Display device and display circuit board

Abstract

The present application relates to a display device and a display circuit board, the display device including: a display panel including a plurality of panel protrusions protruding from an edge of a display area and disposed spaced apart from each other along the edge of the display area; and a display circuit board, the display circuit board comprises a main body part which is separated from the edge of the display area and extends along the edge of the display area. A plurality of connecting portions spaced apart in an extension direction of the main body portion and overlapping the plurality of panel protrusions, respectively; and a plate protrusion protruding from the main body portion toward a recessed region defined between the plurality of panel protrusions.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to and all benefits arising therefrom of Korean Patent Application No. 10-2023-0146995, filed on October 30, 2023, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0003] The embodiments relate to display devices and display circuit boards, and more particularly, to display devices and display circuit boards having reduced non-display areas. Background Technology

[0004] Recently, electronic devices have become increasingly widespread. They are used extensively in various forms, such as portable and stationary configurations. These electronic devices include display devices, which can provide users with visual information such as still or moving images and support various functions.

[0005] With recent advancements in the miniaturization of components used to drive display devices, display devices are becoming increasingly important in electronic devices, and therefore, there is a desire to increase the display area while reducing the non-display area.

[0006] The display circuit board can be connected to the display panel of the display device to provide electrical signals. In this case, it is necessary to ensure that the non-display area does not increase due to the placement of the display circuit board. Utility Model Content

[0007] The implementation includes a display device in which the non-display area is reduced, and a display circuit board.

[0008] However, this is only one implementation method, and the scope of this disclosure is not limited thereto.

[0009] Additional features will be set forth in part in the description which follows, and in part will be apparent from the description or may be learned by practice of the embodiments presented in this disclosure.

[0010] In embodiments of this disclosure, the display device includes: a display panel including a plurality of panel protrusions that project from the edge of a display area and are spaced apart from each other along the edge of the display area; and a display circuit board including a main body portion that is spaced apart from the edge of the display area and extends along the edge of the display area, a plurality of connecting portions that are spaced apart in the extending direction of the main body portion and overlap with the plurality of panel protrusions respectively, and a plate protrusion that projects from the main body portion toward a recessed area defined between the plurality of panel protrusions.

[0011] In one embodiment, the plurality of panel protrusions may include a first pad, the plurality of connecting portions may include a second pad on the portion of the plurality of connecting portions that overlaps with the plurality of panel protrusions, and the first pad may contact and be electrically connected to the second pad.

[0012] In one implementation, multiple connecting portions may protrude from the main body portion and may be connected to multiple panel protrusions.

[0013] In an implementation, the protruding length of the plate protrusion can be greater than the protruding length of the multiple connecting portions.

[0014] In one embodiment, the number of connecting portions may correspond to the number of panel protrusions, and the panel protrusions may be disposed between the multiple connecting portions.

[0015] In this implementation, the main body, multiple connecting parts, and plate protrusions can be integrated with each other.

[0016] In an implementation, in a plan view, the plate protrusion may not overlap with the display panel and may be spaced apart from the display panel.

[0017] In an implementation, in a plan view, the plate protrusion may have a gradually narrowing shape with a width that decreases as it moves away from the main body.

[0018] In an implementation, in a plan view, the plate protrusion may be quadrilateral, for example, a rectangular shape having a consistent width away from the main body portion.

[0019] In this implementation, the length of the extended main body portion may be less than the length of the edge of the display area.

[0020] In one embodiment, the main body portion and the plurality of connecting portions may include a plurality of conductive layers stacked in the thickness direction of each of the main body portion and the plurality of connecting portions, and the conductive layer of the lowermost conductive layer of the plurality of conductive layers of the plurality of connecting portions may contact and be electrically connected to the plurality of panel protrusions.

[0021] In an embodiment, the main body portion and the plurality of connecting portions may each include at least one conductive layer stacked in the thickness direction of each of the main body portion and the plurality of connecting portions, and the number of at least one conductive layer in the plurality of connecting portions may be less than the number of at least one conductive layer in the main body portion.

[0022] In an embodiment, at least one conductive layer of the main body portion may be provided as a plurality of conductive layers, and one of the conductive layers of the main body portion may protrude from the main body portion to form a plurality of connecting portions, and may contact and be electrically connected to a plurality of panel protrusions.

[0023] In an implementation, the conductive layer protruding from the main body may be the uppermost conductive layer among multiple conductive layers.

[0024] In an implementation, the conductive layer protruding from the main body may be the lowest conductive layer among multiple conductive layers.

[0025] In an implementation, the conductive layer protruding from the main body may be the middle conductive layer among a plurality of conductive layers.

[0026] In embodiments of this disclosure, a display circuit board connectable to a display panel includes: a main body portion extending in one direction; a plurality of connecting portions protruding from the main body portion and spaced apart from each other in the extending direction of the main body portion; and a board protrusion protruding from the main body portion between the plurality of connecting portions, wherein the plurality of connecting portions include pads electrically connected to the display panel.

[0027] In an implementation, the protruding length of the plate protrusion can be greater than the protruding length of the multiple connecting portions.

[0028] In this implementation, the main body, multiple connecting parts, and plate protrusions can be integrated with each other.

[0029] In one embodiment, the main body portion may include a plurality of conductive layers stacked in the thickness direction, and one of the plurality of conductive layers may protrude from the main body portion to form a plurality of connection portions.

[0030] Other features and advantages, in addition to those described above, will become apparent from the following detailed description, claims, and drawings used in carrying out this disclosure. Attached Figure Description

[0031] The above and other features and advantages of the exemplary embodiments of this disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0032] Figure 1 This is a schematic plan view of an embodiment of a display device.

[0033] Figure 2 This is a schematic side view of an embodiment of a display device.

