, films, panels, regions, and / or aspects of the various embodiments (hereinafter referred to as "elements") can be combined, separated, interchanged, and / or rearranged, unless otherwise specified, without departing from the present disclosure.

[0048] The use of cross-hatching and / or shading in the drawings is generally provided to illustrate the boundaries between adjacent elements. As such, unless otherwise specified, the presence of cross-hatching or shading in a drawing generally shall not be construed to mean that a particular material, material property, dimension, ratio, etc. is being represented. In addition, for purposes of the disclosure, the terms "first," "second," etc. are used herein not only for clearly identifying one element from another, but also to distinguish between different sets of elements. Thus, a first element discussed below could be termed a second element without departing from the teachings of the present disclosure.

[0049] When an element or layer is referred to as being "on", "connected to", or "coupled to" another element or layer, it can be directly on, connected, or coupled to the other element or layer, or intervening elements or layers can be present. In contrast, when an element or layer is referred to as being "directly on", "directly connected to", or "directly coupled to" another element or layer, there are no intervening elements or layers present. In this regard, the term "connected" can refer to physical, electrical, and / or fluidic connections, with or without intervening elements. In addition, the DR1 axis, the DR2 axis, and the DR3 axis are not limited to three axes of a rectangular coordinate system, such as an x-axis, a y-axis, and a z-axis, and can be interpreted in a broader sense. For example, the DR1 axis, the DR2 axis, and the DR3 axis can be perpendicular to each other, or can represent different directions that are not perpendicular to each other. For the purposes of the present disclosure, "at least one of A and B" can be interpreted to mean only A, only B, or any combination of A and B. In addition, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" can be interpreted to mean only X, only Y, only Z, or any combination of two or more of X, Y, and Z. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0050] Although the terms "first", "second", etc. can be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Thus, a first element discussed below could be termed a second element without departing from the teachings of the present disclosure.

[0051] Spatially relative terms (such as "beneath", "below", "lower", "under", "above", "upper", "over", "higher", "side" (e.g., as in "sidewall") and the like) can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. Spatially relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture in addition to the orientations depicted in the figures. For example, if a device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the illustrative terms "below" and "above" can encompass both orientations when the device is turned over. The terms "below" and "above" should therefore be interpreted as "on" or "over" or "under" or "beneath" in other words, the spatially relative terms are used herein for ease of description to describe one element's or feature's relation to another element(s) or feature(s) as illustrated in the figures. It is thus contemplated that the device can be oriented in other ways (e.g., rotated 90 degrees or located in any orientation) and the spatially relative descriptors used herein are interpreted accordingly.

[0052] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Furthermore, the terms "comprises", "comprising", "includes", "including" and / or "contains", "containing", when used in this specification, specify the presence of stated features, integers, steps, operations, elements, components and / or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof. It is also noted that, as used herein, the terms "substantially", "about" and other similar terms are used as terms of approximation and not as terms of degree, unless the context clearly indicates otherwise.

[0053] Various embodiments are described herein with reference to cross-sectional illustrations and / or exploded illustrations that are schematic illustrations of embodiments and / or intermediate structures of embodiments. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and / or tolerances, are to be expected. Thus, embodiments disclosed herein should not necessarily be construed as limited to the particular shapes of the regions illustrated in the drawings, but are to include deviations in shapes that result from, for example, manufacturing. In this manner, regions illustrated in the drawings can be schematic in nature and the shapes of the regions can not reflect actual shapes of the regions of a device and, as such, are not intended to limit the scope of embodiments. Embodiments are disclosed herein with reference to the attached figures, which form a part of this description. Various devices of the description are shown by way of example in the drawings and can be related to each other in time, electronic, or data signaling order. It is to be noted that features that are the same in function or serve the same purpose can retain the same reference characters and numbers, denote different features having a "prime" or like designation or be presented in different drawings. It is to be further noted that, because several of the components of the devices illustrated in the drawings are means plus function, structural and / or functional delineations thereof are not provided based on the means plus function format in the drawings.

[0054] As is conventional in the art, some of the embodiments are described in terms of functional blocks, units, and / or modules, in the figures. Those skilled in the art will recognize that these blocks, units, and / or modules are implemented by electronic (or optical) circuitry (such as logic circuitry, discrete components, microprocessors, hardwired circuitry, memory elements, wiring connections, etc., which can be formed using semiconductor-based manufacturing techniques or other manufacturing techniques) that physically performs the operations described herein. In this regard, the blocks, units, and / or modules can be functional blocks (e.g., of an apparatus, software, firmware, etc.), units (e.g., of a computer program), and / or modules (e.g., of program code). In cases where blocks, units and / or modules are implemented by microprocessors or other similar hardware, the blocks, units and / or modules can be programmed and controlled by software (e.g., microcode) to perform the various functions discussed herein and can be driven by firmware and / or software. It is also contemplated that each block, unit and / or module can be implemented by dedicated hardware as well, or a combination of dedicated hardware to perform some functions and a processor (e.g., one or more programmed microprocessors and associated circuitry) to perform other functions. Additionally, it is also contemplated that each block, unit and / or module of some of the illustrative embodiments can be physically separated into two or more distinct blocks, units and / or modules without departing from the scope of the disclosure. Moreover, it is also contemplated that blocks, units and / or modules of some of the illustrative embodiments can be physically combined into more complex blocks, units and / or modules without departing from the scope of the disclosure.

[0055] Hereinafter, embodiments of the disclosure will be described with reference to the accompanying drawings.

[0056] Figure 1 is a schematic plan view of a display apparatus according to an embodiment constructed according to the principles of the disclosure.

[0057] Referring to Figure 1 The display apparatus 10 according to an embodiment can be applied to a smart phone, a mobile phone, a tablet PC, a personal digital assistant (PDA), a portable multimedia player (PMP), a television, a game console, a wristwatch-type electronic apparatus, a head-mounted display, a personal computer monitor, a notebook computer, a car navigation system, a car dashboard, a digital camera, a camcorder, an outdoor billboard, an electronic billboard, various medical devices, various home appliances such as a refrigerator and a washing machine, an Internet of Things (IoT) apparatus, etc. In the following description, a television is described as an example of the display apparatus 10. The television can have a high resolution or an ultra-high resolution such as HD, UHD, 4K, and 8K.

[0058] The display device 10 according to embodiments can be variously classified by a way in which an image is displayed. Examples of the classification of the display device 10 can include an organic light emitting display device (OLED), an inorganic light emitting display device (inorganic EL), a quantum dot light emitting display device (QED), a micro LED display device (micro LED), a nano LED display device (nano LED), a plasma display device (PDP), a field emission display device (FED), a cathode ray display device (CRT), a liquid crystal display device (LCD), an electrophoretic display device (EPD), etc. In the following description, the organic light emitting display device and the inorganic light emitting display device will be described as examples of the display device 10, and such light emitting display device will be simply referred to as the display device 10 unless it is necessary to distinguish them. However, it is to be understood that the embodiments described herein are not limited to the organic light emitting display device or the inorganic light emitting display device, and one of the above-listed display devices or any other display device well known in the art can be employed without departing from the scope of the present disclosure.

[0059] According to embodiments, the display device 10 can have a quadrangular shape, for example, a rectangular shape, when viewed from the top. When the display device 10 is a television, it is oriented such that the longer side is positioned in the horizontal direction. However, it is to be understood that the present disclosure is not limited thereto. The longer side can be positioned in the vertical direction. As another example, the display device 10 can be rotatably mounted such that the longer side can be variably positioned in the horizontal direction or the vertical direction.

[0060] The display device 10 can include a display area DPA and a non-display area NDA. The display area DPA can be an active area in which an image is displayed. The display area DPA can have, but is not limited to, a rectangular shape similar to a general shape of the display device 10 when viewed from the top.

[0061] The display area DPA can include pixels PX. The pixels PX can be arranged in a matrix. The shape of each of the plurality of pixels PX can be, but is not limited to, a rectangle or a square when viewed from the top. Each of the plurality of pixels PX can have a rhombus shape with a side inclined with respect to one side of the display device 10. The pixels PX can include pixels PX of different colors. For example, the pixels PX can include, but are not limited to, pixels PX of a first color of red, pixels PX of a second color of green, and pixels PX of a third color of blue. The pixels PX of the plurality of colors can be arranged in an RGB stripe pattern or an RGB sub-pixel pattern. The matrix is alternately arranged.

[0062] The non-display area NDA can be arranged around the display area DPA. The non-display area NDA can completely or partially surround the display area DPA. The display area DPA can have a rectangular shape, and the non-display area NDA can be arranged adjacent to four sides of the display area DPA. The non-display area NDA can form a bezel of the display device 10.

[0063] In the non-display area NDA, a driving circuit or a driving element for driving the display area DPA can be arranged. According to an embodiment, the pad area is arranged on the display substrate of the display device 10 in a first non-display area NDA1 adjacent to a first longer side (a lower side in Figure 1 ) of the display device 10 and a second non-display area NDA2 adjacent to a second longer side (an upper side in Figure 1 ) of the display device 10. An external device EXD can be mounted on the pad electrode of the pad area. Examples of the external device EXD can include a connection film, a printed circuit board, a driver chip DIC, a connector, a wiring connection film, etc. A scan driver SDR directly formed on the display substrate of the display device 10 can be arranged in a third non-display area NDA3 arranged adjacent to a first shorter side (a left side in Figure 1 ) of the display device 10. However, it should be understood that the present disclosure is not limited thereto. The scan driver SDR can be arranged in a fourth non-display area NDA4 arranged adjacent to a second shorter side (a right side in Figure 1 ) of the display device 10.

