Pen key core with flexible film structure

Abstract

The utility model discloses a stylus key core with a flexible film structure, which belongs to the technical field of stylus key cores, and is characterized in that the stylus key core comprises a base, a stylus key core assembly is arranged at the top of the base, and the stylus key core assembly comprises a flexible circuit board film adhered to the top of the base; the top of the flexible circuit board thin film is provided with a flexible thin film structure, and the top of the flexible thin film structure is provided with a silica gel layer. Through the arrangement of the pen electric key core assembly, many advantages are brought, through the flexible circuit board thin film, it is ensured that electrical connection is stable, various actions of a notebook computer are adapted, and the service life is prolonged through the flexible thin film structure; the silica gel layer buffers impact, optimizes hand feeling and protects components, the keycap pad guarantees stable movement of the keycap, improves typing experience, solves the problems that a traditional key core is poor in hand feeling and prone to failure, optimizes space utilization and weight control, and improves comprehensive performance to meet the light and thin requirements.

Description

Technical Field

[0001] This utility model relates to the field of laptop keyboard technology, and in particular to a laptop keyboard with a flexible thin film structure. Background Technology

[0002] With the widespread use of laptops, users have increasingly higher requirements for keyboard performance and lifespan. Among them, the laptop keyboard core is the core component of the laptop keyboard. Its main function is to convert the user's key operations into electrical signals and transmit them to the computer motherboard for processing, thereby realizing operations such as text input and command execution. Its performance and quality directly affect the user's typing experience, the lifespan of the keyboard, and the overall reliability of the laptop.

[0003] Because the details of keyboards vary, the details of the backlight mold's light shield, light guide, and reflector also differ. This results in different manufacturing molds being needed to manufacture backlight modules to match different keyboards, which increases manufacturing costs.

[0004] An existing patent (publication number: CN Flexible thin film structure includes a base thin film layer disposed on the top of a flexible circuit board film, the top of the base thin film layer being in contact with the bottom of a silicone layer 126345U) discloses a backlight module and a backlight module for a backlight-emitting laptop key core. This utility model, by providing a lamp ring slide rail and enabling the lamp ring to move within the lamp ring slide rail, allows light strips with different lamp bead configurations to be installed in the reflector. When applied to different backlight-emitting laptop key cores, it eliminates the need to process the insertion opening of the light strip, which is beneficial to improving the manufacturing efficiency of the backlight module.

[0005] To address the aforementioned issues, existing patents have provided solutions. However, the existing traditional laptop key core structure is prone to problems such as deterioration of key feel and malfunction during long-term use due to mechanical structure wear, fatigue of elastic components, and intrusion of dust and foreign objects. In addition, its laptop key core cannot reduce size and weight while maintaining performance, thus failing to meet the requirements of thin and light laptop design.

[0006] To address this, a laptop key with a flexible thin-film structure is proposed. Utility Model Content

[0007] The purpose of this invention is to provide a laptop keyboard with a flexible thin-film structure, which solves the problems of traditional laptop keyboard structures, such as deterioration of key feel and malfunction due to mechanical wear, fatigue of elastic components, and intrusion of dust and foreign objects during long-term use. Furthermore, these traditional keyboards cannot reduce size and weight while maintaining performance, thus failing to meet the requirements of thin and light laptop designs. The laptop keyboard of this invention includes a flexible thin-film structure composed of multiple thin-film materials, including at least a base thin-film layer and a silicone layer. The base thin-film layer is disposed on top of the flexible circuit board film, while the bottom of the silicone layer contacts the top of the base thin-film layer. By setting a light ring slide rail on the base thin-film layer, the light ring can move within the slide rail, allowing different types of light strips to be installed in the reflector. This design not only improves the manufacturing efficiency of the backlight module but also eliminates the need for additional processing of the light strip embedding opening during application. In addition, the laptop keyboard of this invention also includes an elastic component that effectively absorbs the impact force generated during key operation, reducing wear on the mechanical structure. Meanwhile, the structural design of the elastic component also takes into account the intrusion of dust and foreign objects. Through optimized design, the durability and reliability of the laptop key core are improved. While meeting performance requirements, the laptop key core of this invention achieves a reduction in size and weight by adopting a flexible thin film structure, thus better adapting to the design trend of thinner and lighter laptops.

