RISER card group, RISER module and server
By designing RISER card arrays and module brackets, the problems of simple RISER card structure and redundant cables were solved, enabling flexible configuration and cost optimization to meet the needs of modular servers.
Patent Information
- Application Number
- CN202423163434.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-20
- Publication Date
- 2025-10-31
- Estimated Expiration
- 2034-12-20
AI Technical Summary
Existing RISER cards have a simple configuration structure, redundant connection cables, occupy a lot of external space, increase production and maintenance costs, and cannot be adapted to modular servers.
Design a RISER card deck including a main expansion card and a secondary expansion card, adopting MCIO cable connectors and independent power supply design, supporting PCIe 5.0 speed, transmitting signals through gold fingers and MCIO connectors, and installing through a module bracket, optimizing cable clutter and heat dissipation airflow.
It enables flexible configuration based on actual needs, reduces redundant connection cables, optimizes chassis heat dissipation, and lowers production and maintenance costs.
Smart Images
Figure CN223501362U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of computer technology, specifically a RISER card set, RISER module and server. Background Technology
[0002] In the server application field, RISE cards, as a common hardware expansion device, play a crucial role in meeting the diverse upgrade and expansion needs of users. A RISE card is a hardware device used to expand motherboard slots. It typically employs a flexible circuit board design, allowing certain motherboard slots to be extended to other locations within the chassis to connect more devices. With the continuous evolution of server architecture and the PCIe protocol, RISE cards also require continuous upgrades and improvements in structural design and high-speed signal interconnect design to adapt to new server architectures. This paper presents a composable RISE solution that is compatible with new server architectures.
[0003] like Figure 1 The existing RISER solution can be directly installed via two gold fingers. Figure 3 On the server motherboard shown, one set of gold fingers provides the low-speed signals required by the PCIe x16 lanes and the RISER card; another set of gold fingers provides P12V, P3V3, and P3V3STBY power to the RISER card. The other upstream PCIe ports of the RISER card are connected to the motherboard's MCIO connectors via 3*MCIO connectors. Figure 2 The existing RISE solution shown connects the RISE's upstream PCIe ports to the motherboard's MCIO connector via MCIO. The RISE's power and low-speed signals are connected to the motherboard via low-speed cables. Figure 3 The existing RISER solution shown has the PCIe high-speed signal, power supply and low-speed signal required by the RISER directly connected to the RISER PCB by bonding wires on the RISER side, and the other end of the cable is connected to the motherboard through a connector.
[0004] Figure 1 , Figure 2 The two RISER schemes shown are mainly used in applications such as Figure 3In the existing general-purpose 2U server shown in Figure 5, in Scheme 1, the RISER retains one x16 CEM slot gold finger and one power gold finger. This scheme requires the server motherboard to provide corresponding x16 CEM slot slots and power gold finger slots, but the modular motherboard shown in Figure 5 no longer retains these slots, so it cannot be supported. For Scheme 2, since its high-speed signals, low-speed sideband signals, power supply, etc. all use cable connectors, this scheme will result in messy chassis cables, which will have an adverse effect on chassis heat dissipation. At the same time, due to space and structural limitations, both of the above RISER schemes have two MCIO connectors located at the edge of the board. If applied to a rear-fan chassis, cable management space will be severely limited. For Scheme 3, since all RISER signals are soldered to the PCB by wire bonding, the cost of manual wire bonding is much higher than the cost of connector solutions.
[0005] exist Figure 4 In the modular server layout shown, the fan module is located near the rear window of the chassis and mounted above the power supply board. The fan module is also close to the RISE card; placing the MCIO connector next to the RISE board would make cable management difficult. The server motherboard uses... Figure 5 The modular design scheme shown, after the power board adopts a low-cost material design, due to the influence of structure and SI parameters, this architecture no longer supports the RISER card to use PCIE x16 Slot gold finger design, and the RISER card can only select MCIO cable connection for uplink PCIE, etc.
