Split type dispensing tool for DAC high-speed cable in OSFP

Abstract

The utility model relates to a split type dispensing tool for a DAC (Digital-to-Analog Converter) high-speed cable in an OSFP (Optical Small Form-factor Pluggable). The split type dispensing tool comprises a lower outer frame, a base, an upper cover and an upper outer frame, a containing cavity matched with a DAC high-speed cable is formed between the upper cover and the base in a penetrating mode, and a gasket is horizontally arranged in a front inlet of the containing cavity. A first forming cavity and a second forming cavity are formed in the positions, close to the gasket and the DAC high-speed cable middle tail sleeve, in the containing cavity of the base respectively, and two glue inlet holes communicated with the first forming cavity and the second forming cavity respectively are formed in the upper cover. The tool has the beneficial effects that the DAC high-speed cable assembled by a scattered cable is placed in the tool for dispensing, so that a glue block and a limiting glue block are formed at the corresponding positions on the cable, two glue positions can be formed at the expected positions on the cable by virtue of the tool, the dispensing quality can be ensured by virtue of the tool, and for a vulnerable upper cover or base, the dispensing quality can be ensured by virtue of the tool. And when being damaged, the device can be correspondingly replaced, and other parts can be repeatedly used.

Description

Technical Field

[0001] This utility model relates to the field of optical module technology, specifically to a separate dispensing fixture for high-speed DAC cables in OSFP. Background Technology

[0002] The high-speed DAC cable in the OSFP optical module has 16 individual cables, distributed in four layers, with four individual cables per layer and four individual cables per column. Adjacent columns must not be in close contact; the top two layers must be in close contact, as must the bottom two layers, with a 0.5mm gap between them. This type of high-speed DAC cable often involves adhesive dispensing. For designs with cable sheaths, adhesive is applied only in the middle. For designs without cable sheaths, which are assembled from loose cables, this dispensing method cannot be used (the cable sheath provides a fixing function for the internal cables, while the unsheathed cable cannot). An additional dispensing must be applied near the tail sleeve, resulting in two dispensing points. The purpose of these two methods is to prevent the cables from moving or rotating within the structural components, thus avoiding pad detachment. Currently, there is a lack of suitable dispensing fixtures for designs without cable sheaths that are assembled from loose cables. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a separate dispensing fixture for high-speed DAC cables in OSFP, so as to overcome the shortcomings of the prior art.

[0004] The technical solution of this utility model to solve the above-mentioned technical problems is as follows:

[0005] A separate dispensing fixture for high-speed DAC cables in an OSFP includes:

[0006] The upper and lower outer frames are distributed opposite to each other. A top cover is arranged below the upper outer frame and fixed thereto. A base is arranged on the lower outer frame and limited thereto. The top cover is placed on the base.

[0007] A cavity for receiving DAC high-speed cables is opened between the top cover and the base in a through manner. A gasket is horizontally arranged in the front entrance of the cavity to separate the upper two layers of single cables from the lower two layers of single cables in the stacked single cable distribution.

[0008] The cavity containing the first forming cavity is located near the gasket. When the glue is poured into the cavity, a glue block is formed on the cable to wrap around all the individual cables in a circumferential manner and to divert and limit the flow of individual cables.

[0009] A second molding cavity is provided near the tail sleeve of the DAC high-speed cable in the receiving cavity. When the glue is poured into it, a limiting glue block is formed on the cable to wrap around all the individual cables in a circumferential manner and to prevent the cables from moving back and forth or rotating in the structural component.

[0010] The top cover has two glue inlet holes that communicate with the first molding cavity and the second molding cavity, respectively.

[0011] Based on the above technical solution, the present invention can be further improved as follows.

[0012] Furthermore, the upper outer frame is made of stainless steel, the lower outer frame is made of stainless steel, the upper cover is made of stainless steel or aluminum alloy or other metals, and the base is made of stainless steel or aluminum alloy or other metals.

[0013] Furthermore, the top cover and the upper outer frame are connected by screws.

[0014] Furthermore, a limiting groove is opened in the middle area of ​​the lower outer frame, and the base is placed in the limiting groove opened on the lower outer frame. A first groove communicating with the limiting groove is opened at each of the two ends of the pad on the lower outer frame, and the two ends of the pad are respectively located in the two first grooves.

