Electronic equipment
By placing a buffer between the sound cavity and the housing behind the sound-emitting device of the electronic device, the noise problem caused by user pressing is solved, and the external sound effect is improved.
Patent Information
- Application Number
- CN202422867519.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-22
- Publication Date
- 2025-10-31
- Estimated Expiration
- 2034-11-22
AI Technical Summary
Users may accidentally press on the outer casing of electronic devices, causing deformation, noise, and affecting the external speaker performance.
A buffer is provided between the rear sound cavity of the sound-generating device and the first cavity of the housing. The buffer has an air gap to extend the gas flow path and absorb noise.
It effectively reduces noise caused by shell deformation and improves the external speaker performance of electronic devices.
Smart Images
Figure CN223502894U_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the field of electronic equipment technology, and more particularly to an electronic device. Background Technology
[0002] With the continuous development of electronic device technology, mobile electronic devices such as mobile phones have become the most common electronic products in people's daily lives.
[0003] Users have increasingly higher demands for the external speaker performance of mobile phones and other devices. However, if users accidentally press the outer casing of the electronic device while using it, causing deformation, it can lead to noise and affect the external speaker experience. Utility Model Content
[0004] To overcome the problems existing in the related technologies, this disclosure provides an electronic device.
[0005] According to an embodiment of this disclosure, an electronic device is provided, comprising:
[0006] The shell defines the first cavity;
[0007] A sound-generating device is disposed within the first cavity, and the sound-generating device has a rear sound cavity;
[0008] A buffer element having an air gap is disposed on the communication passage between the rear acoustic cavity and the first cavity, and the rear acoustic cavity is connected to the first cavity through the air gap.
[0009] In some embodiments, the sound-generating device includes a rear cavity cover plate for separating the first cavity from the rear sound cavity;
[0010] The buffer is disposed on the side of the rear cavity cover facing the first cavity; and / or, the buffer is disposed on the side of the rear cavity cover facing the rear acoustic cavity.
[0011] In some embodiments, the sound-generating device further includes a partition plate, which is stacked with the rear cavity cover plate, and the buffer is located between the partition plate and the rear cavity cover plate.
[0012] In some embodiments, the size of the buffer is greater than or equal to 0.5 mm in the stacking direction of the partition plate and the rear cavity cover plate.
[0013] In some embodiments, the partition plate has a first preset through hole, which penetrates the partition plate along its thickness direction;
[0014] The rear cavity cover plate has a second preset through hole, which penetrates the rear cavity cover plate along the thickness direction.
[0015] The first preset through hole, the second preset through hole, and the buffer form a communication path between the rear acoustic cavity and the first cavity.
[0016] In some embodiments, the rear cavity cover includes a cover body and a surrounding edge, the surrounding edge being formed by an edge portion of the cover body extending toward the partition plate;
[0017] The sound-generating device also includes multiple sidewalls, and the sidewalls facing the rear cavity cover have a stepped structure. The stepped structure includes a first surface and a second surface that are parallel to each other. The partition plate is connected to the first surface, and the surrounding edge is connected to the second surface. The cover plate body, the surrounding edge, and the partition plate enclose an installation space, and the buffer is located within the installation space.
[0018] In some embodiments, the buffer is composed of BASS powder filling the mounting space.
[0019] In some embodiments, a mesh structure is provided at the first preset through hole and the second preset through hole, and the mesh size of the mesh structure is smaller than the particle size of the BASS powder.
[0020] In some embodiments, the buffer has a porous structure.
[0021] In some embodiments, the material of the cushioning element includes any one of sound-absorbing cotton, sponge, or foam.
[0022] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects: by providing a buffer between the rear sound cavity of the sound-generating device and the first cavity of the housing, the air gap of the buffer can extend the gas flow path between the rear sound cavity and the first cavity. When the volume change of the first cavity causes gas flow between the first cavity and the rear sound cavity, the buffer can provide a buffering effect on the gas to reduce the noise caused by the large volume change of the rear sound cavity in a short time. In addition, the air gap of the buffer can also absorb the generated noise, thereby effectively improving the external playback effect of the electronic device.
[0023] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description
[0024] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.
[0025] Figure 1 This is a schematic diagram of an electronic device according to an exemplary embodiment.
[0026] Figure 2 yes Figure 1 Cross-sectional view along the AA direction.
