Speed reducer with heat dissipation function

Abstract

The speed reducer with the heat dissipation function comprises a speed reducer body, heat dissipation fins are fixedly connected to the front face of the speed reducer body, first strip-shaped heat dissipation holes are formed in the front face of the speed reducer body, and second strip-shaped heat dissipation holes are formed in one side of the speed reducer body. A grid air outlet groove is formed in the bottom of the speed reducer body, a mounting support is fixedly connected to the bottom of the speed reducer body, an air inlet is formed in the top of the speed reducer body, and a mounting cover is fixedly connected to the top of the speed reducer body. The cooling fan can be started to guide external air filtered by the filter plate into the mounting cover, the external air enters the speed reducer body through the air inlet, and the entering air can be cooled through cooperation of the semiconductor chilling plate, so that the speed reducer body can be cooled; and air flows outwards through the multiple heat dissipation openings formed in the speed reducer body, the air circulation performance is improved, and the problem that the current heat dissipation shape is low is solved.

Description

Technical Field

[0001] This utility model belongs to the field of speed reducer technology, specifically relating to a speed reducer device with heat dissipation function. Background Technology

[0002] Speed ​​reducers play a role in matching speed and transmitting torque between prime movers and working machines or actuators. They are widely used in modern machinery. Speed ​​reducers can be divided into two main categories according to their uses: general-purpose speed reducers and special-purpose speed reducers. The design, manufacturing and usage characteristics of the two are different.

[0003] Currently, most speed reducers lack heat dissipation structures, and their outer casings have low heat dissipation capabilities. This results in high internal frictional temperatures during operation, which can negatively impact the normal use of the speed reducer. This phenomenon has become a problem that urgently needs to be solved by those in the field. Utility Model Content

[0004] The purpose of this invention is to provide a deceleration device with heat dissipation function for existing devices, so as to solve the problems mentioned in the background art.

[0005] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a speed reduction device with heat dissipation function, including a speed reducer body, heat dissipation fins fixedly connected to the front of the speed reducer body, a first strip-shaped heat dissipation hole opened on the front of the speed reducer body, a second strip-shaped heat dissipation hole opened on one side of the speed reducer body, a mesh air outlet groove opened at the bottom of the speed reducer body, and a mounting bracket fixedly connected to the bottom of the speed reducer body.

[0006] The reducer body has an air inlet at its top, and a mounting cover is fixedly connected to the top of the reducer body. A filter plate is movably connected to the top of the mounting cover, and a mounting groove is provided at the bottom of the filter plate. A limit block is fixedly connected to the bottom of the filter plate, and a semiconductor cooling chip and a cooling fan are fixedly connected to the bottom of the filter plate. The cooling fan can be activated to guide the filtered external air into the mounting cover and into the reducer body through the air inlet. The semiconductor cooling chip can also cool the incoming air, thereby dissipating heat from the reducer body and allowing it to circulate outward through multiple heat dissipation vents on the reducer body, improving airflow.

[0007] This utility model further illustrates that a support block is fixedly connected to the inner wall of the mounting cover, and a limiting groove is provided on the top of the support block. A mounting column is fixedly connected to the inner wall of the mounting cover, and a mounting ring is movably connected to the outer wall of the mounting column. Rotating the mounting ring disengages it from the mounting column, making it convenient to disassemble the filter plate from the mounting cover. This facilitates cleaning the dust on the filter plate, avoiding the inconvenience of disassembly and assembly due to the integrated structure, which would cause dust to accumulate on the surface of the filter plate and affect normal heat dissipation. It also brings convenience to maintenance.

[0008] This utility model further explains that the filter plate is movably connected to the mounting column and the support block through the mounting groove and the limiting block, respectively. The outer wall of the mounting column is movably connected to the inner wall of the mounting groove, and the limiting block is movably connected to the limiting groove, which facilitates the installation and connection of the filter plate and the mounting cover, and also facilitates disassembly, cleaning and maintenance in the later stage.

[0009] The present invention further explains that the outer wall of the mounting column and the inner wall of the mounting ring are both provided with threads, and the mounting column and the mounting ring are threadedly connected, which facilitates the threaded installation of the mounting ring and the mounting column, thereby enabling the disassembly and assembly of the filter plate.

[0010] This invention further illustrates that the semiconductor cooling chip and the heat dissipation fan are fixedly connected to the filter plate by welding, and the diameter of the filter plate is the same as the diameter of the mounting cover, which can improve the overall robustness of the structure.

