Assembly type dispensing tool for DAC high-speed cable in OSFP

Abstract

The utility model relates to a DAC (Digital-to-Analog Converter) high-speed cable splicing type dispensing tool in an OSFP (Optical Small Form-factor Pluggable). The DAC high-speed cable splicing type dispensing tool comprises a lower outer frame, a base, an upper cover and an upper outer frame which are sequentially stacked from bottom to top, wherein the upper cover and the base are of a multi-section splicing type structure; a containing cavity is formed between the upper cover and the base. A gasket is horizontally arranged in a front inlet of the containing cavity. A first forming cavity is formed in the accommodating cavity; a second forming cavity is formed in the accommodating cavity; and the upper cover is provided with two glue inlet holes which are respectively communicated with the first forming cavity and the second forming cavity. The DAC high-speed cable dispensing tool has the beneficial effects that a DAC high-speed cable assembled by a scattered cable is placed in the tool for dispensing, so that a glue block and a limiting glue block are formed at corresponding positions on the cable, two glue positions can be formed at expected positions on the cable by virtue of the tool, the dispensing quality can be ensured by virtue of the tool, the upper cover and the base are designed into a multi-section assembled structure, and the production efficiency is improved. When one section is damaged, the section can be correspondingly replaced, and the whole upper cover and the base do not need to be replaced.

Description

TECHNICAL FIELD

[0001] The utility model relates to optical module technical field, concretely relates to a DAC high speed cable assembly type point gum tool in OSFP. BACKGROUND

[0002] The DAC high speed cable equipped in the OSFP optical module has 16 single cables, and the 16 single cables are distributed in a four-layer mode, each layer has four single cables, and each column also has four single cables, the cables between adjacent columns are not tightly attached together, the upper two layers of single cables are tightly attached together, the lower two layers are tightly attached together, and there is a 0.5mm gap between the upper two layers of single cables and the lower two layers of single cables, the DAC high speed cable of this type often involves a point gum process, for the scheme with a cable skin, only point gum at the middle position, for the scheme of self-assembly from scattered cables without a cable skin, the above-mentioned point gum scheme cannot be used (the cable skin can have a fixed effect on the inner cable, but the one without a cable skin cannot), and it is necessary to point gum again near the tail cover, that is, two point gum positions are provided, and the purpose of the above two schemes is to prevent the cables from moving forward and backward or rotating in the structure, so as to avoid the welding pad from falling off, and for the scheme of self-assembly from scattered cables without a cable skin, there is currently a lack of a corresponding suitable point gum tool. SUMMARY

[0003] The technical problem to be solved by the utility model is to provide a DAC high speed cable assembly type point gum tool in OSFP to overcome the deficiencies in the prior art.

[0004] The technical scheme for solving the above technical problem of the utility model is as follows:

[0005] A DAC high speed cable assembly type point gum tool in OSFP, comprising:

[0006] An upper outer frame and a lower outer frame are oppositely distributed, an upper cover fixed to the upper outer frame is arranged below the upper outer frame, and a base limited in the lower outer frame is arranged on the lower outer frame, and the upper cover covers the base;

[0007] The upper cover is a multi-section assembly type structure, and the base is a multi-section assembly type structure;

[0008] A receiving cavity matched with the DAC high speed cable is arranged in a through mode between the upper cover and the base, and a gasket horizontally arranged in the front entrance of the receiving cavity separates the upper two layers of single cables and the lower two layers of single cables distributed in a laminated mode;

[0009] A first forming cavity for forming a glue block on the cable to wrap all the single cables in a circumferential direction and separate and limit the single cables when the glue is poured into the first forming cavity is arranged near the gasket in the receiving cavity;

[0010] The second forming cavity is arranged near the tail sleeve of the DAC high-speed cable in the accommodating cavity, and a limiting glue block is formed on the cable when glue is poured into the second forming cavity, so as to wrap all single cables in the circumferential direction and prevent the cable from moving forward and backward and rotating in the structure.

[0011] Two glue inlet holes are arranged on the upper cover and communicated with the first forming cavity and the second forming cavity respectively.

[0012] On the basis of the above technical scheme, the utility model can also be improved as follows.

