Device for testing moisture absorption and desorption performance of heat exchanger coating material

Abstract

The utility model discloses a moisture absorption and desorption performance testing device for a heat exchanger coating material, and belongs to the technical field of moisture absorption functional coating materials. The moisture absorption and desorption performance testing device for the heat exchanger coating material comprises a shell provided with a testing bin, and a testing sample is arranged in the testing bin; the temperature adjusting assembly is used for adjusting the temperature in the testing bin to simulate the environment temperature; the humidity adjusting assembly is used for adjusting the humidity in the testing bin to simulate the environment humidity; the semiconductor testing tool comprises a semiconductor chilling plate, and one end of the semiconductor chilling plate is in contact with the surface of the test sample; and the first temperature sensor and the probe are arranged between the semiconductor chilling plate and the test sample. When the testing device is used for testing the coating material of the heat exchanger, the actual use working condition of the heat exchanger is better met, and the testing result is more accurate and better coincides with the whole machine experiment result.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of moisture absorption functional coating materials, and particularly relates to a heat exchanger coating material moisture absorption and release performance testing device. BACKGROUND

[0002] The temperature and humidity independent control technology is one of the most concerned technologies of the new air product of the air conditioner, and has obvious advantages in improving the energy saving effect of the whole machine and the indoor comfort. Among them, the adsorption dehumidification technology can not only realize the dehumidification of air in summer, but also realize the humidification of indoor air in winter, and is one of the most commonly used and most efficient technical solutions of the temperature independent control. The adsorption dehumidification technology currently includes packed bed dehumidification technology, rotary dehumidification technology and coated heat exchanger dehumidification technology. Among them, the coated heat exchanger dehumidification technology has the highest dehumidification efficiency and the smallest space occupation, but the technical difficulty is also relatively high. The Daikin Desica product adopts a coated dehumidification and heat exchanger coated with a high molecular moisture absorption material. In addition to the high molecular moisture absorption material, molecular sieve, inorganic silica gel and MOF are also common moisture absorption materials. How to evaluate the performance difference of different moisture absorption materials and the overall performance level after coating on the surface of the heat exchanger is the key to the development of the coated heat exchanger dehumidification technology and the selection of the material.

[0003] The main way to evaluate the performance of the moisture absorption material at present is to test its adsorption and desorption performance to water vapor, but this test method is inconsistent with the actual working condition (fin surface temperature, test air volume, etc.), and can only realize the horizontal comparison of the performance of the moisture absorption material. In addition, in addition to the moisture absorption material, the heat exchanger surface moisture absorption coating also contains adhesive, crosslinking agent and other components, and the coating thickness and coating combination method will also affect the overall dehumidification performance of the heat exchanger, so it is difficult to simply measure the overall performance of the heat exchanger by testing the water vapor adsorption performance of the moisture absorption material. The main way to evaluate the overall dehumidification performance of the heat exchanger at present is to prepare a heat exchanger sample coated with a moisture absorption coating, and to carry out enthalpy difference experiment performance verification on the heat exchanger monomer experiment table or the whole machine. Although this method has relatively accurate test results and meets the actual use working condition. But in the development or material selection process, there are problems such as large consumption of raw materials, high consumption of test resources, long evaluation period, not suitable for large batch sample comparison test and the like.

[0004] From the above, although the method of directly testing the water vapor adsorption and desorption performance of the moisture-absorbing material can simulate the environmental working conditions during the test, it is difficult to simulate the temperature condition of the heat exchange surface, and there is a difference from the actual adsorption and desorption process. In addition, the performance test of the pure moisture-absorbing material is also difficult to directly measure the moisture absorption and desorption performance of the coating of the heat exchanger. It is necessary to comprehensively compare factors such as the binder, crosslinking agent, and coating structure of the coating. Therefore, directly evaluating the overall coating sample can be more in line with the actual situation. At the same time, the current way of directly evaluating the moisture absorption and desorption performance of the overall coating is mainly relying on the experimental test of the single or assembled heat exchanger sample. Although this method is more direct and accurate, it consumes more raw materials and experimental resources, and the evaluation period is longer, which makes it difficult to realize the comparative analysis of a large number of samples. Practical new type content

[0005] The present application provides a kind of heat exchanger coating material moisture absorption and desorption performance testing device, utilize the testing device to test heat exchanger coating material is more in line with the actual use of heat exchanger working condition, test result is more accurate, with whole machine experimental result is more consistent.