[0027] Figure 3 This is an exploded view of a sound-generating device according to an exemplary embodiment. Detailed Implementation
[0028] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.
[0029] In related electronic devices, the rear cavity of the electronic device is directly connected to the rear cavity of the speaker. If the user accidentally presses the battery cover during the use of the electronic device, causing deformation and a change in the volume of the rear cavity, the airflow in the rear cavity will quickly enter the rear sound cavity of the speaker and interfere with the speaker, causing the speaker to emit noise and affecting the user's external sound experience.
[0030] To address the problems in related technologies, this disclosure provides an electronic device including a housing, a sound-generating device, and a buffer. The sound-generating device is disposed within a first cavity, and its rear acoustic cavity communicates with the first cavity defined by the housing. The buffer is disposed on the communication path between the rear acoustic cavity and the first cavity, which is connected to the first cavity via an air gap. In this disclosure, by providing a buffer between the rear acoustic cavity of the sound-generating device and the first cavity of the housing, the air gap of the buffer extends the gas flow path between the rear acoustic cavity and the first cavity. When a change in the volume of the first cavity causes gas flow between the first cavity and the rear acoustic cavity, the buffer provides a buffering effect to reduce noise caused by a large volume change in the rear acoustic cavity in a short time. Furthermore, the air gap of the buffer can absorb the generated noise, thereby effectively improving the external playback performance of the electronic device.
[0031] According to exemplary embodiments of this disclosure, such as Figure 1 As shown, this disclosure provides an electronic device, which can be a smartphone, tablet computer, laptop computer, smart wearable device (smartwatch, bracelet) or other electronic product with sound-emitting function.
[0032] like Figure 1 and Figure 2As shown, the electronic device includes a housing 10, which provides protection for the internal components of the electronic device. For example, taking a smartphone as an example, the housing 10 may be a structure consisting of a display panel, a mid-frame structure, and a battery cover.
[0033] like Figure 1 and Figure 2 As shown, the electronic device includes a sound-generating device 20, which, as an internal component of the electronic device, can be disposed within the first cavity 10a defined by the housing 10. (See reference...) Figure 2 The sound-generating device 20 includes a rear acoustic cavity 20a, which is connected to the first cavity 10a. It is understood that the first cavity 10a defined by the housing 10 has a larger volume than the rear acoustic cavity 20a of the sound-generating device 20, thus providing the sound-generating device 20 with a larger rear space. A larger volume in the rear acoustic cavity 20a allows for better high and low frequency performance, improving the external sound output of the electronic device. It should be noted that the first cavity 10a can, for example, be the rear cavity of the entire device defined by the battery cover and the mid-frame structure.
[0034] like Figure 2 and Figure 3 As shown, the electronic device also includes a buffer 30, which has an air gap and is disposed on the communication path between the rear acoustic cavity 20a and the first cavity 10a. The rear acoustic cavity 20a is connected to the first cavity 10a through the air gap of the buffer 30.
[0035] It can be determined that when there is gas flow between the rear acoustic cavity 20a and the first cavity 10a, the gas entering the buffer 30 will be affected by the air gap of the buffer 30. The air gap prolongs the gas transmission path and has a buffering effect on the gas. For example, when the housing 10 of the electronic device is squeezed, causing the volume of the first cavity 10a to decrease, during the process of the gas flowing from the first cavity 10a to the rear acoustic cavity 20a, the gas will be affected by the buffer 30, so that the rear acoustic cavity 20a will not change drastically in a short period of time, thus avoiding excessive volume change of the rear acoustic cavity 20a that would cause the sound-emitting device 20 to emit noise.
[0036] The buffer element 30 can be composed of a large number of powders or particles stacked together, or it can be made of a porous structure, as long as it can extend the buffering path of the gas. In one example, the participants... Figure 2 The thickness of the buffer 30 ( Figure 2 The thickness direction of the buffer 30 (in the z direction shown) is greater than or equal to 0.5 mm, and the vibration direction of the vibration unit 25 of the sound-generating device 20 is the same as the vibration direction of the buffer 30.
[0037] In this embodiment of the present disclosure, a buffer is provided between the rear sound cavity of the sound-generating device and the first cavity of the housing. The air gap of the buffer can extend the gas flow path between the rear sound cavity and the first cavity. When the volume change of the first cavity causes gas flow between the first cavity and the rear sound cavity, the buffer can provide a buffering effect on the gas to reduce the noise caused by the large volume change of the rear sound cavity in a short time. In addition, the air gap of the buffer can also absorb the generated noise, thereby effectively improving the external playback effect of the electronic device.