[0013] Further, the base comprises: first glue sealing blocks, first limiting glue block forming blocks, first glue block forming blocks, first shunt forming blocks, second glue block forming blocks and second shunt forming blocks which are distributed in sequence, the accommodating cavity sequentially passes through the first glue sealing blocks, the first limiting glue block forming blocks, the first glue block forming blocks, the first shunt forming blocks, the second glue block forming blocks and the second shunt forming blocks, the second forming cavity is between the first limiting glue block forming blocks and the upper cover, and the first forming cavity is between the first glue block forming blocks, the first shunt forming blocks, the second glue block forming blocks and the upper cover.

[0014] Further, the upper cover comprises: second glue sealing blocks, second limiting glue block forming blocks and third glue block forming blocks which are distributed in sequence, the accommodating cavity sequentially passes through the second glue sealing blocks, the second limiting glue block forming blocks and the third glue block forming blocks, the second forming cavity is between the first limiting glue block forming blocks and the second limiting glue block forming blocks, the first forming cavity is between the first glue block forming blocks, the first shunt forming blocks, the second glue block forming blocks and the third glue block forming blocks, and a glue inlet hole is arranged on each of the second limiting glue block forming blocks and the third glue block forming blocks.

[0015] Further, three front shunt plates for shunting four columns of single cables in the DAC high-speed cable in a laminated manner are arranged side by side in the cavity of the second shunt forming block, each front shunt plate is fixedly connected with the bottom of the cavity of the second shunt forming block, a first groove is arranged on each end portion of the gasket of the lower outer frame, the gasket comprises: a plate and four ear plates fixed on the same side of the plate, the two end portions of the plate are arranged in the two first grooves respectively, the four ear plates are arranged in the four columns of single cables in the DAC high-speed cable in a laminated manner respectively, and each ear plate is used for separating the upper two layers of single cables and the lower two layers of single cables in each column of single cables, two rear shunt plates for shunting two columns of single cables on the outer side of the DAC high-speed cable in a column are arranged in the cavity of the first shunt forming block, and each rear shunt plate is fixedly connected with the bottom of the cavity of the first shunt forming block.

[0016] Further, the third glue block forming block is provided with a glue inlet hole communicated with the first forming cavity, and the glue inlet hole is located between the rear flow distribution plate and the front flow distribution plate; the lower surface of the third glue block forming block is provided with a first glue sealing block on each side of the glue inlet hole communicated with the first forming cavity.

[0017] Further, the first glue block forming block is provided with a third groove communicated with the first forming cavity on each side of the first forming cavity in the region behind the rear flow distribution plate; the lower surface of the third glue block forming block is provided with a second glue sealing block entering the third groove at the positions corresponding to the two third grooves.

[0018] Further, the first glue block forming block is provided with a third groove communicated with the first forming cavity on each side of the first forming cavity in the region behind the rear flow distribution plate; the lower surface of the third glue block forming block is provided with a second glue sealing block entering the third groove at the positions corresponding to the two third grooves.

[0019] Further, the upper outer frame is made of stainless steel, the lower outer frame is made of stainless steel, the upper cover is made of stainless steel or aluminum alloy or other metal materials, and the base is made of stainless steel or aluminum alloy or other metal materials.

[0020] Further, the middle region of the lower outer frame is provided with a limiting groove, the base is arranged in the limiting groove of the lower outer frame, and the upper cover and the upper outer frame are connected by screws.

[0021] Further, the lower outer frame is provided with a limiting block at each corner, the upper outer frame is provided with a notch at each corner, and the limiting block of the lower outer frame is arranged in the notch of the upper outer frame when the upper cover covers the base.

[0022] The utility model discloses the beneficial effects are:

[0023] When the tool is applied to the DAC high-speed cable self-assembled by the scattered cable and the DAC high-speed cable is glued, the DAC high-speed cable is placed on the base, then the gasket is inserted in the corresponding position, and the upper cover is covered, so that the DAC high-speed cable is arranged in the containing cavity, liquid glue is injected into the first forming cavity and the second forming cavity through the two glue inlet holes according to the pressure of the glue dispenser, and after cooling, a glue block is formed on the cable to wrap all single cables in the circumferential direction and distribute the single cables and limit the single cables, a limiting glue block is formed on the cable to wrap all single cables in the circumferential direction and prevent the cable from moving and rotating in the structure, so that the solder pad is prevented from falling off, two glue positions can be formed on the cable by the tool, and the glue quality can be ensured by the tool.

