Passive temperature measurement electronic tag

Abstract

The utility model relates to a passive temperature measurement electronic tag in the field of electronic tags, which comprises a base material layer, an antenna layer and a plane material layer, an antenna groove is arranged on the base material layer, the antenna layer is arranged in the antenna groove, the surface of the antenna layer is flush with the surface of the base material layer, a chip is arranged on the antenna layer, a temperature sensor is integrated in the chip, and the surface of the plane material layer is provided with a temperature sensor. A positioning part is arranged in the antenna groove, a positioning hole corresponding to the positioning part is formed in the antenna layer, the positioning part can be inserted into the positioning hole in a paired mode, a bottom material layer is arranged at the end, away from the plane material layer, of the base material layer, the edge of the bottom material layer and the edge of the plane material layer are sewn, so that a containing cavity is formed between the bottom material layer and the plane material layer, and the base material layer is arranged in the containing cavity. The buffer compression-resistant layer is arranged in the containing cavity to wrap the base material layer and the sealing protection layer, and accurate positioning and supporting are provided for installation of the antenna layer through the arrangement of the antenna groove. The antenna layer can be easily embedded into the antenna groove of the base material layer, and the installation process is greatly simplified.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic tag field, especially a passive temperature measurement electronic tag. BACKGROUND

[0002] Electronic tags, as an important part of modern Internet of Things technology, are widely used in various fields such as tracking, management and temperature measurement of goods. They realize wireless communication with the reader through the built-in chip and antenna, so as to realize real-time updating and monitoring of the information of goods. However, with the continuous expansion of application scenarios, the requirements for the installation convenience, protection performance and temperature measurement accuracy of electronic tags are also getting higher and higher. Passive temperature measurement electronic tags, as a kind of electronic tags, are particularly suitable for occasions where temperature monitoring of goods is required. It can monitor and record the temperature information of goods in real time by integrating temperature sensors in the chip. The label is usually composed of a substrate layer, an antenna layer and a face layer. The antenna layer is arranged on one side of the substrate layer and is used for wireless communication with the reader. The face layer is arranged on the side of the substrate layer close to the antenna layer and plays a protective and decorative role.

[0003] The existing passive temperature measurement electronic tags have the following defects: first, in the production process, the position of the antenna layer and the substrate layer is easy to deviate, and there is lack of effective positioning structure between the antenna layer and the substrate layer, which leads to the decline of installation quality, and even affects the normal use of the electronic tag. In addition, the antenna layer is one of the key components of the electronic tag, and its structure and performance directly affect the communication effect and service life of the electronic tag, and the antenna layer is easy to be damaged by pressure during use or transportation. UTILITY MODEL CONTENT

[0004] In order to overcome the defects of the prior art, the utility model provides a passive temperature measurement electronic tag, which can effectively solve the technical problems.

[0005] The technical scheme adopted by the utility model to solve its technical problems is:

[0006] A passive temperature measurement electronic tag includes a substrate layer, an antenna layer, and a face layer. The antenna layer is disposed on one side of the substrate layer, and the face layer is disposed on the side of the substrate layer near the antenna layer. An antenna slot is provided on the substrate layer, and the antenna layer is disposed in the antenna slot with its surface flush with the surface of the substrate layer. A chip is disposed on the antenna layer, and a temperature sensor is integrated inside the chip. A positioning part is provided in the antenna slot, and a positioning hole corresponding to the positioning part is provided on the antenna layer. The positioning part can be paired and inserted into the positioning hole. A sealing protective layer is covered on the side of the substrate layer with the antenna slot. The sealing protective layer is bonded to the substrate layer with waterproof sealant. A bottom layer is provided at the end of the substrate layer away from the face layer. The edge of the bottom layer is sewn to the edge of the face layer to form a receiving cavity between the bottom layer and the face layer. The substrate layer is disposed in the receiving cavity, and a buffer and pressure-resistant layer is provided in the receiving cavity to wrap the substrate layer and the sealing protective layer.

[0007] Furthermore, the side of the substrate layer away from the face layer is provided with an adhesive layer for adhering to the surface of the article, and a peelable backing paper layer is adhered to the side of the adhesive layer away from the substrate layer.

[0008] Furthermore, the chip is bonded to the antenna layer with conductive adhesive, and a receiving portion is provided in the antenna slot. When the antenna layer is placed in the antenna slot, the chip is paired and installed in the receiving portion.

