Power electronic component rubberizing positioning device

Abstract

The utility model relates to the technical field of power electronic components, in particular to a power electronic component rubberizing and positioning device which comprises a base, a positioning assembly and an overturning assembly, guide assemblies are fixedly arranged on the two sides of the base, and the positioning assembly is slidably connected between the guide assemblies and located on the top of the base. The top of the positioning assembly is rotationally connected with an overturning assembly. The overturning assembly comprises an L-shaped pressing plate, one side of the L-shaped pressing plate is connected with a rotating seat through welding, the two sides of the rotating seat are connected with rotating shafts through bolts, the positioning assembly comprises a positioning pressing plate, the peripheries of the rotating shafts are sleeved with coil springs, and one ends of the coil springs are connected with the rotating shafts through welding; by additionally arranging the pin auxiliary leveling mechanism, the pins of the electronic component are subjected to auxiliary leveling treatment in an overturning and elastic extrusion mode, the positioning stability is improved, and therefore the using effect is improved.

Description

Technical Field

[0001] This utility model relates to the field of power electronic components technology, specifically to a power electronic component adhesive positioning device. Background Technology

[0002] Electronic components are the foundation of electronic products. Commonly used electronic components include resistors, capacitors, inductors, potentiometers, and transformers. During the manufacturing process of electronic components, processing operations such as applying adhesive are required to protect the pins from painting. During the process of applying adhesive to the pins, positioning devices are needed to help fix the electronic components in place.

[0003] Currently, positioning devices lack a pin-assisting flattening mechanism. Often, during the process of applying tape to the pins of electronic components, some pins are bent due to impacts or other factors, making them difficult to adhere with tape. This not only affects the positioning quality but also makes them susceptible to damage during subsequent painting processes. Therefore, a power electronic component adhesive-applying positioning device is proposed to add a pin-assisting flattening mechanism. This mechanism utilizes flipping and elastic compression to assist in flattening the pins of electronic components, improving positioning stability and thus enhancing the overall performance. Utility Model Content

[0004] To address the problems in the existing technology, this utility model provides a power electronic component adhesive positioning device, which facilitates the auxiliary flattening of the pins of electronic components by means of flipping and elastic compression, thereby improving the performance.

[0005] The technical solution adopted by this utility model to solve its technical problem is a power electronic component adhesive positioning device, including a base, a positioning component and a flipping component. Guide components are fixedly arranged on both sides of the base, and the positioning component is slidably connected between the guide components at the top of the base. The top of the positioning component is rotatably connected to the flipping component.

[0006] The flipping assembly includes an L-shaped pressure plate, a rotating seat is welded to one side of the L-shaped pressure plate, and rotating shafts are bolted to both sides of the rotating seat. The positioning assembly includes a positioning pressure plate, and a coil spring is sleeved around the rotating shaft, with one end of the coil spring welded to the rotating shaft.

[0007] By adopting the above technical solution, an auxiliary leveling mechanism can be added. By utilizing the flipping and squeezing generated by elastic deformation, the pins after positioning can be pre-leveled, thereby improving the stability of use and the accuracy of adhesive application.

[0008] Specifically, the top of the base and the bottom of the positioning plate are provided with grooves corresponding to the electronic components, the base is provided with a hollow groove, and the top of the base is provided with air inlets on both sides of the groove.

[0009] By adopting the above technical solution, the negative pressure generated by suction can be used to further improve the stability of pin bonding, making it less prone to misalignment, and at the same time, it can assist in the bonding process.

[0010] Specifically, the top of the positioning plate has a notch, and the L-shaped plate is rotatably connected to the notch via a rotating shaft. An electromagnet corresponding to the rotating seat is connected to the notch by bolts.

[0011] By adopting the above technical solution, it is easy to rotate and install the L-shaped pressure plate for use, and it is easy to manually drive the L-shaped pressure plate and then use the magnetic attraction generated by the power to fix the rotating seat.

[0012] Specifically, the guide assembly includes a support frame, which is connected to the base by bolts. A sliding groove is provided on the inner side of the support frame, and a slider is slidably connected in the sliding groove. The sliders are connected to a positioning pressure plate by bolts, and a compression spring is installed in the top of the slider in the sliding groove through a slot.

[0013] By adopting the above technical solution, the positioning plate can be driven to slide down quickly to perform the initial positioning action by using elastic force, thereby improving the convenience of operation.

[0014] Specifically, a connecting rod is sleeved on the top of the support frame, and one end of the connecting rod passes through a spring bolt to connect to a slider. The outer side of the support frame is threaded with a tightening screw corresponding to the connecting rod through a pre-drilled threaded hole.