[0024] The gasket is inserted into the single cable distributed in a laminated manner to separate the upper two layers of single cables from the lower two layers of single cables, glue sealing is realized, and when the glue is poured into the first forming cavity subsequently, the glue is prevented from flowing to other positions where the glue should not be present;

[0025] Since the upper cover and the base are consumables, they are designed as a multi-section assembled structure, when a section is damaged, the corresponding section can be replaced, so that the entire upper cover and base do not need to be replaced, in addition, for the DAC high-speed cable, since the cable has different specifications, such as 26AWG, 28AWG and 30AWG, etc., the first glue sealing block, the first glue block forming block, the second shunt forming block, the second glue sealing block, the second limiting glue block forming block and the third glue block forming block can be replaced while other blocks remain unchanged to meet the dispensing requirements of different specifications of cables, which can further reduce the optimization cost in the later stage, the tooling is more versatile, and the repair is more convenient.

[0026] Since the upper cover and the base are consumables, the material of the upper cover and the base can be selected according to the processing difficulty, which is beneficial to reduce the cost and improve the processing speed. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 It is an exploded view of the DAC high-speed cable assembled dispensing tool in the OSFP in the utility model;

[0028] Figure 2 It is an assembly drawing of the lower outer frame and the base in the utility model;

[0029] Figure 3 It is an assembly drawing of the upper outer frame and the upper cover in the utility model;

[0030] Figure 4 It is an application drawing of the DAC high-speed cable assembled dispensing tool in the OSFP;

[0031] Figure 5 It is an application exploded view of the DAC high-speed cable assembled dispensing tool in the OSFP.

[0032] In the drawings, the components represented by each reference numeral are listed as follows:

[0033] 1, upper outer frame, 110, notch, 2, lower outer frame, 210, first groove, 220, limiting groove, 230, limiting block, 3, upper cover, 310, glue inlet hole, 320, second glue sealing block, 330, second limiting glue block forming block, 331, third glue sealing block, 340, third glue block forming block, 341, first glue sealing block, 342, second glue sealing block, 4, base, 410, first glue sealing block, 420, first limiting glue block forming block, 421, fourth groove, 430, first glue block forming block, 431, third groove, 440, first shunt forming block, 441, rear shunt plate, 450, second glue block forming block, 451, second groove, 460, second shunt forming block, 461, front shunt plate, 5, containing cavity, 6, gasket, 610, plate, 620, ear plate, 7, first forming cavity, 8, second forming cavity, 9, screw, 10, glue block, 11, limiting glue block, 12, DAC high-speed cable. DETAILED DESCRIPTION

[0034] The principles and features of the present application are described below in conjunction with the accompanying drawings, and the examples are only used to explain the present application and are not intended to limit the scope of the present application.

[0035] Example 1

[0036] As shown in the drawings, an OSFP DAC high-speed cable assembly type dispensing tool comprises: Figures 1-5

[0037] The upper outer frame 1 and the lower outer frame 2 are arranged on the upper and lower sides of the upper outer frame 1 and the lower outer frame 2, respectively. An upper cover 3 is arranged below the upper outer frame 1, and the upper cover 3 is fixed to the upper outer frame 1. A base 4 is arranged on the lower outer frame 2, and the base 4 is limited by the lower outer frame 2. The upper cover 3 covers the base 4.

[0038] The upper cover 3 is a multi-segment assembly type structure, and the base 4 is also a multi-segment assembly type structure.