[0006] A kind of heat exchanger coating material moisture absorption and desorption performance testing device, including: shell, with test bin, test bin is equipped with test sample;Temperature adjusting assembly, the temperature in test bin is adjusted to simulate ambient temperature;Humidity adjusting assembly, the humidity in test bin is adjusted to simulate ambient humidity;And semiconductor testing tool, including: semiconductor refrigeration sheet, one end of semiconductor refrigeration sheet and test sample face contact;First temperature sensor, probe is arranged between semiconductor refrigeration sheet and test sample. Wherein, semiconductor testing tool can be according to the actual temperature of refrigerant in the copper pipe of heat exchanger under actual working condition to carry out surface temperature regulation, temperature adjusting assembly can be according to actual environmental working condition to carry out environmental temperature and humidity regulation in test bin, humidity adjusting assembly can be according to actual environmental working condition to carry out environmental humidity regulation in test bin, the heat exchanger coating material moisture absorption and desorption performance testing device can accurately evaluate the moisture absorption and desorption performance of heat exchanger coating without whole machine test.

[0007] In some embodiments, the semiconductor refrigeration sheet includes a semiconductor material, the semiconductor material has oppositely arranged cold end and hot end, the cold end is connected with the upper end plate, and the hot end is connected with the lower end plate;The upper end plate is in contact with the test sample, and the upper end plate and the test sample are provided with heat-conducting silicone grease. According to the Peliter effect, when a direct current passes through a loop composed of two kinds of semiconductor materials, a phenomenon that one end absorbs heat and the other end releases heat occurs at both ends of the material. The cold end that absorbs heat is connected with the upper end plate, and the hot end that releases heat is connected with the lower end plate, so as to realize the temperature control effect of surface refrigeration or heating of the semiconductor refrigeration sheet. Heat-conducting silicone grease is arranged between the upper end plate and the test sample. The heat-conducting silicone grease can fill the gap between the test sample and the upper end plate to reduce the contact thermal resistance, thereby improving the test accuracy.

[0008] In some embodiments, the semiconductor test tool further comprises a weighing scale, and the semiconductor test tool is arranged on the weighing scale. The weighing scale is used to accurately weigh the weight change of the hygroscopic material during the hygroscopic and dehydric process, so as to accurately obtain the hygroscopic and dehydric performance of the measured coating.

[0009] In some embodiments, the semiconductor test tool further comprises a heat sink connected to the lower end plate, and a thermal insulation material connected to the heat sink, and the semiconductor test tool is in contact with the weighing scale through the thermal insulation material. The surface temperature can be accurately controlled by the first temperature sensor, and the weighing accuracy of the weighing scale can be avoided by the blocking effect of the thermal insulation material.

[0010] In some embodiments, the temperature adjusting assembly comprises a copper pipe, and the inlet and outlet ends of the copper pipe are respectively connected to a constant temperature water tank. The copper pipe is filled with a flowing refrigerant medium, and the temperature of the refrigerant medium can be controlled by the constant temperature water tank, so as to accurately control the temperature of the copper pipe.

[0011] In some embodiments, the temperature adjusting assembly further comprises a supply air baffle arranged in the test chamber, one side of the supply air baffle is provided with the copper pipe, and the other side of the supply air baffle is provided with the semiconductor test tool; a plurality of small holes are formed in the supply air baffle. The fan simulates the air supply source, and uses convection heat exchange to uniformly disperse heat to the entire test chamber through the supply air baffle.

[0012] In some embodiments, the temperature adjusting assembly further comprises a fan, which simulates the air supply source and uniformly disperses heat through the supply air baffle. In addition to the function of air convection to achieve uniform dispersion of temperature and humidity in the test chamber, the fan can simulate the actual air speed on the surface of the heat exchanger by adjusting the air speed. After the airflow of the supply air baffle reaches the upper surface of the test sample, the wind speed sensor can be used to accurately control the wind speed on the surface of the test sample.

[0013] In some embodiments, the humidity adjusting assembly comprises a humidifier, a drying device, and a compressed air source connected to the drying device. The humidifier can provide humid air for high humidity conditions, the drying device and the compressed air source can provide dry air for low humidity conditions, and the air is transported into the test chamber through the airflow inlet valve, and combined with the fan simulating the air supply source, the air convection is used to uniformly disperse the humidity to the entire test chamber through the supply air baffle.