[0064] Figure 2 is a view schematically showing lines included in a display device according to an embodiment.

[0065] Referring to Figure 2 , the display device 10 can include lines. The lines can include scan lines SCL, sensing lines SSL, data lines DTL, initialization voltage lines VIL, first voltage lines VDL, second voltage lines VSL, etc. In addition, other lines can also be arranged in the display device 10.

[0066] The scan lines SCL and the sensing lines SSL can extend in a first direction DR1. The scan lines SCL and the sensing lines SSL can be connected to a scan driver SDR. The scan driver SDR can include a driving circuit. The scan driver SDR can be arranged on, but not limited to, one side of the display area DPA in the first direction DR1. The scan driver SDR can be connected to a signal connection line CWL, and at least one end of the signal connection line CWL can form a pad WPD_CW on the pad area PDA in the non-display area NDA to be connected to an external device EXD.

[0067] As used herein, when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements can be present. Such an element can be understood to single integrated element, and thus a portion thereof is connected to another portion. Also, as used herein, when an element is referred to as being "connected" to another element, it can be directly in contact with the other element and also electrically connected to the other element.

[0068] The data lines DTL and the initialization voltage lines VIL can extend in a second direction DR2 crossing the first direction DR1. The initialization voltage lines VIL can also include branches extending in the second direction DR2 and portions. Each of the first voltage lines VDL and the second voltage lines VSL can also include portions extending in the second direction DR2 and portions connected thereto and extending in the first direction DR1. The first voltage lines VDL and the second voltage lines VSL can have, but are not limited to, a mesh structure. Each of the plurality of pixels PX of the display device 10 can be connected to at least one of the data lines DTL, the initialization voltage lines VIL, the first voltage lines VDL, and the second voltage lines VSL.

[0069] The data lines DTL, the initialization voltage lines VIL, the first voltage lines VDL, and the second voltage lines VSL can be electrically connected to one or more wiring pads WPD. The wiring pads WPD can be arranged in a pad area PDA. According to an embodiment, the wiring pads WPD_DT (hereinafter referred to as data pads) of the data lines DTL can be arranged in the pad area PDA on one side of the display area DPA in the second direction DR2, and the wiring pads WPD_Vint (hereinafter referred to as initialization voltage pads) of the initialization voltage lines VIL, the wiring pads WPD_VDD (hereinafter referred to as first power voltage pads) of the first voltage lines VDL, and the wiring pads WPD_VSS (hereinafter referred to as second power voltage pads) of the second voltage lines VSL can be arranged in the pad area PDA located on the other side of the display area DPA in the second direction DR2. As another example, the data pads WPD_DT, the initialization voltage pads WPD_Vint, and the first power voltage pads WPD_VDD and the second power voltage pads WPD_VSS can all be arranged in the same area, for example, in the non-display area NDA on the upper side of the display area DPA. An external device EXD can be mounted on the wiring pads WPD. The external device EXD can be mounted on the wiring pads WPD by an anisotropic conductive film, ultrasonic bonding, or the like.

[0070] The plurality of pixels PX or the sub-pixels SPX (see Figure 3Each of the lines includes a pixel driving circuit, where n is an integer of 1 to 3. The above-described lines can pass through each of the plurality of pixels PX or a periphery thereof to apply a driving signal to the pixel driving circuit. The pixel driving circuit can include a transistor and a capacitor. The number of transistors and capacitors of each pixel driving circuit can vary in various ways. According to an embodiment, each of the plurality of sub-pixels SPX of the display device 10 can have a 3T1C structure, i.e., the pixel driving circuit includes three transistors and one capacitor. In the following description, the pixel driving circuit having the 3T1C structure will be described as an example. However, it is to be understood that the present disclosure is not limited thereto. Various modified pixel structures, such as a 2T1C structure, a 7T1C structure, and a 6T1C structure, can be employed.

[0071] Figure 3 is a schematic view of an equivalent circuit of a sub-pixel according to an embodiment.

[0072] Referring to Figure 3 , each of the plurality of sub-pixels SPX of the display device 10 according to an embodiment includes, in addition to the light emitting element ED, a driving transistor DTR, a first transistor STR1 and a second transistor STR2, and one storage capacitor CST.

[0073] The light emitting element ED emits light in proportion to a current supplied through the driving transistor DTR. The light emitting element ED can be implemented as an inorganic light emitting diode, an organic light emitting diode, a micro light emitting diode, a nano light emitting diode, etc.

[0074] A first electrode (i.e., an anode electrode) of the light emitting element ED can be connected to a source electrode of the driving transistor DTR, and a second electrode (i.e., a cathode electrode) thereof can be connected to a second power voltage line ELVSL from which a low-level voltage (a second power voltage) lower than a high-level voltage (a first power voltage) of the first power voltage line ELVDL is applied.

[0075] The driving transistor DTR adjusts a current flowing from the first power voltage line ELVDL according to a voltage difference between a gate electrode and a source electrode, from which the first power voltage is applied to the light emitting element ED. The gate electrode of the driving transistor DTR can be connected to a first electrode of the first transistor STR1, the source electrode can be connected to a first electrode of the light emitting element ED, and the drain electrode can be connected to the first power voltage line ELVDL from which the first power voltage is applied.

[0076] The first transistor STR1 is turned on by a scan signal of the scan line SCL to connect the data line DTL with the gate electrode of the drive transistor DTR. The gate electrode of the first transistor STR1 can be connected to the scan line SCL, the first electrode of the first transistor STR1 can be connected to the gate electrode of the drive transistor DTR, and the second electrode of the first transistor STR1 can be connected to the data line DTL.

[0077] The second transistor STR2 can be turned on by a sensing signal of the sensing line SSL to connect the initialization voltage line VIL to the source electrode of the drive transistor DTR. The gate electrode of the second transistor STR2 can be connected to the sensing line SSL, the first electrode of the second transistor STR2 can be connected to the initialization voltage line VIL, and the second electrode of the second transistor STR2 can be connected to the source electrode of the drive transistor DTR.

[0078] According to an embodiment, the first electrode of each of the first transistor STR1 and the second transistor STR2 can be a source electrode, and the second electrode of each of the first transistor STR1 and the second transistor STR2 can be a drain electrode. However, it is to be understood that the present disclosure is not limited thereto. The first electrode of each of the first transistor STR1 and the second transistor STR2 can be a drain electrode, and the second electrode of each of the first transistor STR1 and the second transistor STR2 can be a source electrode.

[0079] The storage capacitor CST can be formed between the gate electrode and the source electrode of the drive transistor DTR. The storage capacitor CST stores a voltage difference between the gate voltage and the source voltage of the drive transistor DTR.

[0080] The drive transistor DTR, and the first transistor STR1 and the second transistor STR2 can be formed as thin film transistors. Although Figure 3 Although it is shown that each of the drive transistor DTR, and the first transistor STR1 and the second transistor STR2 is implemented as an n-type MOSFET (Metal Oxide Semiconductor Field Effect Transistor), it is noted that the present disclosure is not limited thereto. For example, the drive transistor DTR, and the first transistor STR1 and the second transistor STR2 can be implemented as a p-type MOSFET, or some of the drive transistor DTR, and the first transistor STR1 and the second transistor STR2 can be implemented as an n-type MOSFET, and others of the drive transistor DTR, and the first transistor STR1 and the second transistor STR2 can be implemented as a p-type MOSFET.

[0081] Figure 4 FIG. 1 is a cross-sectional view schematically showing a display device according to an embodiment. Figure 5 FIG. 2 is a cross-sectional view schematically showing a display region of a display device according to an embodiment.

[0082] Referring to Figure 4 and Figure 5 The display device 10 according to the embodiments can include a substrate SUB, an emission element layer EML, a thin film encapsulation layer TFEL, a filling layer FIL, a wavelength conversion layer WCL, a color filter layer CFL, an opposite substrate TSUB, and a sealing member SEL.

[0083] The substrate SUB can be an insulating substrate. The substrate SUB can include a transparent material. For example, the substrate SUB can include a transparent insulating material such as glass and quartz. The substrate SUB can be a rigid substrate. The substrate SUB is not limited to those described above. The substrate SUB can include plastic such as polyimide, or can be flexible such that it can be bent, curved, folded, or rolled.

[0084] The emission element layer EML can be disposed on the substrate SUB. The emission element layer EML can include a switching element and a light emitting element ED disposed in each sub-pixel SPX. The switching element can drive the light emitting element ED such that the light emitting element ED emits light.

[0085] The thin film encapsulation layer TFEL can be disposed on the emission element layer EML. The thin film encapsulation layer TFEL can include an organic film disposed between inorganic films, and can protect the emission element layer EML from external moisture and oxygen.

[0086] The opposite substrate TSUB can be disposed to face the substrate SUB. The opposite substrate TSUB can encapsulate the emission element layer EML together with the substrate SUB. The opposite substrate TSUB can include a transparent material. For example, the opposite substrate TSUB can include a transparent insulating material such as glass and quartz.

[0087] The color filter layer CFL can be disposed on a surface of the opposite substrate TSUB. The color filter layer CFL can filter light incident from the outside to reduce reflection of external light, and improve color properties of light emitted through the wavelength conversion layer WCL.

[0088] The wavelength conversion layer WCL can be disposed on a surface of the color filter layer CFL. The wavelength conversion layer WCL can convert a wavelength of light emitted from the emission element layer EML to emit red light, green light, and blue light.

[0089] The filling layer FIL can be disposed between the substrate SUB and the opposite substrate TSUB. The filling layer FIL can be used to fill between the substrate SUB and the opposite substrate TSUB to protect a display area DPA of the display device 10.

