Automatic tin coating tool for SOP (Small Outline Package) device

Abstract

The utility model discloses an automatic tinning tool for SOP packaging devices, which comprises SOP reverse loading plates, SOP loading plate pressing plates and a supporting mechanism, a plurality of SOP reverse loading plates are laterally fixed on the supporting mechanism, the SOP reverse loading plates are provided with a plurality of accommodating cabins corresponding to the sizes of devices to be tinned, the accommodating cabins are used for placing and limiting the devices to be tinned, and the SOP loading plate pressing plates are used for pressing the devices to be tinned. Pins of the device extend out of the containing bin, and the SOP carrying plate pressing plate is pressed on the SOP reverse carrying plate to fix the device. By using the tool, the consistency of tin coating of pins of a whole batch of components can be ensured, tin coating operation can be carried out on a plurality of electronic components at the same time, the tin coating production efficiency can be effectively improved, the operation is simple, the requirement for the technical level of workers is low, and the labor cost can be effectively reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to a kind of frock, specifically a kind of automatic tin-lining frock of SOP packaging device. BACKGROUND

[0002] SOP back-end process steps are: injection molding, laser typing, high-temperature curing, overflow / electroplating, electroplating annealing, cutting rib / forming, inspection. The electroplating process is to use metal and chemical methods to plate a layer of metal coating on the surface of Lead Frame to prevent the influence of external environment (moisture and heat). The cutting rib / forming process is to cut a piece of Lead Frame into individual Unit (IC) first, and then to perform pin forming on single IC product to achieve the shape required by process. As can be seen from the specific operation steps of electroplating and cutting rib / forming, the electroplating protective layer will be correspondingly thinned due to the extrusion of the mold at the bending part of the single IC pin, and the cutting rib cross section will be completed without electroplating protective layer, which leaves a hidden danger for IC pin oxidation.

[0003] High humidity is an important reason for the formation of oxide layer. In most cases, the SOP packaged ICs purchased by electronic product manufacturers are not used immediately, but are stored in the warehouse in advance for backup. The inventory environment does not meet the requirements for storing devices, lacks corresponding dehumidification equipment, or the warehouse is in a humid environment for a long time. Therefore, the devices in the environment for a long time will inevitably absorb moisture and oxidize, resulting in a decrease in solderability.

[0004] Currently, tin-lining process equipment generally uses two types of soldering iron and tin pot, both of which use manual clamping of electronic components for tin lining. Manual tin lining has low production efficiency, and there are many uncertainties in manual clamping, such as the requirement in the aerospace industry standard QJ3267-2006 "Electronic Component Tin Lining Process Technical Requirements" that the non-tin lining length of the root of the electronic component should be greater than 2 mm. Manual operation cannot guarantee this requirement, and it is also impossible to guarantee the consistency of the tin lining of the pins of electronic components. UTILITY MODEL CONTENTS

[0005] To solve the above technical problems, the utility model provides an automatic tin-lining frock for SOP packaging devices, and the technical solution is as follows.

[0006] An automatic tin-lining frock for SOP packaging devices includes SOP reverse carrier plates, SOP carrier plate pressing plates, and a support mechanism. The support mechanism has a plurality of SOP reverse carrier plates fixed on the upper side. The SOP reverse carrier plates have a plurality of accommodation cavities corresponding in size to the devices to be tin-lined. The accommodation cavities hold and position the devices to be tin-lined, with the pins of the devices extending outside the accommodation cavities. The SOP carrier plate pressing plates are pressed against the SOP reverse carrier plates to fix the devices.

[0007] Further, the SOP reverse carrier plate and the carrier plate pressing strip oppositely arranged have a plurality of pairs of suction magnets.

[0008] Further, the SOP reverse carrier plate is detachably mounted on the supporting mechanism.

[0009] Further, the supporting mechanism is provided with clamping blocks in pairs through screws, and the distance between the clamping blocks is consistent with the thickness of the SOP reverse carrier plate and the SOP carrier plate pressing plate.

[0010] Further, the depth of the accommodating bin is consistent with the thickness of the tin-coating device to be prepared.

[0011] Further, the width of the accommodating bin is consistent with the width of the tin-coating device to be prepared.

[0012] Compared with the prior art, the present application has the following beneficial effects: 1. The SOP component is placed in the accommodating bin of the SOP reverse carrier plate, and the pressing strip is pressed on the tin-coating SOP packaging device by magnetic attraction, only the pin is left on the outside, and the pin has the same length. The selective wave soldering can adjust the vertical and horizontal welding directions, so that the tin-coating length of the whole batch of electronic components is consistent, and the consistency of the tin-coating of the whole batch of electronic components is ensured. 2. The present application can tin-coat multiple electronic components at a time, which can effectively improve the tin-coating production efficiency. The operation is simple, which can further improve the tin-coating production efficiency, and the technical level of the workers is low, which can effectively reduce the labor cost. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 is a structural schematic view of the present application.