[0015] By adopting the above technical solution, it is convenient to use the slider to drive the positioning component to slide upward for reset, and it is convenient to limit and fix the pull rod.

[0016] Specifically, a miniature vacuum pump is bolted to the surface of the guide assembly, and the air inlet of the miniature vacuum pump is connected to the hollow trough through a pipe.

[0017] By adopting the above technical solution, it is easy to generate negative pressure in the hollow slot to reinforce the pins of electronic components.

[0018] The beneficial effects of this utility model are:

[0019] (1) The power electronic component adhesive positioning device of this utility model can increase the pin auxiliary flattening mechanism by setting an L-shaped pressure plate, rotating seat, rotating shaft and coil spring. By flipping and squeezing, the raised and bent pins are assisted in flattening, improving the accuracy of adhesive application to the electronic component pins, thereby improving the device's performance.

[0020] (2) The power electronic component adhesive positioning device described in this utility model can increase the auxiliary reinforcement mechanism by setting a base, groove, hollow groove, air inlet and micro vacuum pump. It can further improve the stability of the pins in the adhesive application process by using negative pressure suction, and at the same time increase the convenience of manual adhesive application operation. Attached Figure Description

[0021] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0022] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0023] Figure 2 This is a schematic diagram of the positioning component and the flipping component of this utility model;

[0024] Figure 3 This is a cross-sectional view of the base structure of this utility model;

[0025] Figure 4 This is a cross-sectional view of the guide component of this utility model;

[0026] In the diagram: 1. Base; 101. Groove; 102. Hollow slot; 103. Air inlet; 2. Guide assembly; 201. Support frame; 202. Slide groove; 203. Slider; 204. Compression spring; 205. Pull rod; 206. Tightening screw; 3. Positioning assembly; 301. Positioning pressure plate; 302. Notch; 303. Electromagnet; 4. Flipping assembly; 401. L-shaped pressure plate; 402. Rotating seat; 403. Rotating shaft; 404. Coil spring; 5. Miniature vacuum pump. Detailed Implementation

[0027] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0028] To facilitate the use of flipping and elastic compression to assist in flattening the pins of electronic components, thereby improving their performance, such as... Figure 1-3 As shown, the power electronic component adhesive positioning device of this utility model includes a base 1, a positioning component 3 and a flipping component 4. Guide components 2 are fixedly arranged on both sides of the base 1. The positioning component 3 is slidably connected between the guide components 2 at the top of the base 1. The flipping component 4 is rotatably connected to the top of the positioning component 3.

[0029] The flipping assembly 4 includes an L-shaped pressure plate 401. A rotating seat 402 is welded to one side of the L-shaped pressure plate 401. A rotating shaft 403 is bolted to both sides of the rotating seat 402. The positioning assembly 3 includes a positioning pressure plate 301. A coil spring 404 is sleeved around the rotating shaft 403, and one end of the coil spring 404 is welded to the rotating shaft 403.

[0030] During use, the L-shaped pressure plate 401, rotating seat 402, rotating shaft 403 and coil spring 404 can be used to add an auxiliary leveling mechanism. The flipping and squeezing generated by elastic deformation can be used to pre-level the positioned pins, thereby improving the stability of use and the accuracy of adhesive application.

[0031] To improve the stability of lead bonding, for example, such as Figure 1 , Figure 3 As shown, the present invention also includes grooves 101 corresponding to electronic components on the top of the base 1 and the bottom of the positioning plate 301, a hollow groove 102 in the base 1, and air inlets 103 on both sides of the top of the base 1 located in the grooves 101.

[0032] In use, the groove 101, hollow groove 102 and air inlet 103 can utilize the negative pressure generated by suction to further improve the stability of pin bonding, making it less prone to displacement, and at the same time play an auxiliary role in bonding.

[0033] For example, such as Figure 2 As shown, the present invention also includes a notch 302 on the top of the positioning plate 301, and an L-shaped plate 401 is rotatably connected to the notch 302 via a rotating shaft 403. An electromagnet 303 corresponding to the rotating seat 402 is bolted into the notch 302.

[0034] In use, the L-shaped pressure plate 401 is easily rotated and installed through the notch 302, and the L-shaped pressure plate 401 is easily manually driven by the electromagnet 303, and the rotating seat 402 is fixed by the magnetic attraction generated by the energization.

[0035] For example, such as Figure 4 As shown, the present invention also includes the following: the guide assembly 2 includes a support frame 201, and the support frame 201 is connected to the base 1 by bolts. A sliding groove 202 is provided on the inner side of the support frame 201. A slider 203 is slidably connected in the sliding groove 202, and a positioning pressure plate 301 is connected between the sliders 203 by bolts. A compression spring 204 is installed in the sliding groove 202 at the top of the slider 203 by a slot.

