Display module and electronic equipment

Abstract

The utility model relates to a display module and electronic equipment, the display module is applied to the electronic equipment, the display module comprises a display panel, a flexible circuit board and a sealing colloid, the display panel comprises a display area and a binding area, the flexible circuit board comprises a circuit board main body and a binding end, the binding area and the circuit board main body are both arranged on a non-display surface of the display area, and the sealing colloid is arranged on the binding end. The flexible circuit board, the binding area and the non-display surface define a first clearance space, the first clearance space extends in the width direction of the binding area, and the sealing colloid is filled in at least one end of the first clearance space in the width direction of the binding area. According to the display module, the sealing colloid is arranged at the end of the first gap space, the sealing colloid can block the opening in the end of the first gap space, so that the situation that the display module is damaged due to the fact that water vapor and impurities enter the first gap space to corrode the binding end is avoided, and the sealing structure is simple and effective; the waterproof performance of the display module is improved, and the cost is reduced.

Description

Technical Field

[0001] This disclosure relates to the field of electronic equipment technology, and in particular to a display module and an electronic device. Background Technology

[0002] Water resistance is an important factor for users when purchasing electronic devices.

[0003] In related technologies, electronic devices primarily rely on their casings for waterproofing, while the internal waterproofing measures are often inadequate. When the casing's waterproofing is insufficient, moisture can enter the electronic device and corrode the pins of the display screen, leading to display malfunctions. Utility Model Content

[0004] To overcome the problems existing in related technologies, this disclosure provides a display module and an electronic device.

[0005] A first aspect of this disclosure provides a display module for use in an electronic device, the display module comprising:

[0006] A display panel includes an electrically connected display area and a bonding area, wherein the bonding area is located on the non-display surface of the display area;

[0007] A flexible circuit board includes a circuit board body and a bonding end, wherein the circuit board body is connected to the non-display surface, and the bonding end is stacked with the bonding area and forms an electrical connection;

[0008] In a first direction, there is a first mounting gap between the circuit board body and the bonding area; in a second direction, there is a second mounting gap between the bonding end and the non-display surface; the flexible circuit board, the bonding area, and the non-display surface enclose a first gap space, which extends along the width direction of the bonding area, and the first direction, the second direction, and the width direction of the bonding area are perpendicular to each other;

[0009] A sealing compound, which fills at least one end of the first gap space in the width direction of the bonding area.

[0010] In some embodiments, the display module further includes a first adhesive layer for connecting the circuit board body to the non-display surface;

[0011] The first adhesive layer includes:

[0012] The first main body is directly opposite the main body of the circuit board;

[0013] The first limiting structure is formed by a portion of the sidewall of the first main body protruding along the width direction of the binding area, and the first limiting structure protrudes from the sidewall of the circuit board body.

[0014] In some embodiments, in the width direction of the bonding area, the size of the first main body is smaller than the size of the circuit board body, and a first adhesive groove is formed between the area of ​​the circuit board body that is not directly opposite to the first adhesive layer and the non-display surface;

[0015] Along the first direction, one end of the first glue groove is connected to the first limiting structure, and the other end of the first glue groove is connected to the first gap space. A portion of the structure of the sealing adhesive is filled in the first glue groove.

[0016] In some embodiments, the display module further includes a reinforcement layer disposed between the bonding area and the non-display surface;

[0017] The reinforcing layer includes:

[0018] The second main body is directly opposite the binding area;

[0019] The second limiting structure is formed by a portion of the side wall of the second main body protruding along the width direction of the binding area, and the second limiting structure protrudes from the side wall of the binding area.

[0020] In some embodiments, in the width direction of the bonding area, the size of the second main body portion is smaller than the size of the bonding area, and a second adhesive groove is formed between the area of ​​the bonding area that is not directly opposite the reinforcing layer and the shown non-display surface;

[0021] Along the first direction, one end of the second glue groove is connected to the second limiting structure, and the other end of the second glue groove is connected to the first gap space. A portion of the structure of the sealing glue is filled in the second glue groove.