[0034] Figure 3 It is along Figure 1 Line III-III' is a schematic cross-sectional view that captures and shows a portion of an embodiment of the display device.

[0035] Figure 4 It is along Figure 1 Line IV-IV' cuts out and shows a schematic cross-sectional view of an embodiment of the display device, and

[0036] Figures 5 to 7 Is with Figure 4 A schematic cross-sectional view of an embodiment of a display device similar to the one described above. Detailed Implementation

[0037] Reference will now be made in detail to embodiments, examples of which are shown in the accompanying drawings, wherein similar reference numerals always denote the same elements. In this respect, the embodiments shown may take different forms and should not be construed as limited to the description set forth herein. Therefore, embodiments are described below only by reference to the accompanying drawings to illustrate the features of this specification. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. Throughout this disclosure, the expression “at least one of a, b, and c” means only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or variations thereof.

[0038] Because this disclosure encompasses various modifications and numerous embodiments, specific embodiments will be shown in the accompanying drawings and described in detail in the written description. Reference is made to the accompanying drawings, which illustrate the embodiments, to gain a full understanding of this disclosure, its advantages, and the objects accomplished by practicing this disclosure. However, this disclosure may be implemented in many different forms and should not be construed as limited to the embodiments set forth herein.

[0039] In the following description, embodiments will be described in detail with reference to the accompanying drawings. The same reference numerals in the drawings denote the same elements, and repeated descriptions are omitted.

[0040] It will be understood that although the terms “first,” “second,” etc., may be used in this document to describe various elements, these elements should not be limited by these terms, and these terms are only used to distinguish one element from another.

[0041] As used in this article, the singular forms “a,” “an,” and “the” are intended to also include the plural forms unless the context clearly indicates otherwise.

[0042] It will also be understood that the terms “comprises” and / or “comprising” as used herein specify the presence of a stated feature or element, but do not exclude the presence or addition of one or more other features or elements.

[0043] It will be understood that when a layer, region, or element is referred to as being “formed on” another layer, region, or element, it can be formed directly or indirectly on that other layer, region, or element. That is, for example, there can be intermediate layers, regions, or elements.

[0044] For ease of illustration, the dimensions of the elements in the accompanying drawings may be exaggerated. In other words, since the dimensions and thicknesses of the elements in the accompanying drawings are arbitrarily shown for ease of illustration, the following disclosure is not limited thereto.

[0045] In the following examples, the x-axis, y-axis, and z-axis are not limited to the three axes of a Cartesian coordinate system and can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, or they can represent different directions that are not perpendicular to each other.

[0046] When exemplary embodiments can be implemented differently, a particular process sequence may be performed differently than the described sequence. For example, two consecutively described processes may be performed substantially simultaneously or in the reverse order of their description.

[0047] Figure 1 This is a schematic plan view of an embodiment of a display device.

[0048] refer to Figure 1 The display device 1 can display dynamic or static images and can be used as a display screen for various products, such as mobile phones, smartphones, tablet PCs (“PCs”), mobile communication terminals, personal digital assistants, e-book terminals, portable multimedia players (“PMPs”), navigation devices, or portable electronic devices such as ultra-mobile PCs (“UMPCs”), televisions (“TVs”), laptops, monitors, billboards, Internet of Things (“IoT”) devices, etc. Furthermore, in embodiments, the display device 1 can be used in wearable devices such as smartwatches, watch phones, glasses-type displays, and head-mounted displays (“HMDs”). Additionally, in embodiments, the display device 1 can be used as a display in a vehicle's dashboard, a central information display (“CID”) set (e.g., installed) in the vehicle's center console or dashboard, an interior mirror display replacing the vehicle's side mirrors, or a car headrest display providing entertainment for rear seats.

[0049] like Figure 1 As shown, the shape of display device 1 can be substantially rectangular. Figure 1 As shown, for example, display device 1 may have a quadrilateral planar shape, such as a rectangular planar shape having a long side extending in a first direction (e.g., the x-direction or -x-direction) and a short side extending in a second direction (e.g., the y-direction or -y-direction). In embodiments, the portion where the long side extending in the first direction (e.g., the x-direction or -x-direction) intersects with the short side extending in the second direction (e.g., the y-direction or -y-direction) may have a right-angled shape or a rounded shape with a predetermined curvature. The planar shape of display device 1 is not limited to a rectangle, and may be a polygon, a circle, or an ellipse.

[0050] Display device 1 may include a display area DA and a peripheral area PA. An image can be displayed in the display area DA. Multiple pixels PX can be arranged in the display area DA. Display device 1 can provide an image by emitting light from the pixels PX. Each pixel PX can emit light through a display element. In one embodiment, each pixel PX can emit red, green, or blue light. In another embodiment, each pixel PX can emit red, green, blue, or white light.

[0051] The peripheral region PA is an area where no image is displayed, and may be a non-display area. The peripheral region PA may at least partially surround the display area DA. In some embodiments, for example, the peripheral region PA may surround the entire display area DA. Within the peripheral region PA, drivers that provide electrical signals to pixels PX, power lines that supply power to pixels PX, etc., may be arranged. In some embodiments, for example, a scan driver that applies scan signals to pixels PX may be provided in the peripheral region PA. Furthermore, a data driver that applies data signals to pixels PX may be provided in the peripheral region PA.

[0052] In one implementation, the peripheral area PA may include the pad area PDA to which the display circuit board 40 is connected.

[0053] Figure 2 This is a schematic side view of an embodiment of a display device.

[0054] refer to Figure 2 The display device 1 may include a display panel 10, a cover window 20, a display driver 30, a display circuit board 40, a pad 50, and a protective film PTF.

[0055] Display panel 10 can display information processed in display device 1. In embodiments, for example, display panel 10 can display information about the execution screen of an application running on display device 1, or user interface (“UI”) information or graphical user interface (“GUI”) information based on the execution screen.