[0038] In one exemplary embodiment, such as Figure 1 and Figure 2 As shown, this embodiment provides an electronic device, which includes a housing 10, a sound-generating device 20, and a buffer 30. The sound-generating device 20 is disposed in a first cavity 10a, and the rear sound cavity 20a of the sound-generating device 20 is connected to the first cavity 10a defined by the housing 10. The buffer 30 is disposed on the communication path between the rear sound cavity 20a and the first cavity 10a, and the rear sound cavity 20a is connected to the first cavity 10a through an air gap.
[0039] In this embodiment, as Figure 2 and Figure 3 As shown, the sound-generating device 20 includes a rear cavity cover plate 21, which separates the rear sound cavity 20a and the first cavity 10a. The rear cavity cover plate 21 is provided with a second preset through hole 21a, through which the rear sound cavity 20a communicates with the first cavity 10a.
[0040] In one example, see Figure 2 The buffer 30 is disposed on the side of the rear cavity cover 21 facing the rear acoustic cavity 20a, that is, the buffer 30 is disposed inside the rear acoustic cavity 20a. In this example, by disposing of the buffer 30 inside the rear acoustic cavity 20a of the sound-generating device 20, the installation method is simple, and the buffer 30 can be protected by the rear cavity cover 21.
[0041] In another example (not shown in the attached figures), the buffer is disposed on the side of the rear cavity cover facing the first cavity; that is, the buffer is disposed within the first cavity and connected to the rear cavity cover. It should be noted that the buffer in this example is typically made of a porous structure.
[0042] In another example (not shown in the attached diagram), the buffer comprises two parts, one part being disposed on the side of the rear cavity cover facing the rear acoustic cavity, and the other part being disposed on the side of the rear cavity cover facing the first cavity. The two parts of the buffer can be independent of each other or be a single integrated structure. When the two parts are a single integrated structure, they can be connected through a second pre-set through hole in the rear cavity cover. In this example, by using two parts for the buffer, the thickness of the buffer is increased without occupying much space in the rear acoustic cavity, thus improving the buffer's cushioning effect on the gas.
[0043] Among them, such as Figure 2 and Figure 3 As shown, the sound-generating device 20 also includes a partition plate 22, which is stacked with the rear cavity cover plate 21 of the sound-generating device 20, with the stacking direction being the same as the vibration direction of the vibration unit 25. Figure 2 As shown in the z-direction, the buffer 30 is located between the partition plate 22 and the rear cavity cover plate 21. The partition plate 22 and the rear cavity cover plate 21 are used to provide reliable support and limit the two sides of the buffer 30, respectively, so as to avoid the buffer 30 being misaligned due to the large impact of the flowing gas on the buffer 30.
[0044] Among them, such as Figure 2 and Figure 3 As shown, a first preset through hole 22a is provided in the partition plate 22, and the first preset through hole 22a penetrates the partition plate 22 in the thickness direction. The first preset through hole 22a, the buffer member 30 and the second preset through hole 21a of the rear cavity cover plate 21 constitute a communication passage between the rear sound cavity 20a and the first cavity 10a.
[0045] Among them, such as Figure 2 As shown, the rear cavity cover 21 includes a cover body 211 and a surrounding edge 212, which extends from the edge portion of the cover body 211 toward the partition plate 22. The cover body 211 and the surrounding edge 212 form a groove-like structure. In the assembled state, the cover body 211, the surrounding edge 212, and the partition plate 22 enclose an installation space, and the buffer member 30 can be disposed within the installation space.