[0011] The present invention further explains that the top of the mounting bracket is provided with a bolt groove, and the mounting bracket is an L-shaped mounting bracket, which facilitates the support and installation of the reducer body and allows the bottom of the reducer body to have a certain heat dissipation space.

[0012] Compared with the prior art, the beneficial effects achieved by this utility model are: This utility model,

[0013] (1) By providing heat dissipation fins, a first strip heat dissipation hole, a second strip heat dissipation hole, a mesh air outlet groove, a mounting bracket, an air inlet, a mounting cover, a semiconductor cooling chip, and a heat dissipation fan, the heat dissipation fan can be activated to introduce the external air filtered by the filter plate into the mounting cover and into the reducer body through the air inlet. With the cooperation of the semiconductor cooling chip, the incoming air can be cooled, thereby dissipating heat from the reducer body and allowing it to circulate outward through multiple heat dissipation holes on the reducer body, thus improving air circulation.

[0014] (2) By setting a support block, a limiting groove, a mounting column, a mounting ring, a filter plate, a mounting groove and a limiting block, the mounting ring can be rotated to disengage from the mounting column, making it easy to disassemble the filter plate and the mounting cover, thereby making it easy to clean the dust on the filter plate. This avoids the inconvenience of disassembly and assembly caused by the integrated structure, which would cause dust to accumulate on the surface of the filter plate and affect normal heat dissipation, and also brings convenience to maintenance. Attached Figure Description

[0015] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0016] Figure 1 This is a front view structural diagram of the present invention;

[0017] Figure 2 This is a bottom view structural diagram of this utility model;

[0018] Figure 3 This is a schematic diagram of the filter plate structure of this utility model after disassembly;

[0019] Figure 4 This is an enlarged view of point A in part 3 of this utility model;

[0020] Figure 5 This is a schematic diagram of the filter plate structure of this utility model.

[0021] In the diagram: 1. Reducer body; 2. Heat dissipation fins; 3. First strip-shaped heat dissipation hole; 4. Second strip-shaped heat dissipation hole; 5. Mesh air outlet groove; 6. Mounting bracket; 7. Bolt groove; 8. Air inlet; 9. Mounting cover; 10. Support block; 11. Limiting groove; 12. Mounting column; 13. Mounting ring; 14. Filter plate; 15. Mounting groove; 16. Limiting block; 17. Semiconductor cooling chip; 18. Cooling fan. Detailed Implementation

[0022] The following detailed, non-limiting description of the present invention, in conjunction with preferred embodiments and accompanying drawings, is provided. Obviously, the described embodiments are merely some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0023] Please see Figure 1-5 The present invention provides a technical solution: a speed reduction device with heat dissipation function, including a speed reducer body 1, heat dissipation fins 2 fixedly connected to the front of the speed reducer body 1, a first strip-shaped heat dissipation hole 3 opened on the front of the speed reducer body 1, a second strip-shaped heat dissipation hole 4 opened on one side of the speed reducer body 1, a mesh air outlet groove 5 opened at the bottom of the speed reducer body 1, and a mounting bracket 6 fixedly connected to the bottom of the speed reducer body 1.

[0024] The reducer body 1 has an air inlet 8 on its top. A mounting cover 9 is fixedly connected to the top of the reducer body 1. A filter plate 14 is movably connected to the top of the mounting cover 9. A mounting groove 15 is provided at the bottom of the filter plate 14. A limit block 16 is fixedly connected to the bottom of the filter plate 14. A semiconductor cooling chip 17 and a cooling fan 18 are fixedly connected to the bottom of the filter plate 14. The cooling fan 18 can be activated to guide the external air filtered by the filter plate 14 into the mounting cover 9 and into the reducer body 1 through the air inlet 8. The air is cooled by the semiconductor cooling chip 17, thereby dissipating heat from the reducer body 1 and allowing it to circulate outward through multiple heat dissipation vents on the reducer body 1, improving airflow.

[0025] In this embodiment, a support block 10 is fixedly connected to the inner wall of the mounting cover 9. A limiting groove 11 is provided on the top of the support block 10. A mounting column 12 is fixedly connected to the inner wall of the mounting cover 9. A mounting ring 13 is movably connected to the outer wall of the mounting column 12. Rotating the mounting ring 13 disengages it from the mounting column 12, making it convenient to disassemble the filter plate 14 from the mounting cover 9. This facilitates cleaning the dust on the filter plate 14, avoiding the inconvenience of disassembly and assembly due to the integrated structure, which causes dust to accumulate on the surface of the filter plate 14 and affect normal heat dissipation. It also brings convenience to maintenance.

