Camera and recording and broadcasting equipment
By using a thermally conductive bracket and thermally conductive adhesive in the camera to transfer the heat of the image sensor to the housing, the problem of poor heat dissipation of the image sensor is solved, thereby improving the imaging quality and stability of the camera.
Patent Information
- Application Number
- CN202422926025.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-28
- Publication Date
- 2025-11-14
- Estimated Expiration
- 2034-11-28
AI Technical Summary
The poor heat dissipation of image sensors in existing cameras leads to performance degradation, affecting image quality and stability.
A thermally conductive bracket is used to transfer the heat from the image sensor to the housing, which then dissipates the heat into the outside air. Thermally conductive adhesive is used to enhance the thermal conductivity.
It improves the heat dissipation efficiency of the image sensor, thereby enhancing the image quality and stability of the camera.
Smart Images
Figure CN223553380U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of camera technology, and in particular to a camera and recording equipment. Background Technology
[0002] Currently, cameras are capable of video surveillance, image capture, and other tasks, and their applications in security, machine vision inspection, and autonomous driving inspection are becoming increasingly widespread, providing many conveniences for people's lives and work.
[0003] A camera includes an image sensor, which converts light signals into electrical signals for subsequent processing and storage. In related technologies, the image sensor relies on its own surface for heat dissipation, which is ineffective, leading to decreased sensor performance and reduced image quality, thus hindering the camera's imaging stability. Utility Model Content
[0004] This application provides a camera and recording equipment that can improve the heat dissipation efficiency of the image sensor.
[0005] To address the aforementioned technical problems, one technical solution adopted in this application embodiment is as follows: A camera is provided, including a housing, a lens module, an image sensor, and a heat-conducting bracket. The housing has a mounting cavity; the lens module is mounted on the housing, with at least a portion of the lens module housed within the mounting cavity; the image sensor is housed within the mounting cavity and connected to the lens module; the heat-conducting bracket has a first surface and a second surface, the first surface being connected to the image sensor and the second surface being connected to the housing. The heat-conducting bracket is used to conduct at least a portion of the heat from the image sensor to the housing. In this embodiment, by connecting the first surface of the heat-conducting bracket to the image sensor and the second surface of the heat-conducting bracket to the housing, at least a portion of the heat from the image sensor can be transferred to the housing through the heat-conducting bracket. The housing then dissipates the heat to the outside air, thereby improving the heat dissipation efficiency of the image sensor, which is beneficial for improving the performance of the image sensor and thus improving the imaging quality of the camera.
[0006] In some embodiments, the camera includes a first thermally conductive adhesive, and the image sensor is bonded and fixed to the first surface using the first thermally conductive adhesive. In this embodiment, bonding and fixing the image sensor to the first surface using the first thermally conductive adhesive can improve the thermal conductivity between the image sensor and the thermally conductive bracket, thereby accelerating the heat dissipation efficiency of the image sensor.
[0007] In some embodiments, the camera includes a second thermally conductive adhesive, and the second surface is bonded and fixed to the housing using the second thermally conductive adhesive. In this embodiment, bonding and fixing the second surface to the housing using the second thermally conductive adhesive can improve the thermal conductivity between the thermally conductive bracket and the housing, thereby accelerating the heat dissipation efficiency of the thermally conductive bracket and allowing the heat in the image sensor to be dissipated to the outside air in a timely manner through the thermally conductive bracket and the housing.
[0008] In some embodiments, the camera includes a motherboard disposed within a mounting cavity, and an image sensor electrically connected to the motherboard. A thermally conductive bracket has a third surface connected to the motherboard, and the thermally conductive bracket is used to transfer at least a portion of the heat from the motherboard to the housing. In this embodiment, by connecting the motherboard to the third surface of the thermally conductive bracket, the heat in the motherboard can be dissipated in a timely manner, which helps to improve the performance of the motherboard and thus improve the image quality of the camera.
[0009] In some embodiments, the camera includes a third thermally conductive adhesive, and the third surface is bonded and fixed to the motherboard using the third thermally conductive adhesive. In this embodiment, bonding and fixing the thermally conductive bracket to the motherboard using the third thermally conductive adhesive can improve the thermal conductivity between the motherboard and the thermally conductive bracket, thereby accelerating the heat dissipation efficiency of the motherboard.
[0010] In some embodiments, the housing includes a bottom shell and a cover, the cover being connected to the bottom shell, the bottom shell and the cover together forming a mounting cavity, the lens module being mounted on the bottom shell, and at least one of the bottom shell and the cover being connected to a second surface.