[0090] The substrate SUB and the opposite substrate TSUB can be coupled to each other by a sealing member SEL. The sealing member SEL can seal the emission element layer EML by coupling the substrate SUB and the opposite substrate TSUB. The sealing member SEL can be disposed in the non-display area NDA and can be formed to surround the display area DPA of the display device 10.

[0091] Hereinafter, elements of the display device 10 according to the embodiments will be described in detail with reference to other drawings.

[0092] Figure 6 is a cross-sectional view schematically illustrating a display device according to an embodiment. Figure 6 A portion of the display area DPA of the display device 10 is illustrated.

[0093] In conjunction with Figure 5 Referring to Figure 6 The emission element layer EML can be disposed on the substrate SUB. The emission element layer EML can include a buffer layer 120, a bottom metal layer BML, a first insulating layer 130, a semiconductor layer ACT, a gate electrode GE, a gate insulator 140, a second insulating layer 150, a source electrode SE, a drain electrode DE, a third insulating layer 155, a fourth insulating layer 160, a light emitting element ED, and a pixel defining layer 170.

[0094] The buffer layer 120 can be disposed on the substrate SUB. The buffer layer 120 can block penetration of particles or moisture through the substrate SUB into elements disposed on the buffer layer 120.

[0095] The buffer layer 120 can include, but is not limited to, inorganic materials such as SiO2, SiN x and SiON, and can be composed of a single layer or multiple layers.

[0096] The bottom metal layer BML can be disposed on the buffer layer 120. The bottom metal layer BML can block inflow of external light or light emitted from the light emitting element ED into the semiconductor layer ACT, which will be described in greater detail later. By doing so, it is possible to prevent or reduce generation of leakage current in the thin film transistor due to light, which will be described in greater detail later.

[0097] The bottom metal layer BML can be made of a material that blocks light and has electrical conductivity. According to some embodiments, the bottom metal layer BML can include a single material such as silicon (Si), nickel (Ni), gold (Au), platinum (Pt), aluminum (Al), copper (Cu), molybdenum (Mo), titanium (Ti), and neodymium (Nd), or an alloy thereof. According to some embodiments, the bottom metal layer BML can be composed of a single layer or a multi-layer structure. For example, for the bottom metal layer BML composed of a multi-layer structure, the bottom metal layer BML can be, but is not limited to, a stack structure of titanium (Ti) / copper (Cu) / indium tin oxide (ITO) or a stack structure of titanium (Ti) / copper (Cu) / aluminum oxide (Al2O3).

[0098] According to some embodiments, one or more bottom metal layers BML can be disposed. The number of the bottom metal layers BML can be equal to the number of the semiconductor layers ACT. The plurality of bottom metal layers BML can respectively overlap the plurality of semiconductor layers ACT. According to some embodiments, the width of the bottom metal layer BML can be greater than the width of the semiconductor layer ACT.

[0099] According to some embodiments, the bottom metal layer BML can be a part of a data line, a voltage line, a line electrically connecting a thin film transistor (not shown in the drawings) and the gate electrode GE, the semiconductor layer ACT, the drain electrode DE, and the source electrode SE shown in FIG. 1, etc. According to some embodiments, the bottom metal layer BML can be made of a material having a lower resistance than the source electrode SE and the drain electrode DE. Figure 6

[0100] The first insulating layer 130 can cover the bottom metal layer BML. The first insulating layer 130 can electrically insulate the bottom metal layer BML from the semiconductor layer ACT. The first insulating layer 130 can cover the bottom metal layer BML.

[0101] The first insulating layer 130 can include, but is not limited to, an inorganic material such as SiO2, SiNx, SiON, Al2O3, TiO2, Ta2O, HfO2, and ZrO2.

[0102] The semiconductor layer ACT can be disposed on the first insulating layer 130. The semiconductor layer ACT can be disposed in each of the first emission area ELA1, the second emission area ELA2, and the third emission area ELA3 in the display area DPA. The semiconductor layer ACT can be disposed to overlap each of the plurality of bottom metal layers BML, thereby suppressing the generation of a photo current in the semiconductor layer ACT.

[0103] ​The semiconductor layer ACT can include an oxide semiconductor. According to some embodiments, the semiconductor layer ACT can be made of, but not limited to, Zn oxide, In-Zn oxide, Ga-In-Zn oxide, etc. as a Zn oxide-based material, and can be an IGZO (In-Ga-Zn-O) semiconductor including metals such as indium (In) and gallium (Ga) in ZnO. For example, the semiconductor layer ACT can include amorphous silicon, polysilicon, etc.

[0104] The gate electrode GE can be disposed on the semiconductor layer ACT. The gate electrode GE can be disposed in the display area DPA to overlap the semiconductor layer ACT. According to some embodiments, the width of the gate electrode GE can be smaller than the width of the semiconductor layer ACT, but the present disclosure is not limited thereto.

[0105] The gate electrode GE can include, but not limited to, at least one of materials including aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and copper (Cu), and can be composed of a single layer or multiple layers in consideration of adhesion to adjacent layers, surface flatness for layers to be laminated thereon, processability, etc.

[0106] The gate insulator 140 can be disposed between the semiconductor layer ACT and the gate electrode GE. The gate insulator 140 can insulate the semiconductor layer ACT from the gate electrode GE. According to some embodiments, the gate insulator 140 can not be composed of a single layer disposed on the surface of the substrate SUB in the third direction DR3, but can be formed in a partially patterned shape. The width of the gate insulator 140 can be smaller than the width of the semiconductor layer ACT, and can be greater than the width of the gate electrode GE. However, it should be understood that the present disclosure is not limited thereto.

[0107] The gate insulator 140 can include an inorganic material. For example, the gate insulator 140 can include the inorganic materials listed above as the material of the first insulating layer 130.

[0108] The second insulating layer 150 can be disposed on the gate insulator 140, and cover the semiconductor layer ACT and the gate electrode GE. In some embodiments, the second insulating layer 150 can serve as a planarization film that provides a flat surface.

[0109] The second insulating layer 150 can include an organic material. According to some embodiments, the second insulating layer 150 can include, but not limited to, at least one of photoacrylic acid (PAC), polystyrene, polymethyl methacrylate (PMMA), polyacrylonitrile (PAN), polyamide, polyimide, polyarylether, heterocyclic polymer, parylene, fluoropolymer, epoxy resin, benzocyclobutene-based resin, siloxane-based resin, and silane resin.

[0110] In some embodiments, the second insulating layer 150 can include an inorganic material. For example, the second insulating layer 150 can include the inorganic materials listed above as the materials of the first insulating layer 130.

[0111] The source electrode SE and the drain electrode DE can be spaced apart from each other and disposed on the second insulating layer 150. The drain electrode DE and the source electrode SE can be connected to the semiconductor layer ACT through a contact hole that penetrates the second insulating layer 150. The source electrode SE can be connected to the bottom metal layer BML through the first insulating layer 130 and the second insulating layer 150. If the bottom metal layer BML is part of a line that transmits a signal or a voltage, the source electrode SE can be connected to the bottom metal layer BML and electrically coupled with the bottom metal layer BML, and can receive a voltage applied to the line. As another example, if the bottom metal layer BML is a floating pattern rather than a separate line, a voltage applied to the source electrode SE or the like can be transmitted to the bottom metal layer BML.

[0112] The source electrode SE and the drain electrode DE can include aluminum (Al), copper (Cu), titanium (Ti), or the like, and can be composed of a single layer or multiple layers. In some embodiments, the source electrode SE and the drain electrode DE can have a multi-layer structure of Ti / Al / Ti, but are not limited thereto.

[0113] The semiconductor layer ACT, the gate electrode GE, the source electrode SE, and the drain electrode DE can form a thin film transistor as a switching element. According to some embodiments, the thin film transistor can be disposed in each of the first emission area ELA1, the second emission area ELA2, and the third emission area ELA3. According to some embodiments, a portion of the thin film transistor can be positioned in the non-emission area NELA.

[0114] The third insulating layer 155 can be disposed on the second insulating layer 150 to cover the thin film transistor. According to some embodiments, the third insulating layer 155 can be a passivation layer.

[0115] According to some embodiments, the third insulating layer 155 can include an inorganic material. For example, the third insulating layer 155 can include the inorganic materials listed above as the materials of the first insulating layer 130.

[0116] The fourth insulating layer 160 can be disposed on the third insulating layer 155 to cover the third insulating layer 155. According to some embodiments, the fourth insulating layer 160 can be a passivation film.

[0117] The fourth insulating layer 160 can be made of an organic material. According to some embodiments, the fourth insulating layer 160 can include, but is not limited to, an acrylic resin, an epoxy resin, an imide resin, an ester resin, or the like, or can include a photosensitive organic substance.

[0118] The anode ANO can be positioned on the fourth insulating layer 160 in the display area DPA.

[0119] A plurality of anodes ANO can be respectively arranged in the first emission area ELA1, the second emission area ELA2, and the third emission area ELA3, and at least a portion of the anodes ANO can extend to the non-emission area NELA. The anodes ANO can be connected to the drain electrode DE of the thin film transistor.

[0120] According to some embodiments, the anode ANO can be a reflective electrode, which can be a metal layer including a metal such as Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, and Cr. According to another embodiment, the anode ANO can further include a metal oxide layer stacked on the metal layer. According to an embodiment, the anode ANO can have a multi-layer structure, such as a two-layer structure of ITO / Ag, Ag / ITO, ITO / Mg, or ITO / MgF2, or a three-layer structure of ITO / Ag / ITO.