[0026] Example 2

[0027] Based on Embodiment 1, a preferred embodiment of the deceleration device with heat dissipation function provided by this utility model is, for example... Figures 1 to 5 As shown: the filter plate 14 is movably connected to the mounting column 12 and the support block 10 through the mounting groove 15 and the limiting block 16 respectively. The outer wall of the mounting column 12 is movably connected to the inner wall of the mounting groove 15, and the limiting block 16 is movably connected to the limiting groove 11, which facilitates the installation and connection of the filter plate 14 and the mounting cover 9, and also facilitates disassembly, cleaning and maintenance in the later stage.

[0028] In this embodiment, the outer wall of the mounting column 12 and the inner wall of the mounting ring 13 are both provided with threads, and the mounting column 12 and the mounting ring 13 are threadedly connected, which facilitates the threaded installation of the mounting ring 13 and the mounting column 12, thereby enabling the disassembly and assembly of the filter plate 14.

[0029] Furthermore, the semiconductor cooling chip 17 and the heat dissipation fan 18 are fixedly connected to the filter plate 14 by welding, and the diameter of the filter plate 14 is the same as the diameter of the mounting cover 9, which can improve the overall robustness of the structure.

[0030] Furthermore, the top of the mounting bracket 6 is provided with a bolt groove 7, and the mounting bracket 6 is an L-shaped mounting bracket, which facilitates the support and installation of the reducer body 1, and allows the bottom of the reducer body 1 to have a certain amount of heat dissipation space.

[0031] In use, the reducer body 1 is installed using the mounting bracket 6 to provide adequate ventilation space at the bottom. When dissipating heat, the cooling fan 18 can be turned on. The cooling fan 18 introduces external space into the mounting cover 9, and the air entering the mounting cover 9 is cooled by the semiconductor cooling chip 17 and then enters the reducer body 1 through the air inlet 8, thereby cooling down the internal temperature of the device. The incoming air will circulate outward through the first strip-shaped heat dissipation hole 3, the second strip-shaped heat dissipation hole 4, and the mesh air outlet 5, thus ensuring air circulation inside the device. Furthermore, the reducer body 1 has heat dissipation fins 2 on the front, which can transfer the internal temperature of the device outward, thereby improving the heat dissipation effect of the reducer body.

[0032] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0033] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A speed reduction device with heat dissipation function, comprising a speed reducer body (1), characterized in that: The front of the reducer body (1) is fixedly connected with heat dissipation fins (2), the front of the reducer body (1) is provided with a first strip heat dissipation hole (3), the side of the reducer body (1) is provided with a second strip heat dissipation hole (4), the bottom of the reducer body (1) is provided with a mesh air outlet groove (5), and the bottom of the reducer body (1) is fixedly connected with a mounting bracket (6). The reducer body (1) has an air inlet (8) on its top. The reducer body (1) is fixedly connected to a mounting cover (9). The top of the mounting cover (9) is movably connected to a filter plate (14). The bottom of the filter plate (14) has an installation groove (15). The bottom of the filter plate (14) is fixedly connected to a limit block (16). The bottom of the filter plate (14) is fixedly connected to a semiconductor cooling chip (17) and a cooling fan (18).

2. The speed reduction device with heat dissipation function according to claim 1, characterized in that: The inner wall of the mounting cover (9) is fixedly connected to a support block (10), and a limit groove (11) is opened on the top of the support block (10). The inner wall of the mounting cover (9) is fixedly connected to a mounting column (12), and the outer wall of the mounting column (12) is movably connected to a mounting ring (13).

3. The deceleration device with heat dissipation function according to claim 1, characterized in that: The filter plate (14) is movably connected to the mounting column (12) and the support block (10) through the mounting groove (15) and the limiting block (16), respectively. The outer wall of the mounting column (12) is movably connected to the inner wall of the mounting groove (15), and the limiting block (16) is movably connected to the limiting groove (11).

4. A speed reduction device with heat dissipation function according to claim 2, characterized in that: The outer wall of the mounting post (12) and the inner wall of the mounting ring (13) are both provided with threads, and the mounting post (12) and the mounting ring (13) are threaded together.

5. A speed reduction device with heat dissipation function according to claim 1, characterized in that: The semiconductor cooling chip (17) and the heat dissipation fan (18) are fixedly connected to the filter plate (14) by welding, and the diameter of the filter plate (14) is the same as the diameter of the mounting cover (9).

6. A speed reduction device with heat dissipation function according to claim 1, characterized in that: The mounting bracket (6) has a bolt groove (7) on its top, and the mounting bracket (6) is an L-shaped mounting bracket.

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