[0014] Figure 2 is a SOP reverse carrier plate and an accommodating bin.

[0015] Figure 3 is a carrier plate pressing plate.

[0016] Figure 4 is a SOP packaging device schematic view.

[0017] 1 is a SOP reverse carrier plate, 2 is a carrier plate pressing plate, 3 is a supporting mechanism, 4 is a magnet, 5 is a SOP accommodating bin, 6 is a carrier plate, 7 is a magnet, and 8 is a pressing plate. DETAILED DESCRIPTION

[0018] The technical scheme of the present application will be further explained below with reference to the drawings.

[0019] As Figure 1 , Figure 2 , Figure 3 ,Figure 4 The application discloses an automatic tin filling device for SOP encapsulated devices, which comprises SOP reverse carrier plates, SOP carrier plate pressing plates and a supporting mechanism, the supporting mechanism is laterally fixed with a plurality of SOP reverse carrier plates, the SOP reverse carrier plates are provided with a plurality of accommodating cavities corresponding to the sizes of devices to be tin filled, the accommodating cavities are used for placing and limiting the devices to be tin filled, and the device pins are arranged outside the accommodating cavities, and the SOP carrier plate pressing plates are used for pressing the devices on the SOP reverse carrier plates.

[0020] A plurality of pairs of magnetism-attracting magnets are oppositely arranged on the SOP reverse carrier plates and the carrier plate pressing strips. The SOP reverse carrier plates are detachably mounted on the supporting mechanism. A plurality of clamping blocks are mounted on the supporting mechanism in pairs through screws, the distance between the clamping blocks is consistent with the thickness of a group of the SOP reverse carrier plates and the SOP carrier plate pressing plates. The depth of the accommodating cavities is consistent with the thickness of the devices to be tin filled. The width of the accommodating cavities is consistent with the width of one group or a plurality of groups of the devices to be tin filled.

[0021] In use, the SOP device pins are placed in the accommodating cavities of the "SOP device reverse carrier plates" in the device in an upward direction, the cover plates in the device are covered, the two devices are connected through the magnets, the two devices are tightly combined, the whole tightly combined device is placed on the supporting mechanism, the device fixed in a lateral direction is placed in a wave soldering machine, and automatic tin filling operation is carried out through a previously programmed procedure. Figure 2 Figure 3 The device used for tin filling is a selective wave soldering machine, the device is provided with a programmable condition and is capable of controlling horizontal and vertical movement. The carrier plate provided with the SOP components is placed on the supporting mechanism, and then is placed in the device, the tin filling depth and speed are controlled by adjusting the vertical descending depth and the horizontal moving speed of the device.

[0022] Compared with the traditional tin pot tin filling method, the tin filling efficiency of the device is obviously improved, and the tin filling effect of the device is obviously better than that of the traditional method when the components with poor weldability are used.​

Claims

1. An automatic soldering tool for SOP package devices, characterized in that, The application relates to a SOP reverse carrier plate, a SOP carrier plate pressing plate and a supporting mechanism, the upper side of the supporting mechanism is fixed with a plurality of SOP reverse carrier plates, a plurality of accommodating cavities corresponding to the size of devices to be tin-coated are formed in the SOP reverse carrier plates, the devices to be tin-coated are placed in the accommodating cavities and are limited, and the device pins are arranged outside the accommodating cavities, and the SOP carrier plate pressing plate is pressed on the SOP reverse carrier plate to fix the devices.

2. The automatic soldering apparatus for SOP package device according to claim 1, wherein, A plurality of pairs of suction magnets are oppositely arranged on the SOP reverse carrier plate and the carrier plate pressing strip.

3. The automatic soldering apparatus for SOP package devices according to claim 1, wherein The SOP reverse carrier plate is detachably mounted on the supporting mechanism.

4. The automatic soldering apparatus for SOP package device according to claim 3, wherein, A pair of clamping blocks are mounted on the supporting mechanism through screws, the distance between the clamping blocks is consistent with the thickness of a group of SOP reverse carrier plates and SOP carrier plate pressing plates.

5. The automatic soldering apparatus for SOP package devices according to claim 1, wherein The depth of the accommodating cavities is consistent with the thickness of the devices to be tin-coated.

6. The automatic soldering apparatus for SOP package device according to claim 5, wherein, The width of the accommodating cavities is consistent with the width of one group or a plurality of groups of the devices to be tin-coated.

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