[0011] In some embodiments, the lens module includes a lens and a lens bracket. The lens bracket is mounted on the base housing, the lens is mounted on the lens bracket, and the lens is electrically connected to the image sensor. In this embodiment, the lens is mounted on the base housing via the lens bracket. During assembly, the lens can be mounted on the lens bracket first, and then the lens bracket can be mounted on the base housing, thereby achieving lens mounting and fixing, which helps to reduce the difficulty of lens installation.
[0012] In some embodiments, the lens holder is provided with a mounting hole, the lens is disposed in the mounting hole, the bottom housing is provided with a clearance hole, and at least a portion of the lens is exposed to the clearance hole so that the lens can acquire external image information through the clearance hole.
[0013] In some embodiments, the camera includes a panel mounted on the bottom housing, and the panel covers clearance holes.
[0014] To solve the above-mentioned technical problems, another technical solution adopted in this application embodiment is to provide a recording and broadcasting device, including the above-mentioned camera.
[0015] The beneficial effects of this application embodiment are as follows: Unlike the prior art, in this application embodiment, by connecting the first surface of the heat-conducting bracket to the image sensor and the second surface of the heat-conducting bracket to the outer shell, at least part of the heat in the image sensor can be transferred to the outer shell through the heat-conducting bracket, and the outer shell dissipates the heat to the outside air, thereby improving the heat dissipation efficiency of the image sensor, which is beneficial to improving the performance of the image sensor and thus improving the imaging quality of the camera. Attached Figure Description
[0016] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the accompanying drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.
[0017] Figure 1 This is a schematic diagram of the camera structure provided in the embodiments of this application;
[0018] Figure 2 This is an exploded view of the camera provided in the embodiments of this application;
[0019] Figure 3 This is a partial cross-sectional view of the camera provided in the embodiments of this application.
[0020] Label Explanation
[0021]
[0022] Detailed Implementation
[0023] To facilitate understanding of this application, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on the other element, or one or more intermediate elements may exist between them. When an element is described as "connected" to another element, it can be directly connected to the other element, or one or more intermediate elements may exist between them. The terms "upper," "lower," "inner," "outer," "vertical," "horizontal," etc., used in this specification indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0024] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.
[0025] Furthermore, the technical features involved in the different embodiments of this application described below can be combined with each other as long as they do not conflict with each other.
[0026] A camera contains an image sensor, which converts light signals into electrical signals for subsequent processing and storage. In related technologies, the image sensor is usually located inside a housing, in a relatively enclosed space. This makes it difficult for heat to dissipate from the image sensor, which can easily lead to a decrease in the sensor's performance and reduce the camera's image quality, thus hindering the improvement of the camera's imaging stability.
[0027] To address the aforementioned issues, this application provides a camera and recording / broadcasting device that uses a heat-conducting bracket to transfer at least a portion of the heat from the image sensor to the housing, thereby accelerating the heat dissipation efficiency of the image sensor and improving the stability of camera imaging.
[0028] The specific scheme of this application is described in detail below.
[0029] Please see Figure 1 , Figure 2 and Figure 3 The camera 100 includes a housing 10, a lens module 11, an image sensor 12, and a heat-conducting bracket 13. The housing 10 has a mounting cavity 101. The lens module 11 is mounted on the housing 10, and at least a portion of the lens module 11 is housed within the mounting cavity 101. The lens module 11 is used to acquire image information from the outside world. The image sensor 12 is housed within the mounting cavity 101 and connected to the lens module 11. The image sensor 12 is used to convert light signals into electrical signals for subsequent storage and processing. The heat-conducting bracket 13 has a first surface 131 and a second surface 132. The image sensor 12 is connected to the first surface 131, and the housing 10 is connected to the second surface 132. The heat-conducting bracket 13 conducts at least a portion of the heat from the image sensor 12 to the housing 10, which then dissipates the heat to the outside air, thereby improving the heat dissipation efficiency of the image sensor 12, which in turn improves the performance of the image sensor 12 and ultimately enhances the imaging quality of the camera 100.
[0030] In some embodiments, the heat-conducting bracket 13 is made of aluminum alloy, which has high thermal conductivity and low cost.
[0031] In some embodiments, please refer to Figure 2 and Figure 3 The camera 100 includes a first thermally conductive adhesive 14. One side of the first thermally conductive adhesive 14 is bonded and fixed to the image sensor 12, and the other side of the first thermally conductive adhesive 14 is bonded and fixed to the first surface 131, thereby fixing the thermally conductive bracket 13 and the image sensor 12 to each other. In this embodiment, by bonding and fixing the image sensor 12 to the first surface 131 with the first thermally conductive adhesive 14, the thermal conductivity between the image sensor 12 and the thermally conductive bracket 13 can be improved, thereby accelerating the heat dissipation efficiency of the image sensor 12.
