Thermal imaging camera
By eliminating the external germanium chip and using adhesive connections for the lens barrel and light-transmitting aperture, along with an overflow groove structure, the problems of high cost and low accuracy in thermal imaging cameras were solved, achieving more efficient infrared imaging and target monitoring.
Patent Information
- Application Number
- CN202422654235.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-31
- Publication Date
- 2025-11-18
- Estimated Expiration
- 2034-10-31
AI Technical Summary
Existing thermal imaging cameras have high hardware costs and low infrared imaging accuracy.
The external germanium plate at the light-transmitting hole is removed, and the lens barrel and the light-transmitting hole are sealed by adhesive. An overflow groove is set on the lens barrel to ensure airtightness, and a binocular thermal imaging lens assembly is configured.
It reduces hardware costs, improves infrared light penetration and imaging accuracy, and enhances target positioning and monitoring capabilities in complex environments.
Smart Images
Figure CN223567691U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to thermal imaging technical field especially relates to a thermal imaging camera. BACKGROUND
[0002] With the continuous development of science and technology, thermal imaging technology plays an increasingly important role in many fields. Thermal imaging technology detects the infrared radiation emitted by an object and converts it into a visible thermal image, thereby achieving non-contact measurement and monitoring of the temperature distribution of the target object. It has a wide range of applications in modern industry, security, medical care, fire protection and other fields.
[0003] The thermal imaging camera provided in the related art is provided with a germanium sheet before the lens assembly, and the infrared light is filtered through the germanium sheet. However, such a way results in high hardware cost of the thermal imaging camera, and there is the defect of low infrared imaging precision. UTILITY MODEL CONTENT
[0004] The technical problem to be solved by the utility model is to overcome the defect of high hardware cost and low infrared imaging precision of the thermal imaging camera in the prior art, thereby providing a thermal imaging camera.
[0005] The embodiment of the application provides a thermal imaging camera, which comprises a shell and a thermal imaging lens assembly.
[0006] The shell is formed with a mounting cavity and a light transmission hole in communication;
[0007] The thermal imaging lens assembly comprises:
[0008] A lens seat is located in the mounting cavity;
[0009] A lens barrel has one end located inside the mounting cavity and connected with the lens seat, and the other end away from the lens seat and passing through the light transmission hole to be directly exposed outside the camera, and an adhesive layer is arranged on the lens barrel to surround the outer wall, and the outer wall of the lens barrel is sealed and connected with the inner wall of the light transmission hole through the adhesive; in the mounting cavity, an overflow groove is arranged on the periphery of the lens barrel, and the opening of the overflow groove faces the light transmission hole.
[0010] Optionally, the overflow groove surrounds the lens barrel, and the side wall of the overflow groove abuts against the periphery of the light transmission hole.
[0011] Optionally, the distance from the outer wall of the overflow groove to the outer wall of the lens barrel is greater than or equal to 0.5mm.
[0012] Optionally, the light transmission hole comprises:
[0013] An expansion section, the radial dimension of the expansion section gradually decreases in the direction pointing to the mounting cavity,
[0014] The connecting section is connected to the small-diameter end of the expansion section at one end and connected to the mounting cavity at the other end; the adhesive layer is arranged on the inner wall of the connecting section and covers the inner wall of the connecting section.
[0015] Optionally, the camera further comprises an image processing chip electrically connected with the lens seat assembly, and the shell comprises:
[0016] a front shell, the front shell being provided with the light transmission hole and the mounting cavity;
[0017] a heat dissipation support connected to one side of the front shell where the mounting cavity is arranged, the heat dissipation support comprising a first support member and a second support member with heat conduction performance, the first support member and the second support member being distributed away from the lens seat in sequence;
[0018] the first support member being connected to the lens seat through a heat conduction medium, and the second support member being connected to the image processing chip through a heat conduction medium.
[0019] Optionally, the camera further comprises:
[0020] a main board on which a processor and a functional module are mounted;
[0021] a main board support stacked with the main board and provided with a boss protruding towards the main board, a heat conduction medium layer being arranged between the boss and the main board;
[0022] a projection position of the boss on the main board corresponding to a mounting position of the processor on the main board.
[0023] Optionally, an ear is arranged on an edge of the main board support and bent downward, the ear being connected to the front shell.
[0024] The shell further comprises a body shell inserted with the front shell, the body shell being formed with an accommodating cavity to accommodate the main board support and the main board.
[0025] Optionally, the camera further comprises a warning light assembly electrically connected with the processor and used for emitting light under the control of the processor.