[0022] In some embodiments, in the first direction, the first limiting structure and the second limiting structure are respectively disposed on both sides of the first gap space.

[0023] In some embodiments, the first limiting structure protrudes from the sidewall of the flexible circuit board by a dimension greater than or equal to 0.5 mm; and / or,

[0024] The second limiting structure protrudes from the side wall of the binding area by a dimension greater than or equal to 0.5 mm.

[0025] In some embodiments, the display module further includes a second adhesive layer.

[0026] The second adhesive layer includes a first adhesive area, a second adhesive area, and a connecting area connected in sequence. The first adhesive area is attached to the side of the bonding end that is away from the display area, and the second adhesive area is attached to the side of the bonding area that is away from the display area.

[0027] The first bonding area, the connecting area, and the second bonding area form a stepped structure. The connecting area and the sidewall of the binding end in the first direction have a third installation gap. The connecting area, the binding end, and the binding area enclose a second gap space.

[0028] Part of the structure of the sealing colloid fills the second gap space.

[0029] In some embodiments, the sealant comprises a UV adhesive.

[0030] According to a second aspect of this disclosure, an electronic device is provided, including a display module as described in the first aspect.

[0031] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects: by providing a sealing colloid at the end of the first gap space, the sealing colloid can seal the opening at the end of the first gap space, so as to prevent moisture and impurities from entering the first gap space and causing corrosion to the bonding end, resulting in damage to the display module. The sealing structure is simple and effective, which helps to improve the waterproof performance of the display module and reduce costs.

[0032] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0033] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0034] Figure 1 This is a schematic diagram of a display module in related technologies.

[0035] Figure 2 yes Figure 1 A magnified view of region A in the middle.

[0036] Figure 3 This is a schematic diagram of the non-display surface of a display module according to an exemplary embodiment.

[0037] Figure 4 This is a partial schematic diagram of a display module according to an exemplary embodiment.

[0038] Figure 5 yes Figure 4 A magnified view of region B in the middle.

[0039] Figure 6 yes Figure 4 A magnified view of region B in the middle. Detailed Implementation

[0040] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0041] See Figure 1 and Figure 2 The illustration shows a display module for an electronic device in the related art. The display module includes a display panel 10' consisting of a display area 11' and a bonding area 12'. A first back plate 111' is provided on the side of the display area 11' facing the bonding area 12' (non-display surface), and a second back plate 121' is provided on the side of the bonding area 12' facing the display area 11'. The display module also includes a flexible circuit board 20', which includes a circuit board body 21' and a bonding end 22'. The circuit board body 21' is bonded to the first back plate 111' through a first adhesive portion (not shown in the figure). The bonding end 22' is stacked with the bonding area 12' and forms an electrical connection. The circuit board body 21' and the display panel 10' form a signal path through the bonding end 22'.

[0042] Among them, see Figure 2 It can be determined that the connection can only be achieved by stacking the bonding end 22' and the bonding area 12', resulting in a first gap space 31' between the bonding end 22' and the first back plate 111'. In related technologies, to prevent moisture from entering the electronic device and damaging the display panel 10', a long strip of adhesive 80' is usually placed in the first gap space 31', with the top surface of the adhesive 80' adhering to the bottom surface of the bonding end 22' and the side surface of the adhesive 80' adhering to the side surface of the bonding area 12'. However, the waterproof effect of the adhesive 80' is limited, and the adhesive 80' needs to be set along the width direction of the bonding area 12'. Figure 4 The long strip structure extending in the y-direction (i.e., the width direction of the electronic device) shown in the figure has a high cost.