[0121] A pixel defining layer 170 can be arranged above the anode ANO. The pixel defining layer 170 can define the first emission area ELA1, the second emission area ELA2, and the third emission area ELA3 as openings exposing the anode ANO.

[0122] The pixel defining layer 170 can coincide with the light-blocking area BA of the color filter layer CFL in the third direction DR3, which will be described in more detail later. The pixel defining layer 170 can coincide with the bank BK in the third direction DR3, which will be described in more detail later.

[0123] The pixel defining layer 170 can include an organic insulating material such as a polyacrylate resin, an epoxy resin, a phenol resin, a polyamide resin, a polyimide resin, an unsaturated polyester resin, a polyphenylene ether resin, a polyphenylene sulfide resin, and benzocyclobutene (BCB).

[0124] An emission layer OL can be arranged on the anode ANO. According to some embodiments, the emission layer OL can have a shape of a continuous film arranged across the first emission area ELA1, the second emission area ELA2, and the third emission area ELA3, and the non-emission area NELA. According to some embodiments, the emission layer OL can be positioned only in the display area DPA, but the present disclosure is not limited thereto. For example, a portion of the emission layer OL can also be positioned in the non-display area NDA.

[0125] According to some embodiments, the emission layer OL can include an organic layer including an organic material. The organic layer includes an organic emission layer, and in some implementations can further include a hole injection / transport layer and / or an electron injection / transport layer as auxiliary layers to facilitate emission.

[0126] According to an embodiment in which the display device 10 is a micro-LED display device, a nano-LED display device, or the like, the emission layer OL can include an inorganic material, such as an inorganic semiconductor.

[0127] The cathode CE can be disposed on the emission layer OL. According to some embodiments, the cathode CE can have a shape of a continuous film disposed on the emission layer OL and formed across the first emission area ELA1, the second emission area ELA2, and the third emission area ELA3, as well as the non-emission area NELA. In other words, the cathode CE can completely cover the emission layer OL.

[0128] The cathode CE can be semi-transmissive or transmissive. If the thickness of the cathode CE is in a range from tens of angstroms to hundreds of angstroms, the cathode CE can be semi-transmissive. According to some embodiments, if the cathode CE is semi-transmissive, it can include Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF / Ca, LiF / Al, Mo, Ti, or a compound or a mixture thereof, for example, a mixture of Ag and Mg. The cathode CE can include a transparent conductive oxide, and can have transparency. According to some embodiments in which the cathode CE has transparency, the cathode CE can be formed of tungsten oxide (WxOx), titanium oxide (TiO2), indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), magnesium oxide (MgO), or the like.

[0129] The anode ANO, the emission layer OL, and the cathode CE can form a light emitting element ED. For example, the anode ANO, the emission layer OL, and the cathode CE in the first emission area ELA1 can form a first light emitting element, the anode ANO, the emission layer OL, and the cathode CE in the second emission area ELA2 can form a second light emitting element, and the anode ANO, the emission layer OL, and the cathode CE in the third emission area ELA3 can form a third light emitting element. Each of the first light emitting element, the second light emitting element, and the third light emitting element can emit outgoing light. The outgoing light emitted from each of the plurality of light emitting elements ED can have a peak wavelength in a range from about 440 nm to about 480 nm. For example, the outgoing light can be blue light.

[0130] A thin film encapsulation layer TFEL can be disposed on the emission element layer EML. The thin film encapsulation layer TFEL can be disposed on the cathode CE. The thin film encapsulation layer TFEL can protect the underlying elements from external foreign substances such as moisture. The thin film encapsulation layer TFEL can be disposed commonly across the first emission area ELA1, the second emission area ELA2, the third emission area ELA3, and the non-emission area NELA.

[0131] The thin film encapsulation layer TFEL can include a lower inorganic layer TFE1, an organic layer TFE2, and an upper inorganic layer TFE3 sequentially stacked on the cathode CE.

[0132] The lower inorganic layer TFE1 can completely cover the cathode CE in the display area DPA, thereby covering the first, second, and third light emitting elements. The organic layer TFE2 can be disposed on the lower inorganic layer TFE1 and cover the first, second, and third light emitting elements. The upper inorganic layer TFE3 can be disposed on the organic layer TFE2 and completely cover the organic layer TFE2.

[0133] Each of the lower inorganic layer TFE1 and the upper inorganic layer TFE3 can be made of, but is not limited to, at least one of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, titanium oxide, tin oxide, cerium oxide, silicon oxynitride (SiON), lithium fluoride, etc.

[0134] In some embodiments, the organic layer TFE2 can be made of, but is not limited to, an acrylic resin, a methacrylic resin, a polyisoprene, a vinyl resin, an epoxy resin, a urethane resin, a cellulose resin, and a perylene resin.

[0135] The opposite substrate TSUB can be disposed above the substrate SUB on which the emission element layer EML and the thin film encapsulation layer TFEL are disposed. The color filter layer CFL can be disposed on a surface of the opposite substrate TSUB, and the wavelength conversion layer WCL can be disposed on a surface of the color filter layer CFL. The display device 10 can include a low-refraction layer LR and a first cap layer CPL1 disposed between the color filter layer CFL and the wavelength conversion layer WCL, and can include a spacing layer SPC disposed on a surface of the wavelength conversion layer WCL.

[0136] The color filter layer CFL can be disposed on opposite sides of the opposite substrate TSUB in the third direction DR3, i.e., between the opposite substrate TSUB and the substrate SUB. The color filter layer CFL can include a color filter pattern region and a black matrix BM. The black matrix BM can surround the color filter pattern region. The color filter pattern of the color filter layer CFL can define a transmissive region, and the black matrix BM can define a black-out region BA.

[0137] As Figure 6As illustrated in FIG. 3, the color filter layer CFL can include a first color filter 321, a second color filter 322, and a third color filter 323. The first color filter 321 can absorb the second light L2 and the third light L3 except for the first light L1, the second color filter 322 can absorb the first light L1 and the third light L3 except for the second light L2, and the third color filter 323 can absorb the first light L1 and the second light L2 except for the third light L3. In other words, the first color filter 321 can transmit the first light L1, the second color filter 322 can transmit the second light L2, and the third color filter 323 can transmit the third light L3.

[0138] According to some embodiments, the first color filter 321 can be a blue color filter and can include a blue colorant. As used herein, a colorant includes a dye as well as a pigment. The first color filter 321 can include a base resin, and the blue colorant can be dispersed in the base resin. According to some embodiments, the second color filter 322 can be a red color filter and can include a red colorant. The second color filter 322 can include a base resin, and the red colorant can be dispersed in the base resin. According to embodiments, the third color filter 323 can be a green color filter and can include a green colorant. The third color filter 323 can include a base resin, and the green colorant can be dispersed in the base resin.

[0139] The first color filter 321 can include a first color filter pattern area 321a and a first light-blocking pattern area 321b surrounding the first color filter pattern area 321a, the second color filter 322 can include a second color filter pattern area 322a and a second light-blocking pattern area 322b surrounding the second color filter pattern area 322a, and the third color filter 323 can include a third color filter pattern area 323a and a third light-blocking pattern area 323b surrounding the third color filter pattern area 323a.

[0140] Specifically, the first color filter pattern area 321a of the first color filter 321 can overlap the first transmission area TA1, and the first light-blocking pattern area 321b of the first color filter 321 can surround the first color filter pattern area 321a overlapping the first transmission area TA1, and can overlap the light-blocking area BA, but not overlap the second transmission area TA2 and / or the third transmission area TA3. The second color filter pattern area 322a of the second color filter 322 can overlap the second transmission area TA2, and the second light-blocking pattern area 322b of the second color filter 322 can surround the second color filter pattern area 322a overlapping the second transmission area TA2, and can overlap the light-blocking area BA, but not overlap the first transmission area TA1 and / or the third transmission area TA3. The third color filter pattern area 323a of the third color filter 323 can overlap the third transmission area TA3, and the third light-blocking pattern area 323b of the third color filter 323 can surround the third color filter pattern area 323a overlapping the third transmission area TA3, and can overlap the light-blocking area BA, but not overlap the first transmission area TA1 and / or the second transmission area TA2. In other words, the color filter pattern areas of the color filter layer CFL can include the first color filter pattern area 321a of the first color filter 321, the second color filter pattern area 322a of the second color filter 322, and the third color filter pattern area 323a of the third color filter 323. The light-blocking pattern BM can have a stacked structure in which the first light-blocking pattern area 321b of the first color filter 321, the second light-blocking pattern area 322b of the second color filter 322, and the third light-blocking pattern area 323b of the third color filter 323 are stacked on each other.

[0141] The first color filter pattern area 321a of the first color filter 321 can function as a blocking color filter that blocks red light and green light. Specifically, the first color filter pattern area 321a can selectively transmit the first light L1 (e.g., blue light) and block or absorb the second light L2 (e.g., red light) and the third light L3 (e.g., green light).

[0142] The second color filter pattern area 322a of the second color filter 322 can function as a blocking color filter that blocks blue light and green light. Specifically, the second color filter pattern area 322a can selectively transmit the second light L2 (e.g., red light) and block or absorb the first light L1 (e.g., blue light) and the third light L3 (e.g., green light).

[0143] The third color filter pattern area 323a of the third color filter 323 can function as a blocking color filter that blocks blue light and red light. Specifically, the third color filter pattern area 323a can selectively transmit the third light L3 (e.g., green light) and block or absorb the first light L1 (e.g., blue light) and the second light L2 (e.g., red light).