[0032] In some embodiments, please refer to Figure 2 and Figure 3 The camera 100 includes a second thermally conductive adhesive 15. One side of the second thermally conductive adhesive 15 is bonded and fixed to the second surface 132, and the other side of the second thermally conductive adhesive 15 is bonded and fixed to the outer shell 10, thereby achieving mutual fixation between the thermally conductive bracket 13 and the outer shell 10. In this embodiment, by bonding and fixing the second surface 132 to the outer shell 10 with the second thermally conductive adhesive 15, the thermal conductivity between the thermally conductive bracket 13 and the outer shell 10 can be improved, thereby accelerating the heat dissipation efficiency of the thermally conductive bracket 13, so that the heat in the image sensor 12 can be dissipated to the outside air in a timely manner through the thermally conductive bracket 13 and the outer shell 10.
[0033] In some embodiments, the included angle between the first surface 131 and the second surface 132 can be any one of an acute angle, a right angle, or an obtuse angle, which can be adaptively adjusted according to the layout position of the image sensor 12 in the camera 100.
[0034] In some embodiments, the camera 100 includes a motherboard 16 disposed within a mounting cavity 101. An image sensor 12 is connected to the motherboard 16, which processes and stores signals from the image sensor 12. A heat-conducting bracket 13 has a third surface 133, and the motherboard 16 is connected to this third surface 133, allowing at least a portion of the heat in the motherboard 16 to be transferred to the housing 10 via the heat-conducting bracket 13 and then dissipated into the outside air. In this embodiment, by connecting the motherboard 16 to the third surface 133 of the heat-conducting bracket 13, the heat in the motherboard 16 can be dissipated in a timely manner through the heat-conducting bracket 13 and the housing 10, which improves the performance of the motherboard 16 and thus enhances the imaging quality of the camera 100.
[0035] In some embodiments, the camera 100 includes a third thermally conductive adhesive 17. One side of the third thermally conductive adhesive 17 is bonded and fixed to the motherboard 16, and the other side of the third thermally conductive adhesive 17 is bonded and fixed to the third surface 133 of the thermally conductive bracket 13, thereby achieving mutual fixation between the thermally conductive bracket 13 and the motherboard 16. In this embodiment, by bonding and fixing the thermally conductive bracket 13 and the motherboard 16 with the third thermally conductive adhesive 17, the thermal conductivity between the motherboard 16 and the thermally conductive bracket 13 can be improved, thereby accelerating the heat dissipation efficiency of the motherboard 16.
[0036] In some embodiments, the housing 10 includes a bottom housing 102 and a cover 103. The cover 103 is connected to the bottom housing 102, and the cover 103 and the bottom housing 102 together enclose the aforementioned mounting cavity 101. The motherboard 16 is mounted on the bottom housing 102. The lens module 11 is mounted on the bottom housing 102. At least one of the bottom housing 102 and the cover 103 is bonded to the second surface 132 by the aforementioned second thermally conductive adhesive 15, so that the thermally conductive bracket 13 can conduct heat to at least one of the bottom housing 102 and the cover 103.
[0037] Furthermore, the second surface 132 of the heat-conducting bracket 13 is bonded and fixed to the cover 103 by a second thermally conductive adhesive 15. The cover 103 is made of aluminum alloy, which gives it good thermal conductivity. The bottom shell 102 can be made of plastic or silicone material, which can reduce costs.
[0038] In some embodiments, the lens module 11 includes a lens 111 and a lens bracket 112. The lens bracket 112 is mounted on the base housing 102, and the lens 111 is mounted on the lens bracket 112. The lens 111 is used to acquire image information from the outside world and is electrically connected to the image sensor 12. In this embodiment, the lens 111 is mounted on the base housing 102 via the lens bracket 112. During assembly, the lens 111 can be mounted on the lens bracket 112 first, and then the lens bracket 112 can be mounted on the base housing 102, thereby achieving the installation and fixation of the lens 111 and reducing the installation difficulty of the lens 111.
[0039] In some embodiments, the lens holder 112 is provided with a mounting hole 1121, and the lens 111 is disposed in the mounting hole 1121. The bottom housing 102 is provided with a clearance hole 1021, and at least a portion of the lens 111 is exposed to the clearance hole 1021 so that the lens 111 can acquire external image information through the clearance hole 1021.