[0015] Furthermore, three front splitter plates are arranged side-by-side in the front area of ​​the first forming cavity within the receiving cavity to split the four rows of single cables distributed in a stacked manner in the DAC high-speed cable. Each front splitter plate is fixedly connected to the bottom of the receiving cavity. The gasket includes a plate and four ear plates fixed on the same side of the plate. The two ends of the plate are respectively located in two first grooves. The four ear plates are respectively located in the four rows of single cables distributed in a stacked manner in the DAC high-speed cable. Each ear plate is used to separate the upper two layers of single cables and the lower two layers of single cables in each row of single cables.

[0016] Furthermore, two rear splitter plates are arranged inside the first molding cavity to split the two rows of single cables on the outer side of the DAC high-speed cable into columns. Each rear splitter plate is fixedly connected to the bottom of the first molding cavity.

[0017] Furthermore, the glue inlet on the upper cover, which communicates with the first molding cavity, is located between the rear and front splitter plates. On the lower surface of the upper cover, a first sealing block is provided on each side of the glue inlet that communicates with the first molding cavity. On the base, a second groove is provided on each side of the first molding cavity at the location corresponding to the two first sealing blocks to accommodate the first sealing blocks. The second groove communicates with the first molding cavity.

[0018] Furthermore, on the base, a third groove communicating with the first molding cavity is opened on each side of the first molding cavity in the area behind the rear splitter plate, and a second sealing block is provided on the lower surface of the upper cover at each of the two corresponding third grooves, which enters the third groove.

[0019] Further, the base is provided with a fourth recess on each side of the second forming cavity, and the lower surface of the upper cover is provided with a third sealing block corresponding to the two fourth recesses.

[0020] Further, the lower outer frame is provided with a limiting block at each corner, and the upper outer frame is provided with a notch at each corner.

[0021] The present application has the following advantages:

[0022] When the tool is applied to dispensing glue on the DAC high-speed cable, the DAC high-speed cable is placed on the base, then the gasket is inserted into the corresponding position, and the upper cover is covered, so that the DAC high-speed cable is in the accommodating cavity. According to the pressure of the dispensing machine, the liquid glue is injected into the first forming cavity and the second forming cavity through the two glue injection holes respectively. After cooling, a glue block is formed on the cable to wrap all single cables in the circumferential direction and to separate and limit the single cables. A limiting glue block is formed on the cable to wrap all single cables in the circumferential direction and to prevent the cable from moving forward and backward or rotating in the structure, thereby avoiding the solder pad from falling off. By means of the tool, two glue positions can be formed on the cable at the expected position, and the dispensing quality can be ensured by the tool.

[0023] The gasket is inserted into the single cable distributed in a laminated manner to separate the upper two layers of single cables from the lower two layers of single cables, so as to realize glue sealing and prevent the glue from flowing to other positions where there should be no glue when the glue is poured into the first forming cavity.

[0024] Since the upper cover and the base are consumable parts, the material of the upper cover and the base can be selected according to the processing difficulty, which is beneficial to reduce the cost and improve the processing speed. For the consumable upper cover or base, it can be replaced when it is damaged, and other parts can be reused to reduce the repair cost. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 It is an explosion first perspective view of the DAC high-speed cable split dispensing tool in the OSFP of the present application.

[0026] Figure 2 It is an explosion second perspective view of the DAC high-speed cable split dispensing tool in the OSFP of the present application.

[0027] Figure 3 It is an application diagram of the DAC high-speed cable split dispensing tool in the OSFP.

[0028] Figure 4 It is an application explosion diagram of the DAC high-speed cable split dispensing tool in the OSFP.

[0029] In the drawings, the components represented by each reference numeral are listed as follows:

[0030] 1, upper outer frame, 110, notch, 2, lower outer frame, 210, limiting groove, 220, first groove, 230, limiting block, 3, upper cover, 310, glue inlet hole, 320, first glue sealing block, 330, second glue sealing block, 340, third glue sealing block, 4, base, 410, front flow distribution plate, 420, rear flow distribution plate, 430, second groove, 440, third groove, 450, fourth groove, 5, accommodating cavity, 6, gasket, 610, plate piece, 620, ear plate, 7, first forming cavity, 8, second forming cavity, 9, screw, 10, DAC high-speed cable, 11, glue block, 12, limiting glue block. DETAILED DESCRIPTION

[0031] The principles and characteristics of the present application are described below in conjunction with the drawings, and the examples are used only to explain the present application and are not intended to limit the scope of the present application.