[0014] In some embodiments, the test chamber further comprises a humidity sensor and a second temperature sensor, which can accurately control the temperature and humidity in the test chamber, and are more conducive to simulating the environmental temperature and humidity, and improving the accuracy of the test.

[0015] The heat exchanger coating material moisture absorption and release performance testing device comprises a shell with a test chamber, a temperature adjusting assembly for adjusting the temperature in the test chamber to simulate the ambient temperature, a humidity adjusting assembly for adjusting the humidity in the test chamber to simulate the ambient humidity, and a semiconductor testing tool for contacting the sample to be tested and simulating the actual surface temperature of the heat exchanger. The testing device is more suitable for the actual working condition of the heat exchanger, and the test results are more accurate and consistent with the experimental results of the whole machine. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 A structural diagram of a heat exchanger coating material moisture absorption and release performance testing device according to some embodiments is shown.

[0017] Figure 2 Another structural diagram of a heat exchanger coating material moisture absorption and release performance testing device according to some embodiments is shown.

[0018] Figure 3 A copper pipe connection diagram according to some embodiments is shown.

[0019] Figure 4 A semiconductor testing tool diagram according to some embodiments is shown.

[0020] Figure 5 A sample testing diagram of a semiconductor testing tool according to some embodiments is shown.

[0021] Figure 6 A lateral view of a semiconductor testing tool according to some embodiments is shown.

[0022] Figure 7 A lateral view of a sample testing of a semiconductor testing tool according to some embodiments is shown.

[0023] In the above figures: 1, shell; 2, semiconductor testing tool; 201, semiconductor refrigeration sheet; 2011, upper end plate; 2012, semiconductor material; 2013, lower end plate; 202, heat sink; 203, thermal insulation material; 204, first temperature sensor; 205, heat-conducting silicone grease; 206, test sample; 3, weighing balance; 4, air supply partition; 5, fan; 6, copper pipe; 7, air inlet valve; 8, air pipe; 9, humidifier; 10, drying device; 11, compressed air source; 12, constant temperature water tank; 13, second temperature sensor; 14, humidity sensor; 15, air speed sensor; 16, system control panel; 17, exhaust hole. DETAILED DESCRIPTION

[0024] In order to make the purposes and embodiments of the present application more clear, the exemplary embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the exemplary embodiments of the present application. Obviously, the described exemplary embodiments are only a part of the embodiments of the present application, but not all the embodiments of the present application.

[0025] In the description of the present application, it should be understood that the terms "center", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0026] The terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features referred to. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise stated, "a plurality of" means two or more.

[0027] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral connection; it can be mechanical connection, or electrical connection; it can be direct connection, or indirect connection through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0028] At present, the main way to evaluate the performance of the heat exchanger moisture-absorbing material is to directly test the water vapor adsorption and desorption performance of the moisture-absorbing material. Although this method can simulate the environmental conditions in the test process, it is difficult to simulate the temperature conditions of the heat exchange surface, and there is a difference from the actual adsorption and desorption process. In addition, the performance test of the pure moisture-absorbing material is also difficult to directly measure the moisture absorption and desorption performance of the coating of the heat exchanger, and it is necessary to comprehensively compare the factors such as the binder, the crosslinking agent, and the coating structure in the coating, so that the direct evaluation of the overall coating sample can better meet the actual situation. At present, the main way to directly evaluate the moisture absorption and desorption performance of the overall coating is still to rely on the experimental test of the single or assembled heat exchanger sample in the whole machine. Although this method is more direct and accurate, it consumes more raw materials and experimental resources, and the evaluation period is longer, which makes it difficult to realize the comparative analysis of a large number of samples.

[0029] The application provides a coating material moisture absorption and release performance testing device. The testing device is more suitable for the actual working conditions of the heat exchanger, and the testing results are more accurate and consistent with the experimental results of the whole machine.

[0030] The heat exchanger coating material moisture absorption and release performance testing device includes a shell with a test chamber. A test sample 206 is arranged in the test chamber for moisture absorption and release performance testing. The test chamber is a closed space for simulating different environmental conditions to accurately test the moisture absorption and release performance of the heat exchanger coating material. During the test, the humidity and temperature in the test chamber can be accurately adjusted by control to simulate the humidity and temperature changes in the actual use environment. The weight change of the test sample 206 during the moisture absorption and release process is monitored and recorded in real time to calculate the moisture absorption and release rates of the material. In some embodiments, an exhaust hole 17 is formed in the shell.