[0144] According to some embodiments, the light-blocking pattern BM can have, but is not limited to, a structure in which the first light-blocking pattern area 321b, the second light-blocking pattern area 322b, and the third light-blocking pattern area 323b are sequentially stacked in the third direction DR3. For example, the light-blocking pattern BM can not be formed by the first color filter 321, the second color filter 322, and the third color filter 323 described above, but can be formed by a separate organic light-blocking material via a coating and exposure process of the organic light-blocking material. In the following description, for convenience of explanation, the light-blocking pattern BM has a structure in which the first light-blocking pattern area 321b, the second light-blocking pattern area 322b, and the third light-blocking pattern area 323b are sequentially stacked in the third direction DR3. The light-blocking pattern BM can absorb all of the first light L1, the second light L2, and the third light L3 by the above-described configuration.

[0145] The low-refraction layer LR can be disposed on a surface of the color filter layer CFL, for example, on opposite sides in the third direction DR3. The low-refraction layer LR has a refractive index lower than that of the first light-transmitting member TPL, the second light-transmitting member WCL1, and the third light-transmitting member WCL2, which will be described later, and thus causes total reflection of light traveling from the first light-transmitting member TPL, the second light-transmitting member WCL1, and the third light-transmitting member WCL2 to the low-refraction layer LR, so that the light can be recycled.

[0146] The low-refraction layer LR can include an organic material. According to some embodiments, the low-refraction layer LR can have a refractive index equal to or less than 1.3. For the low-refraction layer LR having a refractive index of 1.3 or less, total reflection of light can sufficiently occur due to a large difference in refractive index between the first light-transmitting member TPL, the second light-transmitting member WCL1, and the third light-transmitting member WCL2.

[0147] The low-refraction layer LR can compensate for a horizontal difference generated by the first light-blocking pattern area 321b, the second light-blocking pattern area 322b, and the third light-blocking pattern area 323b of the color filter layer CFL to provide a flat surface. Accordingly, the first capping layer CPL1 disposed on the low-refraction layer LR can have a flat surface.

[0148] The first capping layer CPL1 can be disposed on a surface of the low-refraction layer LR and cover the low-refraction layer LR. The first capping layer CPL1 can prevent impurities such as moisture and air from penetrating from the outside into the low-refraction layer LR or the color filter layer CFL, which can damage or contaminate the low-refraction layer LR and the light-blocking pattern BM as well as the color pattern areas of the color filter layer CFL.

[0149] The first capping layer CPL1 can include an inorganic material. According to some embodiments, the first capping layer CPL1 can include, but is not limited to, an inorganic material such as SiO2, SiNx, and SiON, and can be composed of a single layer or multiple layers.

[0150] The wavelength conversion layer WCL can be disposed on a surface of the first capping layer CPL1. The wavelength conversion layer WCL can include a bank BK, a first light-transmissive member TPL, a second light-transmissive member WCL1, a third light-transmissive member WCL2, and a second capping layer CPL2.

[0151] The bank BK can be disposed on opposite sides of the first capping layer CPL1 in the third direction DR3, and can be individually disposed on the second direction DR2 to form a space for accommodating the light-transmissive member. For example, the bank BK can define a space in which the light-transmissive member is disposed. The bank BK can be in direct contact with the opposite surface of the first capping layer CPL1 in the third direction DR3. The bank BK can surround the light-transmissive member when viewed from the top. The bank BK can overlap the non-emission area NELA and the light-blocking area BA. The bank BK can not overlap the first emission area ELA1, the second emission area ELA2, and the third emission area ELA3 and / or the first transmissive area TA1, the second transmissive area TA2, and the third transmissive area TA3. Figure 6

[0152] According to some embodiments, the bank BK can include, but is not limited to, a photocurable organic material or an organic material that is photocurable and includes a light-blocking material.

[0153] The first light-transmissive member TPL can coincide with the first transmissive area TA1, the second light-transmissive member WCL1 can coincide with the second transmissive area TA2, and the third light-transmissive member WCL2 can coincide with the third transmissive area TA3. The first light-transmissive member TPL, the second light-transmissive member WCL1, and the third light-transmissive member WCL2 can be referred to as a wavelength conversion layer WCL or a wavelength conversion material layer.

[0154] The first light-transmissive member TPL can be disposed in a space defined by the bank BK, and can coincide with the first emission area ELA1 and the first transmissive area TA1 in the third direction DR3. The first light-transmissive member TPL can be in direct contact with the first capping layer CPL1 and the bank BK.

[0155] The first light-transmissive member TPL can be a light-transmissive pattern that transmits incident light. The first light-transmissive member TPL can transmit the light of the first color emitted from the emission element layer EML as it is. Specifically, as described above, the emergent light provided from the first light emitting element is blue light, and can be transmitted through the first light-transmissive member TPL and the first color filter pattern area 321a of the first color filter 321 to be emitted to the outside of the display device 10. In other words, the first light L1 that is transmitted through the first transmissive area TA1 and emitted to the outside in the first emission area ELA1 can be blue light.

[0156] The first light-transmissive member TPL can include a base resin 330 and a light scattering body 331.

[0157] ​The base resin 330 can be made of an organic material having a high light transmittance. According to some embodiments, the base resin 330 can include, but is not limited to, an organic material such as an epoxy resin, an acrylic resin, a cardo resin, and an imide resin.

[0158] The light scatterer 331 can have a refractive index different from that of the base resin 330, and can form an optical interface with the base resin 330. The light scatterer 331 can be a light scattering particle. The light scatterer 331 can scatter light in a random direction without substantially changing the wavelength of the transmitted light, regardless of the direction in which the incident light is incident thereon.

[0159] The light scatterer 331 can be a material that scatters at least a portion of the transmitted light, and can include metal oxide particles or organic particles. According to some embodiments, the light scatterer 331 can include a metal oxide such as titanium oxide (TiO2), zirconium oxide (ZrO2), aluminum oxide (Al2O3), indium oxide (In2O3), zinc oxide (ZnO), and tin oxide (SnO2), and can include organic particles such as an acrylic resin and a polyurethane resin.

[0160] The second light-transmitting member WCL1 can be disposed in a space defined by the bank BK, and can coincide with the second emission area ELA2 and the second transmission area TA2 in the third direction DR3. The second light-transmitting member WCL1 can be in direct contact with the first capping layer CPL1 and the bank BK.

[0161] The second light-transmitting member WCL1 can convert or shift the peak wavelength of the incident light to another peak wavelength to output light having the other peak wavelength. The second light-transmitting member WCL1 can convert the first color light emitted from the emission element layer EML to the second color light to output the light. Specifically, as described above, the emergent light provided from the second light emitting element is blue light, and can be transmitted through the second light-transmitting member WCL1 and the second color filter pattern area 322a of the second color filter 322 to be converted to red light having a peak wavelength in the range of about 610 nm to about 650 nm, so that the light can be emergent to the outside of the display device 10. In other words, the second light L2 transmitted through the second transmission area TA2 and emergent to the outside in the second emission area ELA2 can be red light.

[0162] The second light-transmitting member WCL1 can include a base resin 330, a light scatterer 331 dispersed in the base resin 330, and a first wavelength shifter 332 dispersed in the base resin 330.

[0163] The first wavelength shifter 332 can convert or shift a peak wavelength of incident light to another peak wavelength. The first wavelength shifter 332 can convert blue light output from the second light emitting element to red light having a peak wavelength in a range of about 610 nm to about 650 nm, so that the red light exits.

[0164] According to some embodiments, the first wavelength shifter 332 can be a quantum dot, a quantum rod, or a phosphor, but the present disclosure is not limited thereto. In the following description, for convenience of explanation, the first wavelength shifter 332 is a quantum dot. The quantum dot can be a particulate matter that emits a color of light as an electron transitions from a conduction band to a valence band. The quantum dot can be a semiconductor nanocrystalline material. The quantum dot has a specific band gap according to its composition and size, and can absorb light and emit light having an inherent wavelength. Examples of the semiconductor nanocrystal of the quantum dot can include a group IV nanocrystal, a group II-VI compound nanocrystal, a group III-V compound nanocrystal, a group IV-VI nanocrystal, or a combination thereof.

[0165] The group II-VI compound can be selected from the group consisting of a binary compound selected from CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnO, HgS, HgSe, HgTe, MgSe, MgS, and a mixture thereof, a ternary compound selected from InZnP, AgInS, CuInS, CdSeS, CdSeTe, CdSTe, ZnSeS, ZnSeTe, ZnSTe, HgSeS, HgSeTe, HgSTe, CdZnS, CdZnSe, CdZnTe, CdHgS, CdHgSe, CdHgTe, HgZnS, HgZnSe, HgZnTe, MgZnSe, MgZnS, and a mixture thereof, and a quaternary compound selected from HgZnTeS, CdZnSeS, CdZnSeTe, CdZnSTe, CdHgSeS, CdHgSeTe, CdHgSTe, HgZnSeS, HgZnSeTe, HgZnSTe, and a mixture thereof.

[0166] III-V compounds can be selected from the group consisting of binary compounds selected from the group of GaN, GaP, GaAs, GaSb, AIN, AlP, AlAs, AlSb, InN, InP, InAs, InSb, and mixtures thereof, ternary compounds selected from the group of GaNP, GaNAs, GaNSb, GaPAs, GaPSb, AlNP, AlNAs, AlNSb, AlPAs, AlPSb, InGaP, InNP, InAlP, InNAs, InNSb, InPAs, InPSb, GaAlNP, and mixtures thereof, and quaternary compounds selected from the group of GaAlNAs, GaAlNSb, GaAlPAs, GaAlPSb, GaInNP, GaInNAs, GaInNSb, GaInPAs, GaInPSb, InAlNP, InAlNAs, InAlNSb, InAlPAs, InAlPSb, and mixtures thereof.