[0032] Example 1

[0033] As shown in Figure 1 , Figure 2 , Figure 3 , Figure 4 An OSFP DAC high-speed cable split type dispensing tool, comprising:

[0034] An upper outer frame 1 and a lower outer frame 2, the upper outer frame 1 and the lower outer frame 2 are arranged opposite to each other, an upper cover 3 is arranged below the upper outer frame 1, the upper cover 3 is fixed with the upper outer frame 1, a base 4 is arranged on the lower outer frame 2, and the base 4 is limited by the lower outer frame 2, and the upper cover 3 covers the base 4;

[0035] An accommodating cavity 5 is formed between the upper cover 3 and the base 4, the contour shape of the accommodating cavity 5 matches the contour shape of the DAC high-speed cable 10, the accommodating cavity 5 penetrates through the front and rear sides of the upper cover 3 and also penetrates through the front and rear sides of the base 4, the accommodating cavity 5 is used to accommodate the DAC high-speed cable 10, the accommodating cavity 5 is composed of two parts, one part is located on the upper cover 3, and the other part is located on the base 4, when the upper cover 3 covers the base 4, a complete accommodating cavity 5 is formed, a gasket 6 is horizontally arranged in the front entrance of the accommodating cavity 5, since the single cable in the DAC high-speed cable 10 is arranged in a laminated manner, the upper two layers are tightly attached together, the lower two layers are tightly attached together, and there is a 0.5mm gap between the upper two layers of single cables and the lower two layers of single cables, so that the gasket 6 is inserted into the single cable arranged in a laminated manner to separate the upper two layers of single cables from the lower two layers of single cables, and the glue is prevented from flowing to other positions where there should be no glue when the glue is subsequently poured into the first forming cavity 7;

[0036] The first forming cavity 7 is arranged near the gasket 6 in the accommodating cavity 5, and when the glue is poured into the first forming cavity 7, a glue block 11 will be formed in the first forming cavity 7 to wrap all the single cables in the circumferential direction and to separate and limit the single cables.

[0037] The first forming cavity 7 is arranged near the gasket 6 in the accommodating cavity 5, and when the glue is poured into the first forming cavity 7, a glue block 11 will be formed in the first forming cavity 7 to wrap all the single cables in the circumferential direction and to separate and limit the single cables.

[0038] The second forming cavity 8 is arranged near the tail sleeve of the DAC high-speed cable 10 in the accommodating cavity 5, and when the glue is poured into the second forming cavity 8, a limiting glue block 12 will be formed on the cable to wrap all the single cables in the circumferential direction and to prevent the cable from moving forward and backward or rotating in the structure.

[0039] The second forming cavity 8 is arranged near the tail sleeve of the DAC high-speed cable 10 in the accommodating cavity 5, and when the glue is poured into the second forming cavity 8, a limiting glue block 12 will be formed on the cable to wrap all the single cables in the circumferential direction and to prevent the cable from moving forward and backward or rotating in the structure.

[0040] Two glue inlet holes 310 are arranged on the upper cover 3 and communicate with the first forming cavity 7 and the second forming cavity 8, respectively, that is, the glue can be poured into the first forming cavity 7 through the glue inlet hole 310 communicating with the first forming cavity 7, and the glue can be poured into the second forming cavity 8 through the glue inlet hole 310 communicating with the second forming cavity 8, and the glue inlet hole 310 is preferably inverted conical.

[0041] In this scheme, the first forming cavity 7 and the second forming cavity 8 are both composed of two parts, one part is located on the upper cover 3, and the other part is located on the base 4, and when the upper cover 3 is covered on the base 4, a complete first forming cavity 7 and a complete second forming cavity 8 are formed.

[0042] When the tool is applied to dispensing glue on the DAC high-speed cable 10 which is self-assembled, the DAC high-speed cable 10 is placed on the base 4, then the gasket 6 is inserted at the corresponding position, and then the upper cover 3 is covered, so that the DAC high-speed cable 10 is in the accommodating cavity 5.