[0031] The heat exchanger coating material moisture absorption and release performance testing device includes a temperature adjusting assembly that can adjust the temperature in the test chamber to simulate the ambient temperature. The temperature adjusting assembly can dynamically adjust the temperature in the test chamber within a set temperature range to ensure stable and uniform temperature. During the test, the temperature adjusting assembly can adjust the temperature in the test chamber to a specific value to simulate the temperature state of the heat exchanger under different climate conditions or working environments. For example, the moisture absorption performance of the coating material is tested in a high-temperature and high-humidity environment, or the moisture release performance is tested in a low-temperature and low-humidity environment. Through accurate temperature control, the performance of the coating material in actual use can be more realistically reflected.

[0032] In some embodiments, the temperature adjusting assembly includes a copper pipe 6, and the inlet and outlet ends of the copper pipe 6 are connected to a constant temperature water tank 12. A flowing refrigerant medium is passed through the copper pipe 6, and the temperature of the refrigerant medium can be controlled by the constant temperature water tank 12 to accurately control the temperature of the copper pipe 6, thereby controlling the temperature in the test chamber and simulating the temperature state of the heat exchanger under different climate conditions or working environments.

[0033] The copper pipe 6, as the core component of temperature conduction, has good thermal conductivity and corrosion resistance, and can efficiently transfer the heat of the cold and hot medium. The inlet and outlet ends of the copper pipe 6 can be connected with the constant temperature water tank 12 through sealing joints respectively, forming a closed loop circulation system. The constant temperature water tank 12, as the control center of the temperature adjusting assembly, can accurately adjust the temperature of the medium according to the test requirements, and deliver the medium into the copper pipe 6. In the running process, the copper pipe 6 is filled with flowing medium, and the temperature of the medium is accurately controlled by the heating or refrigeration device in the constant temperature water tank 12. For example, when a high temperature environment needs to be simulated, the constant temperature water tank 12 heats the medium to the set temperature; when a low temperature environment needs to be simulated, the constant temperature water tank 12 cools the medium to reduce the temperature. By adjusting the temperature of the medium, the surface temperature of the copper pipe 6 also changes, thereby regulating the air temperature in the test chamber. When the medium flows in the copper pipe 6, the copper pipe 6 exchanges heat with the air in the test chamber through heat exchange, realizing rapid and uniform adjustment of the temperature in the chamber.

[0034] In some embodiments, the temperature adjusting assembly further comprises an air supply baffle 4 arranged in the test chamber. One side of the air supply baffle 4 is provided with the copper pipe 6, and a plurality of small holes are arranged on the air supply baffle 4. The air supply source uses convection heat exchange to uniformly disperse heat to the entire test chamber through the air supply baffle 4. The plurality of small holes arranged on the air supply baffle 4 can ensure that the airflow passes through the baffle at a stable speed and direction. The airflow generated by the air supply source (such as a fan 5 or a blower) passes through the surface of the copper pipe 6 and is heated or cooled through heat exchange with the copper pipe 6, and then uniformly dispersed to the entire test chamber through the small holes on the air supply baffle 4. This design uses the principle of convection heat exchange to efficiently and uniformly transfer heat or cold to every corner of the test chamber, thereby ensuring that the temperature distribution in the test chamber is uniform and avoiding the situation that the local temperature is too high or too low. It should be noted that the role of the air supply baffle 4 is not only to uniformly disperse heat, but also to improve the flow of air in the test chamber, thereby more realistically simulating the air flow state in the actual application environment. For example, in air conditioning or dehumidification equipment, the heat exchanger is usually in an air flow environment, and the design of the air supply baffle 4 can better simulate this dynamic condition, making the test results more valuable.

[0035] In some embodiments, the temperature adjusting assembly further comprises a fan 5 which simulates the air supply source and uniformly disperses heat through the air supply baffle 4. In addition to using air convection to achieve uniform dispersion of temperature and humidity in the test chamber, the fan 5 can also simulate the actual wind speed on the surface of the heat exchanger by adjusting the wind speed. After the airflow through the air supply baffle 4 reaches the upper surface of the test sample 206, the wind speed on the surface of the test sample 206 can be accurately regulated by the wind speed sensor 15.