[0167] IV-VI compounds can be selected from the group consisting of binary compounds selected from the group of SnS, SnSe, SnTe, PbS, PbSe, PbTe, and mixtures thereof, ternary compounds selected from the group of SnSeS, SnSeTe, SnSTe, PbSeS, PbSeTe, PbSTe, SnPbS, SnPbSe, SnPbTe, and mixtures thereof, and quaternary compounds selected from the group of SnPbSSe, SnPbSeTe, SnPbSTe, and mixtures thereof. The IV element can be selected from the group consisting of Si, Ge, and mixtures thereof. The IV compound can be a binary compound selected from the group of SiC, SiGe, and mixtures thereof.

[0168] The binary, ternary, and / or quaternary compounds can be present in the particles at a uniform concentration or can be present at partially different concentrations in the same particle. The binary, ternary, and / or quaternary compounds can have a core / shell structure in which one quantum dot surrounds another quantum dot. At the interface between the core and the shell, a gradient of atomic concentration in the shell can decrease toward the center.

[0169] In some embodiments, the quantum dots can have a core-shell structure including a core comprising a nanocrystal and a shell surrounding the core. The shell of the quantum dot can serve as a protective layer for maintaining the semiconductor properties by preventing chemical degradation of the core and / or as a charging layer for imparting electrophoretic properties to the quantum dot. The shell can be a single layer or multiple layers. At the interface between the core and the shell, a gradient of atomic concentration in the shell can decrease toward the center. Examples of the shell of the quantum dot can include oxides of metals or non-metals, semiconductor compounds, combinations thereof, and the like.

[0170] For example, examples of the metal or non-metal oxide can include, but are not limited to, binary compounds such as SiO2, Al2O3, TiO2, ZnO, MnO, Mn2O3, Mn3O4, CuO, FeO, Fe2O3, Fe3O4, CoO, Co3O4, and NiO, or ternary compounds such as MgAl2O4, CoFe2O4, NiFe2O4, and CoMn2O4.

[0171] Examples of the semiconductor compound can include, but are not limited to, CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnSeS, ZnTeS, GaAs, GaP, GaSb, HgS, HgSe, HgTe, InAs, InP, InGaP, InSb, AlAs, AlP, AlSb, etc.

[0172] The light output from the first wavelength shifter 332 can have a full width at half maximum (FWHM) of an emission wavelength spectrum of about 45 nm or less, about 40 nm or less, or about 30 nm or less. Thus, the color purity and the color gamut of the color displayed by the display device 10 can be further improved. The light output from the first wavelength shifter 332 can travel in different directions regardless of the incident direction of the incident light. In this way, the side visibility of the second color displayed in the second transmission area TA2 can be improved.

[0173] A portion of the light output from the second light emitting element can be transmitted through the second light-transmissive member WCL1 to exit without being converted into red light by the first wavelength shifter 332. A component of the light whose wavelength is not converted by the second light-transmissive member WCL1 and is incident on the second color filter pattern area 322a of the second color filter 322 can be blocked by the second color filter pattern area 322a. On the other hand, the red light converted by the second light-transmissive member WCL1 can be transmitted through the second color filter pattern area 322a to exit to the outside. For example, the second light L2 that exits to the outside of the display device 10 through the second transmission area TA2 can be red light.

[0174] The third light-transmissive member WCL2 can be disposed in the space defined by the bank BK and can coincide with the third emission area ELA3 and the third transmission area TA3 in the third direction DR3. The third light-transmissive member WCL2 can be in direct contact with the first capping layer CPL1 and the bank BK.

[0175] The third light-transmitting member WCL2 can convert or shift a peak wavelength of incident light to another peak wavelength to output light having the other peak wavelength. Specifically, as described above, the emergent light provided from the third light-emitting element is blue light, and can be transmitted through the second light-transmitting member WCL1 and the second color filter pattern area 322a of the second color filter 322 to be converted to green light having a peak wavelength in a range of about 510 nm to about 550 nm, so that the light can be emitted to the outside of the display device 10. In other words, the third light L3 transmitted through the third transmission area TA3 and emitted to the outside in the third emission area ELA3 can be green light.

[0176] The third light-transmitting member WCL2 can include a base resin 330, light scatterers 331 dispersed in the base resin 330, and a second wavelength shifter 333 dispersed in the base resin 330.

[0177] The second wavelength shifter 333 can convert or shift a peak wavelength of incident light to another peak wavelength. The second wavelength shifter 333 can convert blue light output from the third light-emitting element to green light having a peak wavelength in a range of about 510 nm to about 550 nm, so that the green light is emitted. According to some embodiments, the second wavelength shifter 333 can be a quantum dot, a quantum rod, or a phosphor, but the present disclosure is not limited thereto. The second wavelength shifter 333 of the quantum dot can have substantially the same configuration as that of the first wavelength shifter 332 of the quantum dot as described above; and thus, a redundant description will be omitted for the sake of brevity.

[0178] A portion of light output from the third light-emitting element can be transmitted through the second light-transmitting member WCL1 to be emitted without being converted to green light by the second wavelength shifter 333. A component of light whose wavelength is not converted by the third light-transmitting member WCL2 and is incident on the third color filter pattern area 323a of the third color filter 323 can be blocked by the third color filter pattern area 323a. On the other hand, green light converted by the third light-transmitting member WCL2 can be transmitted through the third color filter pattern area 323a to be emitted to the outside. For example, the third light L3 emitted to the outside of the display device 10 through the third transmission area TA3 can be green light.

[0179] The second capping layer CPL2 can be disposed on the bank BK, the first light-transmitting member TPL, the second light-transmitting member WCL1, and the third light-transmitting member WCL2 to prevent impurities such as moisture and air from penetrating from the outside, thereby damaging or contaminating the first light-transmitting member TPL, the second light-transmitting member WCL1, and the third light-transmitting member WCL2. The second capping layer CPL2 can cover the first light-transmitting member TPL, the second light-transmitting member WCL1, and the third light-transmitting member WCL2.

[0180] The spacer layer SPC can be disposed on a surface of the second capping layer CPL2. The spacer layer SPC can maintain a cell gap between the substrate SUB and the opposing substrate TSUB. The spacer layer SPC can surround the light-transmissive member when viewed from the top. The spacer layer SPC can be disposed in conformity with the non-emissive area NELA and the light-blocking area BA. The spacer layer SPC can not overlap the first emissive area ELA1, the second emissive area ELA2, and the third emissive area ELA3 and / or the first transmissive area TA1, the second transmissive area TA2, and the third transmissive area TA3.

[0181] According to some embodiments, the spacer layer SPC can include, but is not limited to, a transparent organic material which is photocurable or an organic material which is photocurable and includes a light-blocking material. According to some embodiments, the spacer layer SPC can be made of, but is not limited to, at least one of an acrylic resin, a methacrylic resin, a polyisoprene, a vinyl resin, an epoxy resin, a urethane resin, a cellulose resin, a perylene resin, etc.

[0182] Incidentally, the filling layer FIL can be disposed between the opposing substrate TSUB and the substrate SUB. The filling layer FIL can be interposed between the wavelength conversion layer WCL and the thin film encapsulation layer TFEL to fill a space between the wavelength conversion layer WCL and the thin film encapsulation layer TFEL. Specifically, according to some embodiments, the filling layer FIL can be in direct contact with the upper inorganic layer TFE3 of the thin film encapsulation layer TFEL and the second capping layer CPL2 of the wavelength conversion layer WCL. However, it should be understood that the present disclosure is not limited thereto.

[0183] According to some embodiments, the filling layer FIL can be made of a material having an extinction coefficient of substantially zero. The refractive index and the extinction coefficient are related, and thus the refractive index can decrease as the extinction coefficient decreases. If the refractive index is about 1.7 or less, the extinction coefficient can converge to substantially zero. According to some embodiments, the filling layer FIL can be made of a material having a refractive index of about 1.7 or less. Thus, it is possible to prevent or reduce light provided by the spontaneous light emitting element from passing through the filling layer FIL and being absorbed. According to some embodiments, the filling layer FIL can be made of an organic material having a refractive index in the range of about 1.4 to about 1.6.

[0184] Figure 7 FIG. 1 is a cross-sectional view schematically illustrating a non-display area of a display device according to an embodiment. Figure 8 FIG. 2 is a plan view schematically illustrating a layout of an opening of a display device according to an embodiment. Figure 7 FIG. 3 is an enlarged view of a region A of FIG. 2. Figure 9 FIG. 4 is a cross-sectional view schematically illustrating a non-display area of a display device according to an embodiment. Figure 10 FIG. 5 is a cross-sectional view schematically illustrating a penetration path of moisture in a display device according to an embodiment.

[0185] In conjunction with Figure 6 Referring toFigures 7 to 10 In addition to the layer extending from the display area DPA, the first, second, third, and fourth separation walls BR1, BR2, BR3, and BR4 and the sealing member SEL can also be disposed in the non-display area NDA of the display device 10.

[0186] Specifically, the buffer layer 120, the first insulating layer 130, the second insulating layer 150, and the third insulating layer 155 can be disposed on the substrate SUB of the non-display area NDA. The buffer layer 120, the first insulating layer 130, the second insulating layer 150, and the third insulating layer 155 can extend to the side surface of the substrate SUB, and the side surface of the substrate SUB and the side surface of the buffer layer 120, the first insulating layer 130, the second insulating layer 150, and the third insulating layer 155 can be aligned with each other.