[0056] Display panel 10 may include display elements. In embodiments, for example, display panel 10 may be an organic light-emitting display panel using organic light-emitting diodes (“OLEDs”), a micro light-emitting diode (“LED”) display panel using micro LEDs, a quantum dot light-emitting display panel using quantum dot LEDs including quantum dot emission layers, or an inorganic light-emitting display panel using inorganic LEDs including inorganic semiconductors. Hereinafter, the case where display panel 10 is an organic light-emitting display panel using OLEDs as display elements is described in detail.

[0057] The display panel 10 may include a substrate 100 and a multilayer film disposed on the substrate 100. In an embodiment, the display panel 10 may include a substrate 100, a display layer DSL, an encapsulation layer 300, a touch sensor layer TSL, and an optical functional layer OFL. In this case, the display area DA and the peripheral area PA may be defined in the substrate 100 and / or the multilayer film. In an embodiment, for example, the substrate 100 may be described as including the display area DA and the peripheral area PA. Furthermore, the peripheral area PA may include a pad area PDA protruding from one side of the display area DA.

[0058] Substrate 100 may comprise a polymeric resin such as polyethersulfone, polyarylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyimide, polycarbonate, cellulose triacetate, or cellulose acetate propionate. In embodiments, substrate 100 may have a multilayer structure comprising a base layer containing the above-mentioned polymeric resin and a barrier layer (not shown). Substrate 100 comprising polymeric resin may be flexible, rollable, or bendable.

[0059] The display layer DSL can be disposed on the substrate 100. The display layer DSL may include pixel circuits and display elements. In this case, each pixel circuit may be connected to each display element. The pixel circuit may include thin-film transistors and storage capacitors. Therefore, the display layer DSL may include multiple display elements, multiple thin-film transistors, and multiple storage capacitors. In addition, the display layer DSL may also include multiple insulating layers interposed therebetween.

[0060] The encapsulation layer 300 can be disposed above the display layer DSL. The encapsulation layer 300 can be disposed above and cover the display element. In an embodiment, the encapsulation layer 300 may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. The at least one inorganic encapsulation layer may include materials selected from aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), zinc oxide (ZnO), silicon oxide (SiO2), and silicon nitride (SiN). x The encapsulation layer may comprise one or more inorganic materials selected from silicon nitride oxide (SiON). At least one organic encapsulation layer may comprise a polymer-based material. Polymer-based materials may include acrylic resins, epoxy-based resins, polyimides, polyethylene, etc. In some embodiments, at least one organic encapsulation layer may comprise an acrylate.

[0061] A touch sensor layer (TSL) can be disposed on top of the package layer 300. The touch sensor layer (TSL) can sense coordinate information based on external input (e.g., a touch event). The touch sensor layer (TSL) may include sensor electrodes and touch lines connected to the sensor electrodes. The touch sensor layer (TSL) can sense external input using either self-capacitance or mutual capacitance.

[0062] The touch sensor layer (TSL) can be formed on the encapsulation layer 300. In an alternative embodiment, after the touch sensor layer (TSL) is formed separately on the touch substrate, the touch sensor layer (TSL) can be bonded to the encapsulation layer 300 via an adhesive layer such as an optically clear adhesive (“OCA”). In another embodiment, the touch sensor layer (TSL) can be formed directly on the encapsulation layer 300, and in this case, no adhesive layer may be inserted between the touch sensor layer (TSL) and the encapsulation layer 300.

[0063] An optical functional layer (OFL) can be disposed above the touch sensor layer (TSL). The OFL can reduce the reflectivity of light incident from the outside toward the display device 1 (external light), and / or can improve the color purity of light emitted from the display device 1. In an embodiment, the OFL may include a retarder and a polarizer. The retarder may be a film type or a liquid crystal coating type, and may include a λ / 2 retarder and / or a λ / 4 retarder. The polarizer may also be a film type or a liquid crystal coating type. The film type may include a stretched synthetic resin film, and the liquid crystal coating type may include liquid crystal arranged in a predetermined configuration. The retarder and polarizer may also include a protective film.

[0064] In another embodiment, the optical functional layer OFL may include a black matrix and color filters. The color filters may be arranged to represent the colors of light emitted from pixels PX of the display device 1. Each color filter may include a red, green, or blue pigment or dye. In an alternative embodiment, in addition to the pigments or dyes described above, each color filter may also include quantum dots. In an alternative embodiment, some of the color filters may not include the pigments or dyes described above and may include scattering particles such as TiO2.

[0065] In another embodiment, the optical functional layer (OFL) may include a destructive interference structure. The destructive interference structure may include a first reflective layer and a second reflective layer disposed in different layers. First reflected light and second reflected light reflected from the first reflective layer and the second reflective layer, respectively, can destructively interfere with each other, and the reflectivity of external light can thus be reduced.

[0066] A cover window 20 may be disposed on the display panel 10. The cover window 20 protects the display panel 10. In an embodiment, the cover window 20 may be a flexible window. The cover window 20 can be easily bent by external forces without cracking, thereby providing protection for the display panel 10. The cover window 20 may include at least one of glass, sapphire, and plastic. The cover window 20 may be, for example, ultra-thin glass (“UTG”) or colorless polyimide (“CPI”). In an embodiment, the cover window 20 may have a structure in which a flexible polymer layer is disposed on one surface of a glass substrate, or it may consist only of a polymer layer.

[0067] The cover window 20 can be attached to the display panel 10 via an adhesive member. The adhesive member can be a colorless adhesive member such as OCA. Alternatively, the adhesive member can include known adhesive materials. Such an adhesive member can be formed on the upper portion of the display panel 10 in various ways; for example, a film-type adhesive member can be attached to the upper portion of the display panel 10, or a material-type adhesive member can be applied to the upper portion of the display panel 10.