[0036] The heat exchanger coating material moisture absorption and release performance testing device includes a humidity adjusting assembly that adjusts the humidity in the test chamber to simulate environmental humidity. The humidity adjusting assembly is used to precisely adjust and control the humidity in the test chamber to simulate the humidity changes in actual application environments. The humidity adjusting assembly can dynamically adjust within a set humidity range according to testing needs, ensuring stable and uniform humidity in the test chamber. During testing, the humidity adjusting assembly can adjust the humidity in the test chamber to a specific value as required by the experiment to simulate the humidity state of the heat exchanger under different climate conditions or working environments. For example, testing the moisture absorption performance of the coating material in a high-humidity environment or testing its moisture release performance in a low-humidity environment. Through precise humidity control, the performance of the coating material in actual use can be more realistically reflected. In addition, the humidity adjusting assembly works in conjunction with the temperature adjusting assembly to achieve simultaneous adjustment of temperature and humidity, thereby simulating complex environmental conditions. This multi-parameter control capability enables the testing device to comprehensively evaluate the moisture absorption and release performance of heat exchanger coating materials under different temperature and humidity combinations, providing reliable data support for material optimization design and performance improvement.

[0037] The humidity adjusting assembly includes a humidifier 9 that can provide humid air for high-humidity working conditions. The humidifier 9 can quickly and accurately increase the humidity of the air in the chamber by converting water into water vapor and releasing it into the test chamber, thereby meeting different testing needs. In high-humidity working conditions, the humidifier 9 can provide continuous humid air to the test chamber to simulate high-humidity environments in actual applications.

[0038] The humidity adjusting assembly includes a drying device 10 filled with adsorbent material, including at least one of molecular sieves, inorganic silica gel, activated carbon, etc. Among them, molecular sieves can selectively adsorb molecules based on their size and shape, and with this unique feature, molecular sieves can efficiently capture water molecules in the air and adsorb them firmly in their pores, effectively reducing the water vapor content in the test chamber; inorganic silica gel is a highly active adsorbent material that is insoluble in water and any solvent, has stable chemical properties, and has strong adsorption performance, allowing it to quickly and massively adsorb water in the air to create a dry environment in the test chamber; activated carbon has a rich pore structure and a large specific surface area, which gives it excellent adsorption capacity, not only can it adsorb water vapor, but also can remove odors and impurities in the air, further ensuring the purity of the test environment. When the humidity in the test chamber needs to be reduced, the water molecules in the air will be captured by the adsorbent material as it passes through the drying device 10, thereby reducing the amount of water vapor entering the test chamber.

[0039] The humidity adjusting assembly further comprises a compressed air source 11 connected to the drying device 10. The compressed air source 11 comprises one of an air compressor, a compressed air cylinder, a compressed air pipe 8, and the like. The compressed air source 11 can provide a stable and sufficient air source for the entire humidity adjusting process, ensuring the normal operation of each component. The above-mentioned drying device 10 and compressed air source 11 can provide dry air for low humidity conditions, which is transported from the air inlet valve 7 to the test chamber, respectively, and combined with the fan 5 to simulate the air supply source. The air is evenly dispersed to the entire test chamber through the air supply baffle 4 by convection. The above-mentioned humidifier 9 and drying device 10 are connected to the test chamber through the air pipe 8, and the air inlet valve 7 is arranged on the air pipe 8 to control the air flow into the test chamber.

[0040] The heat exchanger coating material moisture absorption and desorption performance testing device further comprises a semiconductor test tool 2, which comprises a semiconductor refrigeration sheet 201. One end of the semiconductor refrigeration sheet 201 is in surface contact with the test sample 206. The semiconductor test tool 2 can adjust the surface temperature according to the actual temperature of the refrigerant in the heat exchanger copper pipe 6 under actual working conditions. Based on the Peltier effect, the semiconductor refrigeration sheet 201 can achieve rapid refrigeration or heating by adjusting the current direction, and has the advantages of fast response speed, high temperature control precision, and small size. By limiting the direct contact between one end of the semiconductor refrigeration sheet 201 and the surface of the test sample 206, efficient heat transfer is ensured. By adjusting the current size and direction of the semiconductor refrigeration sheet 201, the temperature of the surface of the test sample 206 can be accurately controlled, thereby simulating the temperature change of the refrigerant in the heat exchanger copper pipe 6 under actual working conditions. When simulating low-temperature conditions, the semiconductor refrigeration sheet 201 absorbs heat from the surface of the test sample 206, causing the temperature to decrease; when simulating high-temperature conditions, the semiconductor refrigeration sheet 201 releases heat to the surface of the test sample 206, causing the temperature to increase.