[0187] The connection line SDL can be disposed between the second insulating layer 150 and the third insulating layer 155. The connection line SDL can be a signal line connected to a thin film transistor in the display area DPA. According to some embodiments, the connection line SDL can be a gate line or a sensing line. According to some embodiments, the connection line SDL can be a routing line connected to a thin film transistor in the display area DPA.

[0188] The fourth insulating layer 160 can be disposed on the third insulating layer 155. The fourth insulating layer 160 can extend from the display area DPA to the non-display area NDA.

[0189] The auxiliary electrode AXL can be disposed on the fourth insulating layer 160. The auxiliary electrode AXL can be electrically connected to the cathode electrode CE extending from the display area DPA. The auxiliary electrode AXL can have the same structure as that of the anode electrode ANO described above. According to some embodiments, the auxiliary electrode AXL can be a second voltage line that applies a second voltage to the cathode electrode CE. According to some embodiments, the auxiliary electrode AXL can be a routing line that electrically connects a second power voltage pad to the cathode electrode CE.

[0190] The pixel definition layer 170 covering the auxiliary electrode AXL can be disposed on the fourth insulating layer 160. The pixel definition layer 170 can extend from the display area DPA to the non-display area NDA. The pixel definition layer 170 can include a contact hole exposing the underlying auxiliary electrode AXL.

[0191] The cathode electrode CE can be disposed on the pixel definition layer 170. The cathode electrode CE can extend from the display area DPA to the non-display area NDA. The cathode electrode CE can be electrically connected to the auxiliary electrode AXL through a contact hole formed in the fourth insulating layer 160. The contact hole can reduce contact resistance between the cathode electrode CE and the auxiliary electrode AXL.

[0192] First, second, third, and fourth partition walls BR1, BR2, BR3, and BR4 may be disposed on the third insulating layer 155. The first, second, third, and fourth partition walls BR1, BR2, BR3, and BR4 may prevent the organic layer TFE2 of the thin film encapsulation layer TFEL extending from the display area DPA from overflowing.

[0193] The first to fourth partition walls BR1, BR2, BR3, and BR4 may be sequentially arranged from the display area DPA to the non-display area NDA and may be spaced apart from each other.

[0194] The first partition wall BR1 may have a single-layer structure. The first partition wall BR1 may include the same material as that of the fourth insulating layer 160. The first partition wall BR1 may be formed by the same mask process as that of the fourth insulating layer 160.

[0195] The second partition wall BR2, the third partition wall BR3, and the fourth partition wall BR4 may each have a multi-layer structure. Each of the second partition wall BR2, the third partition wall BR3, and the fourth partition wall BR4 may include a first layer 165 and a second layer 175 stacked on the first layer 165. The first layer 165 may be directly disposed on the third insulating layer 155 and may include the same material as the fourth insulating layer 160. The first layer 165 may be formed using the same mask process as the fourth insulating layer 160. The second layer 175 may be directly disposed on the first layer 165 and may include the same material as the pixel defining layer 170. The second layer 175 may be formed using the same mask process as the pixel defining layer 170.

[0196] The thin film encapsulation layer TFEL may be arranged in the non-display area NDA extending from the display area DPA. The lower inorganic layer TFE1 and the upper inorganic layer TFE3 of the thin film encapsulation layer TFEL may cover the first partition wall BR1, the second partition wall BR2, the third partition wall BR3, and the fourth partition wall BR4. According to some embodiments, the lower inorganic layer TFE1 and the upper inorganic layer TFE3 completely cover the first partition wall BR1, the second partition wall BR2, and the third partition wall BR3, and may cover a portion of the fourth partition wall BR4. According to some embodiments, the lower inorganic layer TFE1 and the upper inorganic layer TFE3 completely cover the first partition wall BR1, the second partition wall BR2, the third partition wall BR3, and the fourth partition wall BR4.

[0197] The organic layer TFE2may be disposed between the lower inorganic layer TFE1and the upper inorganic layer TFE3to cover the first barrier rib BR1and the second barrier rib BR2. According to some embodiments, the organic layer TFE2may completely cover the first barrier rib BR1and partially cover the second barrier rib BR2.

[0198] The color filter layer CFL, the low-refraction layer LR, and the first capping layer CPL1may extend from the display area DPA and be disposed on a surface of the opposite substrate TSUB of the non-display area NDA. For example, the first color filter 321, the second color filter 322, the third color filter 323, the low-refraction layer LR, and the first capping layer CPL1may be sequentially stacked. The first color filter 321, the second color filter 322, the third color filter 323, the low-refraction layer LR, and the first capping layer CPL1may extend to the non-display area NDA and can be aligned with a side surface of the opposite substrate TSUB. However, it should be understood that the present disclosure is not limited thereto. The first color filter 321, the second color filter 322, the third color filter 323, the low-refraction layer LR, and the first capping layer CPL1may be spaced apart from the side surface of the opposite substrate TSUB.

[0199] The bank BK and the second capping layer CPL2may be disposed on the first capping layer CPL1. The bank BK and the second capping layer CPL2may extend from the display area DPA to the non-display area NDA. The second capping layer CPL2may cover the bank BK and the first capping layer CPL1.

[0200] The spacer layer SPC can be disposed on the second capping layer CPL2. The spacer layer SPC can extend from the display area DPA to the non-display area NDA. According to some embodiments, the spacer layer SPC can be in a pattern shape spaced apart from the display area DPA.

[0201] The filling layer FIL extending from the display area DPA can be disposed between the substrate SUB and the opposite substrate TSUB in the non-display area NDA. The filling layer FIL can be in contact with the upper inorganic layer TFE3and the third insulating layer 155, and can be in contact with the spacer layer SPC and the second capping layer CPL2. The filling layer FIL can be in contact with the sealing member SEL and can be accommodated in a space defined by the substrate SUB, the opposite substrate TSUB, and the sealing member SEL.

[0202] The color filter layer CFL disposed in the non-display area NDA can extend to a side of the opposing substrate TSUB. For example, sides of the first color filter 321, the second color filter 322, and the third color filter 323 can be aligned with a side of the opposing substrate TSUB. The opposing substrate TSUB on which the color filter layer CFL is formed can be attached to the substrate SUB, and then can be scribed. When the opposing substrate TSUB and the color filter layer CFL are scribed together, the side of each of the first color filter 321, the second color filter 322, and the third color filter 323 can be aligned with the side of the opposing substrate TSUB.

[0203] The color filter layer CFL can be exposed on a side of the display device 10. The color filter layer CFL can include an organic material, and thus can serve as a penetration path of moisture from the outside of the display device 10. When moisture penetrates from the color filter layer CFL, peeling can occur between the color filter layer CFL and the opposing substrate TSUB, or between the first color filter 321, the second color filter 322, and the third color filter 323. If moisture penetrates into the sealing member SEL through the color filter layer CFL, the sealing member SEL can be peeled.

[0204] According to an embodiment, to prevent the color filter layer CFL from serving as a penetration path of moisture, the color filter layer CFL can include a first opening OP1, a second opening OP2, and a third opening OP3.

[0205] Specifically, the first color filter 321 can include the first opening OP1, the second color filter 322 can include the second opening OP2, and the third color filter 323 can include the third opening OP3.

[0206] The first opening OP1 of the first color filter 321, the second opening OP2 of the second color filter 322, and the third opening OP3 of the third color filter 323 can be positioned in the non-display area NDA. For example, the first opening OP1, the second opening OP2, and the third opening OP3 can be positioned outside the display area DPA and on an outer side of the sealing member SEL. Since the first opening OP1, the second opening OP2, and the third opening OP3 are positioned on the outer side of the sealing member SEL, it is possible to prevent moisture from penetrating into the sealing member SEL through the color filter layer CFL, thereby preventing a peeling defect of the sealing member SEL.

[0207] In the first opening OP1, the second opening OP2, and the third opening OP3, the first color filter 321, the second color filter 322, and the third color filter 323 may be disconnected. For example, the first opening OP1 may be formed as a gap in which the first color filter 321 is disconnected and separated into a plurality of parts. The second opening OP2 may be formed as a gap in which the second color filter 322 is disconnected and separated into a plurality of parts. The third opening OP3 may be formed as a gap in which the third color filter 323 is disconnected and separated into a plurality of parts.

[0208] The first opening OP1 of the first color filter 321 may expose the surface of the counter substrate TSUB and may be filled with the second color filter 322. Therefore, the second color filter 322 may contact the surface of the counter substrate TSUB through the first opening OP1. The second opening OP2 of the second color filter 322 may expose the surface of the first color filter 321 and may be filled with the third color filter 323. Therefore, the third color filter 323 may contact the surface of the first color filter 321 through the second opening OP2. The third opening OP3 of the third color filter 323 may expose the surface of the second color filter 322 and may be filled with the low-refractive layer LR. Therefore, the low-refractive layer LR may contact the surface of the second color filter 322 through the third opening OP3.

[0209] like Figure 9 As shown in , when viewed from the top, each of the first opening OP1, the second opening OP2, and the third opening OP3 may have a closed loop shape. For example, the third opening OP3 may surround the sealing member SEL and the display area DPA and may have a closed loop shape. The second opening OP2 may surround the third opening OP3 and may have a closed loop shape. The first opening OP1 may surround the second opening OP2 and may have a closed loop shape.

[0210] When viewed from the top, the first opening OP1, the second opening OP2, and the third opening OP3 may be spaced apart from each other. For example, the first opening OP1, the second opening OP2, and the third opening OP3 may not overlap with each other in the third direction DR3. The first opening OP1, the second opening OP2, and the third opening OP3 may be spaced apart from each other at equal distances. For example, the gap G1 between the first opening OP1 and the second opening OP2 may be equal to the gap G2 between the second opening OP2 and the third opening OP3. According to some embodiments, the gaps between any two of the first opening OP1, the second opening OP2, and the third opening OP3 may be different. For example, the gap G1 between the first opening OP1 and the second opening OP2 may be greater than or smaller than the gap G2 between the second opening OP2 and the third opening OP3.