[0068] The display driver 30 may be disposed on the display panel 10 (e.g., substrate 100). The display driver 30 may receive control signals and power voltages, and generate and output signals and voltages for driving the display panel 10. The display driver 30 may include an integrated circuit (“IC”). In an embodiment, the display driver 30 may be disposed in a peripheral area PA (e.g., pad area PDA).

[0069] Display circuit board 40 can be electrically connected to display panel 10. In one embodiment, display circuit board 40 can be connected to display panel 10 in the pad area PDA of display panel 10. In another embodiment, display circuit board 40 can be a rigid and therefore difficult-to-bend rigid printed circuit board (“PCB”). However, this disclosure is not limited thereto, and does not exclude the possibility that display circuit board 40 is a flexible printed circuit board (“FPCB”).

[0070] Although not shown, various drivers can be arranged on the display circuit board 40. In some embodiments, for example, a touch sensor driver can be provided on the display circuit board 40. The touch sensor driver may include an IC. The touch sensor driver can be electrically connected via the display circuit board 40 to the sensor electrodes of the touch sensor layer TSL of the display panel 10.

[0071] In addition, a power supply can be provided on the display circuit board 40. The power supply can provide the driving voltage for driving the pixels PX of the display panel 10 and the display driver 30.

[0072] The protective film PTF can be patterned and attached to the lower surface of the substrate 100. That is, the protective film PTF can be disposed between the substrate 100 and the pad 50.

[0073] In one embodiment, the padding layer 50 may be disposed beneath the display panel 10 (particularly the substrate 100). The padding layer 50 can prevent damage to the display panel 10 by absorbing external impacts. The padding layer 50 may comprise a polymer resin such as polyurethane, polycarbonate, polypropylene, or polyethylene, or an elastic material (e.g., sponge) obtained by foaming rubber, urethane-based materials, or acryloyl-based materials.

[0074] Figure 3 It is along Figure 1 Line III-III' is a schematic cross-sectional view that captures and shows a portion of an embodiment of the display device.

[0075] refer to Figure 3 The display device 1 may include a display panel 10. The display panel 10 may include a substrate 100, a display layer DSL, an encapsulation layer 300, a touch sensor layer TSL, and an optical functional layer OFL. Figure 3 For ease of explanation, the touch sensor layer (TSL) and the optical functional layer (OFL) have been omitted.

[0076] The display layer DSL can be disposed on the substrate 100. The display layer DSL may include a buffer layer 111, a pixel circuit layer PCL, and a display element layer DEL.

[0077] Substrate 100 may comprise glass or a polymeric resin such as polyethersulfone, polyarylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyimide, polycarbonate, cellulose triacetate, or cellulose acetate propionate. Substrate 100 comprising a polymeric resin may be flexible, rollable, or bendable. Substrate 100 may have a multilayer structure comprising a base layer containing the aforementioned polymeric resin and a barrier layer (not shown).

[0078] Buffer layer 111 may include materials such as SiN x Inorganic insulating materials of SiON and SiO2, and may be one or more layers including inorganic insulating materials.

[0079] The pixel circuit layer PCL can be disposed above the buffer layer 111. The pixel circuit layer PCL may include transistor TFTs contained in the pixel circuit and inorganic insulating layer IIL, first planarization layer 115 and second planarization layer 116 disposed below and / or above the components of the transistor TFTs. The inorganic insulating layer IIL may include a first gate insulating layer 112, a second gate insulating layer 113 and an interlayer insulating layer 114.

[0080] The transistor TFT may include a semiconductor layer A, and semiconductor layer A may include polycrystalline silicon. In alternative embodiments, semiconductor layer A may include amorphous silicon, oxide semiconductor, organic semiconductor, etc. Semiconductor layer A may include a channel region and source and drain regions located on opposite sides of the channel region. The gate electrode G may overlap with the channel region.

[0081] The gate electrode G may include a low-resistance metallic material. The gate electrode G may include a conductive material comprising molybdenum (Mo), aluminum (Al), copper (Cu), or titanium (Ti), and may be one or more layers comprising the above materials.

[0082] The first gate insulating layer 112 between semiconductor layer A and gate electrode G may include materials such as SiO2 and SiN. x , SiON, Al2O3, TiO2, Ta2O5, HfO2 or ZnO x Inorganic insulating material. ZnO x It can be ZnO and / or ZnO2.

[0083] The second gate insulating layer 113 may cover the gate electrode G. Similar to the first gate insulating layer 112, the second gate insulating layer 113 may include materials such as SiO2 and SiN. x , SiON, Al2O3, TiO2, Ta2O5, HfO2 or ZnO x Inorganic insulating material. ZnO x It can be ZnO and / or ZnO2.

[0084] The upper electrode CE2 of the storage capacitor Cst can be disposed above the second gate insulating layer 113. The upper electrode CE2 can overlap with the gate electrode G disposed below the upper electrode CE2. In this case, the gate electrode G and the upper electrode CE2, which are spaced apart from each other and with the second gate insulating layer 113 between them, can form the storage capacitor Cst of the pixel circuit. That is, the gate electrode G can be used as the lower electrode CE1 of the storage capacitor Cst. As described, the storage capacitor Cst can overlap with the transistor TFT. In some embodiments, the storage capacitor Cst may not overlap with the transistor TFT.

[0085] The upper electrode CE2 may include Al, platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), Mo, Ti, tungsten (W) and / or Cu, and may be one or more layers of the above materials.

[0086] The interlayer insulating layer 114 may cover the upper electrode CE2. The interlayer insulating layer 114 may include SiO2, SiNx , SiON, Al2O3, TiO2, Ta2O5, HfO2, ZnO x etc. ZnO x It can be ZnO and / or ZnO2. The interlayer insulation layer 114 can be one or more layers comprising the above inorganic insulating materials.