[0043] According to the pressure of the dispensing machine, the liquid glue is injected into the first forming cavity 7 and the second forming cavity 8 through the two glue inlet holes 310, and after cooling, a glue block 11 is formed on the cable to wrap all the single cables in the circumferential direction and to separate and limit the single cables, and a limiting glue block 12 is formed on the cable to wrap all the single cables in the circumferential direction and to prevent the cable from moving forward and backward or rotating in the structure.

[0044] Embodiment 2

[0045] AsFigure 1 , Figure 2 , Figure 3 , Figure 4 As shown, this embodiment is a further improvement on embodiment 1, as detailed below:

[0046] Considering the ease of processing, the upper outer frame 1 and the lower outer frame 2 are made of stainless steel, while the upper cover 3 and the base 4 can be made of stainless steel or aluminum alloy or other metals as needed. This helps to reduce costs and increase processing speed. For the easily damaged upper cover 3 or base 4, they can be replaced when they are damaged, while other parts can be reused to reduce repair costs.

[0047] The first molding cavity 7 is usually located in the area about 10mm away from the OSFP inner PCB board in the DAC high-speed cable 10.

[0048] Example 3

[0049] like Figure 1 , Figure 2 As shown, this embodiment is a further improvement on embodiment 1 or 2, as detailed below:

[0050] The upper cover 3 and the upper outer frame 1 are connected by screws 9 to ensure a stable connection between the upper cover 3 and the upper outer frame 1, and to facilitate easy disassembly and assembly.

[0051] Example 4

[0052] like Figure 1 , Figure 2 As shown, this embodiment is a further improvement on any one of embodiments 1 to 3, as detailed below:

[0053] A limiting groove 210 is opened in the middle area of ​​the lower outer frame 2, and the base 4 is placed in the limiting groove 210 opened on the lower outer frame 2. The base 4 is limited in this way, which makes it easy for the base 4 to separate from the lower outer frame 2, and the limiting stability is also easy to ensure.

[0054] On the lower outer frame 2, a first groove 220 communicating with the limiting groove 210 is opened at each of the two ends of the gasket 6. The two ends of the gasket 6 are respectively located in the two first grooves 220, which can support and limit the gasket 6 so that it is stably in the expected position to achieve sealing.

[0055] Example 5

[0056] like Figure 1 , Figure 2 , Figure 3 , Figure 4The embodiment is further improved on the basis of any one of embodiments 1-4, and the specific improvements are as follows:

[0057] The three front flow dividing plates 410 are arranged side by side in the front area of the first forming cavity 7 in the accommodating cavity 5, each of the three front flow dividing plates 410 is fixedly connected with the cavity bottom of the accommodating cavity 5, and the three front flow dividing plates 410 are used to divide the four columns of single cables in the DAC high-speed cable 10 in a column-by-column manner, can block the gap between adjacent columns of single cables, realize glue sealing, and prevent glue from flowing to other positions that should not have glue; one insertion slot for the upper end of each front flow dividing plate 410 is formed on the lower surface of the upper cover 3 at the position corresponding to each front flow dividing plate 410.

[0058] The gasket 6 comprises a plate 610 and four ear plates 620 fixed on the same side of the plate 610, both ends of the plate 610 are respectively located in two first grooves 220, and the four ear plates 620 are respectively located in the four columns of single cables in the DAC high-speed cable 10 distributed in a laminated manner, and each ear plate 620 is used to separate the upper two layers of single cables from the lower two layers of single cables in each column of single cables. The gasket 6 with the above structure can effectively realize glue sealing and prevent glue from flowing to other positions that should not have glue when glue is poured into the first forming cavity 7 subsequently.

[0059] Further, two rear flow dividing plates 420 are arranged in the first forming cavity 7 to divide the two columns of single cables on the outer side of the DAC high-speed cable in a column-by-column manner, each rear flow dividing plate 420 is fixedly connected with the cavity bottom of the first forming cavity 7, and the glue block 11 formed when glue is poured into the first forming cavity 7 has two holes, one insertion slot for the upper end of each rear flow dividing plate 420 is formed on the lower surface of the upper cover 3 at the position corresponding to each rear flow dividing plate 420.