[0006] In summary, existing RISER cards have a simple configuration structure and require excessively complex connecting cables, resulting in a large amount of external space being occupied and increasing production and subsequent maintenance costs. Utility Model Content
[0007] To address the high costs resulting from the simple structure and cumbersome cables of existing RISER cards, this invention provides a RISER card set, a RISER module, and a server.
[0008] This utility model is achieved through the following technical solution:
[0009] A RISER card deck includes a main expansion card and a secondary expansion card; the main expansion card is provided with an MCIO X8 connector, a PCIE x16 CEM standard slot, a PCIe x8 CEM standard slot, a first gold finger, and a second gold finger;
[0010] The MCIO X8 connector transmits uplink signals to the main expansion card; the PCIE x16 CEM standard slot and PCIEx8 CEM standard slot transmit downlink signals to the main expansion card.
[0011] The first gold finger is used to connect to the motherboard card; the second gold finger is used to connect to the secondary expansion card;
[0012] The secondary expansion card is equipped with an expansion connector, a PCIe x16 standard slot, and a soldering area.
[0013] The expansion connector can be connected to the second gold finger;
[0014] The PCIE x16 standard slot transmits downlink signals to the secondary expansion card;
[0015] The bonding area transmits uplink signals to the sub-expansion card via an MCIO cable.
[0016] It can be flexibly configured according to actual expansion needs, and helps to reduce the complexity of the connection cables required for this card set, as well as optimize the chassis heat dissipation airflow, thus forming a cost advantage.
[0017] A further improvement of this invention is that the main expansion card adopts an MCIO cable connector solution.
[0018] A further improvement of this utility model is that the above-mentioned MCIO X8 connector is provided in three parts, and the three MCIO X8 connectors form x24 lanes.
[0019] A further improvement of this invention is that the aforementioned PCIE x16 CEM standard slot and PCIEx8 CEM standard slot can support a speed of PCIE 5.0, and both support 75W power consumption daughter cards.
[0020] A further improvement of this utility model is that the first gold finger draws power from the motherboard card and supplies power to the main expansion card and the sub-expansion card.
[0021] A further improvement of this utility model is that the first gold finger adopts a 14-pin design, and a single pin can support a maximum current of 5A. Eleven pins of the first gold finger are used as P12V power pins to power the main expansion card and the sub-expansion card. The remaining three pins of the first gold finger can transmit Throttle and I2C signals to the main expansion card and the sub-expansion card.
[0022] A further improvement of this invention is that the aforementioned PCIE x16 CEM standard slot and PCIEx8 CEM standard slot adopt an independent power supply design and can be expanded to support SMART NIC cards.
[0023] A further improvement of this invention is that the second gold finger adopts a 14-pin design, of which 4 pins are P12V and P3V3STBY power pins, and a single power pin can support a maximum current of 9A; the remaining 10 pins of the second gold finger are signal pins, which can transmit I2C and Throttle signals to the bonding area.
[0024] A RISER module includes a module bracket body, wherein the RISER card set is mounted on the module bracket body by fasteners.
[0025] A server comprising the aforementioned RISER module.
[0026] As can be seen from the above technical solutions, the beneficial effects of this utility model are: it can be flexibly configured according to actual expansion needs, and it helps to improve the complexity of the connection cables required by this card set, as well as optimize the heat dissipation airflow of the chassis, thus forming a cost advantage. Attached Figure Description
[0027] To more clearly illustrate the technical solution of this utility model, the drawings used in the description will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0028] Figure 1 This is a schematic diagram of the existing RISER scheme 1.
[0029] Figure 2 This is a schematic diagram of the existing RISER scheme 2.
[0030] Figure 3 This is a schematic diagram of the existing RISER scheme 3.
[0031] Figure 4 This is a schematic diagram of the existing server chassis layout.
[0032] Figure 5 This is a schematic diagram of an existing modular server motherboard.
[0033] Figure 6 This is a schematic diagram of the first structure of the main expansion card according to a specific embodiment of the present invention.
[0034] Figure 7 This is a schematic diagram of the second structure of the main expansion card in a specific embodiment of this utility model.
[0035] Figure 8 This is a functional block diagram of the main expansion card according to a specific embodiment of this utility model.