[0087] The drain electrode D and the source electrode S can each be disposed on the interlayer insulating layer 114. The drain electrode D and the source electrode S can each comprise a material with relatively good conductivity. The drain electrode D and the source electrode S can each comprise a conductive material containing Mo, Al, Cu, or Ti, and can be one or more layers comprising the above materials. In an embodiment, the drain electrode D and the source electrode S can have a Ti / Al / Ti multilayer structure.

[0088] The first planarization layer 115 may cover the drain electrode D and the source electrode S. The first planarization layer 115 may include an organic insulating layer. The first planarization layer 115 may include organic insulating materials such as general-purpose polymers (such as polymethyl methacrylate (“PMMA” or polystyrene (“PS”)), polymer derivatives having phenol-based groups, acryloyl-based polymers, imide-based polymers, polyaryl ether-based polymers, amide-based polymers, fluorine-based polymers, p-xylene-based polymers, vinyl alcohol-based polymers, and any combination thereof.

[0089] The connecting electrode CML can be disposed on the first planarization layer 115. In this case, the connecting electrode CML can be connected to the drain electrode D or the source electrode S through contact holes in the first planarization layer 115. The connecting electrode CML can include a material with relatively good conductivity. The connecting electrode CML can include a conductive material comprising Mo, Al, Cu, or Ti, and can be one or more layers comprising the above materials. In an embodiment, the connecting electrode CML can have a Ti / Al / Ti multilayer structure.

[0090] The second planarization layer 116 may cover the connection electrode CML. The second planarization layer 116 may include an organic insulating layer. The second planarization layer 116 may include organic insulating materials such as general polymers (such as PMMA or PS), polymer derivatives having phenol-based groups, acryloyl-based polymers, imide-based polymers, polyarylether-based polymers, amide-based polymers, fluorine-based polymers, p-xylene-based polymers, vinyl alcohol-based polymers, and any combination thereof.

[0091] The display element layer DEL can be disposed above the pixel circuit layer PCL. The display element layer DEL can include display elements DE. The display element DE can be an organic light-emitting diode (“OLED”). The pixel electrode 211 of the display element DE can be electrically connected to the connection electrode CML through contact holes in the second planarization layer 116.

[0092] Pixel electrode 211 may include a conductive oxide such as indium tin oxide (“ITO”), indium zinc oxide (“IZO”), ZnO, indium oxide (In2O3), indium gallium oxide (“IGO”), or zinc aluminum oxide (“AZO”). In one embodiment, pixel electrode 211 may include a reflective film comprising Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, or any combination thereof. In another embodiment, pixel electrode 211 may also include a film comprising ITO, IZO, ZnO, or In2O3 on or under the aforementioned reflective film.

[0093] A pixel defining layer 118 defining an opening 118OP may be disposed above the pixel electrode 211, with the opening 118OP exposing the central portion of the pixel electrode 211. The pixel defining layer 118 may include an organic insulating material and / or an inorganic insulating material. The opening 118OP may define an emission region EA (hereinafter also referred to as the emission region) of light emitted from the display element DE. In an embodiment, for example, the width of the opening 118OP may correspond to the width of the emission region EA of the display element DE.

[0094] Spacer 119 may be disposed on pixel defining layer 118. In a method of manufacturing a display device, spacer 119 can prevent damage to substrate 100. When manufacturing display panel 10, a mask can be used to deposit deposition material on substrate 100. In this case, spacer 119 can prevent defects (such as damage to a portion of substrate 100 or breakage of substrate 100) that may occur when the mask enters the opening 118OP of pixel defining layer 118 or adheres to pixel defining layer 118.

[0095] Spacer 119 may comprise an organic insulating material such as polyimide. In an alternative embodiment, spacer 119 may comprise a material such as SiN. x It can be either an inorganic insulating material made of SiO2 or a combination of organic and inorganic insulating materials.

[0096] In one embodiment, the spacer 119 may comprise a different material than the pixel defining layer 118. In an alternative embodiment, the spacer 119 may comprise the same material as the pixel defining layer 118, and in this case, the pixel defining layer 118 and the spacer 119 may be formed together using a masking process such as a halftone mask.

[0097] Intermediate layer 212 may be disposed above pixel defining layer 118. Intermediate layer 212 may include emitting layer 212b disposed in opening 118OP of pixel defining layer 118. Emitting layer 212b may include high molecular weight or low molecular weight organic material that emits light of a predetermined color.

[0098] The first functional layer 212a and the second functional layer 212c may be disposed below and above the emitter layer 212b, respectively. The first functional layer 212a may include, for example, a hole transport layer (“HTL”) or both an HTL and a hole injection layer (“HIL”). The second functional layer 212c may be disposed above the emitter layer 212b and is optional. The second functional layer 212c may include an electron transport layer (“ETL”) and / or an electron injection layer (“EIL”). Similar to the opposing electrode 213 described below, the first functional layer 212a and / or the second functional layer 212c may each be a common layer formed to cover the entire substrate 100.

[0099] The counter electrode 213 may comprise a conductive material having a relatively low work function. In one embodiment, for example, the counter electrode 213 may comprise a transparent (or translucent) layer comprising Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, lithium (Li), calcium (Ca), or any alloy thereof. In an alternative embodiment, the counter electrode 213 may further comprise a layer comprising ITO, IZO, ZnO, or In2O3 on top of the transparent (or translucent) layer comprising the above materials.

[0100] In some embodiments, a capping layer (not shown) may also be provided above the counter electrode 213. The capping layer may include LiF, inorganic materials and / or organic materials.