[0043] To address the problems existing in related technologies, this disclosure provides a display module and an electronic device. The display module is applied to an electronic device and includes a display panel, a flexible circuit board, and a sealing adhesive. The display panel includes a display area and a bonding area. The flexible circuit board includes a circuit board body and a bonding end. Both the bonding area and the circuit board body are disposed on the non-display surface of the display area. The flexible circuit board, the bonding area, and the non-display surface enclose a first gap space, which extends along the width direction of the bonding area. The sealing adhesive fills at least one end of the first gap space along the width direction of the bonding area. In this disclosure, by providing a sealing adhesive at the end of the first gap space, the sealing adhesive can seal the opening at the end of the first gap space, preventing moisture and impurities from entering the first gap space and corroding the bonding end, thus preventing damage to the display module. The sealing structure is simple and effective, improving the waterproof performance of the display module and reducing costs.

[0044] According to an exemplary embodiment of this disclosure, such as Figures 3 to 6 As shown, this disclosure provides a display module that is applied to electronic devices, such as smartphones, tablets, laptops, smart wearable devices, and any other electronic products with image display capabilities.

[0045] like Figure 3 and Figure 4 As shown, the display module includes a display panel 10, which includes a display area 11. The display area 11 has a display surface and a non-display surface. The display surface is used to display image information, while the non-display surface is typically located inside the electronic device. In some optional embodiments, a first backplate 111 is provided on the non-display side of the display area 11. The first backplate 111 can be a copper foil sheet, which can enhance the heat dissipation efficiency of the display area 11 and achieve electromagnetic shielding.

[0046] For example, the display panel 10 provided in this embodiment can be an organic light-emitting diode (OLED) panel. OLED panels are bendable, and electronic devices using OLED panels typically have extremely narrow bezels, high screen-to-body ratios, and good display effects. See also... Figure 3 and Figure 4 The display panel 10 also includes a bonding area 12. The bonding area 12 can be electrically connected to the display area 11 through a bending area 13. The bonding area 12 is folded to the non-display surface of the display area 11 through the U-shaped bending area 13. The bonding area 12 can be electrically connected to the flexible circuit board 20 (described in detail below), the display driver chip 70, etc., to supply power to the display area 11 and output display signals.

[0047] like Figures 3 to 6As shown, the display module also includes a flexible circuit board 20. One end of the flexible circuit board 20 is electrically connected to the bonding area 12 of the display panel 10, and the other end of the flexible circuit board 20 can be electrically connected to the motherboard of the electronic device. Thus, the motherboard can supply power to the display panel 10 and transmit display signals through the flexible circuit board 20. (See reference...) Figure 5 The flexible circuit board 20 includes a connected circuit board body 21 and a bonding end 22. The circuit board body 21 is connected to the non-display surface of the display area 11, and the bonding end 22 is stacked with the bonding area 12 to form an electrical connection. It is understood that...

[0048] like Figure 5 As shown, in the first direction ( Figure 4 In the x-direction shown, there is a first mounting gap between the circuit board body 21 and the bonding area 12. It is understood that, since the circuit board body 21 and the bonding area 12 are independent components, various first mounting gaps of different sizes will occur during assembly based on assembly precision. Figure 5 As shown, in the second direction ( Figure 4 In the z-direction shown, there is a second mounting gap between the binding end 22 and the non-display surface of the display area 11. The second mounting gap is related to the thickness of the binding area 12. The greater the thickness of the binding area 12, the larger the size of the second mounting gap.

[0049] As can be seen from the above, the non-display surfaces of the flexible circuit board 20, the bonding area 12, and the display area 11 enclose a first gap space 31, which is a through channel extending along the width direction of the bonding area 12. It is understandable that the first gap space 31 can communicate with the pins of the bonding end 22, allowing external moisture and impurities to easily contact the pins through the connection seam between the first gap space 31, the bonding area 12, and the bonding end 22, potentially leading to short circuits, corrosion, and other issues.