[0008] To achieve the above objectives, this utility model provides the following technical solution: a laptop keyboard core with a flexible thin film structure, including a base, wherein a laptop keyboard core assembly is disposed on the top of the base;

[0009] The laptop keyboard assembly includes a flexible circuit board film adhered to the top of the base. A flexible film structure is positioned on top of the flexible circuit board film, a silicone layer is positioned on top of the flexible film structure, and a keycap pad is positioned on top of the silicone layer. The keycap pad has tiny protrusions on its surface, which fit tightly against the silicone layer, ensuring the stability and accuracy of the keycap pad during keystrokes. Furthermore, the elasticity of the silicone layer provides good tactile feedback, giving users a comfortable typing experience. The use of the flexible film structure not only reduces the weight of the laptop keyboard but also improves the key response speed and sensitivity. At the bottom of the keyboard assembly, the flexible circuit board film is connected to the base via conductive adhesive, ensuring stable circuit conduction. The entire laptop keyboard assembly design considers both operational comfort and durability, as well as ease of maintenance.

[0010] Preferably, the flexible film structure includes a base film layer disposed on top of the flexible circuit board film, the top of which contacts the bottom of the silicone layer. The base film layer is made of a special material with excellent tensile and tear resistance, ensuring it will not be damaged by frequent keystrokes during prolonged use. Multiple tiny bumps are evenly distributed on the base film layer, which, in conjunction with the tiny bumps on the silicone layer, form a unique pressure-sensing mechanism. When the user presses the keycap pad, these bumps accurately transmit pressure to the silicone layer, thereby achieving precise key recognition. Furthermore, the material selection for the base film layer also considers its adaptability to temperature changes, ensuring that the performance of the laptop's keycap core remains stable under different ambient temperatures. Overall, this flexible film structure design not only improves the sensitivity and accuracy of the keys but also extends the lifespan of the laptop's keycap core.

[0011] Preferably, a conductive circuit layer is disposed at the bottom of the base thin film layer, the conductive circuit layer is located at the top of the flexible circuit board film, the conductive circuit layer is electrically connected to the flexible circuit board film, and both the top and bottom of the conductive circuit layer are coated with an anti-silver migration coating, the anti-silver migration coating being made of an organic polymer material containing nitrogen heterocyclic compounds.

[0012] Preferably, a low-temperature vacuum-encapsulated biosensor is disposed on the right side of the bottom of the base film layer, and the low-temperature vacuum-encapsulated biosensor is located on top of the flexible circuit board film.

[0013] Preferably, the bottom of the base is coated with a heat dissipation coating, the thickness of which is 20-50 micrometers.

[0014] Preferably, the cryogenic vacuum-encapsulated biosensor is manufactured using MEMS technology and includes a piezoresistive pressure-sensitive element and a signal processing circuit. The piezoresistive pressure-sensitive element of this biosensor can accurately detect the pressure applied by the user and convert it into an electrical signal. The signal processing circuit is responsible for amplifying, filtering, and converting these electrical signals to ensure a stable and accurate output signal. Through the use of MEMS technology, the sensor size can be made extremely small while maintaining high performance, which is crucial for the compact design of laptop keyboards. Furthermore, the application of cryogenic vacuum encapsulation technology not only improves the reliability of the sensor but also extends its lifespan in various environments.

[0015] Preferably, the cryogenic vacuum-encapsulated biosensor is connected to the flexible circuit board film via either gold wire bonding or a flexible connector electrical connection. Gold wire bonding uses fine gold wires to connect the sensor to the circuit board film, offering excellent conductivity and mechanical strength, capable of withstanding repeated bending and pressure changes without affecting performance. Flexible connector electrical connections provide a more flexible connection, allowing the sensor to move within a certain range without affecting signal transmission. This is particularly important in laptop keyboards, as button operations often involve displacement and pressure changes. The choice of these two connection methods ensures a stable connection between the sensor and the circuit board film while also adapting to the needs of laptop keyboards in different usage environments.