[0101] The encapsulation layer 300 may be disposed above the opposing electrode 213. The encapsulation layer 300 may be disposed above and cover the display element layer DEL. The encapsulation layer 300 may include at least one inorganic encapsulation layer and at least one organic encapsulation layer, and in embodiments, Figure 3 The encapsulation layer 300 is shown to include a first inorganic encapsulation layer 310, an organic encapsulation layer 320, and a second inorganic encapsulation layer 330 stacked sequentially.

[0102] The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may each include materials selected from Al2O3, TiO2, Ta2O5, HfO2, and ZnO. x SiO2, SiN x The organic encapsulation layer 320 may comprise one or more inorganic materials, including SiON. The organic encapsulation layer 320 may comprise a polymer-based material. Polymer-based materials may include acryloyl-based resins, epoxy-based resins, polyimides, polyethylene, etc. In some embodiments, the organic encapsulation layer 320 may comprise an acrylate. The organic encapsulation layer 320 may be formed by curing monomers or applying polymers. The organic encapsulation layer 320 may be transparent.

[0103] Although not shown on the encapsulation layer 300, the touch sensor layer TSL described above can be provided, and the optical functional layer OFL can be provided above the touch sensor layer TSL.

[0104] Figure 4 It is along Figure 1 The line IV-IV' cuts out and shows a schematic cross-sectional view of an embodiment of the display device.

[0105] refer to Figure 1 and Figure 4 As described above, the display device 1 may include a display area DA and a peripheral area PA surrounding at least a portion of the display area DA. In an embodiment, the display area DA may have a quadrilateral shape (e.g., a rectangular shape). In this case, the display area DA may be formed by a first direction (e.g., Figure 1 A pair of parallel first edges extending in the x-direction and in the second direction (e.g., Figure 1 The peripheral region PA is defined by a pair of parallel second edges extending in the y-direction. The peripheral region PA can be configured to surround the first and second edges of the display region DA. In this case, the peripheral region PA may include the edges of the display region DA, for example, a pad region PDA protruding from the first edge. In the pad region PDA, the display panel 10 (e.g., substrate 100) can be electrically connected to the display circuit board 40.

[0106] The display panel 10 (e.g., substrate 100) may include panel protrusions 60 projecting outward from a portion of the periphery of the display area DA (e.g., a first edge S1). In embodiments, multiple panel protrusions 60 may be provided, and in this case, the panel protrusions 60 may be spaced apart from each other along the first edge S1. In embodiments, such as Figure 1 As shown, for example, there may be two panel protrusions 60 or two or more panel protrusions 60. In the following text, for ease of explanation, two panel protrusions 60 are used.

[0107] like Figure 1 As shown, the panel protrusion 60 can have a substantially gradually narrowing quadrilateral shape, but is not limited to this. The panel protrusion 60 can have various shapes, such as a semi-elliptical shape that protrudes from the first edge S1 and has a decreasing width. In addition, the panel protrusion 60 can also have a quadrilateral shape, such as a rectangular shape with a uniform width.

[0108] As described above, the display driver 30 may be disposed on the panel protrusion 60. Furthermore, a first pad 60P may be disposed on the panel protrusion 60. The first pad 60P may contact and be electrically connected to the second pad 42P, as described below.

[0109] The display circuit board 40 can contact and be electrically connected to the panel protrusion 60. In an embodiment, the display circuit board 40 can be a rigid PCB that is rigid and difficult to bend. The display circuit board 40 may include a main body portion 41, a connecting portion 42, and a board protrusion 43.

[0110] The main body portion 41 may extend along a portion of the periphery of the display area DA. In an embodiment, for example, the main body portion 41 may extend along a first direction (e.g., Figure 1 The first edge S1 extends in the x-direction. In this case, the main body 41 may extend in a second direction (e.g., the direction of extension of the first edge S1) that intersects the extension direction of the first edge S1. Figure 1 The main body portion 41 is spaced apart from the first edge S1 in the y-direction. In an embodiment, the main body portion 41 may extend parallel to the first edge S1. Furthermore, in an embodiment, the length of the main body portion 41 extending in the first direction may be less than the length of the first edge S1 in the first direction. As described below, this length provides space for components such as hinges to be connected when the display device 1 is connected to an electronic device.

[0111] The connecting portion 42 may extend to the main body portion 41 and overlap with the panel protrusion 60. The connecting portion 42 may include a second pad 42P on the portion of the connecting portion 42 that overlaps with the panel protrusion 60. The second pad 42P may contact the first pad 60P and electrically connect the connecting portion 42 to the panel protrusion 60. Furthermore, the connecting portion 42 may be electrically connected to the display panel 10 via the panel protrusion 60.

[0112] In one embodiment, the connecting portion 42 may have a shape that protrudes from the main body portion 41. However, this disclosure is not limited thereto, and in another embodiment, the connecting portion 42 may not protrude and may be integrated into the main body portion 41. In this case, it can be described that the second pad 42P may be provided on the main body portion 41.

[0113] The number of connecting portions 42 can correspond to the number of panel protrusions 60. In an embodiment, for example, when the number of panel protrusions 60 is as follows: Figure 1 When two are shown, the number of connecting portions 42 can also be two. In this case, the connecting portions 42 can be spaced apart from each other in the extending direction (i.e., the first direction) of the main body portion 41. In the embodiment, as... Figure 1 As shown, the connecting portion 42 may have a generally gradually narrowing quadrilateral shape, but the shape is not limited to this.

[0114] The panel protrusion 43 can protrude from the main body portion 41. In one embodiment, the panel protrusion 43 can protrude toward a recessed region CA defined between a plurality of panel protrusions 60. In other words, the panel protrusion 43 can be disposed between the panel protrusions 60. Furthermore, the panel protrusion 43 can be disposed between the connecting portions 42. Figure 1 A single panel protrusion 43 is shown, but when multiple panel protrusions 60 exist (e.g., three panel protrusions 60), two panel protrusions 43 may be arranged between the three panel protrusions 60. In this case, the panel protrusions 60 and panel protrusions 43 can be arranged alternately. The connecting portion 42 and the panel protrusions 43 can also be arranged alternately.