[0039] ​A containing cavity 5 is formed between the upper cover 3 and the base 4, the profile shape of the containing cavity 5 matches the profile shape of the DAC high-speed cable 12, the containing cavity 5 penetrates the front and rear sides of the upper cover 3 and also penetrates the front and rear sides of the base 4, the containing cavity 5 is used to contain the DAC high-speed cable 12, the containing cavity 5 is composed of two parts, one part is located on the upper cover 3, and the other part is located on the base 4, when the upper cover 3 covers the base 4, a complete containing cavity 5 is formed, a gasket 6 is horizontally arranged in the front entrance of the containing cavity 5, because the single cables distributed in the DAC high-speed cable 12 in a laminated manner have four layers, the upper two layers are tightly attached together, the lower two layers are tightly attached together, and there is a 0.5mm gap between the upper two single cables and the lower two single cables, so the gasket 6 is inserted into the single cables distributed in a laminated manner to separate the upper two single cables and the lower two single cables, realize glue sealing, and prevent the glue from flowing to other positions where there should be no glue when the glue is subsequently poured into the first forming cavity 7;

[0040] A first forming cavity 7 for forming a glue block 10 on the cable to wrap all single cables in a circumferential direction and separate and limit the single cables when the glue is poured into the first forming cavity 7 is arranged near the gasket 6 in the containing cavity 5, which can be specifically understood as:

[0041] The first forming cavity 7 is arranged near the gasket 6 in the containing cavity 5, and the opening position of the first forming cavity 7 usually corresponds to the region about 10mm away from the PCB board in the OSFP in the DAC high-speed cable 12, when the glue is poured into the first forming cavity 7, a glue block 10 wrapping all single cables in a circumferential direction and separating and limiting the single cables will be formed in the first forming cavity 7;

[0042] A second forming cavity 8 for forming a limiting glue block 11 on the cable to wrap all single cables in a circumferential direction and prevent the cable from moving forward and backward and rotating in the structure when the glue is poured into the second forming cavity 8 is arranged near the tail sleeve in the DAC high-speed cable 12 in the containing cavity 5, which can be specifically understood as:

[0043] The second forming cavity 8 is arranged near the tail sleeve in the DAC high-speed cable 12 in the containing cavity 5, when the glue is poured into the second forming cavity 8, a limiting glue block 11 wrapping all single cables in a circumferential direction and preventing the cable from moving forward and backward and rotating in the structure will be formed in the second forming cavity 8;

[0044] Two glue inlet holes 310 are formed on the upper cover 3 and communicate with the first forming cavity 7 and the second forming cavity 8 respectively, that is, the glue can be poured into the first forming cavity 7 through the glue inlet hole 310 communicating with the first forming cavity 7, and the glue can be poured into the second forming cavity 8 through the glue inlet hole 310 communicating with the second forming cavity 8, the glue inlet hole 310 is preferably inverted conical;

[0045] In the present scheme, the first forming cavity 7 and the second forming cavity 8 are both composed of two parts, one part is located on the upper cover 3, and the other part is located on the base 4, when the upper cover 3 is covered on the base 4, a complete first forming cavity 7 and a second forming cavity 8 are formed;

[0046] When the tool is applied to dispensing glue on the DAC high-speed cable 12 which is self-assembled, the DAC high-speed cable 12 is placed on the base 4, then the gasket 6 is inserted at the corresponding position, and then the upper cover 3 is covered, so that the DAC high-speed cable 12 is in the containing cavity 5;

[0047] According to the pressure of the dispensing machine, liquid glue is injected into the first forming cavity 7 and the second forming cavity 8 through two glue injection holes 310 respectively, and after cooling, a glue block 10 is formed on the cable to wrap all single cables in the circumferential direction and to separate and limit the single cables, and a limiting glue block 11 is formed on the cable to wrap all single cables in the circumferential direction and to prevent the cable from moving forward and backward and rotating in the structure.

[0048] Embodiment 2

[0049] As shown in Figure 1 , Figure 2 , Figure 3 , the present embodiment is a further improvement based on embodiment 1, as follows:

[0050] The base 4 comprises: first glue sealing blocks 410, first limiting glue block forming blocks 420, first glue block forming blocks 430, first shunt forming blocks 440, second glue block forming blocks 450 and second shunt forming blocks 460 distributed in sequence, the containing cavity 5 passes through the first glue sealing blocks 410, the first limiting glue block forming blocks 420, the first glue block forming blocks 430, the first shunt forming blocks 440, the second glue block forming blocks 450 and the second shunt forming blocks 460 in sequence, the second forming cavity 8 is between the first limiting glue block forming blocks 420 and the upper cover 3, the first glue sealing blocks 410 cooperate with the upper cover 3 to realize glue sealing behind the second forming cavity 8, and the first glue block forming blocks 430 cooperate with the upper cover 3 to realize glue sealing in front of the second forming cavity 8, the first forming cavity 7 passes through the first glue block forming blocks 430, the first shunt forming blocks 440 and the second glue block forming blocks 450, so the first forming cavity 7 is between the first glue block forming blocks 430, the first shunt forming blocks 440 and the second glue block forming blocks 450 and the upper cover 3;