[0060] The glue inlet hole 310 of the upper cover 3 in communication with the first forming cavity 7 is located between the rear flow dividing plate 420 and the front flow dividing plate 410, and one first glue sealing block 320 is arranged on the lower surface of the upper cover 3 on each side of the glue inlet hole 310 in communication with the first forming cavity 7, that is, two first glue sealing blocks 320 are arranged, one second groove 430 for accommodating the first glue sealing block 320 is arranged on the base 4 at the position corresponding to each first glue sealing block 320 on each side of the first forming cavity 7, the second groove 430 is in communication with the first forming cavity 7, when the upper cover 3 is covered on the base 4, the first glue sealing block 320 is located in the second groove 430, glue sealing is realized to prevent glue from flowing to other areas that should not have glue, and at the same time, the position limiting between the upper cover 3 and the base 4 is realized to prevent the upper cover 3 and the base 4 from being dislocated.

[0061] The base 4 is provided with a third groove 440 on each side of the first forming cavity 7, which is located at the rear of the rear shunt plate 420, and the third groove 440 is communicated with the first forming cavity 7, that is, the base 4 is provided with two third grooves 440, and the lower surface of the upper cover 3 is provided with a second sealing glue block 330 corresponding to the two third grooves 440, which enters the third groove 440, when the upper cover 3 is covered on the base 4, the second sealing glue block 330 is located in the third groove 440, and the glue is sealed to prevent the glue from flowing to other areas where the glue should not be, and the position between the upper cover 3 and the base 4 is limited to prevent the upper cover 3 and the base 4 from being dislocated.

[0062] The base 4 is provided with a third groove 440 on each side of the first forming cavity 7, which is located at the rear of the rear shunt plate 420, and the third groove 440 is communicated with the first forming cavity 7, that is, the base 4 is provided with two third grooves 440, and the lower surface of the upper cover 3 is provided with a second sealing glue block 330 corresponding to the two third grooves 440, which enters the third groove 440, when the upper cover 3 is covered on the base 4, the second sealing glue block 330 is located in the third groove 440, and the glue is sealed to prevent the glue from flowing to other areas where the glue should not be, and the position between the upper cover 3 and the base 4 is limited to prevent the upper cover 3 and the base 4 from being dislocated.

[0063] Embodiment 6

[0064] As shown in Figure 1 , Figure 2 The embodiment is further improved on the basis of any one of embodiments 1-5, and the specific improvements are as follows:

[0065] The lower outer frame 2 is provided with a limiting block 230 at each corner, and the upper outer frame 1 is provided with a notch 110 at each corner, and when the upper cover 3 is covered on the base 4, the limiting block 230 on the lower outer frame 2 is located in the notch 110 on the upper outer frame 1, and through the structure, the upper outer frame 1 and the lower outer frame 2 can be limited to prevent the upper outer frame 1 and the lower outer frame 2 from being dislocated, thereby further preventing the upper cover 3 and the base 4 from being dislocated.

[0066] Of course, in the actual application process, other ways can also be used, for example:

[0067] The lower outer frame 2 is designed with multiple positioning holes, and the upper outer frame 1 is designed with multiple positioning columns inserted into the positioning holes, or the lower outer frame 2 is designed with multiple positioning columns, and the upper outer frame 1 is designed with multiple positioning holes for the positioning columns to be inserted into, which is only an exemplary description.

[0068] Although the embodiments of the utility model have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limiting the utility model, and those skilled in the art can change, modify, replace and modify the above embodiments within the scope of the utility model.

Claims

1. A separate dispensing fixture for high-speed DAC cables in an OSFP, characterized in that, include: An upper outer frame (1) and a lower outer frame (2) are distributed opposite to each other. A top cover (3) is arranged below the upper outer frame (1) and fixed thereto. A base (4) is arranged on the lower outer frame (2) and limited thereto. The top cover (3) covers the base (4). A cavity (5) for matching DAC high-speed cable (10) is opened between the upper cover (3) and the base (4) in a through manner. A gasket (6) is horizontally arranged in the front entrance of the cavity (5) to separate the upper two layers of single cables and the lower two layers of single cables in the stacked single cables. The cavity (5) is provided with a first forming cavity (7) near the gasket (6) where a glue block (11) is formed on the cable when glue is poured in, so as to wrap all the single cables around the circumference and divert and limit the single cables. The cavity (5) is provided with a second molding cavity (8) near the tail sleeve of the DAC high-speed cable (10). When the glue is poured into it, a limiting glue block (12) is formed on the cable to wrap around all the single cables in the circumference and to prevent the cables from moving back and forth or rotating in the structure. The upper cover (3) has two glue inlet holes (310) that are respectively connected to the first molding cavity (7) and the second molding cavity (8).