[0026] Optionally, the camera further comprises a fill light assembly, the fill light assembly comprising a natural light fill light and an infrared fill light, and the fill light assembly being electrically connected with the processor and used for emitting light under the control of the processor.
[0027] Optionally, the camera further comprises at least another group of lens assemblies, and a light transmission window adapted to the lens assemblies is arranged on the shell.
[0028] Compared with the prior art, the thermal imaging camera provided by the utility model has at least the following technical effects:
[0029] The thermal imaging camera provided by the embodiment of the application has the following advantages. The lens assembly is directly exposed outside the thermal imaging camera through the light transmission hole, that is, no external germanium sheet is arranged at the light transmission hole. The lens assembly and the shell are connected in a sealed manner through the adhesive at the lens barrel and the light transmission hole, the overflow groove is arranged on the lens barrel of the mounting cavity, the adhesive is ensured to be in full contact with the lens barrel and the light transmission hole, the air tightness of the whole thermal imaging camera is ensured, and the thermal imaging camera can work normally. In this way, the thermal imaging camera provided by the utility model can normally acquire images without arranging an external germanium sheet, and the hardware cost of the whole device is reduced. BRIEF DESCRIPTION OF DRAWINGS
[0030] In order to more clearly illustrate the specific embodiments of the application or the technical solutions in the prior art, the drawings needed in the description of the specific embodiments or the prior art will be briefly introduced as follows.
[0031] Figure 1 It is a partial structure diagram of a thermal imaging camera according to an exemplary embodiment.
[0032] Figure 2 It is an exploded view of a thermal imaging camera according to an exemplary embodiment.
[0033] Figure 3 It is a structure diagram of a mainboard support according to an exemplary embodiment.
[0034] Figure 4 It is a rear view of a front shell of a thermal imaging camera according to an exemplary embodiment.
[0035] Figure 5 It is a structure diagram of a thermal imaging camera according to an exemplary embodiment.
[0036] BRIEF DESCRIPTION OF DRAWINGS
[0037] 100, shell, 110, mounting cavity, 120, light transmission hole, 121, inner wall, 122, expansion section, 123, communication section, 130, front shell, 140, heat dissipation support, 141, first support, 142, second support, 150, body shell, 160, light transmission window;
[0038] 200, thermal imaging lens assembly, 210, lens seat, 220, lens barrel, 221, outer wall, 222, overflow groove;
[0039] 300, image processing chip;
[0040] 400, mainboard;
[0041] 500, mainboard support, 510, boss, 520, ear piece;
[0042] 600, warning light assembly;
[0043] 700, light filling lamp assembly. DETAILED DESCRIPTION
[0044] The technical solutions of the present application will be described clearly and completely below in conjunction with the drawings. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0045] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third" are only for descriptive purposes and cannot be understood as indicating or implying relative importance.
[0046] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0047] The utility model embodiment provides a thermal imaging camera, Figure 1 is according to an exemplary embodiment shown in the local structure diagram of thermal imaging camera, as Figure 1 The thermal imaging camera includes a shell 100 and a thermal imaging lens assembly 200.
[0048] The shell 100 is formed with a mounting cavity 110 and a light transmission hole 120 in communication. The mounting cavity 110 is open at a side away from the light transmission hole 120, and the light transmission hole 120 is open at a side away from the mounting cavity 110, i.e., the light transmission hole 120 is directly exposed outside the thermal imaging camera through the open end.
[0049] The thermal imaging lens assembly 200 includes a lens seat 210 and a lens barrel 220 in communication. The lens seat 210 is used to accommodate a thermal imaging sensor capable of generating an electrical signal in response to an infrared light signal. The lens barrel 220 is used to accommodate a thermal imaging lens group for filtering non-infrared light in light so that infrared light penetrates to project on an image sensor in the lens seat 210 to achieve thermal imaging. The thermal imaging lens group includes a germanium sheet, and the light filtering effect is achieved through the germanium sheet to enable only infrared light to pass through the thermal imaging lens group to project on the image sensor.
[0050] The thermal imaging lens assembly 200 is mounted on the shell 100. Specifically, one end of the lens barrel 220 is located inside the mounting cavity 110 and connected to the lens seat 210, and the other end of the lens barrel 220 is away from the lens seat 210 and passes through the light transmission hole 120 to be directly exposed outside the thermal imaging camera. In other words, in the embodiment of the present application, no external germanium sheet is arranged at the open end of the light transmission hole, and the filtering effect of infrared light is achieved through the built-in germanium sheet in the thermal imaging lens assembly 200. Moreover, the outer wall 221 of the lens barrel 220 is sealed and glued to the inner wall 121 of the light transmission hole 120, and the connection between the lens barrel 220 and the shell 100 is achieved through the adhesive while ensuring the connection airtightness at the light transmission hole 120.