[0051] Since the base 4 is a consumable part, it is designed as a multi-section assembled structure. When a section is damaged, the corresponding section can be replaced, so that the entire base 4 does not need to be replaced. In addition, for the DAC high-speed cable 12, since the cable has different specifications, such as 26AWG, 28AWG and 30AWG, etc., the first glue sealing block 410, the first glue block forming block 430 and the second shunt forming block 460 can be replaced to meet the glue dispensing requirements of different specifications of cables, effectively reducing the cost, and improving the utilization rate of universal blocks.

[0052] Embodiment 3

[0053] As shown in Figure 1 、 Figure 2 、 Figure 3 、 Figure 5 The embodiment is a further improvement based on embodiment 2, as follows:

[0054] The upper cover 3 includes: the second glue sealing block 320, the second limiting glue block forming block 330 and the third glue block forming block 340 distributed in sequence, the accommodation cavity 5 passes through the second glue sealing block 320, the second limiting glue block forming block 330 and the third glue block forming block 340 in sequence, the second forming cavity 8 is between the first limiting glue block forming block 420 and the second limiting glue block forming block 330, the first glue sealing block 410 cooperates with the second glue sealing block 320 to realize glue sealing behind the second forming cavity 8, and the first glue block forming block 430 cooperates with the second limiting glue block forming block 330 to realize glue sealing in front of the second forming cavity 8. The first forming cavity 7 is between the first glue block forming block 430, the first shunt forming block 440, the second glue block forming block 450 and the third glue block forming block 340, and the second limiting glue block forming block 330 and the third glue block forming block 340 are respectively provided with an glue inlet hole 310;

[0055] Since the upper cover 3 is a consumable part, it is designed as a multi-section assembled structure. When a section is damaged, the corresponding section can be replaced, so that the entire upper cover 3 does not need to be replaced. In addition, for the DAC high-speed cable 12, since the cable has different specifications, such as 26AWG, 28AWG and 30AWG, etc., the second glue sealing block 320, the second limiting glue block forming block 330 and the third glue block forming block 340 can be replaced to meet the glue dispensing requirements of different specifications of cables.

[0056] Embodiment 4

[0057] As shown in Figure 1 、 Figure 2 、 Figure 3 、 Figure 5As shown, the embodiment is a further improvement on the basis of example 3, as follows:

[0058] Three front shunt plates 461 are arranged in parallel in the cavity of the second shunt forming block 460, each of which is fixedly connected to the bottom of the cavity of the second shunt forming block 460, and the three front shunt plates 461 are used to shunt the four columns of single cables in the DAC high-speed cable 12 in a stacked manner, can block the gap between adjacent columns of single cables, realize glue sealing, prevent glue from flowing to other positions that should not have glue, and the lower surface of the upper cover 3 is provided with a slot for inserting the upper end of the front shunt plate 461 at the position corresponding to the three front shunt plates 461.

[0059] A first groove 210 is formed on the lower outer frame 2 at each end of the gasket 6;

[0060] The gasket 6 includes a plate 610 and four ear plates 620 fixed to the same side of the plate 610, the two ends of the plate 610 are respectively located in the two first grooves 210, which can support and limit the gasket 6 to be stably located in the expected position to realize glue sealing, and the four ear plates 620 are respectively located in the four columns of single cables in the DAC high-speed cable 12 in a stacked manner, each ear plate 620 is used to separate the upper two layers of single cables and the lower two layers of single cables in each column of single cables, and the gasket 6 of this structure can effectively realize glue sealing and prevent glue from flowing to other positions that should not have glue when the glue is poured into the first forming cavity 7 later;

[0061] Two rear shunt plates 441 are arranged in the cavity of the first shunt forming block 440, each of which is fixedly connected to the bottom of the cavity of the first shunt forming block 440, and the two rear shunt plates 441 are used to shunt the two columns of single cables on the outer side of the DAC high-speed cable, and the glue block 10 formed when the glue is poured into the first forming cavity 7 will have two holes, and the lower surface of the upper cover 3 is provided with a slot for inserting the upper end of the rear shunt plate 441 at the position corresponding to the two rear shunt plates 441.