[0050] like Figure 6 As shown, the display module provided in this disclosure also includes a sealing adhesive 30, which is disposed at the end of the first gap space 31. The projected pattern of the sealing adhesive 30 on a preset cross-section is greater than or equal to the projected pattern of the first gap space 31, and the preset cross-section is the cross-section that is perpendicular to the width direction of the bonding area 12. Figure 4 As shown in the y-direction, the plane is perpendicular to the first gap space 31, so that the sealing colloid 30 can completely seal the opening of the first gap space 31 to prevent water vapor and impurities from entering the first gap space 31, thereby preventing water vapor and impurities from contacting the pins of the binding end 22 and achieving the sealing function.

[0051] It is understandable that the cross-sectional shape of the first gap space 31 may differ in different display modules. In this embodiment, waterproof adhesive is used for sealing. Based on the characteristic of waterproof adhesive to change shape at will, the waterproof adhesive applied to the opening of the first gap space 31 can adapt to the cross-sectional shape of the first gap space 31. Once the waterproof adhesive cures to form a sealing colloid 30, it can effectively seal the space. In one example, UV adhesive can be selected as the waterproof adhesive. UV adhesive can cure after being exposed to ultraviolet light. The cured UV adhesive is completely transparent and has advantages such as environmental resistance, non-whitening, and good flexibility.

[0052] In this embodiment of the present disclosure, by providing a sealing adhesive at the end of the first gap space, the sealing adhesive can seal the opening at the end of the first gap space, so as to prevent moisture and impurities from entering the first gap space and causing corrosion to the bonding end, resulting in damage to the display module. The sealing structure is simple and effective, which helps to improve the waterproof performance of the display module and reduce costs.

[0053] In one exemplary embodiment, such as Figures 3 to 6 As shown, this embodiment provides a display module, which includes a display panel 10, a flexible circuit board 20, and a sealing adhesive 30. The display panel 10 includes a display area 11 and a bonding area 12. The flexible circuit board 20 includes a circuit board body 21 and a bonding end 22. The bonding area 12 and the circuit board body 21 are both disposed on the non-display surface of the display area 11. The flexible circuit board 20, the bonding area 12, and the non-display surface enclose a first gap space 31. The first gap space 31 extends along the width direction of the bonding area 12. In the width direction of the bonding area 12, the sealing adhesive 30 fills at least one end of the first gap space 31.

[0054] In this embodiment, as Figure 5 As shown, the display module includes a first adhesive layer, which is used to connect the circuit board body 21 and the non-display surface of the display area 11.

[0055] See Figure 5 and Figure 6 The first adhesive layer includes a first main body portion (not shown in the figures), which extends in the thickness direction of the display area 11. Figure 4 In the z-direction shown, the first main body is directly opposite the circuit board body 21, and the first main body is used to bond and connect the circuit board body 21 and the non-display surface of the display area 11. (Continue reading...) Figure 5 The first adhesive layer also includes a first limiting structure 40, which is formed by extending outward from a portion of the sidewall of the first main body. The extending direction is parallel to the width direction of the bonding area 12. The first limiting structure 40 protrudes not only from the sidewall of the first main body but also from the sidewall of the circuit board body 21. Figure 5 and Figure 6It can be determined that the first limiting structure 40 can limit the waterproof adhesive during the adhesive application stage, that is, limit the adhesive application area, and prevent the waterproof adhesive from spreading too much and causing the waterproof adhesive to not completely seal the opening of the first gap space 31.

[0056] In one example, see Figure 5 In the width direction of the binding area 12, the first limiting structure 40 protrudes from the sidewall of the flexible circuit board 20 by a dimension greater than or equal to 0.5mm. It can be adapted to the size of the display module.