[0041] The semiconductor test tool 2 comprises a first temperature sensor 204, the probe of the first temperature sensor 204 is arranged between the semiconductor refrigeration sheet 201 and the test sample 206, which can directly measure the temperature change at the junction of the two, ensuring the accuracy and reliability of the temperature data. The installation position of the probe ensures that it can fully contact the surface of the semiconductor refrigeration sheet 201 and the test sample 206, while not affecting the heat transfer and distribution. By monitoring the temperature of the contact surface in real time, the first temperature sensor 204 can feed back the data to the control system, which automatically adjusts the working state of the semiconductor refrigeration sheet 201 according to the set value, thereby realizing the accurate control of the surface temperature of the test sample 206. In the actual test process, the first temperature sensor 204 plays a crucial role. When the semiconductor refrigeration sheet 201 starts to cool, the sensor will monitor the temperature change of the contact surface in real time, ensuring that the surface temperature of the test sample 206 can quickly and stably reach the set value; when it is necessary to simulate high-temperature working conditions, the sensor will also monitor the temperature change to prevent the temperature from being too high or too low to affect the accuracy of the test results. This closed-loop control mechanism not only improves the accuracy of the test, but also ensures the repeatability and reliability of the test process.

[0042] The semiconductor refrigeration sheet 201 comprises a semiconductor material 2012, the semiconductor material 2012 has oppositely arranged cold end and hot end, the cold end is connected with the upper end plate 2011, and the hot end is connected with the lower end plate 2013; the upper end plate 2011 is in surface contact with the test sample 206, and the heat-conducting silicone grease 205 is arranged between the upper end plate 2011 and the test sample 206. According to the Peliter effect, when a direct current passes through a loop composed of two kinds of semiconductor materials 2012, a phenomenon that one end absorbs heat and the other end releases heat occurs at the two ends of the material. The cold end that absorbs heat is connected with the upper end plate 2011, and the hot end that releases heat is connected with the lower end plate 2013, thereby realizing the temperature control effect of surface cooling or heating of the semiconductor refrigeration sheet 201. The heat-conducting silicone grease 205 is arranged between the upper end plate 2011 and the test sample 206, which can fill the gap between the test sample 206 and the upper end plate 2011 to reduce the contact thermal resistance, thereby improving the test accuracy.

[0043] The heat exchanger coating material moisture absorption and desorption performance test device further comprises a weighing scale 3, and the semiconductor test tool 2 is arranged on the weighing scale 3. The weighing scale 3 is used to accurately weigh the weight change of the moisture absorption material in the moisture absorption and desorption process, so as to accurately obtain the moisture absorption and desorption performance of the measured coating. The semiconductor test tool 2 is placed on the weighing scale 3, and the weight measurement result of the weighing scale 3 can be directly detected by relying on the weight change of the test sample 206 in the process of adsorbing or desorbing water vapor, so as to realize accurate measurement of the adsorption and desorption performance of the test sample 206.

[0044] In some embodiments, the semiconductor test tool 2 further comprises a heat sink 202 connected to the lower end plate 2013.

[0045] In some embodiments, the semiconductor test tool 2 further comprises a heat insulation material 203 connected to the heat sink 202, and the semiconductor test tool 2 contacts the weighing scale 3 through the heat insulation material 203. By the blocking effect of the heat insulation material 203, the weighing accuracy of the weighing scale 3 can be avoided from being affected.

[0046] In some embodiments, the test chamber further comprises a humidity sensor 14 and a second temperature sensor 13, so as to realize accurate control of the temperature and humidity in the test chamber, and more favorably simulate the environmental temperature and humidity, and improve the testing accuracy.