[0062] Example 5

[0063] As shown in Figure 1 , Figure 2 , Figure 3 As shown, the embodiment is a further improvement on the basis of example 4, as follows:

[0064] The glue inlet hole 310 on the third glue block forming block 340 in communication with the first forming cavity 7 is between the rear distribution plate 441 and the front distribution plate 461, and the lower surface of the third glue block forming block 340 is provided with a first glue sealing block 341 on each side of the glue inlet hole 310 in communication with the first forming cavity 7, that is, two first glue sealing blocks 341 are provided. The upper surface of the second glue block forming block 450 is lower than the upper surface of the first distribution forming block 440 and the upper surface of the second distribution forming block 460, so that a second groove 451 for accommodating the two first glue sealing blocks 341 is formed above the second glue block forming block 450 between the first distribution forming block 440 and the second distribution forming block 460, and the second groove 451 is in communication with the first forming cavity 7. When the upper cover 3 is covered on the base 4, the first glue sealing block 341 on the third glue block forming block 340 is in the second groove 451, and glue sealing is realized to prevent glue from flowing to other areas where glue should not be present. At the same time, the position of the upper cover 3 and the base 4 can be limited to prevent the upper cover 3 and the base 4 from being misaligned.

[0065] Embodiment 6

[0066] As shown in Figure 1 , Figure 2 , Figure 3 This embodiment is a further improvement based on embodiment 4, and the specific improvements are as follows:

[0067] The first glue block forming block 430 is provided with a third groove 431 in communication with the first forming cavity 7 on each side of the first forming cavity 7 in the area behind the rear distribution plate 441, that is, two third grooves 431 are provided. The lower surface of the third glue block forming block 340 is provided with a second glue sealing block 342 entering the third groove 431 at the positions corresponding to the two third grooves 431. When the upper cover 3 is covered on the base 4, the second glue sealing block 342 on the third glue block forming block 340 is in the third groove 431, and glue sealing is realized to prevent glue from flowing to other areas where glue should not be present. At the same time, the position of the upper cover 3 and the base 4 can be limited to prevent the upper cover 3 and the base 4 from being misaligned.

[0068] Embodiment 7

[0069] As shown in Figure 1 , Figure 2 , Figure 3 This embodiment is a further improvement based on embodiment 3, and the specific improvements are as follows:

[0070] The first limiting rubber block forming block 420 is provided with two fourth grooves 421 communicated with the second forming cavity 8 on both sides of the second forming cavity 8, that is, the second limiting rubber block forming block 330 is provided with a third sealing rubber block 331 entering the fourth groove 421 at the position corresponding to the two fourth grooves 421 on the lower surface of the second limiting rubber block forming block 330. When the upper cover 3 is covered on the base 4, the third sealing rubber block 331 on the second limiting rubber block forming block 330 is in the fourth groove 421, the sealing is realized, so as to prevent the glue from flowing to other areas where the glue should not be, and the limiting between the upper cover 3 and the base 4 is also realized, so as to prevent the dislocation of the upper cover 3 and the base 4.

[0071] Embodiment 8

[0072] As shown in Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 indicates that this embodiment is further improved on the basis of any one of embodiments 1-7, as follows:

[0073] Considering the processing difficulty, the upper outer frame 1 is made of stainless steel, the lower outer frame 2 is made of stainless steel, the upper cover 3 can be made of stainless steel or aluminum alloy or other metal materials according to requirements, and the base 4 can be made of stainless steel or aluminum alloy or other metal materials according to requirements, which is beneficial to reduce the cost and improve the processing speed. For the easily damaged upper cover 3 or base 4, when it is damaged, it can be replaced accordingly, and other parts can be reused to reduce the repair cost.