[0211] According to embodiments, the gap G1 between the first opening OP1 and the second opening OP2 and the gap G2 between the second opening OP2 and the third opening OP3 can be in the range of about 10 μm to about 100 μm. If the gap G1 between the first opening OP1 and the second opening OP2 and the gap G2 between the second opening OP2 and the third opening OP3 are equal to or greater than 10 μm, the first opening OP1, the second opening OP2, and the third opening OP3 are easily formed so as to be spaced apart from each other. If the gap G1 between the first opening OP1 and the second opening OP2 and the gap G2 between the second opening OP2 and the third opening OP3 are equal to or less than about 100 μm, it is possible to prevent an increase in the width of the non-display area NDA.

[0212] The first opening OP1 can be closest to the side surface of the opposing substrate TSUB and farthest from the display area DPA. The second opening OP2 can be disposed between the first opening OP1 and the display area DPA, between the first opening OP1 and the third opening OP3, and / or between the first opening OP1 and the sealing member SEL. The third opening OP3 can be positioned between the second opening OP2 and the display area DPA and / or between the second opening OP2 and the sealing member SEL.

[0213] The first opening OP1, the second opening OP2, and the third opening OP3 have a width W1, a width W2, and a width W3, respectively, in the first direction DR1. The width W1 of the first opening OP1, the width W2 of the second opening OP2, and the width W3 of the third opening OP3 can all be equal. According to some embodiments, the width W1 of the first opening OP1, the width W2 of the second opening OP2, and the width W3 of the third opening OP3 can be different from each other. In some embodiments, the width W1 of the first opening OP1 can be greater than the width W2 of the second opening OP2, and the width W2 of the second opening OP2 can be greater than the width W3 of the third opening OP3. According to some embodiments, the width W1 of the first opening OP1 can be less than the width W2 of the second opening OP2, and the width W2 of the second opening OP2 can be less than the width W3 of the third opening OP3.

[0214] The width W1 of the first opening OP1, the width W2 of the second opening OP2, and the width W3 of the third opening OP3 can be in the range of about 10 μm to about 20 μm. In the case where the width W1 of the first opening OP1, the width W2 of the second opening OP2, and the width W3 of the third opening OP3 are about 10 μm or more, it is possible to cut off a penetration path of moisture by separating the color filter. In the case where the width W1 of the first opening OP1, the width W2 of the second opening OP2, and the width W3 of the third opening OP3 are about 20 μm or less, it is possible to avoid deterioration of a light-blocking function of the color filter layer CFL in the non-display area NDA.

[0215] As Figure 10 illustrated in FIG. 32, the first color filter 321, the second color filter 322, and the third color filter 323 have the first opening OP1, the second opening OP2, and the third opening OP3, respectively, and can block a penetration path of moisture. For example, the penetration path of moisture through the first color filter 321 can be blocked at the first opening OP1, the penetration path of moisture through the second color filter 322 can be blocked at the second opening OP2, and the penetration path of moisture through the third color filter 323 can be blocked at the third opening OP3. Accordingly, it is possible to prevent the color filter layer CFL from being used as a penetration path of moisture, thereby suppressing peeling between the color filter layer CFL and the sealing member SEL.

[0216] Figures 11 to 13 is a cross-sectional view schematically illustrating a display device according to other embodiments. Figures 11 to 13 The area A of Figure 7 is illustrated.

[0217] Figures 11 to 13 Embodiments of the color filter layer 320 differ from the above-described embodiments in that the layout of the first opening OP1 of the first color filter 321, the second opening OP2 of the second color filter 322, and the third opening OP3 of the third color filter 323 is different. The following description will focus on the difference, and redundant descriptions will be omitted for the sake of brevity.

[0218] Referring to Figure 11 , the third opening OP3 of the third color filter 323 can be positioned between the first opening OP1 of the first color filter 321 and the second opening OP2 of the second color filter 322.

[0219] The second opening OP2 can surround the sealing member SEL and the display area DPA. The third opening OP3 can surround the second opening OP2, and the first opening OP1 can surround the third opening OP3.

[0220] The first opening OP1 can be closest to a side of the opposing substrate TSUB and farthest from the display area DPA. The third opening OP3 can be positioned between the first opening OP1 and the display area DPA, between the first opening OP1 and the second opening OP2, and / or between the first opening OP1 and the sealing member SEL. The second opening OP2 can be positioned between the third opening OP3 and the display area DPA and / or between the third opening OP3 and the sealing member SEL.

[0221] Referring to Figure 12 , unlike Figure 11 , the first opening OP1 of the first color filter 321 can be positioned between the second opening OP2 of the second color filter 322 and the third opening OP3 of the third color filter 323.

[0222] The third opening OP3 may surround the sealing member SEL and the display area DPA. The first opening OP1 may surround the third opening OP3, and the second opening OP2 may surround the first opening OP1.

[0223] The second opening OP2 may be closest to the side of the counter substrate TSUB and farthest from the display area DPA. The first opening OP1 may be positioned between the second opening OP2 and the display area DPA, between the second opening OP2 and the third opening OP3, and / or between the second opening OP2 and the sealing member SEL. The third opening OP3 may be positioned between the first opening OP1 and the display area DPA and / or between the first opening OP1 and the sealing member SEL.

[0224] However, it should be understood that the present disclosure is not limited thereto. When viewed from the top, the first opening OP1 of the first color filter 321 may be arranged closest to the sealing member SEL, the second opening OP2 of the second color filter 322 may be arranged closest to the side of the counter substrate TSUB, and the third opening OP3 of the third color filter 323 may be arranged between the first opening OP1 and the second opening OP2.

[0225] and Figure 11 and Figure 12 Different, reference Figure 13 At least two of the first opening OP1 of the first color filter 321, the second opening OP2 of the second color filter 322, and the third opening OP3 of the third color filter 323 may overlap with each other in the third direction DR3. For example, the first opening OP1 and the third opening OP3 may overlap with each other in the third direction DR3. When viewed from the top, the first opening OP1 and the third opening OP3 may be aligned with each other and overlap. However, it should be understood that the present disclosure is not limited to this. The second opening OP2 and the third opening OP3 may overlap with each other in the third direction DR3.

[0226] According to an embodiment of the present disclosure, the first opening OP1 may overlap with the third opening OP3, and the first opening OP1 and the third opening OP3 may not overlap with the second opening OP2. For example, two of the first opening OP1, the second opening OP2, and the third opening OP3 may overlap with each other, while the other opening may not overlap with the two openings.

[0227] As described above, the display device 10 according to this embodiment includes first, second, and third openings OP1, OP2, and OP3 in the color filter layer CFL, thereby blocking moisture from penetrating the color filter layer CFL. This prevents delamination of the color filter layer CFL and prevents degradation of the black level in the non-display area (NDA). By reducing delamination of the seal member SEL, degradation of the packaging performance of the display device 10 can be prevented.

[0228] At the conclusion of the detailed description, those skilled in the art will appreciate that the application can be practiced by employing the enumerated embodiments in the written description and examples below. In the foregoing and in the examples, all temperatures are in degrees Celsius (°C) unless otherwise indicated. Temperatures, pressure, and other physical conditions are those at which the reactions are carried out, unless otherwise indicated. The numerical ranges in this disclosure are approximate, meaning that they are intended to be used in a flexible and open-ended way. For example, a numerical range of "1 to 5" is intended to include "1 to 5" as well as "1

Claims

1. A display device, characterized in that: include: an emission element layer, the emission element layer being arranged on a display area of ​​a substrate having a display area and a non-display area; an opposing substrate facing the substrate; a color filter layer arranged on a surface of the counter substrate facing the substrate, the color filter layer including a first color filter, a second color filter, and a third color filter that transmit different lights; as well as a sealing member disposed between the substrate and the opposing substrate and coupling the substrate and the opposing substrate, Wherein, each of the first color filter, the second color filter, and the third color filter includes an opening in the non-display area.

2. The display device according to claim 1, wherein The first color filter is arranged on the surface of the counter substrate, the second color filter is arranged on a surface of the first color filter, and the third color filter is arranged on a surface of the second color filter.

3. The display device according to claim 1, wherein The first color filter includes a first opening, the second color filter includes a second opening, and the third color filter includes a third opening, and Wherein, each of the first opening, the second opening and the third opening has a closed loop shape surrounding the display area.

4. The display device according to claim 3, wherein: The third opening surrounds the display area, The second opening surrounds the third opening, and The first opening surrounds the second opening.

5. The display device according to claim 3, wherein The first opening, the second opening, and the third opening do not overlap with each other in a thickness direction of the display device.

6. The display device according to claim 3, wherein: Two of the first opening, the second opening, and the third opening overlap with each other in a thickness direction of the display device.

7. The display device according to claim 1, wherein The opening of the color filter layer is arranged between a side surface of the counter substrate and the sealing member.

8. The display device according to claim 1, wherein Sides of the first, second, and third color filters are aligned with a side of the opposing substrate.

9. The display device according to claim 3, wherein: The first opening is arranged adjacent to a side surface of the opposing substrate, the second opening is arranged adjacent to the display area, and the third opening is arranged between the first opening and the second opening.

10. The display device according to claim 3, wherein The second opening is arranged adjacent to a side surface of the opposing substrate, the third opening is arranged adjacent to the display area, and the first opening is arranged between the second opening and the third opening.

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