[0047] In some embodiments, the heat exchanger coating material moisture absorption and desorption performance testing device further comprises a system control panel 16 for controlling each structure, and improving the automation degree and convenience of operation. In each component of the above-mentioned heat exchanger coating material moisture absorption and desorption performance testing device, the semiconductor test tool 2 provides a cold source for the test sample 206 to simulate the actual surface temperature of the copper tube 6 and aluminum fin of the heat exchanger. The fan 5 provides a surface wind speed for the test sample 206, the copper tube 6 provides an environmental temperature for the test sample 206, the humidifier 9, the drying device 10, and the compressed air source 11 provide an environmental humidity for the test sample 206, and the actual working conditions of the heat exchanger in the actual operation process are comprehensively simulated. The weighing scale 3 can accurately obtain the water vapor adsorption and desorption of the test sample 206, so as to accurately obtain the moisture absorption and desorption performance of the test sample 206.

[0048] The process of testing the moisture absorption and desorption performance of the heat exchanger coating material by using the above-mentioned heat exchanger coating material moisture absorption and desorption performance testing device includes:

[0049] (1) Sample preparation: The prepared coating solution to be tested is coated on the surface of the metal plate, wherein the coating formula, coating thickness, coating structure, coating process and other parameters are consistent with the actual heat exchanger sample. The metal plate includes at least one of an aluminum plate, a copper plate, and a stainless steel plate, and in some embodiments, the metal plate is a metal plate with the same material as the heat exchanger fin.

[0050] (2) Sample installation: The heat-conducting silicone grease 205 is uniformly coated on the surface of the upper end plate 2011 of the semiconductor test tool 2, and then the plate coated with the moisture absorption material is attached to the surface of the heat-conducting silicone grease 205, and after pressing, no obvious gap is ensured. The semiconductor test tool 2 with the assembled test sample 206 is placed on the surface of the heat insulation material 203 on the weighing scale 3.

[0051] (3) Parameter setting: turn on the humidifier 9, drying device 10, compressed air source 11 and constant temperature water tank 12, set the temperature, humidity, wind speed and semiconductor surface temperature of the test environment working condition through the system control panel 16, and rely on the first temperature sensor 204, humidity sensor 14, wind speed sensor 15 and second temperature sensor 13 to realize the precise adjustment of the test working condition. The specific test working condition parameters refer to Table 1: in winter working condition, the indoor side is adsorption, the surface temperature of the semiconductor upper end plate 2011 is 5℃, the outdoor side is desorption, and the surface temperature of the semiconductor upper end plate 2011 is 35℃; in summer working condition, the indoor side is desorption, the surface temperature of the semiconductor upper end plate 2011 is 50℃, the outdoor side is adsorption, and the surface temperature of the semiconductor upper end plate 2011 is 20℃, and the adsorption-desorption switching time is more than 3 minutes. Among them, the adsorption-desorption switching time is consistent with the actual operation condition of the heat exchanger, if it is less than 3 minutes, the working condition is not enough to complete the switching, which will affect the test accuracy. After completing the parameter setting, start the experiment.

[0052] Table 1 Experimental test working condition reference (wind speed is converted according to the actual heat exchanger test wind volume)

[0053]

[0054] (4) Test value: after starting the experiment, the maximum weight W1 is measured in the adsorption working condition, and after the adsorption-desorption working condition switching time, the minimum weight W2 is measured in the desorption working condition, and the difference between W1 and W2 is calculated to obtain AW, which is the current cycle adsorption amount of the test sample 206. After several cycle adsorption tests, if the current measured cycle adsorption amount AW1 is within 5% of the cycle adsorption amount AW2 calculated from the last cycle, the average of AW1 and AW2 is taken as the cycle adsorption amount value of the test sample 206.

[0055] (5) Complete the test: when replacing the test sample 206, the residual thermal conductive silicone grease 205 needs to be cleaned, and after coating new thermal conductive silicone grease 205, the test sample 206 is replaced. After completing the test, the residual thermal conductive silicone grease 205 also needs to be cleaned in time.

[0056] The above-mentioned heat exchanger coating material adsorption and desorption performance test device has the following advantages for testing the adsorption and desorption performance of the heat exchanger coating material:

[0057] (1) The semiconductor test tool 2 can accurately simulate the surface temperature of the internal copper pipe 6 and aluminum fin in the actual operation process of the heat exchanger, which is consistent with the actual test working condition and improves the test accuracy.

[0058] (2) The use of copper pipe 6, humidifier 9, drying device 10, compressed air source 11, etc. can accurately simulate the temperature and humidity of the external environment in the actual operation process of the heat exchanger, which is consistent with the actual test working condition and improves the test accuracy.