[0016] Preferably, the base is made of metal or plastic and has a thickness of 0.8-2.0 mm.

[0017] Preferably, the flexible circuit board film is made of an ultra-thin, bendable circuit board material with flexible properties. This design allows the laptop keyboard to better distribute stress under pressure, thereby improving key durability. Furthermore, the ultra-thin circuit board material reduces the overall thickness, making the laptop keyboard thinner and lighter, meeting the demands of modern laptops for portability. The circuit patterns on the circuit board film are precisely designed to ensure the accuracy and speed of signal transmission while reducing the possibility of electromagnetic interference. Overall, this flexible film structure for laptop keyboards not only improves product performance but also enhances the user experience.

[0018] Preferably, a flat cable is electrically connected to the front side of the flexible circuit board film, and a ZIF interface is provided on the front side of the flat cable. The ZIF interface allows users to easily connect or disconnect the cable without tools, thereby improving the convenience of maintenance and replacement. The flat cable design not only ensures the stability and reliability of signal transmission, but also effectively reduces space occupation due to its flat structure, making the layout of the laptop's keyboard more compact. Furthermore, the flexibility of the flat cable adapts to the bending and movement requirements of the laptop's keyboard in different usage environments, further improving overall durability and reliability. Overall, this design not only optimizes the performance of the laptop's keyboard but also enhances the user experience.

[0019] Compared with the prior art, the beneficial effects of this utility model are:

[0020] 1. This application offers numerous advantages by setting up a laptop keyboard core assembly. The flexible circuit board film ensures stable electrical connection, adapts to various laptop movements, the flexible film structure extends service life, provides a gentle touch and is fatigue-resistant, the silicone layer cushions impact, optimizes feel and protects components, the keycap pad ensures stable keycap movement, improves typing experience, solves the problems of poor feel and easy failure of traditional keyboard cores, and optimizes space utilization and weight control, improving overall performance to meet the requirements of thinness and lightness.

[0021] 2. This application provides support and integration for the key core assembly by setting a base, precisely fixing each component, ensuring structural stability, and resisting external influences. The base is designed with high-strength materials to ensure it is not easily deformed during long-term use, while its surface treatment process also enhances the bonding force with the key core assembly. Furthermore, the base's structural design considers heat dissipation requirements, helping to maintain a stable internal temperature for the laptop and preventing performance degradation due to overheating. Through these designs, this utility model ensures the stability and durability of the laptop's key core while also improving overall heat dissipation efficiency and safety. Attached Figure Description

[0022] Figure 1 This is an overall structural diagram of the laptop key core with a flexible thin film structure according to this utility model.

[0023] Figure 2 This is a structural diagram of the laptop key core assembly of this utility model;

[0024] Figure 3 This is a structural diagram of the flexible thin film structure of this utility model;

[0025] Figure 4 This is a structural diagram of the base of this utility model;

[0026] Figure 5 This is a structural diagram of the conductive circuit layer of this utility model;

[0027] Figure 6 This is a structural diagram of the flexible circuit board film of this utility model.

[0028] In the diagram, 1 is the base; 2 is the laptop keyboard assembly; 201 is the flexible circuit board film; 202 is the flexible film structure; 2021 is the base film layer; 2022 is the conductive circuit layer; 2023 is the anti-silver migration coating; 2024 is the low-temperature vacuum-encapsulated biosensor; 203 is the silicone layer; 204 is the keycap pad; 3 is the heat dissipation coating; 4 is the flat cable; and 5 is the ZIF interface. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0030] Please see Figure 1-6 The present invention provides the following technical solution:

[0031] A laptop keyboard with a flexible thin film structure includes a base 1, and a laptop keyboard assembly 2 is disposed on the top of the base 1.

