High-performance ultrathin diamond saw blade
By designing a matrix alloy mixed with diamond powder and pressing and sintering it on a diamond saw blade, and setting cross chip removal grooves in the cutting section, the problem of insufficient cutting performance of existing diamond saw blades is solved, achieving more efficient cutting performance and reduced vibration.
Patent Information
- Application Number
- CN202422978327.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-04
- Publication Date
- 2025-11-18
- Estimated Expiration
- 2034-12-04
AI Technical Summary
Existing diamond saw blades have insufficient cutting performance and lack technological breakthroughs.
A high-performance ultrathin diamond saw blade was designed, which is formed by mixing and pressing diamond powder with matrix alloy. The cutting part is equipped with an annular array of chip removal grooves, including intersecting first and second chip removal grooves. The protrusion edge design facilitates the flow of cutting fluid and chips, thereby improving cutting performance.
Improved structural design enhances cutting performance, reduces saw blade vibration and deformation, and enables high-speed cutting.
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Figure CN223558743U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to the saw blade technical field, concretely relates to a high performance ultrathin diamond saw blade. BACKGROUND
[0002] The diamond saw blade is a sawing processing tool, is widely used in the cutting processing of hard brittle materials such as concrete, refractory material, stone, ceramic etc.The diamond saw blade is mainly composed of two parts of base body and cutter head, the cutter head is generally composed of matrix alloy and certain proportion diamond particles, and the cutting of stone etc.is realized by the holding force of matrix alloy to diamond particles.The cutting part of the diamond saw blade produced by each manufacturer in the prior art is made of matrix alloy and diamond particles, and the cutting performance is also similar, lacks technical breakthrough, in order to improve the cutting performance of diamond saw blade, a high performance ultrathin diamond saw blade is provided. SUMMARY
[0003] Therefore, the utility model wants to solve the technical problems, provides a kind of high performance ultrathin diamond saw blade, solve the problem of cutting saw blade cutting performance not strong in prior art.
[0004] In order to solve the above technical problem, the utility model discloses a kind of high performance ultrathin diamond saw blade, including: base body;The center of base body is equipped with mounting hole, and the periphery of mounting hole is equipped with a plurality of heat dissipation holes;The edge of base body is equipped with cutting part, and cutting part is annular body shape, and its thickness is greater than the thickness of base body, and the front and back surfaces of cutting part are all equipped with a plurality of annular array's chip removal groove, and chip removal groove has first chip removal groove and second chip removal groove, and first chip removal groove and second chip removal groove are intersected, and chip removal groove divides the surface of cutting part into the annular array distribution of at least two convex blocks.
[0005] Further, the end of the above-mentioned first chip removal groove intersects with the end of the second chip removal groove, and the intersection is located at the inner edge of the cutting part.
[0006] Further, the above-mentioned chip removal groove divides the surface of the cutting part into the annular array distribution of convex block one and convex block two.
[0007] Further, the edge of the above-mentioned convex block one has the edge of the first chip removal groove, the edge of the second chip removal groove and the outer edge of the cutting part.
[0008] Further, the edge of the above-mentioned convex block two has the edge of the first chip removal groove, the edge of the second chip removal groove, the outer edge of the cutting part and the inner edge of the cutting part.
[0009] Further, the above-mentioned second chip removal groove is bent.
[0010] Further, the width of the above-mentioned second chip removal groove is greater than the width of the first chip removal groove.
[0011] Compared with the prior art, the application can obtain the following technical effects:
[0012] The cutting part is formed by mixing and pressing and sintering of the matrix alloy and the diamond powder, the convex block one and the convex block two are annularly arrayed on the front and back surfaces of the cutting part, the two ends of the first and second chip removal grooves extend to the inner and outer edges of the cutting part, the cutting fluid and the chippings can flow smoothly, and the cutting performance can be improved.
[0013] Of course, it is not necessary for any product implementing the application to achieve all the technical effects described above. BRIEF DESCRIPTION OF DRAWINGS
[0014] The accompanying drawings, which are included to provide a further understanding of the application and constitute a part of this application, illustrate certain illustrative embodiments of the application and together with the description serve to explain the application. In the drawings:
[0015] Figure 1 is a schematic view of a saw blade of an embodiment of the utility model.
[0016] Reference signs: base body 1, mounting hole 2, heat dissipation hole 3, cutting part 4, first chip removal groove 5, second chip removal groove 6, convex block one 7, convex block two 8. DETAILED DESCRIPTION
[0017] The embodiments of the application will be described in detail below with the accompanying drawings and embodiments, so that the realization process of how the application applies technical means to solve technical problems and achieve technical effects can be fully understood and implemented.
