PCB cutting edge smoothness optimizing device

By installing air blowing and air extraction devices on the laser cutting equipment for aluminum-based circuit boards, the burr problem in the traditional aluminum-based circuit board cutting process is solved, and the smoothness and precision of the cutting edges are improved.

CN223531642UActive Publication Date: 2025-11-11RED BOARD JIANGXI CO LTD
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Patent Information

Application Number
CN202422699597.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-06
Publication Date
2025-11-11
Estimated Expiration
2034-11-06

AI Technical Summary

Technical Problem

In the traditional laser cutting process of aluminum-based circuit boards, the molten and vaporized material forms burrs on the sidewalls, affecting the smoothness of the cut.

Method used

A PCB cutting edge smoothness optimization device is adopted, which includes a frame, a processing platform, a cutting device, a first air blowing device, and a second processing device. The first air blowing device blows debris and dust into the dust collection hopper, and the second processing device performs air extraction to prevent debris from falling on the side wall and melting at high temperature to form burrs.

Benefits of technology

This effectively prevents debris from forming burrs on the sidewalls, ensuring smooth cutting edges and improving cutting accuracy and quality.

✦ Generated by Eureka AI based on patent content.

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Abstract

A PCB cutting edge smoothness optimizing device comprises a rack, a machining platform, a cutting device, a first blowing device and a second processing device, the machining platform, the cutting device, the first blowing device and the second processing device are arranged on the rack, a horizontal moving device and a rotating device are arranged on the machining platform, and the cutting device is arranged over the machining platform and comprises a laser cutting device. The first processing device comprises a first blowing device and an air extractor, the first blowing device is arranged on the cutting device, the second processing device comprises a second blowing device and an air extractor, and the second blowing device and the air extractor are arranged on the two sides of the moving direction of the laser cutting device respectively. The first blowing device and the second processing device are arranged to process chippings, dust and the like generated by grooving and penetrating cutting in real time, so that the problem that the chippings fall on the side wall and are melted at high temperature to form burrs, and the edge is uneven and smooth is solved, and the grooving machine is high in practicability and has high popularization significance.
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Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a device for optimizing the smoothness of PCB cutting edges. Background Technology

[0002] Aluminum-based circuit boards possess excellent thermal conductivity, electrical insulation, and machinability, making them widely used in the field of electronic circuits. However, the cutting precision requirements for aluminum-based circuit boards are extremely high during the manufacturing process. Traditionally, aluminum-based circuit boards are typically cut using laser cutting, and the molten and vaporized material during this process forms burrs on the sidewalls, affecting the smoothness of the cut. Utility Model Content

[0003] Therefore, it is necessary to provide a device for optimizing the smoothness of PCB cutting edges to address the shortcomings of existing technologies.

[0004] A device for optimizing the smoothness of PCB cutting edges includes a frame and a processing platform, a cutting device, a first air blowing device, and a second processing device mounted on the frame. The processing platform is equipped with a horizontal moving device and a rotating device. The cutting device is located directly above the processing platform and includes a laser cutting device. The first air blowing device is mounted on the cutting device. The second processing device includes a second air blowing device and an air extraction device, which are respectively located on both sides of the moving direction of the laser cutting device.

[0005] Furthermore, the frame includes a base and a mounting bracket. The processing platform is disposed on the base. The mounting bracket is provided with a horizontally extending guide rail. A mounting seat is provided on the guide rail. A vertically extending slide rail is provided on the outer surface of the mounting seat. The cutting device is mounted on the slide rail and moves up and down along the slide rail.

[0006] Furthermore, the laser cutting device includes a carbon dioxide laser cutting device and a fiber laser cutting device, both of which are mounted on a fixed base, which is mounted on a slide rail.

[0007] Furthermore, the first air blowing device includes an air compressor and an air inlet pipe, the air inlet pipe extending to the outside of the carbon oxide laser cutting device and the fiber laser cutting device.

[0008] Furthermore, a second slide rail is provided below the fixed base, and the second processing device is disposed on the second slide rail and can move up and down along the second slide rail.

[0009] Furthermore, the second air blowing device includes a positioning frame, a second air inlet pipe and an air blowing head. The second air inlet pipe extends from the mounting frame below the cutting device, and the other end of the second air inlet pipe is connected to the air blowing head and is positioned on the positioning frame.