[0032] The laptop keyboard assembly 2 includes a flexible circuit board film 201 bonded to the top of the base 1. A flexible film structure 202 is provided on the top of the flexible circuit board film 201. A silicone layer 203 is provided on the top of the flexible film structure 202. A keycap pad 204 is provided on the top of the silicone layer 203.

[0033] In this embodiment: By setting up the laptop keyboard assembly 2, the base 1 provides a solid support and fixing frame for the entire laptop keyboard assembly 2. Its reasonable structural design and size planning ensure that components such as the flexible circuit board film 201, flexible film structure 202, silicone layer 203, and keycap pad 204 can be accurately and stably installed in the predetermined position. Among them, the flexible circuit board film 201 is made of flexible material, which not only realizes the electrical connection function, but also has good flexibility, ensuring the stability of the electrical connection. The flexible film structure 202 replaces the traditional mechanical structure, which greatly reduces the wear problem caused by long-term use. Its unique material properties make it have excellent fatigue resistance. The performance is such that it can withstand millions of press cycles without easily being damaged, significantly extending its service life. The silicone layer 203 provides excellent cushioning. When the user presses the keycap, the silicone layer 203 can evenly distribute the pressure, making the key feel lighter and more comfortable. At the same time, it can also absorb some of the key impact, further protecting the flexible film structure 202 and other internal components. The keycap pad 204 provides a stable support base for the keycap, ensuring smooth movement during the pressing process, and helps to improve the consistency and stability of the overall key feel. This effectively solves the problems of poor key feel and malfunction caused by mechanical structure wear and fatigue of elastic components in traditional key cores.

[0034] Specifically, such as Figure 3 As shown, the flexible thin film structure 202 includes a base film layer 2021 disposed on top of the flexible circuit board film 201, and the top of the base film layer 2021 is in contact with the bottom of the silicone layer 203.

[0035] Specifically, such as Figure 3 As shown, a conductive circuit layer 2022 is disposed at the bottom of the base thin film layer 2021. The conductive circuit layer 2022 is located at the top of the flexible circuit board film 201 and is electrically connected to the flexible circuit board film 201. Both the top and bottom of the conductive circuit layer 2022 are coated with an anti-silver migration coating 2023, which is made of an organic polymer material containing nitrogen heterocyclic compounds.

[0036] Specifically, such as Figure 3 As shown, a low-temperature vacuum-encapsulated biosensor 2024 is disposed on the right side of the bottom of the base thin film layer 2021, and the low-temperature vacuum-encapsulated biosensor 2024 is located on the top of the flexible circuit board film 201.

[0037] In this embodiment: By setting a flexible thin film structure 202, the base thin film layer 2021 is set on top of the flexible circuit board film 201. On the one hand, it provides stable support for the upper silicone layer 203, ensuring the consistency of the key feel. On the other hand, it closely cooperates with the lower conductive line layer 2022. The conductive line layer 2022 is located on top of the flexible circuit board film 201 and is electrically connected to it. The anti-silver migration coating 2023 coated on its top and bottom is made of organic polymer material containing nitrogen heterocyclic compounds, which effectively prevents silver ions from migrating under the action of an electric field, prevents short circuits, and ensures the long-term stability of signal transmission. Even in complex and variable temperature and humidity environments, electrical signals can pass through accurately. The low-temperature vacuum-encapsulated biosensor 2024 is used to sensitively capture the pressure change when the user presses the keycap. Then, the signal processing circuit of the low-temperature vacuum-encapsulated biosensor 2024 quickly converts it into an electrical signal and then accurately transmits the information.

[0038] Specifically, such as Figure 4 As shown, the bottom of the base 1 is coated with a heat dissipation coating 3, and the thickness of the heat dissipation coating 3 is 20-50 micrometers.

[0039] Specifically, such as Figure 3 As shown, the low-temperature vacuum-encapsulated biosensor 2024 is manufactured using MEMS technology and contains a piezoresistive pressure-sensitive element and a signal processing circuit.