2. The separate dispensing fixture for high-speed DAC cables in an OSFP according to claim 1, characterized in that, The upper outer frame (1) is made of stainless steel, the lower outer frame (2) is made of stainless steel, the upper cover (3) is made of stainless steel or aluminum alloy or other metal, and the base (4) is made of stainless steel or aluminum alloy or other metal.

3. The separate dispensing fixture for high-speed DAC cables in an OSFP according to claim 1, characterized in that, The upper cover (3) and the upper outer frame (1) are connected by screws (9).

4. The separate dispensing fixture for high-speed DAC cables in an OSFP according to claim 1, characterized in that, A limiting groove (210) is opened in the middle area of ​​the lower outer frame (2), and the base (4) is placed in the limiting groove (210) opened on the lower outer frame (2). A first groove (220) communicating with the limiting groove (210) is opened at each of the two ends of the pad (6) on the lower outer frame (2), and the two ends of the pad (6) are respectively located in the two first grooves (220).

5. The separate dispensing fixture for high-speed DAC cables in an OSFP according to claim 1, characterized in that, The receiving cavity (5) contains three front splitter plates (410) arranged side by side in the front area of ​​the first forming cavity (7) for splitting the four rows of single cables distributed in a stacked manner in the DAC high-speed cable (10) column by column. Each front splitter plate (410) is fixedly connected to the bottom of the receiving cavity (5). The gasket (6) includes a plate (610) and four ear plates (620) fixed on the same side of the plate (610). The two ends of the plate (610) are respectively located in two first grooves (220). The four ear plates (620) are respectively located in the four rows of single cables distributed in a stacked manner in the DAC high-speed cable (10). Each ear plate (620) is used to separate the upper two layers of single cables and the lower two layers of single cables in each row of single cables.

6. The separate dispensing fixture for high-speed DAC cables in an OSFP according to claim 5, characterized in that, Two rear splitter plates (420) are arranged in the first molding cavity (7) to split the two single cables on the outer side of the DAC high-speed cable into columns. Each rear splitter plate (420) is fixedly connected to the bottom of the first molding cavity (7).

7. A separate dispensing fixture for high-speed DAC cables in an OSFP according to claim 6, characterized in that, The glue inlet (310) on the upper cover (3) that communicates with the first molding cavity (7) is located between the rear distributor plate (420) and the front distributor plate (410). On the lower surface of the upper cover (3), a first sealing block (320) is provided on each side of the glue inlet (310) that communicates with the first molding cavity (7). On the base (4), a second groove (430) is provided on each side of the first molding cavity (7) at the corresponding two first sealing blocks (320) to accommodate the first sealing blocks (320). The second groove (430) communicates with the first molding cavity (7).

8. A separate dispensing fixture for high-speed DAC cables in an OSFP according to claim 6, characterized in that, On the base (4), a third groove (440) communicating with the first molding cavity (7) is opened on both sides of the first molding cavity (7) in the area behind the rear diversion plate (420). On the lower surface of the upper cover (3), a second sealing block (330) is provided at each of the two corresponding third grooves (440) and enters the third groove (440).

9. A separate dispensing fixture for high-speed DAC cables in an OSFP according to claim 1, characterized in that, On the base (4), a fourth groove (450) communicating with the second molding cavity (8) is opened on each side. On the lower surface of the upper cover (3), a third sealing block (340) is provided at each of the two corresponding fourth grooves (450) and enters the fourth groove (450).

10. A separate dispensing fixture for high-speed DAC cables in an OSFP according to any one of claims 1 to 9, characterized in that, The lower outer frame (2) is provided with a limiting block (230) at each corner, and the upper outer frame (1) is provided with a notch (110) at each corner. When the upper cover (3) is placed on the base (4), the limiting block (230) on the lower outer frame (2) is located in the notch (110) on the upper outer frame (1).

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