[0046] See Figure 2 and Figure 3 The sound-generating device 20 also includes a vibrating unit 25 and multiple sidewalls 23, which together define a rear acoustic cavity 20a. (See also...) Figure 3 The sidewall 23 facing the rear cavity cover 21 has a stepped structure 24, which includes a first surface 241 and a second surface 242 that are parallel to each other. Both the first surface 241 and the second surface 242 are perpendicular to the thickness direction of the electronic device. Figure 2(As shown in the z-direction), wherein the height of the first surface 241 is lower than that of the second surface 242, the side of the partition plate 22 facing the vibration unit 25 is connected to the first surface 241, and the side of the perimeter 212 away from the cover plate body 211 is connected to the second surface 242, thereby the partition plate 22, the perimeter 212 and the cover plate body 211 enclose and form the installation space of the buffer 30. (Continue reading) Figure 3 The stepped structure 24 includes a connecting surface 243 for connecting the first surface 241 and the second surface 242. The side of the partition plate 22 contacts the connecting surface 243, thereby the stepped structure 24 can limit the lateral displacement of the buffer 30. In this embodiment, by providing the stepped structure 24 on the side wall 23, during the assembly process, only the partition plate 22 needs to be placed on the first surface 241 of the stepped structure 24 to achieve rapid positioning, and no fasteners are required for connection, which helps to improve assembly efficiency.
[0047] In some embodiments, such as Figure 2 As shown, the buffer 30 is composed of BASS powder filling the installation space. BASS powder is a nano-metaporous acoustic material with nanoscale, finely designed, and complexly manufactured channels inside, which can form air gaps in the buffer 30. Furthermore, when a certain number of BASS powders are stacked together, gaps will exist between adjacent BASS powders, thus forming air gaps within the buffer 30.
[0048] Among them, a mesh structure 40 is provided at the first preset through hole 22a of the partition plate 22 and the second preset through hole 21a of the rear cavity cover plate 21. The mesh size of the mesh structure 40 is smaller than the particle size of the BASS powder. While preventing the BASS powder from leaking out of the installation space, it ensures that the rear sound cavity 20a and the first cavity 10a are in a connected state.
[0049] In other embodiments, the buffer 30 has a porous structure. Exemplarily, the buffer 30 can be any one of sound-absorbing cotton, sponge, or foam, and the small holes in the sound-absorbing cotton, sponge, and foam constitute the air gap of the buffer 30.
[0050] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the embodiments disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims.
[0051] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.
Claims
1. An electronic device, characterized in that, include: The shell defines the first cavity; A sound-generating device is disposed within the first cavity, and the sound-generating device has a rear sound cavity; A buffer element having an air gap is disposed on the communication passage between the rear acoustic cavity and the first cavity, and the rear acoustic cavity is connected to the first cavity through the air gap.
2. The electronic device according to claim 1, characterized in that, The sound-generating device includes a rear cavity cover plate, which is used to separate the first cavity from the rear sound cavity; The buffer is disposed on the side of the rear cavity cover plate facing the first cavity; And / or, the buffer is disposed on the side of the rear cavity cover facing the rear acoustic cavity.
3. The electronic device according to claim 2, characterized in that, The sound-generating device also includes a partition plate, which is stacked with the rear cavity cover plate, and the buffer is located between the partition plate and the rear cavity cover plate.
4. The electronic device according to claim 3, characterized in that, In the stacking direction of the partition plate and the rear cavity cover plate, the size of the buffer is greater than or equal to 0.5 mm.
5. The electronic device according to claim 3, characterized in that, The partition plate has a first preset through hole, which penetrates the partition plate along its thickness direction. The rear cavity cover plate has a second preset through hole, which penetrates the rear cavity cover plate along the thickness direction. The first preset through hole, the second preset through hole, and the buffer form a communication path between the rear acoustic cavity and the first cavity.
6. The electronic device according to claim 5, characterized in that, The rear cavity cover plate includes a cover plate body and a surrounding edge, wherein the surrounding edge is formed by the edge portion of the cover plate body extending toward the partition plate; The sound-generating device also includes multiple sidewalls, and the sidewalls facing the rear cavity cover have a stepped structure. The stepped structure includes a first surface and a second surface that are parallel to each other. The partition plate is connected to the first surface, and the surrounding edge is connected to the second surface. The cover plate body, the surrounding edge, and the partition plate enclose an installation space, and the buffer is located within the installation space.
7. The electronic device according to claim 6, characterized in that, The buffer is composed of BASS powder filled within the installation space.
8. The electronic device according to claim 7, characterized in that, A mesh structure is provided at the first preset through hole and the second preset through hole, and the mesh size of the mesh structure is smaller than the particle size of the BASS powder.
9. The electronic device according to any one of claims 1-6, characterized in that, The buffer has a porous structure.
10. The electronic device according to claim 9, characterized in that, The material of the cushioning component includes any one of sound-absorbing cotton, sponge, or foam.