[0018] Figure 1 is a schematic view of a saw blade of an embodiment of the utility model.
[0019] A high-performance ultrathin diamond saw blade, comprising: a base body 1; the center of the base body 1 is provided with a mounting hole 2, and six heat dissipation holes 3 are arranged around the mounting hole 2; the edge of the base body 1 is provided with a cutting part 4, the cutting part 4 is in the shape of an annular body, the thickness of the cutting part 4 is greater than the thickness of the base body 1, the front and back surfaces of the cutting part 4 are both provided with a plurality of annularly arrayed chip removal grooves, the chip removal grooves have a first chip removal groove 5 and a second chip removal groove 6, the first chip removal groove 5 and the second chip removal groove 6 are intersected, and the chip removal grooves divide the surface of the cutting part 4 into at least two annularly arrayed convex blocks.
[0020] The end of the first chip groove 5 intersects with the end of the second chip groove 6, and the intersection is located at the inner edge of the cutting part 4; the chip grooves divide the surface of the cutting part 4 into the annular array distribution of the first protrusion 7 and the second protrusion 8, the edge of the first protrusion 7 has the edge of the first chip groove 5, the edge of the second chip groove 6 and the outer edge of the cutting part 4, and the edge of the second protrusion 8 has the edge of the first chip groove 5, the edge of the second chip groove 6, the outer edge of the cutting part 4 and the inner edge of the cutting part 4; the second chip groove 6 is bent, the first protrusion 7 is quadrangular, the second protrusion 8 is pentagonal, the number of edges of the protrusion increases, the grinding cutting edge correspondingly increases, and the cutting performance is improved; the width of the second chip groove 6 is greater than the width of the first chip groove 5, the design of the chip groove being wide and narrow improves the cutting performance of the front and back surfaces of the cutting part 4 on the material contact surface during cutting, the two side edges of the chip groove are the cutting edges, the edge cutting force of the narrow chip groove on the material contact surface is small, the edge cutting force of the wide chip groove on the material contact surface is large, the cutting force is small and large alternately, and the interval spacing of the chip grooves on the front and back surfaces of the cutting part 4 can reduce the vibration and deformation of the saw blade, so that the high-speed cutting function can be achieved, and the cutting performance can be improved.
[0021] The cutting part is formed by mixing and pressing and sintering of the matrix alloy and the diamond powder, the first protrusion 7 and the second protrusion 8 in the annular array distribution are arranged on the front and back surfaces, the two ends of the first chip groove 5 and the second chip groove 6 extend to the inner and outer edges of the cutting part 4, respectively, so that the cutting fluid and the chippings can flow smoothly, and the cutting performance can be improved.
[0022] The above description shows and describes several preferred embodiments of the utility model, but as described above, it should be understood that the utility model is not limited to the forms disclosed herein, and should not be regarded as excluding other embodiments, but can be used in various other combinations, modifications and environments, and can be modified by the above teaching or related technology or knowledge within the scope of the utility model concept described herein. The modification and change made by the person skilled in the art without departing from the spirit and scope of the utility model should be within the protection scope of the claims attached to the utility model.
Claims
1. A high performance ultra-thin diamond saw blade comprising: The base body is provided with a mounting hole in the center and a plurality of heat dissipation holes around the mounting hole; The edge of the base body is provided with a cutting part in the shape of a ring body, the thickness of the cutting part is greater than that of the base body, the front and back surfaces of the cutting part are provided with a plurality of annularly arranged chip removal grooves, the chip removal grooves have a first chip removal groove and a second chip removal groove, the first chip removal groove and the second chip removal groove are intersected, and the chip removal grooves divide the surface of the cutting part into at least two annularly distributed protrusions.
2. The high performance ultrathin diamond saw blade of claim 1, wherein, The end of the first chip removal groove intersects with the end of the second chip removal groove, and the intersection is located at the inner edge of the cutting part.
3. The high performance ultrathin diamond saw blade of claim 2, wherein, The chip removal grooves divide the surface of the cutting part into annularly distributed protrusion one and protrusion two.
4. The high performance ultrathin diamond saw blade of claim 3, wherein, The edge of the protrusion one has the edge of the first chip removal groove, the edge of the second chip removal groove, and the outer edge of the cutting part.
5. The high performance ultrathin diamond saw blade of claim 3, wherein, The edge of the protrusion two has the edge of the first chip removal groove, the edge of the second chip removal groove, the outer edge of the cutting part, and the inner edge of the cutting part.
6. The high performance ultrathin diamond saw blade of claim 4, wherein, The second chip removal groove is in the shape of a bend.
7. The high performance ultrathin diamond saw blade of claim 6, wherein, The width of the second chip removal groove is greater than that of the first chip removal groove.