[0051] Airtightness is the key to ensuring the normal operation of the thermal imaging camera and presenting high-quality images. As a preferred way, an adhesive layer is arranged on the lens barrel 220 and distributed around the outer wall 221. Moreover, the light transmission hole 120 includes an expansion section 122 and a communication section 123, the radial dimension of the expansion section 122 gradually decreases in the direction pointing to the mounting cavity 110, and the communication section 123 connects the small-diameter end of the expansion section 122 and the mounting cavity 110. The adhesive layer is arranged at the inner wall 121 of the communication section 123 and covers the inner wall 121 of the communication section. In this way, the sealed connection between the lens barrel 220 and the shell 210 is effectively ensured.
[0052] Moreover, in the mounting cavity 110, an overflow groove 222 is arranged around the lens barrel 220, and the opening of the overflow groove 222 faces the light transmission hole 120. The overflow groove 222 is used to accommodate excess adhesive, and the adhesive is ensured to fully contact the inner wall of the light transmission hole 120 and the outer wall 221 of the lens barrel 220 through the arrangement of the overflow groove 222, thereby ensuring the airtightness of the connection between the thermal imaging lens assembly 220 and the shell 100 at the light transmission hole 120.
[0053] Optionally, the overflow groove 222 is arranged around the lens barrel 220, that is, the overflow groove 222 is an annular groove. Moreover, the side wall of the overflow groove 222 abuts the periphery of the light transmission hole 120 in the installation cavity 110. In this way, the overflow groove 222 can more fully accommodate the adhesive, ensuring that the adhesive contacts the lens barrel 220 and the light transmission hole 120, improving the bonding stability and sealing performance, while also avoiding the adhesive overflowing to other places in the installation cavity 110. Optionally, the distance from the outer wall of the overflow groove 222 to the outer wall of the lens barrel 220 is greater than or equal to 0.5 mm (for example, 0.6 mm, 0.7 mm, 0.8 mm, 1 mm, etc.), so as to ensure that the overflow groove 222 has sufficient space to accommodate the overflowing adhesive.
[0054] The thermal imaging camera provided by the embodiments of the present application no longer has an external germanium sheet at the light transmission hole 120, and the sealing connection of the lens assembly 200 and the housing 100 is achieved through the adhesive at the lens barrel 220 and the light transmission hole 120. By arranging the overflow groove 222 on the lens barrel 220 of the installation cavity 110, the adhesive is ensured to fully contact the lens barrel 220 and the light transmission hole, thereby ensuring the air tightness of the overall thermal imaging camera. In this way, the thermal imaging camera provided by the present application can normally acquire images without the need to set an external germanium sheet, thereby reducing the hardware cost of the overall device. At the same time, compared with the prior art, the penetration rate of infrared light is improved due to the reduction of one layer of germanium sheet, thereby optimizing the imaging accuracy.
[0055] In one example, the housing 100 includes a front shell 130 and a heat dissipation support 140. The front shell 130 is used to arrange the installation cavity 110 and the light transmission hole 120. The heat dissipation support 140 is connected to one side of the front shell 130 where the installation cavity 110 is arranged, and specifically includes a first support 141 and a second support 142 having heat conduction performance, which are distributed away from the lens seat 210 in sequence. The first support 141 is connected to the lens seat 210 through a heat conduction medium. Moreover, the thermal imaging camera further includes an image processing chip 300 electrically connected to the lens seat assembly 200, and the second support 142 is connected to the image processing chip 300 through a heat conduction medium. The first support 141 and the second support 142 having heat conduction performance are used to dissipate heat for the lens seat 210 and the image processing chip 300, thereby ensuring the normal operation of the camera.
[0056] As an alternative, the first support 141 and the second support 142 are arranged in a stacked manner. The second support 142 has a connecting portion and a recessed portion. The connecting portion is in abutment with the first support 141 (here, an approximately abutment relationship can also be adopted). The connecting portion and the first support 141 are connected with the front shell 130 through a connecting member (for example, a bolt, a screw, etc.). The recessed portion and the first support 141 enclose a half cavity, which is used to mount the image processing chip 300. The image processing chip 300 is connected with the lens seat 210 through a circuit board, so as to receive an analog signal acquired by an image sensor in the lens seat 210.