[0010] Furthermore, the air extraction device includes a positioning frame, an air extraction pipe, and an air extraction head, wherein the tilt angle of the air extraction head is smaller than the tilt angle of the air blowing head.

[0011] Furthermore, the suction head should be higher than the blowing head, and the outermost outer diameter of the suction head should be larger than the outer diameter of the blowing head.

[0012] Furthermore, the base is also equipped with a dust collection hopper, which is located at the bottom and on both sides of the processing platform.

[0013] In summary, the PCB cutting device of this utility model, by setting a first air blowing device and a second processing device, can process the debris and dust generated by slotting and through cutting in real time, thereby avoiding the problem that debris falls on the side wall and melts at high temperature to form burrs, resulting in uneven and smooth edges. This utility model is highly practical and has strong promotional significance. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the PCB cutting edge smoothness optimization device of this utility model;

[0015] Figure 2 for Figure 1 Schematic diagram of the intermediate processing platform;

[0016] Figure 3 for Figure 2 Schematic diagram of the rotating device in the middle;

[0017] Figure 4 for Figure 1 A schematic diagram showing the usage status of the second processing device. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this utility model and are not intended to limit this utility model.

[0019] like Figures 1 to 4As shown, this utility model provides a PCB cutting edge smoothness optimization device. The PCB cutting edge smoothness optimization device includes a frame 10 and a processing platform 20, a cutting device 30, a first air blowing device, and a second processing device disposed on the frame 10. The cutting device 30 is disposed directly above the processing platform 20, the first air blowing device is disposed on the cutting device 30, and the second processing device is disposed on the processing platform 20 and located outside the cutting device 30.

[0020] The frame 10 includes a base 11 and a mounting bracket 12. The processing platform 20 is disposed on the base 11, and the base 11 has dust collection hoppers 13 at the bottom and two outer sides of the processing platform 20. The mounting bracket 12 is provided with a horizontally extending guide rail 14, and a mounting seat 15 is provided on the guide rail 14. The mounting seat 15 can move along the guide rail 14. The outer surface of the mounting seat 15 is provided with a vertically extending slide rail 16, and the cutting device 30 is mounted on the slide rail 16 and can move up and down along the slide rail 16.

[0021] The cutting device 30 includes a fixed base 31 and a carbon dioxide laser cutting device 32 and a fiber laser cutting device 33 mounted on the fixed base 31. The first air blowing device includes an air compressor and an air inlet pipe 41. The air inlet pipe 41 extends to the outside of the carbon dioxide laser cutting device 30 and the fiber laser cutting device 33, or is sleeved on the outside of the carbon dioxide laser cutting device 30 and the fiber laser cutting device 33. This first air blowing device can directly blow the dust and debris generated by the cutting of the carbon dioxide laser cutting device 30 and the fiber laser cutting device 33 downwards into the dust collection hopper 13.

[0022] A second slide rail is also provided below the fixed base 31. The second processing device is mounted on the second slide rail and can move up and down along the second slide rail. The second processing device includes a second air blowing device 50 and an air extraction device 60, which are respectively located on both sides of the moving direction of the laser cutting device 30. Specifically, the second air blowing device 50 is located on the rear side of the moving direction of the laser cutting device 30, and the air extraction device 60 is located on the front side of the moving direction of the laser cutting device 30. The second air blowing device 50 includes a positioning frame 51, a second air inlet pipe 52, and an air blowing head 53. The second air inlet pipe 52 extends from the mounting frame 12 below the cutting device 30. The other end of the second air inlet pipe 52 is connected to the air blowing head 53 and is confined to the positioning frame 51. The angle of the air blowing head 53 is adjustable.

[0023] The structure of the suction device 60 is similar to that of the second blowing device 50. The difference is that the tilt angle of the suction head 61 of the suction device 60 is smaller than that of the blowing head 53, and the suction head 61 is higher than the blowing head 53. The outermost outer diameter of the suction head 61 is larger than that of the blowing head 53, which is more conducive to dust collection.