[0009] Furthermore, the buffer and pressure-resistant layer is made of elastic silicone.

[0010] Furthermore, the sealing and protective layer and the substrate layer are made of the same material, both being composed of PET.

[0011] Furthermore, the antenna layer is made of aluminum foil, and the thickness of the antenna layer is less than 65 μm.

[0012] Compared with existing technologies, the advantages of this invention are as follows: By setting antenna slots, precise positioning and support are provided for the installation of the antenna layer. The antenna layer can be easily embedded into the antenna slot of the substrate layer, and the surface of the antenna layer is flush with the surface of the substrate layer, ensuring the flatness and aesthetics of the electronic tag and greatly simplifying the installation process. Positioning holes and positioning parts are provided; their paired insertion further ensures the stability and accuracy of the antenna layer on the substrate layer, avoiding misalignment and offset during installation, thereby improving installation efficiency and quality. The sealing and protective layer is bonded to the substrate layer with waterproof sealant, forming a solid waterproof barrier that effectively prevents moisture and humidity from corroding the internal components of the electronic tag, improving its waterproof performance and extending its service life. The buffer and pressure-resistant layer in the receiving cavity provides comprehensive protection for the electronic tag. Whether from external impact or pressure, the buffer and pressure-resistant layer can effectively absorb and disperse it, ensuring that the antenna layer and chip inside the electronic tag are not damaged. Attached Figure Description

[0013] Fig. 1 This is a schematic diagram of the structure of this utility model;

[0014] Fig. 2 This is a schematic diagram of the substrate layer in this utility model;

[0015] Fig. 3 This is a schematic diagram of the antenna layer structure in this utility model;

[0016] The numbers in the diagram are: 1-substrate layer, 101-antenna slot, 102-positioning part, 103-accommodating part, 2-antenna layer, 201-positioning hole, 3-face material layer, 4-substrate layer, 5-sealing and protective layer, 6-waterproof sealant, 7-buffered and pressure-resistant layer, 8-adhesive layer, 9-backing paper layer, 10-chip. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] The following is combined Figs. 1-3 A detailed description of a passive temperature measurement electronic tag of this utility model is provided below:

[0019] A passive temperature measurement electronic tag includes a substrate layer 1, an antenna layer 2, and a face material layer 3. The antenna layer 2 is disposed on one side of the substrate layer 1, and the face material layer 3 is disposed on the side of the substrate layer 1 adjacent to the antenna layer 2. An antenna slot 101 is provided on the substrate layer 1, and the antenna layer 2 is disposed in the antenna slot 101, with the surface of the antenna layer 2 flush with the surface of the substrate layer 1. A chip 10 is disposed on the antenna layer 2, and a temperature sensor is integrated inside the chip 10. A positioning part 102 is provided in the antenna slot 101, and a corresponding element is provided on the antenna layer 2 to align with the positioning part 102. The positioning part 102 can be paired and inserted into the positioning hole 201. The side of the substrate layer 1 with the antenna groove 101 is covered with a sealing protective layer 5. The sealing protective layer 5 and the substrate layer 1 are bonded together with waterproof sealant 6. The end of the substrate layer 1 away from the face material layer 3 is provided with a base material layer 4. The edge of the base material layer 4 is sewn to the edge of the face material layer 3, so that a receiving cavity is formed between the base material layer 4 and the face material layer 3. The substrate layer 1 is placed in the receiving cavity. A buffer and pressure-resistant layer 7 is provided in the receiving cavity to wrap the substrate layer 1 and the sealing protective layer 5.

[0020] By providing the antenna slot 101, precise positioning and support are provided for the installation of the antenna layer 2. The antenna layer 2 can be easily embedded into the antenna slot 101 of the substrate layer 1, and the surface of the antenna layer 2 is flush with the surface of the substrate layer 1, ensuring the flatness and aesthetics of the electronic tag and greatly simplifying the installation process. Positioning holes 201 and positioning parts 102 are provided; their paired insertion further ensures the stability and accuracy of the antenna layer 2 on the substrate layer 1, avoiding misalignment and offset during installation, thereby improving installation efficiency and quality. The sealing protective layer 5 is bonded to the substrate layer 1 with waterproof sealant 6, forming a solid waterproof barrier that effectively prevents moisture and humidity from corroding the internal components of the electronic tag, improving its waterproof performance and extending its service life. The buffer pressure-resistant layer 7 in the receiving cavity provides all-round protection for the electronic tag. Whether from external impact or pressure, the buffer pressure-resistant layer 7 can effectively absorb and disperse it, ensuring that the antenna layer 2 and chip 10 inside the electronic tag are not damaged.