[0036] Figure 9 This is a schematic diagram of the first structure of the secondary expansion card according to a specific embodiment of the present invention.
[0037] Figure 10 This is a schematic diagram of the second structure of the sub-expansion card according to a specific embodiment of this utility model.
[0038] Figure 11 This is a functional block diagram of the secondary expansion card according to a specific embodiment of this utility model.
[0039] Figure 12 This is a schematic diagram of the RISER module structure according to a specific embodiment of the present invention.
[0040] In the attached diagram: 10, main expansion card; 11, first gold finger; 12, second gold finger; 20, secondary expansion card; 21, expansion connector; 22, soldering area; 30, module bracket body. Detailed Implementation
[0041] To make the objectives, features, and advantages of this utility model more apparent and understandable, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings of the specific embodiments. Obviously, the embodiments described below are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this patent, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this patent.
[0042] like Figure 6-11 As shown, a RISER card deck includes a main expansion card 10 and a secondary expansion card 20 disposed above the main expansion card 10.
[0043] like Figure 6-8 As shown, the main expansion card 10 adopts the MCIO cable connector solution.
[0044] like Figure 6-8 As shown, the main expansion card 10 is provided with an MCIO x8 connector, a PCIE x16 CEM standard slot, a PCIe x8 CEM standard slot, a first gold finger 11, and a second gold finger 12. The first gold finger 11 is located on the bottom edge of the main expansion card 10 and is used to connect to the motherboard card. The second gold finger 12 is located on the top edge of the main expansion card 10 and is used to connect to the sub-expansion card 20. The second gold finger 12 is connected to the sub-expansion card 20 through an expansion connector 21. The MCIO x8 connector is located on one side of the main expansion card 10, and the PCIE x16 CEM standard slot and the PCIe x8 CEM standard slot are located on the other side of the main expansion card 10.
[0045] like Figure 8As shown, the first gold finger 11 draws power from the motherboard and supplies power to the main expansion card 10 and the secondary expansion card 20. The first gold finger 11 adopts a 14-pin design, with a maximum current of 5A per pin. Eleven pins of the first gold finger 11 are used as P12V power pins to supply power to the main expansion card 10 and the secondary expansion card 20; the remaining three pins of the first gold finger 11 can transmit Throttle and I2C signals to the main expansion card 10 and the secondary expansion card 20.
[0046] like Figure 8 As shown, the PCIE x16 CEM standard slot and PCIEx8 CEM standard slot adopt an independent power supply design and can be expanded to support SMART NIC cards.
[0047] like Figure 8 As shown, the second gold finger 12 adopts a 14-pin design, of which 4 pins are P12V and P3V3STBY power pins, and a single power pin can support a maximum current of 9A; the remaining 10 pins of the second gold finger 12 are signal pins, which can transmit power for I2C and Throttle signals to the bonding area 22.
[0048] like Figure 8 As shown, the MCIO X8 connector transmits uplink signals to the main expansion card 10; there are three MCIO X8 connectors, and the three MCIO X8 connectors form a x24 lane. The signals are directly connected to the PCIe standard slot through the MCIO X8 connectors, mainly transmitting PCIe, WAKE, PERST, CLK and other signals.
[0049] like Figure 8 As shown, the PCIE x16 CEM standard slot and PCIEx8 CEM standard slot transmit downlink signals to the main expansion card 10; the PCIE x16 CEM standard slot and PCIEx8 CEM standard slot can support a PCIE 5.0 speed, and both support 75W power consumption daughter cards.
[0050] like Figure 9-11 As shown, the secondary expansion card 20 adopts an MCIO cable soldering scheme. The secondary expansion card 20 is equipped with an expansion connector 21, a PCIE x16 standard slot, and a soldering area 22.
[0051] like Figure 11As shown, the PCIe x16 standard slot transmits downlink signals to the secondary expansion card 20; the PCIe x16 standard slot supports a speed of PCIe 5.0. The P12V and P3V3STBY power supplies required by the PCIe x16 standard slot, and the low-speed management signals are provided by the second gold finger 12. The uplink signals are directly soldered to the soldering area 22 via the MCIO cable.