[0057] Among them, such as Figure 4 As shown, in the width direction of the binding area 12 ( Figure 4 In the y-direction shown, the size of the first main body is smaller than the size of the circuit board body 21, and a first adhesive groove 32 is formed in the area of ​​the circuit board body 21 opposite to the first adhesive layer. For example, see [reference needed]. Figure 4 The first adhesive groove 32 is formed by the non-display surface of the display area 11, the sidewall of the first adhesive layer, and the bottom surface of the circuit board body 21. (Continue reading...) Figure 5 and Figure 6 In the first direction ( Figure 4 In the x direction shown, one end of the first glue groove 32 is connected to the first limiting structure 40, and the other end of the first glue groove 32 is connected to the first gap space 31. Part of the structure of the sealing glue 30 is filled in the first glue groove 32.

[0058] In this embodiment, by adapting the first adhesive layer, a first adhesive groove 32 communicating with the first gap space 31 is formed in the display module. Part of the structure of the sealing adhesive 30 is filled in the first adhesive groove 32, which increases the connection reliability and sealing performance between the sealing adhesive 30 and the non-display surface, the first adhesive part and the circuit board body 21.

[0059] In some embodiments, as shown in the figure, the display module further includes a reinforcing layer (not shown in the figure), which is disposed between the bonding area 12 and the non-display surface of the display area 11. For example, the reinforcing layer is disposed between the first back plate 111 and the second back plate 121 (described in detail below).

[0060] See Figure 3 and Figure 4It is understood that a portion of the structure of the display panel 10 is bent to form a bending area 13, allowing the bonding area 12 to be flipped onto the non-display surface of the display area 11 for encapsulation. Since the structure of the display area 11 near the bending area 13 needs to withstand significant bending stress, and the structure of the bonding area 12 near the bending area 13 also needs to withstand significant bending stress, a reinforcing layer is provided in the bonding area 12. This reinforcing layer provides sufficient support for both the display area 11 and the bonding area 12 to prevent collapse and deformation that could lead to circuit breakage. In some optional embodiments, a second backplate 121 is also provided between the bonding area 12 and the reinforcing layer. The second backplate 121 can be used to elevate the bonding area 12, ensuring a sufficiently large gap between the bonding area 12 and the display area 11, thereby preventing the bending radius of the bending area 13 from being too small and causing circuit damage.

[0061] Among them, such as Figure 5 and Figure 6 As shown, the reinforcing layer includes a second main body (not shown in the attached drawings), which faces the binding area 12. That is, the second main body provides structural reinforcement to the binding area 12 and the display area 11 to prevent collapse deformation. (Continue reading...) Figure 5 and Figure 6 The reinforcing layer also includes a second limiting structure 50, which is formed by extending outward from a portion of the sidewall of the second main body. The extension direction is parallel to the width direction of the bonding area 12. The second limiting structure 50 protrudes not only from the sidewall of the second main body but also from the sidewall of the circuit board body 21. Figure 5 and Figure 6 It can be determined that the second limiting structure 50 can limit the waterproof adhesive during the adhesive application stage, that is, limit the adhesive application area, and prevent the waterproof adhesive from spreading too much and causing the waterproof adhesive to not completely seal the opening of the first gap space 31.

[0062] In one example, see Figure 4 and Figure 5 In the width direction of binding area 12 ( Figure 4 In the y-direction shown, the first limiting structure 40 protrudes from the sidewall of the flexible circuit board 20 by a dimension greater than or equal to 0.5 mm. It can be adapted to the size of the display module.

[0063] Among them, such as Figures 4 to 6 As shown, in the width direction of the binding area 12 ( Figure 4 In the y-direction shown, the size of the second main body is smaller than the size of the bonding area 12, and the area of ​​the bonding area 12 opposite the reinforcing layer forms a second adhesive groove 33. For example, see [reference needed]. Figure 5 The second adhesive groove 33 is formed by the first back plate 111, the sidewall of the reinforcing layer, and the bottom surface of the bonding area 12. The opening direction of the second adhesive groove 33 is parallel to the width direction of the bonding area 12. (Continue reading...) Figure 5 In the first direction ( Figure 4 In the x direction shown, one end of the second glue groove 33 is connected to the second limiting structure 50, and the other end of the second glue groove 33 is connected to the first gap space 31. Part of the structure of the sealing glue 30 is filled in the second glue groove 33.