[0024] The processing platform 20 includes a base plate 21, two moving devices 22, a top plate 23, a rotating device, and a vacuum plate 25. Both moving devices 22 are mounted on the base plate 21 and drive the base plate 21 to move in the X and Y axes. The top plate 23 is located above the base plate 21, the rotating device is located inside the top plate 23, and the vacuum plate 25 is located above the rotating device, which drives the vacuum plate 25 to rotate. Specifically, each moving device 22 includes a fixed frame 221 passing through the base plate 21 and a driving device 222 mounted on the fixed frame 221. One end of the driving device 222 is mounted on the fixed frame 221, and the other end is mounted on the base plate 21, allowing it to push the base plate 21 along the fixed frame 221 for position adjustment. The rotating device includes a rotary drive 241, a drive gear 242, and a gear disc 243. The gear disc 243 has a limiting boss 244, which is embedded in the bottom surface of the vacuum plate 25. The rotary drive 241 drives the gear disk 243 to rotate via the drive gear 242, and the gear disk 243 drives the vacuum plate 25 to rotate via the limiting boss 244. In this embodiment, the vacuum tube 251 of the vacuum plate 25 extends from the middle of the gear disk 243 to the middle of the vacuum plate 25. The vacuum plate 25 is used to adsorb and position the PCB, and is rotatable to rotate the required cutting position below the laser cutting device 30.

[0025] During operation, the circuit board, including the insulating layer and the underlying aluminum layer, is first grooved using a CO2 laser cutting device 32 (without cutting the bottom aluminum layer). Since debris cannot be blown downwards during grooving, a second air blowing device 50 is activated to blow away the debris and dust. An extraction device 60 then extracts the blown-away dust into a dust collection hopper. After cutting, when cutting the aluminum layer, a fiber laser cutting device 33 is activated to cut through the board. At this time, the first air blowing device is activated, blowing the debris directly into the dust collection hopper 13 below.

[0026] In summary, the PCB cutting device 30 of this utility model, by setting a first air blowing device and a second processing device, can process the debris and dust generated by slotting and through cutting in real time, thereby avoiding the problem that debris falls on the side wall and melts at high temperature to form burrs, resulting in uneven and smooth edges. This utility model is highly practical and has strong promotional significance.

[0027] The above-described embodiments are merely one implementation of this utility model, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A device for optimizing the smoothness of PCB cutting edges, characterized in that: The device includes a frame and a processing platform mounted on the frame, a cutting device, a first air blowing device, and a second processing device. The processing platform is equipped with a horizontal moving device and a rotating device. The cutting device is located directly above the processing platform and includes a laser cutting device. The first air blowing device is mounted on the cutting device. The second processing device includes a second air blowing device and an air extraction device, which are respectively located on both sides of the moving direction of the laser cutting device.

2. The PCB cutting edge smoothness optimization device as described in claim 1, characterized in that: The frame includes a base and a mounting bracket. The processing platform is disposed on the base. The mounting bracket is provided with a horizontally extending guide rail. A mounting seat is provided on the guide rail. A vertically extending slide rail is provided on the outer surface of the mounting seat. The cutting device is mounted on the slide rail and moves up and down along the slide rail.

3. The PCB cutting edge smoothness optimization device as described in claim 2, characterized in that: The laser cutting device includes a carbon dioxide laser cutting device and a fiber laser cutting device. Both the carbon dioxide laser cutting device and the fiber laser cutting device are mounted on a fixed base, which is mounted on a slide rail.

4. The PCB cutting edge smoothness optimization device as described in claim 1, characterized in that: The first air blowing device includes an air compressor and an air inlet pipe, which extends to the outside of the carbon oxide laser cutting device and the fiber laser cutting device.

5. The PCB cutting edge smoothness optimization device as described in claim 3, characterized in that: A second slide rail is provided below the fixed base, and the second processing device is mounted on the second slide rail and can move up and down along the second slide rail.

6. The PCB cutting edge smoothness optimization device as described in claim 1, characterized in that: The second air blowing device includes a positioning frame, a second air inlet pipe and an air blowing head. The second air inlet pipe extends from the mounting frame below the cutting device, and the other end of the second air inlet pipe is connected to the air blowing head and is confined on the positioning frame.

7. The PCB cutting edge smoothness optimization device as described in claim 6, characterized in that: The air extraction device includes a positioning frame, an air extraction pipe, and an air extraction head. The tilt angle of the air extraction head is smaller than that of the air blowing head.

8. The PCB cutting edge smoothness optimization device as described in claim 7, characterized in that: The suction head should be higher than the blowing head, and the outermost outer diameter of the suction head should be larger than the outer diameter of the blowing head.

9. The PCB cutting edge smoothness optimization device as described in claim 7, characterized in that: The base is also equipped with a dust collection hopper, which is located at the bottom and on both sides of the processing platform.