[0059] (3) Using the weighing balance 3 to monitor the weight change of the sample during the hygroscopic and dehumidification process in real time, the cyclic adsorption amount is obtained by testing, and the hygroscopic and dehumidification performance of the sample is accurately measured.

[0060] (4) A testing device and evaluation method with high accuracy and strong universality are provided for the hygroscopic and dehumidification performance of the coating material.

[0061] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

[0062] In order to facilitate explanation, the above description has been made in combination with specific embodiments. However, the above exemplary discussion is not intended to exhaust or limit the embodiments to the specific forms disclosed above. Various modifications and variations can be obtained according to the above teachings. The selection and description of the above embodiments are to better explain the principles and practical applications, so that those skilled in the art can better use the embodiments and various different modified embodiments suitable for specific use considerations.

Claims

1. A device for testing the moisture absorption and desorption performance of a heat exchanger coating material, characterized in that, The application relates to a semiconductor test device and a test method thereof. The semiconductor test device comprises a housing, a temperature adjusting assembly, a humidity adjusting assembly and a semiconductor test tool. The housing is provided with a test chamber, and the test chamber is provided with a test sample. The temperature adjusting assembly adjusts the temperature in the test chamber to simulate the ambient temperature. The humidity adjusting assembly adjusts the humidity in the test chamber to simulate the ambient humidity. The semiconductor test tool comprises a semiconductor refrigerating sheet, one end of the semiconductor refrigerating sheet being in contact with the test sample surface. A first temperature sensor is arranged between the semiconductor refrigerating sheet and the test sample.

2. The heat exchanger coating material moisture adsorption and desorption performance testing device according to claim 1, characterized in that, The semiconductor refrigerating sheet comprises semiconductor material, and the semiconductor material is provided with oppositely arranged cold ends and hot ends.

3. The heat exchanger coating material moisture adsorption and desorption performance testing device according to claim 2, characterized in that, The cold ends are connected with upper end plates, and the hot ends are connected with lower end plates.

4. The heat exchanger coating material moisture adsorption and desorption performance testing device according to claim 3, characterized in that, The upper end plates are in contact with the test sample surface, and heat-conducting silicone grease is arranged between the upper end plates and the test sample surface.

5. The heat exchanger coating material moisture adsorption and desorption performance testing device according to claim 1, characterized in that, The semiconductor test device further comprises a weighing scale, and the semiconductor test tool is arranged on the weighing scale.

6. The heat exchanger coating material moisture adsorption and desorption performance testing device according to claim 5, characterized in that, The semiconductor test tool further comprises a heat sink connected with the lower end plates, and heat insulation material connected with the heat sink.

7. The heat exchanger coating material moisture adsorption and desorption performance testing device according to claim 6, characterized in that, The semiconductor test tool is in contact with the weighing scale through the heat insulation material. 8.The heat exchanger coating material moisture adsorption and desorption performance testing device according to claim 1, wherein, The temperature adjusting assembly comprises copper pipes, and the inlet and outlet ends of the copper pipes are connected with constant-temperature water tanks. 9.The heat exchanger coating material moisture adsorption and desorption performance testing device according to claim 1, wherein, The temperature adjusting assembly further comprises a blowing partition plate arranged in the test chamber.

10. A device for testing the moisture absorption and desorption performance of a heat exchanger coating material, characterized in that, One side of the blowing partition plate is provided with the copper pipes, and the other side of the blowing partition plate is provided with the semiconductor test tool. A plurality of small holes are arranged on the blowing partition plate. The temperature adjusting assembly further comprises a fan, which simulates a blowing source and uniformly disperses heat through the blowing partition plate. The humidity adjusting assembly comprises a humidifier, a drying device and a compressed air source connected with the drying device. The test chamber is further provided with a humidity sensor and a second temperature sensor. The application relates to a semiconductor test device and a test method thereof. The semiconductor test device comprises a housing, a temperature adjusting assembly, a humidity adjusting assembly and a semiconductor test tool. The housing is provided with a test chamber, and the test chamber is provided with a test sample. The temperature adjusting assembly adjusts the temperature in the test chamber to simulate the ambient temperature. The humidity adjusting assembly adjusts the humidity in the test chamber to simulate the ambient humidity. The semiconductor test tool is in contact with the test sample and simulates the actual surface temperature of a heat exchanger.

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