[0040] In some implementations, the camera 100 includes a panel 113 mounted on the outer surface of the base housing 102, and the panel 113 covers the clearance hole 1021, thereby reducing the entry of external dust and other contaminants into the clearance hole 1021 and contaminating the lens 111. It is worth noting that the panel 113 is made of a transparent material so that the lens 111 can capture external image information through the panel 113.
[0041] In some embodiments, the camera 100 includes a support frame 18 connected to the bottom shell 102, and the support frame 18 is used to support the bottom shell 102.
[0042] In some embodiments, the camera 100 further includes a connecting rod 19, one end of which is connected to the base shell 102, and the other end of which is provided with a spherical head 191. One end of the support frame 18 is provided with a spherical groove 181, and the spherical head 191 is disposed in the spherical groove 181 and can rotate within the spherical groove 181. This configuration allows for adjustment of the camera 100's shooting direction and angle through the mounting and engagement between the spherical head 191 and the spherical groove 181, which is beneficial for expanding the application scenarios of the camera 100.
[0043] In this embodiment, by connecting the first surface 131 of the heat-conducting bracket 13 to the image sensor 12 and the second surface 132 of the heat-conducting bracket 13 to the housing 10, at least a portion of the heat in the image sensor 12 can be transferred to the housing 10 through the heat-conducting bracket 13. The housing 10 then dissipates the heat into the outside air, thereby improving the heat dissipation efficiency of the image sensor 12, which is beneficial to improving the performance of the image sensor 12 and thus improving the imaging quality of the camera 100.
[0044] This application also provides an embodiment of a recording and broadcasting device, which includes the camera described above. For the specific structure and function of the camera, please refer to the above embodiments, which will not be repeated here.
[0045] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.
Claims
1. A camera (100), characterized in that, include: The outer casing (10) is provided with a mounting cavity (101); A lens module (11) is mounted on the housing (10), and at least a portion of the lens module (11) is housed in the mounting cavity (101); An image sensor (12) is housed in the mounting cavity (101) and is connected to the lens module (11). The heat-conducting bracket (13) is provided with a first surface (131) and a second surface (132). The first surface (131) is connected to the image sensor (12), and the second surface (132) is connected to the housing (10). The heat-conducting bracket (13) is used to conduct at least part of the heat of the image sensor (12) to the housing (10).
2. The camera (100) according to claim 1, characterized in that, The camera (100) includes a first thermally conductive adhesive (14), and the image sensor (12) is bonded and fixed to the first surface (131) by the first thermally conductive adhesive (14).
3. The camera (100) according to claim 1, characterized in that, The camera (100) includes a second thermally conductive adhesive (15), and the second surface (132) is bonded and fixed to the housing (10) by the second thermally conductive adhesive (15).
4. The camera (100) according to claim 1, characterized in that, The camera (100) includes a motherboard (16), which is disposed in the mounting cavity (101), and the image sensor (12) is electrically connected to the motherboard (16); The heat-conducting bracket (13) has a third surface (133) connected to the motherboard (16), and the heat-conducting bracket (13) is used to transfer at least a portion of the heat from the motherboard (16) to the housing (10).
5. The camera (100) according to claim 4, characterized in that, The camera (100) includes a third thermally conductive adhesive (17), and the third surface (133) is bonded and fixed to the motherboard (16) by the third thermally conductive adhesive (17).
6. The camera (100) according to any one of claims 1-5, characterized in that, The outer casing (10) includes a bottom shell (102) and a cover (103), the cover (103) being connected to the bottom shell (102), the bottom shell (102) and the cover (103) together forming the mounting cavity (101), the lens module (11) being mounted on the bottom shell (102), and at least one of the bottom shell (102) and the cover (103) being connected to the second surface (132).
7. The camera (100) according to claim 6, characterized in that, The lens module (11) includes a lens (111) and a lens bracket (112). The lens bracket (112) is mounted on the bottom shell (102), and the lens (111) is mounted on the lens bracket (112). The lens (111) is electrically connected to the image sensor (12).
8. The camera (100) according to claim 7, characterized in that, The lens bracket (112) is provided with a mounting hole (1121), the lens (111) is disposed in the mounting hole (1121), the bottom shell (102) is provided with a clearance hole (1021), and at least a portion of the lens (111) is exposed in the clearance hole (1021).
9. The camera (100) according to claim 8, characterized in that, The camera (100) includes a panel (113) mounted on the bottom shell (102) and the panel (113) covers the clearance hole (1021).
10. A recording and broadcasting device, characterized in that, Includes the camera (100) as described in any one of claims 1-9.