[0115] In the plan view, the board protrusion 43 may not contact or overlap with the display panel 10, and may be disposed in the space between the panel protrusions 60. Various components PT that can be disposed (e.g., mounted) on the display circuit board 40 can be arranged on the board protrusion 43. Therefore, the dead zone in the second direction can be reduced. Furthermore, the protrusion length L1 of the board protrusion 43 from the main body portion 41 can be greater than the protrusion length L2 of the connecting portion 42 from the main body portion 41. Therefore, a larger area can be ensured on the board protrusion 43 for mounting components PT.

[0116] Furthermore, in the plan view, the plate protrusion 43 has a gradually narrowing shape with a width decreasing away from the main body portion 41. For example, the plate protrusion 43 can have a substantially gradually narrowing quadrilateral shape depending on the shape of the panel protrusion 60, but this disclosure is not limited thereto. The plate protrusion 43 can have various shapes, such as a semi-elliptical shape that protrudes from the main body portion 41 and has a decreasing width. In addition, the plate protrusion 43 can also have a quadrilateral shape, for example, in the plan view, the plate protrusion 43 has a rectangular shape with a uniform width away from the main body portion 41.

[0117] Furthermore, the board protrusion 43, the connecting portion 42, and the main body portion 41 can be integral with each other. The description that the board protrusion 43, the connecting portion 42, and the main body portion 41 are integral can indicate that the board protrusion 43, the connecting portion 42, and the main body portion 41 include a stacked structure of a display circuit board 40 comprising at least one conductive layer and at least one insulating layer, and are continuously connected.

[0118] Refer again Figure 4 The display circuit board 40 may include at least one conductive layer and at least one insulating layer. In an embodiment, the display circuit board 40 may include layers in the thickness direction of the display circuit board 40 (e.g., Figure 4 A first conductive layer CL1, a first insulating layer IL1, a second conductive layer CL2, and a second insulating layer IL2 are sequentially arranged in the z-direction. That is, the first insulating layer IL1 can be disposed between the first conductive layer CL1 and the second conductive layer CL2, and the second insulating layer IL2 can be arranged to cover the second conductive layer CL2. Figure 4 The illustration shows a display circuit board 40 comprising two conductive layers and two insulating layers, but this disclosure is not limited thereto. In embodiments, for example, it will be understood that the display circuit board 40 may include two or more conductive layers and two or more insulating layers.

[0119] The first insulating layer IL1 and the second insulating layer IL2 maintain the rigidity of the display circuit board 40 and protect signals from the outside. Furthermore, the first insulating layer IL1 and the second insulating layer IL2 prevent cracks from forming in the first conductive layer CL1 and the second conductive layer CL2. The first insulating layer IL1 and the second insulating layer IL2 may comprise polyimide.

[0120] The first conductive layer CL1 and the second conductive layer CL2 may comprise conductive materials. In an embodiment, for example, the first conductive layer CL1 and the second conductive layer CL2 may comprise Cu.

[0121] In this embodiment, the stacked structure can be applied equally to the main body portion 41, the connecting portion 42, and the plate protrusion 43. In other words, the main body portion 41, the connecting portion 42, and the plate protrusion 43 may include a first conductive layer CL1, a first insulating layer IL1, a second conductive layer CL2, and a second insulating layer IL2. Furthermore, the corresponding conductive layers of the main body portion 41, the connecting portion 42, and the plate protrusion 43 can extend continuously.

[0122] In this configuration, the first conductive layer CL1 of the connection portion 42 may include a second pad 42P and contact the first pad 60P of the panel protrusion 60, thereby electrically connecting to the first pad 60P. Furthermore, the component PT may be disposed (e.g., mounted) on the surface (e.g., the lower surface) of the first conductive layer CL1 of the body portion 41. Figure 4The component PT can also be disposed (e.g., mounted) on the surface (e.g., the lower surface) of the first conductive layer CL1 of the plate protrusion 43.

[0123] Figures 5 to 7 Is with Figure 4 A schematic cross-sectional view of an embodiment of a display device similar to the one described above. The display device in the illustrated embodiment is similar to the one described above, and therefore, the differences between them will be mainly described.

[0124] refer to Figure 5 The display circuit board 40 may include at least one conductive layer and at least one insulating layer. In an embodiment, the main body portion 41 may include a portion in the thickness direction of the main body portion 41 (e.g., Figure 5 A first conductive layer CL1, a first insulating layer IL1, a second conductive layer CL2, and a second insulating layer IL2 are sequentially arranged in the z-direction. That is, the first insulating layer IL1 can be disposed between the first conductive layer CL1 and the second conductive layer CL2, and the second insulating layer IL2 can be disposed to cover the second conductive layer CL2. In addition, the plate protrusion 43 can have the same stacking structure as the main body portion 41. Figure 5 The illustration shows that the main body portion 41 includes two conductive layers and two insulating layers, but this disclosure is not limited thereto. In embodiments, for example, it will be understood that the main body portion 41 may include two or more conductive layers and two or more insulating layers. Hereinafter, for ease of explanation, the description will primarily focus on... Figure 5 The situation.