[0057] Figure 2 is an exploded view of a thermal imaging camera according to an example embodiment, Figure 3 is a structural view of a mainboard support according to an example embodiment. As Figure 2 and Figure 3 shown, the camera further comprises a mainboard 400 and a mainboard support 500.
[0058] The mainboard 400 is provided with a processor and functional modules (for example, a power supply module, a charging management chip, etc.). The mainboard support 500 is arranged in a stacked manner with the mainboard 400, and is provided with a boss 510 protruding towards the mainboard 400. A heat-conducting medium layer is arranged between the boss 510 and the mainboard 400. Moreover, a projection position of the boss 510 on the mainboard 400 corresponds to an installation position of the processor on the mainboard 400.
[0059] The mainboard support 500 has a heat-conducting property, and not only plays a role of supporting the mainboard 400, but also can realize a heat dissipation function. By arranging the boss 510, the distance from the mainboard support 500 to the mainboard 400, especially the distance from the mainboard support 500 to the processor on the mainboard, is shortened. In this way, the heat-conducting efficiency from the mainboard 400 to the mainboard support 500 is improved.
[0060] An ear 520 bent downward is arranged at an edge of the mainboard support 500, and the ear 520 is used to be connected with the front shell 130. The shell 100 further comprises a body shell 150 inserted with the front shell 130. The body shell 150 is formed with an accommodation cavity to accommodate the mainboard support 500 and the mainboard 400.
[0061] In this case, when the camera is mounted or dismounted, the mainboard support 500 and the mainboard 400 can be disassembled together from the accommodation cavity by separating the front shell 130 from the body shell 150. The assembly and disassembly process is simplified, and the use is facilitated.
[0062] In one example, the thermal imaging camera further comprises at least another lens assembly, and a light-transmitting window 160 is arranged on the shell and matched with the lens assembly. The type of the lens assembly is not limited, for example, it is an infrared lens assembly or a natural light lens assembly. When the lens assembly is a thermal imaging lens assembly, the structure of the lens assembly and the connection mode with the shell can adopt the same implementation mode as the first lens assembly 200.
[0063] By arranging the lens assembly, which is specifically a thermal imaging lens assembly, the thermal imaging camera forms a binocular thermal imaging camera. The binocular thermal imaging camera can perform more comprehensive temperature analysis and improve the accuracy and reliability of temperature measurement by simultaneously collecting thermal radiation information of the target object through two thermal imaging cameras. Moreover, based on the binocular vision principle, the binocular thermal imaging camera can accurately calculate the distance between the target object and the camera and the position of the target object in the three-dimensional space. This enables the user to more accurately locate the target, especially in complex environments such as darkness, smoke, etc., which can greatly improve the accuracy and efficiency of target positioning. For tracking and ranging of moving targets, the binocular thermal imaging camera can obtain the position and distance changes of the target in real time, providing more accurate dynamic information for the user, which helps to achieve effective tracking and monitoring of the target.
[0064] In addition, the binocular thermal imaging camera has a wider observation field of view through the cooperation of the two thermal imaging lens assemblies. Compared with a monocular thermal imaging camera, it can cover a larger area, reduce the observation dead angle, and improve the overall perception ability of the target scene. Specifically in use, different angles of observation can be achieved by adjusting the angles and positions of the two lenses, meeting the needs of users in different application scenarios. For example, in security monitoring, it can achieve all-around monitoring coverage; in industrial detection, it can detect large equipment from multiple angles.
[0065] Figure 4 is a rear view of a thermal imaging camera front shell according to an example embodiment, Figure 5 is a structural diagram of a thermal imaging camera according to an example embodiment. Referring to Figure 4 and Figure 5 In one example, the thermal imaging camera further comprises a warning light assembly 600, which is electrically connected to the processor and is used to emit light under the control of the processor. Optionally, the warning light assembly 600 comprises light-emitting pieces of different colors, which are controlled by the processor to emit light respectively or simultaneously under different conditions. For example, the warning light assembly 600 comprises blue and red light-emitting pieces.
[0066] In one example, the camera further comprises a fill light assembly 700, the fill light assembly 700 comprising a natural light fill light and an infrared fill light, and the fill light assembly 700 is electrically connected to the processor for emitting light under the control of the processor. Different illumination modes are provided by the fill light assembly 700 to meet the use requirements in different environments.
[0067] In addition, the thermal imaging camera further comprises a microphone and a speaker electrically connected to the processor to enrich the application scenarios and use modes and optimize the user experience.