[0074] Embodiment 9

[0075] As shown in Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 indicates that this embodiment is further improved on the basis of any one of embodiments 1-8, as follows:

[0076] The middle region of the lower outer frame 2 is provided with a limiting groove 220, and the base 4 is placed in the limiting groove 220 opened on the lower outer frame 2. The limiting groove 220 is used to limit the base 4, which is beneficial to separate the base 4 from the lower outer frame 2, and the limiting stability is also easy to guarantee; the upper cover 3 and the upper outer frame 1 are connected by screws 9, so that the upper cover 3 and the upper outer frame 1 are connected stably and are easy to disassemble and assemble.

[0077] Embodiment 10

[0078] As shown in Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5The embodiment is further improved on the basis of any one of embodiments 1-9, and the specific improvements are as follows:

[0079] The lower outer frame 2 is provided with limiting blocks 230 at each corner, and the upper outer frame 1 is provided with notches 110 at each corner; when the upper cover 3 covers the base 4, the limiting blocks 230 on the lower outer frame 2 are located in the notches 110 on the upper outer frame 1; through the structure, the upper outer frame 1 and the lower outer frame 2 can be limited to prevent dislocation of the upper outer frame 1 and the lower outer frame 2, thereby further preventing dislocation of the upper cover 3 and the base 4.

[0080] Of course, in the actual application process, other ways can also be used, for example:

[0081] The lower outer frame 2 is provided with multiple positioning holes, and the upper outer frame 1 is provided with multiple positioning columns inserted into the positioning holes, or the lower outer frame 2 is provided with multiple positioning columns, and the upper outer frame 1 is provided with multiple positioning holes for the positioning columns to be inserted into; this is only an exemplary description.

[0082] Although the embodiments of the utility model have been shown and described above, it can be understood that the above-mentioned embodiments are exemplary and cannot be understood as limiting the utility model; those skilled in the art can change, modify, replace and transform the above-mentioned embodiments within the scope of the utility model.

Claims

1. An OSFP DAC high-speed cable assembly dispensing tool, characterized in that, The utility model relates to a DAC high -speed cable (12) containing structure, including: Upper and lower oppositely distributed upper outer frame (1) and lower outer frame (2), one upper cover (3) fixedly arranged below the upper outer frame (1) is arranged one base (4) in the limit in the upper outer frame (2), the upper cover (3) covers the base (4) on, The upper cover (3) is multi -section assembly type structure, and the base (4) is multi -section assembly type structure, The accommodating cavity (5) of the matching DAC high -speed cable (12) is opened in the through mode between the upper cover (3) and the base (4), one gasket (6) is arranged in the horizontal distribution of the front entrance of the accommodating cavity (5) in the upper two layers of single cable and the lower two layers of single cable of the single cable in the laminated mode distribution is separated, The first forming cavity (7) for forming a rubber block (10) on the cable to wrap all single cables and shunt single cables when the glue is poured into the first forming cavity (7) is arranged in the accommodating cavity (5) near the gasket (6), The second forming cavity (8) for forming a limiting rubber block (11) on the cable to wrap all single cables and be used for preventing the cable from moving and rotating in the structure when the glue is poured into the second forming cavity (8) is arranged in the accommodating cavity (5) near the tail cover of the DAC high -speed cable (12), Two glue holes (310) are formed in the upper cover (3) and are communicated with the first forming cavity (7) and the second forming cavity (8) respectively.

2. The DAC high-speed cable assembly dispensing tool in an OSFP according to claim 1, wherein, The base (4) includes: first glue sealing block (410), first limiting rubber block forming block (420), first rubber block forming block (430), first shunt forming block (440), second rubber block forming block (450) and second shunt forming block (460) are sequentially distributed, the accommodating cavity (5) sequentially passes through first glue sealing block (410), first limiting rubber block forming block (420), first rubber block forming block (430), first shunt forming block (440), second rubber block forming block (450) and second shunt forming block (460), the second forming cavity (8) is between the first limiting rubber block forming block (420) and the upper cover (3), and the first forming cavity (7) is between the first rubber block forming block (430), the first shunt forming block (440), the second rubber block forming block (450) and the upper cover (3).