[0064] In this embodiment, by adapting the structure of the reinforcing layer, a second adhesive groove 33 communicating with the first gap space 31 is formed in the display module. Part of the structure of the sealing adhesive 30 is filled in the second adhesive groove 33, which increases the connection reliability and sealing performance between the sealing adhesive 30 and the non-display surface, the first adhesive part and the bonding area 12.

[0065] Among them, see Figures 4 to 6 In the first direction ( Figure 4 In the x-direction shown, the first limiting structure 40 and the second limiting structure 50 are respectively disposed on both sides of the first gap space 31, thereby blocking the two ends of the sealing colloid 30 respectively, ensuring that the sealing colloid 30 is formed within the specified range, and improving the sealing performance.

[0066] In one exemplary embodiment, such as Figures 3 to 6 As shown, this embodiment provides a display module, which includes a display panel 10, a flexible circuit board 20, and a sealing adhesive 30. The display panel 10 includes a display area 11 and a bonding area 12. The flexible circuit board 20 includes a circuit board body 21 and a bonding end 22. The bonding area 12 and the circuit board body 21 are both disposed on the non-display surface of the display area 11. The flexible circuit board 20, the bonding area 12, and the non-display surface enclose a first gap space 31. The first gap space 31 extends along the width direction of the bonding area 12. In the width direction of the bonding area 12, the sealing adhesive 30 fills at least one end of the first gap space 31.

[0067] The display module provided in this embodiment may include any structure of the display modules provided in the above embodiments.

[0068] In this embodiment, as Figure 5 and Figure 6 As shown, the display module also includes a second adhesive layer 60 and a display driver chip 70. The second adhesive layer 60 and the display driver chip 70 are both disposed on the side of the bonding area 12 opposite to the display area 11, and the second adhesive layer 60 is located between the bonding area 12 and the display driver chip 70, that is, the second adhesive layer 60 is used to bond and connect the display driver chip 70 and the bonding area 12.

[0069] like Figure 5 and Figure 6As shown, the second adhesive layer 60 includes a first adhesive area 61 and a second adhesive area 62. The first adhesive area 61 is bonded to the side of the bonding end 22 opposite to the display area 11, and the second adhesive area 62 is bonded to the side of the bonding area 12 opposite to the display area 11. Because the bonding end 22 has a certain thickness, the first adhesive area 61 and the second adhesive area 62 have different heights. (See reference...) Figure 5 and Figure 6 The second adhesive layer 60 also includes a connecting area 63, which is disposed between the first adhesive area 61 and the second adhesive area 62. The connecting area 63 is used to connect the first adhesive area 61 and the second adhesive area 62 with different heights, and the first adhesive area 61, the second adhesive area 62 and the connecting area 63 form a stepped structure.

[0070] It is understandable that when the second adhesive layer 60 is bent, due to the certain thickness of the second adhesive layer 60, the connecting area 63 cannot be completely fitted with the side wall of the binding end 22, resulting in a gap. Specifically, the connecting area 63, the binding end 22 and the binding area 12 enclose and form a second gap space.

[0071] In this embodiment, a portion of the structure of the sealing colloid 30 can fill the second mounting gap to prevent moisture and impurities from contacting the pins of the bonding end 22 through the second gap space.

[0072] According to an exemplary embodiment of this disclosure, such as Figure 3 As shown, this disclosure provides an electronic device, such as a smartphone, tablet computer, laptop computer, smart wearable device, or any other electronic product with image display capabilities.

[0073] The electronic device provided in this disclosure embodiment has all the technical features and effects of the display module provided in this disclosure embodiment. For example, by providing a sealing colloid 30 at the end of the gap space, the sealing colloid 30 can seal the opening at the end of the gap space, so as to prevent moisture and impurities from entering the gap space and corroding the bonding end 22, thereby causing damage to the display module. The sealing structure is simple and effective. When the casing of the electronic device is damaged and the waterproof capability decreases, the sealing colloid 30 in the display module can block moisture from entering the electronic device, thereby preventing screen failure.