[0052] like Figure 11 As shown, the bonding area 22 transmits uplink signals to the sub-expansion card 20 via an MCIO cable. One end of the MCIO cable is soldered to the bonding area 22, and the other end is connected to the motherboard MCIO connector.
[0053] like Figure 12 As shown, a RISER module includes a module support body 30, and the RISER card set is mounted on the module support body 30 by fasteners.
[0054] Specifically, the main expansion card 10 and the secondary expansion card 20 are mounted on the module bracket body 30 from bottom to top by fastening bolts; the side of the main expansion card 10 with the MCIO X8 connector faces away from the module bracket body 30; the side of the secondary expansion card 20 with the soldering area 22 faces away from the module bracket body 30.
[0055] A server comprising the aforementioned RISER module.
[0056] The RISER card set, RISER module and server described in this invention can be flexibly configured according to actual expansion needs, and can help reduce the complexity of the connection cables required by the card set, as well as optimize the heat dissipation airflow of the chassis, thus forming a cost advantage.
[0057] The various embodiments in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.
[0058] The terms "upper," "lower," "outer," "inner," etc., used in the specification, claims, and accompanying drawings of this utility model, are used to distinguish relative positional relationships and are not necessarily qualitative. It should be understood that such data can be interchanged where appropriate so that embodiments of the utility model described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.
[0059] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A RISER card deck, comprising a main expansion card (10) and a secondary expansion card (20); characterized in that, The main expansion card (10) is provided with an MCIO X8 connector, a PCIE x16 CEM standard slot, a PCIe x8 CEM standard slot, a first gold finger (11), and a second gold finger (12); the MCIO X8 connector transmits uplink signals to the main expansion card (10); the PCIE x16 CEM standard slot and the PCIe x8 CEM standard slot transmit downlink signals to the main expansion card (10); the first gold finger (11) is used to connect to the motherboard card; the second gold finger (12) is used to connect to the sub-expansion card (20); the sub-expansion card (20) is provided with an expansion connector (21), a PCIE x16 standard slot, and a soldering area (22); the expansion connector (21) can be connected to the second gold finger (12); the PCIE x16 standard slot transmits downlink signals to the sub-expansion card (20); the soldering area (22) transmits uplink signals to the sub-expansion card (20) through an MCIO cable.
2. A RISER card deck according to claim 1, characterized in that, The main expansion card (10) adopts the MCIO cable connector solution.
3. A RISER card deck according to claim 2, characterized in that, The MCIO X8 connector is provided in three parts, and the three MCIO X8 connectors form x24 lanes.
4. A RISER card deck according to claim 3, characterized in that, The PCIE x16 CEM standard slot and PCIEx8 CEM standard slot support PCIE 5.0 speeds and both support 75W power consumption daughter cards.
5. A RISER card deck according to claim 4, characterized in that, The first gold finger (11) draws power from the motherboard and supplies power to the main expansion card (10) and the secondary expansion card (20).
6. A RISER card deck according to claim 5, characterized in that, The first gold finger (11) adopts a 14-pin design, and a single pin can support a maximum current of 5A. 11 pins of the first gold finger (11) are used as P12V power pins to power the main expansion card (10) and the sub-expansion card (20). The remaining 3 pins of the first gold finger (11) can transmit signals to the main expansion card (10) and the sub-expansion card (20).
7. A RISER card deck according to claim 6, characterized in that, The PCIE x16 CEM standard slot and PCIEx8 CEM standard slot adopt an independent power supply design and can be expanded to support SMART NIC cards.
8. A RISER card deck according to claim 6, characterized in that, The second gold finger (12) adopts a 14-pin design, of which 4 pins are P12V and P3V3STBY power pins, and a single power pin can support a maximum current of 9A; the remaining 10 pins of the second gold finger (12) can transmit signals to the bonding area (22).
9. A RISER module, characterized in that, The RISER card set, as described in any one of claims 1 to 8, is mounted on the module bracket body (30) by fasteners.
10. A server, characterized in that, Includes the RISER module as described in claim 9.