[0040] In this embodiment: the 20-50 micrometer heat dissipation coating 3 coated on the bottom of the base 1 can quickly conduct and dissipate heat when the laptop key core is working for a long time and heat is accumulated, ensuring that the internal component temperature is within a suitable range and avoiding problems such as circuit performance degradation caused by overheating. In addition, its low-temperature vacuum-encapsulated biosensor 2024 is manufactured using MEMS technology and integrates a piezoresistive pressure sensitive element and a signal processing circuit. When the user presses the keycap of the keycap pad 204, the pressure change is keenly captured by the piezoresistive pressure sensitive element, and then the signal processing circuit quickly converts it into an electrical signal.

[0041] Specifically, such as Figure 3 As shown, the low-temperature vacuum-encapsulated biosensor 2024 is connected to the flexible circuit board film 201 by gold wire bonding or electrical connection via a flexible connector.

[0042] Specifically, such as Figure 2 As shown, the base 1 is made of metal or plastic and has a thickness of 0.8-2.0 mm.

[0043] In this embodiment: the low-temperature vacuum-encapsulated biosensor 2024 is electrically connected to the flexible circuit board film 201 by gold wire bonding or flexible connector, which can accurately transmit the key action information and make the key command response faster. At the same time, the base 1 is made of metal or plastic material with a thickness of 0.8-2.0 mm, which provides stable support while accurately adapting to the thin and light requirements of laptops.

[0044] Specifically, such as Figure 5 As shown, the flexible circuit board film 201 is made of an ultra-thin, bendable circuit board material and has flexible properties.

[0045] Specifically, such as Figure 6 As shown, a flat cable 4 is electrically connected to the front side of the flexible circuit board film 201, and a ZIF interface 5 is provided on the front side of the flat cable 4.

[0046] In this embodiment: the flexible circuit board film 201 is made of an ultra-thin and bendable circuit board material. Its flexibility allows it to move freely in the limited and complex internal space of a laptop. It can adapt flexibly to slight twisting during daily use and always ensure a stable electrical connection with various components. The flat cable 4 and ZIF interface 5 electrically connected to the front of the flexible circuit board film 201 form a convenient and efficient external connection channel. The flat cable 4, with its flat and thin characteristics, is easy to wire in narrow spaces and reduces the space compression on other components. The ZIF interface 5 provides convenient plug-in and plug-out functions. Whether it is the connection of components in the production assembly process or the disassembly operation during subsequent maintenance and replacement, it can be easily realized, which greatly improves production efficiency and after-sales maintenance convenience.

[0047] Working Principle: During the use of the laptop key core with a flexible film structure, the base 1 serves as the basic support component. Through reasonable structural design and precise dimensional planning, it provides stable support for the flexible circuit board film 201, flexible film structure 202, silicone layer 203, and keycap pad 204, ensuring tight fit between all components. Furthermore, because the flexible circuit board film 201 uses an ultra-thin, flexible material, even with slight twisting during daily use, the electrical connection remains stable and reliable, never interrupted, laying a solid foundation for signal transmission. The flat cable 4 and ZIF interface 5 connected to its front side can be easily arranged within limited space. Interface 5 offers convenient plug-and-play functionality, ensuring smooth operation for both initial assembly and subsequent maintenance, significantly improving production and after-sales efficiency. Furthermore, the base film layer 2021 sits firmly atop the flexible circuit board film 201, serving as a crucial link. It supports the silicone layer 203, ensuring a uniform and stable pressing feel, and seamlessly connects to the conductive circuit layer 2022 below. The conductive circuit layer 2022 is coated with an anti-silver migration coating 2023 made of nitrogen-containing heterocyclic organic polymer material. Under complex temperature and humidity environments, silver ion migration is completely blocked, eliminating the risk of short circuits and ensuring precise and durable electrical signal transmission. The base film layer 2021 is located at the bottom... The low-temperature vacuum-encapsulated biosensor 2024 on the right is built using MEMS technology, integrating a piezoresistive pressure-sensitive element and signal processing circuit. When a finger presses the keycap under the keycap pad 204, the pressure change is instantly captured and converted into an electrical signal. This signal is then precisely transmitted to the flexible circuit board film 201 via gold wire bonding or a flexible connector, ensuring efficient command response. The silicone layer 203 is tightly attached to the base film layer 2021. When the keycap under the keycap pad 204 is pressed, it evenly distributes the pressure, making the touch light and smooth, while simultaneously neutralizing the impact of the keystrokes, thus providing a smooth and gentle feel for the flexible film structure 202 below. The keycaps and related components are protected, greatly extending their service life. The 204 keycap pad protects and integrates the bottom keycaps, ensuring a straight and stable keystroke trajectory, accurate and consistent key feedback, and a stable and reliable feel. This completely eliminates the problems of poor feel and malfunction caused by mechanical wear and elastic fatigue in traditional keycaps. Furthermore, the 20-50 micron heat dissipation coating 3 on the bottom of the base 1, with its special material structure, can quickly conduct and dissipate the heat of the base 1, keeping the internal components within a suitable temperature range. The circuit performance is rock-solid, eliminating the risk of overheating. The overall design is well-coordinated, with each structure working closely together to fully meet user needs and create an ultimate user experience.