[0074] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the embodiments disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims.

[0075] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A display module, characterized in that, The display module, used in electronic devices, includes: A display panel includes an electrically connected display area and a bonding area, wherein the bonding area is located on the non-display surface of the display area; A flexible circuit board includes a circuit board body and a bonding end, wherein the circuit board body is connected to the non-display surface, and the bonding end is stacked with the bonding area and forms an electrical connection; In a first direction, there is a first mounting gap between the circuit board body and the bonding area; in a second direction, there is a second mounting gap between the bonding end and the non-display surface; the flexible circuit board, the bonding area, and the non-display surface enclose a first gap space, which extends along the width direction of the bonding area, and the first direction, the second direction, and the width direction of the bonding area are perpendicular to each other; A sealing compound, which fills at least one end of the first gap space in the width direction of the bonding area.

2. The display module according to claim 1, characterized in that, The display module further includes a first adhesive layer, which is used to connect the circuit board body to the non-display surface; The first adhesive layer includes: The first main body is directly opposite the main body of the circuit board; The first limiting structure is formed by a portion of the sidewall of the first main body protruding along the width direction of the binding area, and the first limiting structure protrudes from the sidewall of the circuit board body.

3. The display module according to claim 2, characterized in that, In the width direction of the bonding area, the size of the first main body is smaller than the size of the circuit board body, and a first adhesive groove is formed between the area of ​​the circuit board body that is not directly opposite to the first adhesive layer and the non-display surface; Along the first direction, one end of the first glue groove is connected to the first limiting structure, and the other end of the first glue groove is connected to the first gap space. A portion of the structure of the sealing adhesive is filled in the first glue groove.

4. The display module according to claim 2 or 3, characterized in that, The display module further includes a reinforcement layer, which is disposed between the bonding area and the non-display surface; The reinforcing layer includes: The second main body is directly opposite the binding area; The second limiting structure is formed by a portion of the side wall of the second main body protruding along the width direction of the binding area, and the second limiting structure protrudes from the side wall of the binding area.

5. The display module according to claim 4, characterized in that, In the width direction of the bonding area, the size of the second main body is smaller than the size of the bonding area, and a second adhesive groove is formed between the area of ​​the bonding area that is not directly opposite the reinforcing layer and the non-display surface shown; Along the first direction, one end of the second glue groove is connected to the second limiting structure, and the other end of the second glue groove is connected to the first gap space. A portion of the structure of the sealing glue is filled in the second glue groove.

6. The display module according to claim 4, characterized in that, In the first direction, the first limiting structure and the second limiting structure are respectively disposed on both sides of the first gap space.

7. The display module according to claim 4, characterized in that, The first limiting structure protrudes from the sidewall of the flexible circuit board by a dimension greater than or equal to 0.5 mm; and / or, The second limiting structure protrudes from the side wall of the binding area by a dimension greater than or equal to 0.5 mm.

8. The display module according to claim 1, characterized in that, The display module further includes a second adhesive layer, which includes a first adhesive area, a second adhesive area, and a connecting area connected in sequence. The first adhesive area is attached to the side of the bonding end that is away from the display area, and the second adhesive area is attached to the side of the bonding area that is away from the display area. The first bonding area, the connecting area, and the second bonding area form a stepped structure. The connecting area and the sidewall of the binding end in the first direction have a third installation gap. The connecting area, the binding end, and the binding area enclose a second gap space. Part of the structure of the sealing colloid fills the second gap space.

9. The display module according to claim 1, characterized in that, The sealant includes UV adhesive.

10. An electronic device, characterized in that, Includes the display module as described in any one of claims 1-9.

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