[0125] The connecting portion 42 may be formed by an extension of at least one of the conductive layers included in the main body portion 41 and the plate protrusion 43. In an embodiment, for example, as Figure 5 As shown, the main body portion 41 may include a first conductive layer CL1, a first insulating layer IL1, a second conductive layer CL2, and a second insulating layer IL2. The lowermost conductive layer (e.g., the first conductive layer CL1) may protrude from the main body portion 41 and form a connection portion 42. Furthermore, the first insulating layer IL1 covering the first conductive layer CL1 may protrude from the main body portion 41 and form the connection portion 42. In this case, other conductive layers (e.g., the second conductive layer CL2) may not protrude from the main body portion 41 and may not form the connection portion 42.

[0126] As a result, the thickness of the connecting portion 42 can be less than the thickness of the main body portion 41. As the number of layers forming the connecting portion 42 increases, the modulus and elongation may increase. Therefore, when the display circuit board 40 is attached to and connected to the display panel 10 via the connecting portion 42, connection defects such as separation of the first pad 60P from the second pad 42P may occur due to increased contraction and expansion. In this embodiment, since the connecting portion 42 is formed to be thinner than the main body portion 41, i.e., formed to include fewer conductive layers than the main body portion 41, the modulus and elongation can be reduced and contact and connection characteristics can be improved when the display circuit board 40 is attached.

[0127] refer to Figure 6 The connecting portion 42 may be formed by the extension of at least one of the conductive layers included in the main body portion 41 and the plate protrusion 43. In an embodiment, for example, as Figure 6 As shown, the main body portion 41 may include a first conductive layer CL1, a first insulating layer IL1, a second conductive layer CL2, and a second insulating layer IL2. The uppermost conductive layer (e.g., the second conductive layer CL2) may protrude from the main body portion 41 and form a connection portion 42. Furthermore, the second insulating layer IL2 covering the second conductive layer CL2 may protrude from the main body portion 41 and form the connection portion 42. In this case, other conductive layers (e.g., the first conductive layer CL1) may not protrude from the main body portion 41 and may not form the connection portion 42.

[0128] refer to Figure 7 The connecting portion 42 may be formed by the extension of at least one of the conductive layers included in the main body portion 41 and the plate protrusion 43. In an embodiment, for example, as Figure 7 As shown, the main body portion 41 may include a first conductive layer CL1, a first insulating layer IL1, a second conductive layer CL2, a second insulating layer IL2, a third conductive layer CL3, and a third insulating layer IL3. The second conductive layer CL2, which is disposed in the middle of the conductive layers and is neither at the top nor the bottom, may protrude from the main body portion 41 to form a connection portion 42. Furthermore, the second insulating layer IL2 covering the second conductive layer CL2 may protrude from the main body portion 41 to form the connection portion 42. In this case, other conductive layers (e.g., the first conductive layer CL1 and the third conductive layer CL3) may not protrude from the main body portion 41 and may not form the connection portion 42.

[0129] Figure 7The illustration shows three conductive layers included in the main body portion 41, but this disclosure is not limited thereto. In embodiments, for example, when the main body portion 41 includes four or more conductive layers (i.e., a first conductive layer, a second conductive layer, a third conductive layer, and a fourth conductive layer), a second or third conductive layer disposed in the middle of the main body portion 41 to form a connecting portion 42 may protrude from the main body portion 41. In alternative embodiments, it is understood that both the second and third conductive layers may protrude from the main body portion 41 and form the connecting portion 42.

[0130] According to the implementation method, the non-display area can be reduced in the display device. Furthermore, the area of ​​components disposed (e.g., mounted) on the display circuit board can be secured.

[0131] It should be understood that the embodiments described herein are to be considered descriptive only and not for limiting purposes. The description of features or advantages within each embodiment should generally be considered applicable to other similar features or advantages in other embodiments. Although embodiments have been described with reference to the accompanying drawings, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope defined by the appended claims.

Claims

1. A display device, characterized in that, include: A display panel, the display panel defining a display area and a non-display area, the display panel comprising: Multiple panel protrusions protrude from the edge of the display area and are spaced apart from each other along the edge of the display area; and Display circuit board, including: The main body portion is spaced apart from the edge of the display area and extends along the edge of the display area; Multiple connecting portions are spaced apart in the extending direction of the main body portion. And respectively overlap with the plurality of panel protrusions; and A panel protrusion protrudes from the main body portion toward a recessed area defined between the plurality of panel protrusions.

2. The display device according to claim 1, characterized in that, The plurality of panel protrusions include a first pad, and the plurality of connecting portions include a second pad on the portion of the plurality of connecting portions that overlaps with the plurality of panel protrusions, and the first pad contacts and is electrically connected to the second pad.

3. The display device according to claim 1, characterized in that, The plurality of connecting portions protrude from the main body portion and are connected to the plurality of panel protrusions.

4. The display device according to claim 3, characterized in that, The protruding length of the plate protrusion is greater than the protruding length of the plurality of connecting portions.

5. The display device according to claim 1, characterized in that, The plurality of connecting portions are configured to correspond in number to the plurality of panel protrusions, and the panel protrusions are disposed between the plurality of connecting portions.

6. The display device according to claim 1, characterized in that, The main body, the plurality of connecting portions, and the plate protrusions are integral with each other.

7. The display device according to claim 1, characterized in that, In the plan view, the plate protrusion does not overlap with the display panel and is spaced apart from the display panel.

8. The display device according to claim 1, characterized in that, In the plan view, the plate protrusion has a gradually narrowing shape with a width that decreases as it moves away from the main body portion.

9. The display device according to claim 1, characterized in that, In the plan view, the plate protrusion has a rectangular shape with a consistent width away from the main body portion.

10. A display circuit board capable of being connected to a display panel, characterized in that, The display circuit board includes: The main body extends in one direction; A plurality of connecting portions, protruding from the main body portion and spaced apart from each other in the extending direction of the main body portion, the plurality of connecting portions comprising: solder pads, electrically connected to the display panel; and A plate protrusion protrudes from the main body portion between the plurality of connecting portions.

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