[0036] In use, the support frame 201, slide 202, slider 203 and compression spring 204 can use the elastic force to push the positioning plate 301 to slide down quickly to perform the initial positioning action, which improves the convenience of operation.

[0037] For example, such as Figure 4 As shown, the present invention also includes a top sleeve connecting a pull rod 205 to the support frame 201, and one end of the pull rod 205 passes through a compression spring 204 and is bolted to a slider 203. The outer side of the support frame 201 is threadedly connected to a tightening screw 206 corresponding to the pull rod 205 through a reserved threaded hole.

[0038] In use, the pull rod 205 facilitates the sliding of the slider 203 to drive the positioning component 3 to slide upward for reset, and the pull rod 205 is fixed by tightening the screw 206.

[0039] For example, such as Figure 1 As shown, the present invention also includes a micro vacuum pump 5 connected to the surface of the guide component 2 by bolts, and the air inlet of the micro vacuum pump 5 is connected to the hollow groove 102 through a pipe.

[0040] In use, the micro vacuum pump 5 facilitates the generation of negative pressure in the hollow trough 102 to reinforce the pins of electronic components.

[0041] In use, the operator first places the electronic components into the groove 101 of the base 1. The spring 204 pushes the slider 203 and the positioning plate 301 to slide down quickly, thus pressing down and limiting the electronic components. The tightening screw 206 is then turned to fix the pull rod 205, completing the positioning of the electronic components. Before applying adhesive to the electronic component pins, the electromagnet 303 can be manually turned off in advance. The elastic deformation of the coil spring 404 drives the rotating shaft 403 and the L-shaped pressure plate 401 to rotate downward, thus assisting in leveling the pins. This improves the accuracy of adhesive application and avoids omissions. At the same time, the elastic and flat method can also avoid excessive pressure that could damage the pins.

[0042] Furthermore, the micro vacuum pump 5 can be manually turned on, and the negative pressure generated by the hollow groove 102 and the air inlet 103 can be used to hold the pin in place and reinforce it, thereby further improving the stability of the adhesive application operation. It can also use the adhesive tape to assist in the adhesive application of the pin. The structure is simple and easy to operate, and it is more flexible and stable to use.

[0043] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The descriptions of the above embodiments and specifications are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of protection claimed by this utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A power electronic component adhesive positioning device, characterized in that, It includes a base (1), a positioning component (3) and a flipping component (4). Guide components (2) are fixedly provided on both sides of the base (1). The positioning component (3) is slidably connected between the guide components (2) at the top of the base (1). The flipping component (4) is rotatably connected to the top of the positioning component (3). The flipping assembly (4) includes an L-shaped pressure plate (401), one side of which is connected to a rotating seat (402) by welding. Both sides of the rotating seat (402) are connected to a rotating shaft (403) by bolts. The positioning assembly (3) includes a positioning pressure plate (301), and a coil spring (404) is sleeved around the rotating shaft (403), with one end of the coil spring (404) connected to the rotating shaft (403) by welding.

2. The power electronic component adhesive positioning device according to claim 1, characterized in that, The top of the base (1) and the bottom of the positioning plate (301) are provided with grooves (101) corresponding to the electronic components. A hollow groove (102) is provided inside the base (1). Air inlets (103) are provided on both sides of the groove (101) at the top of the base (1).

3. The power electronic component adhesive positioning device according to claim 1, characterized in that, The top of the positioning plate (301) is provided with a notch (302), and the L-shaped plate (401) is rotatably connected to the notch (302) through a rotating shaft (403). An electromagnet (303) corresponding to the rotating seat (402) is connected to the notch (302) by bolts.

4. The power electronic component adhesive positioning device according to claim 1, characterized in that, The guide assembly (2) includes a support frame (201), and the support frame (201) is connected to the base (1) by bolts. A slide groove (202) is provided on the inner side of the support frame (201). A slider (203) is slidably connected in the slide groove (202), and a positioning pressure plate (301) is connected between the sliders (203) by bolts. A compression spring (204) is installed in the slide groove (202) at the top of the slider (203) through a slot.

5. The power electronic component adhesive positioning device according to claim 4, characterized in that, The top of the support frame (201) is connected to a connecting rod (205), and one end of the connecting rod (205) passes through a compression spring (204) and is bolted to a slider (203). The outer side of the support frame (201) is threaded with a tightening screw (206) corresponding to the connecting rod (205) through a reserved threaded hole.

6. The adhesive positioning device for power electronic components according to claim 2, characterized in that, The surface of the guide assembly (2) is bolted to a micro vacuum pump (5), and the air inlet of the micro vacuum pump (5) is connected to the hollow trough (102) through a pipe.

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