[0021] The substrate layer 4, on the side away from the face material layer 3, has an adhesive layer 8 for adhering to the surface of the item. A peelable backing paper layer 9 is adhered to the side of the adhesive layer 8 away from the substrate layer 4. By simply peeling off the backing paper layer 9, the electronic tag can be easily attached to the item surface via the adhesive layer 8, without the need for additional fixing devices or tools. This simplifies the installation process and improves installation efficiency. Furthermore, the adhesive layer 8 ensures that the electronic tag adheres more firmly to the item, preventing it from falling off and guaranteeing the stability and reliability of the electronic tag during use.

[0022] The chip 10 is bonded to the antenna layer 2 with conductive adhesive. A receiving portion 103 is provided in the antenna slot 101. When the antenna layer 2 is placed in the antenna slot 101, the chip 10 is paired and installed in the receiving portion 103. This improves the connection stability between the chip 10 and the antenna layer 2 and ensures the accurate positioning of the chip 10 in the antenna slot 101. The use of conductive adhesive enhances the electrical signal transmission between the chip 10 and the antenna layer 2, reduces signal loss, and thus improves the communication performance of the electronic tag. Simultaneously, the receiving portion 103 prevents misalignment and offset of the chip 10 during installation, further improving the installation quality and reliability of the electronic tag.

[0023] The buffer and pressure-resistant layer 7 is made of elastic silicone, and the sealing and protective layer 5 is made of the same material as the substrate layer 1, both being made of PET, which significantly improves the pressure resistance and waterproof performance of the electronic tag. Elastic silicone has excellent elasticity and pressure resistance, effectively absorbing and dispersing external impact or compressive forces, thereby protecting the antenna layer 2 and chip 10 inside the electronic tag from damage. PET material has good waterproof performance and corrosion resistance, forming a solid waterproof barrier that effectively prevents moisture and humidity from corroding the internal components of the electronic tag. The antenna layer 2 is made of aluminum foil, and its thickness is less than 65 μm.

[0024] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A passive temperature measuring electronic tag comprising a substrate layer, an antenna layer and a facestock layer, the antenna layer being provided on one side of the substrate layer and the facestock layer being provided on the side of the substrate layer closest to the antenna layer, characterized in that: The antenna slot is arranged on the substrate layer, the antenna layer is arranged in the antenna slot, the surface of the antenna layer is flush with the surface of the substrate layer, the chip is arranged on the antenna layer, the temperature sensor is integrated in the chip, the positioning part is arranged in the antenna slot, the positioning hole corresponding to the positioning part is arranged on the antenna layer, the positioning part can be inserted into the positioning hole in pairs, the sealing protective layer covers one side of the substrate layer provided with the antenna slot, the sealing protective layer and the substrate layer are bonded by the waterproof sealing glue, the base material layer is arranged at the end of the substrate layer away from the surface material layer, the edge of the base material layer is sewn with the edge of the surface material layer, so that the accommodating cavity is formed between the base material layer and the surface material layer, the substrate layer is arranged in the accommodating cavity, and the buffer pressure-resistant layer wraps the substrate layer and the sealing protective layer in the accommodating cavity.

2. The passive temperature measuring electronic tag according to claim 1, characterized in that: The adhesive layer for attaching the surface of the article is arranged on one side of the base material layer away from the surface material layer, and the bottom paper layer which can be peeled off is attached to the side of the adhesive layer away from the base material layer.

3. The passive temperature measuring electronic tag according to claim 1, characterized in that: The chip is bonded to the antenna layer by conductive glue, and the accommodating part is arranged in the antenna slot, so that when the antenna layer is placed in the antenna slot, the chip is installed in the accommodating part in pairs.

4. The passive temperature measuring electronic tag according to any one of claims 1 to 3, characterized in that: The buffer pressure-resistant layer is composed of elastic silica gel.

5. The passive temperature measuring electronic tag according to any one of claims 1-3, characterized in that: The sealing protective layer and the substrate layer are made of the same material, which is PET.

6. The passive temperature measuring electronic tag according to any one of claims 1-3, characterized in that: The antenna layer is composed of aluminum foil, and the thickness of the antenna layer is less than 65μm.

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