[0068] In summary, the thermal imaging camera provided by the embodiments of the present application no longer sets an external germanium sheet at the light transmission hole 120, and the sealing connection of the lens assembly 200 and the shell 100 is achieved through the lens barrel 220 and the adhesive at the light transmission hole 120. By setting the overflow groove 222 on the lens barrel 220 of the mounting cavity 110, the adhesive is ensured to be in full contact with the lens barrel 220 and the light transmission hole, thereby ensuring the air tightness of the overall thermal imaging camera. In this way, the thermal imaging camera provided by the present application can normally acquire images without setting an external germanium sheet, thereby reducing the hardware cost of the overall device. At the same time, compared with the prior art, the penetration rate of infrared light is improved due to the reduction of one layer of germanium sheet, thereby optimizing the imaging accuracy. In addition, by configuring another lens assembly, the binocular thermal imaging function is realized, thereby improving the adaptability and accuracy in positioning, tracking, detection and other application scenarios. By configuring the warning light assembly 600 and the fill light assembly 700, different use requirements are met, thereby optimizing the user experience.
[0069] The above-mentioned embodiments are only preferred embodiments of the present application, and cannot be used to limit the scope of protection of the present application. Any non-essential changes and replacements made by those skilled in the art on the basis of the present application shall fall within the scope of protection of the present application.
Claims
1. A thermal imaging camera, characterized by The camera comprises: a shell and a thermal imaging lens assembly; the shell is formed with a mounting cavity and a light transmission hole in communication; the thermal imaging lens assembly comprises: a lens seat located in the mounting cavity; a lens barrel, one end of which is located inside the mounting cavity and connected with the lens seat, the other end of which is away from the lens seat and penetrates through the light transmission hole to be directly exposed outside the camera, and an adhesive layer is arranged on the lens barrel to surround the outer wall of the lens barrel, and the outer wall of the lens barrel is sealed and connected with the inner wall of the light transmission hole through the adhesive; in the mounting cavity, an overflow groove is arranged around the periphery of the lens barrel, and the opening of the overflow groove faces the light transmission hole.
2. The thermal imaging camera of claim 1, wherein, The overflow groove is arranged around the lens barrel, and the side wall of the overflow groove abuts against the periphery of the light transmission hole.
3. The thermal imaging camera of claim 2, wherein, The distance from the outer wall of the overflow groove to the outer wall of the lens barrel is greater than or equal to 0.5mm.
4. The thermal imaging camera of claim 1, wherein, The light transmission hole comprises: an expansion section, the radial dimension of which gradually decreases in the direction pointing to the mounting cavity, a communication section, one end of which is connected with the small-diameter end of the expansion section, and the other end of which is connected with the mounting cavity; the adhesive layer is arranged corresponding to the inner wall of the communication section and covers the inner wall of the communication section.
5. The thermal imaging camera of claim 1, wherein, The camera further comprises an image processing chip electrically connected with the lens seat assembly, and the shell comprises: a front shell, the light transmission hole and the mounting cavity are arranged on the front shell; a heat dissipation support connected with one side of the front shell where the mounting cavity is arranged, the heat dissipation support comprises a first support member and a second support member with heat conduction performance, and the first support member and the second support member are distributed away from the lens seat in sequence; the first support member is connected with the lens seat through a heat conduction medium, and the second support member is connected with the image processing chip through a heat conduction medium.
6. The thermal imaging camera of claim 5, wherein, The camera further comprises: a mainboard on which a processor and a functional module are mounted; a mainboard support stacked with the mainboard and provided with a boss protruding towards the mainboard, and a heat conduction medium layer is arranged between the boss and the mainboard; the projection position of the boss on the mainboard corresponds to the mounting position of the processor on the mainboard.
7. The thermal imaging camera of claim 6, wherein, An ear is arranged on the edge of the mainboard support and bent downward, and the ear is connected with the front shell; the shell further comprises a body shell inserted with the front shell, and the body shell is formed with an accommodation cavity to accommodate the mainboard support and the mainboard.
8. The thermal imaging camera of claim 6, wherein, The camera further comprises a warning light assembly electrically connected with the processor and used for emitting light under the control of the processor.
9. The thermal imaging camera of claim 6, wherein, The camera further comprises a fill light assembly, the fill light assembly comprises a natural light fill light and an infrared fill light, and the fill light assembly is electrically connected with the processor and used for emitting light under the control of the processor.
10. The thermal imaging camera according to any of claims 1 to 8, characterized in that The camera further comprises at least another group of lens assemblies, and a light transmission window matched with the lens assembly is arranged on the shell.