[0048] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A laptop keyboard core with a flexible thin film structure, comprising a base (1), characterized in that: The top of the base (1) is provided with a laptop key core assembly (2). The laptop key core assembly (2) includes a flexible circuit board film (201) bonded to the top of the base (1), a flexible film structure (202) is provided on the top of the flexible circuit board film (201), a silicone layer (203) is provided on the top of the flexible film structure (202), and a keycap pad (204) is provided on the top of the silicone layer (203).

2. The laptop key core with a flexible thin film structure according to claim 1, characterized in that: The flexible thin film structure (202) includes a base film layer (2021) disposed on top of the flexible circuit board film (201), the top of the base film layer (2021) being in contact with the bottom of the silicone layer (203).

3. A laptop keyboard with a flexible thin-film structure according to claim 2, characterized in that: A conductive circuit layer (2022) is disposed at the bottom of the base thin film layer (2021). The conductive circuit layer (2022) is located on the top of the flexible circuit board film (201). The conductive circuit layer (2022) is electrically connected to the flexible circuit board film (201). Both the top and bottom of the conductive circuit layer (2022) are coated with an anti-silver migration coating (2023). The anti-silver migration coating (2023) is made of an organic polymer material containing nitrogen heterocyclic compounds.

4. A laptop keyboard with a flexible thin-film structure according to claim 2, characterized in that: A low-temperature vacuum-encapsulated biosensor (2024) is disposed on the right side of the bottom of the base thin film layer (2021), and the low-temperature vacuum-encapsulated biosensor (2024) is located on top of the flexible circuit board film (201).

5. A laptop keyboard with a flexible thin-film structure according to claim 1, characterized in that: The bottom of the base (1) is coated with a heat dissipation coating (3), the thickness of which is 20-50 micrometers.

6. A laptop keyboard with a flexible thin-film structure according to claim 4, characterized in that: The low-temperature vacuum-encapsulated biosensor (2024) is manufactured using MEMS technology and contains a piezoresistive pressure-sensitive element and a signal processing circuit.

7. A laptop keyboard with a flexible thin-film structure according to claim 4, characterized in that: The connection between the low-temperature vacuum-encapsulated biosensor (2024) and the flexible circuit board film (201) is achieved by gold wire bonding or electrical connection via a flexible connector.

8. A laptop keyboard with a flexible thin-film structure according to claim 1, characterized in that: The base (1) is made of metal or plastic and has a thickness of 0.8-2.0 mm.

9. A laptop keyboard with a flexible thin-film structure according to claim 1, characterized in that: The flexible circuit board film (201) is made of an ultra-thin, bendable circuit board material and has flexibility properties.

10. A laptop keyboard with a flexible thin-film structure according to claim 1, characterized in that: The front side of the flexible circuit board film (201) is electrically connected to a flat cable (4), and the front side of the flat cable (4) is provided with a ZIF interface (5).

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