3. The DAC high-speed cable assembly dispensing tool in an OSFP according to claim 2, wherein, The upper cover (3) comprises: second sealing glue blocks (320), second limiting glue block forming blocks (330) and third glue block forming blocks (340) distributed in sequence, the accommodating cavity (5) sequentially passes through the second sealing glue blocks (320), the second limiting glue block forming blocks (330) and the third glue block forming blocks (340), the second forming cavity (8) is between the first limiting glue block forming block (420) and the second limiting glue block forming block (330), the first forming cavity (7) is between the first glue block forming block (430), the first shunt forming block (440), the second glue block forming block (450) and the third glue block forming block (340), and one glue inlet hole (310) is formed on each of the second limiting glue block forming block (330) and the third glue block forming block (340).

4. The OSFP DAC high-speed cable assembly point glue tool of claim 3, wherein, Three front shunt plates (461) for column shunting four columns of single cables in the DAC high-speed cable (12) in a laminated manner are arranged side by side in the cavity of the second shunt forming block (460), and each front shunt plate (461) is fixedly connected with the cavity bottom of the second shunt forming block (460); one first groove (210) is formed on each end of the gasket (6) on the lower outer frame (2); the gasket (6) comprises a plate (610) and four ear plates (620) fixed on the same side of the plate (610), the two ends of the plate (610) are respectively located in the two first grooves (210), and the four ear plates (620) are respectively located in the four columns of single cables in the DAC high-speed cable (12) in a laminated manner; two rear shunt plates (441) for column shunting two columns of single cables on the outer side of the DAC high-speed cable are arranged in the cavity of the first shunt forming block (440), and each rear shunt plate (441) is fixedly connected with the cavity bottom of the first shunt forming block (440).

5. The OSFP DAC high-speed cable assembly point glue tool of claim 4, wherein, The glue inlet hole (310) of the third glue block forming block (340) in communication with the first forming cavity (7) is between the rear shunt plate (441) and the front shunt plate (461), and one first sealing glue block (341) is arranged on the lower surface of the third glue block forming block (340) on the two sides of the glue inlet hole (310) in communication with the first forming cavity (7); the upper surface of the second glue block forming block (450) is lower than the upper surfaces of the first shunt forming block (440) and the second shunt forming block (460), so as to form a second groove (451) accommodating two first sealing glue blocks (341) above the second glue block forming block (450).

6. The OSFP DAC high-speed cable assembly point glue tool of claim 4, wherein, The first glue block forming block (430) is provided with a third groove (431) on each side of the first forming cavity (7) and behind the rear shunt plate (441), and the third groove (431) is communicated with the first forming cavity (7); the lower surface of the third glue block forming block (340) is provided with a second sealing glue block (342) corresponding to the two third grooves (431) and entering the third groove (431).

7. The OSFP DAC high-speed cable assembly point glue tool of claim 3, wherein, The first limiting glue block forming block (420) is provided with a fourth groove (421) on each side of the second forming cavity (8) and communicated with the second forming cavity (8); the lower surface of the second limiting glue block forming block (330) is provided with a third sealing glue block (331) corresponding to the two fourth grooves (421) and entering the fourth groove (421).

8. The OSFP DAC high-speed cable assembly point glue tool of claim 1, wherein, The upper outer frame (1) is made of stainless steel, the lower outer frame (2) is made of stainless steel, the upper cover (3) is made of stainless steel or aluminum alloy, and the base (4) is made of stainless steel or aluminum alloy.

9. The OSFP DAC high-speed cable assembly point glue tool of claim 1, wherein, The middle region of the lower outer frame (2) is provided with a limiting groove (220), and the base (4) is arranged in the limiting groove (220) of the lower outer frame (2); the upper cover (3) and the upper outer frame (1) are connected by screws (9).

10. The DAC high-speed cable assembly dispensing tool in an OSFP according to any one of claims 1-9, characterized in that, The lower outer frame (2) is provided with a limiting block (230) at each corner, and the upper outer frame (1) is provided with a notch (110) at each corner; when the upper cover (3) covers the base (4), the limiting block (230) on the lower outer frame (2) is arranged in the notch (110) on the upper outer frame (1).

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