Copper-plated adhesive tape

Abstract

The utility model provides a copper-plated adhesive tape. The copper-plated adhesive tape comprises a release film layer, an adhesive layer and a composite base material layer which are sequentially stacked, the composite base material layer comprises a polyimide film layer, a copper-plated layer and a black ink layer which are sequentially stacked, and the polyimide film layer is close to the adhesive layer. The copper-plated adhesive tape provided by the utility model has the characteristics of warping resistance, thin thickness, good interlayer bonding force, reliable bonding, strong electromagnetic shielding effect and good shading property.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of edge bonding adhesive tape, and specifically relates to a copper-plated adhesive tape. BACKGROUND

[0002] The edge bonding adhesive tape for display screen module is usually a light-shielding single-sided adhesive tape for covering a rubber frame or a metal frame around the four edges of a display screen module. It is commonly used in display screen modules such as computer display screens, tablets, and vehicle-mounted display screens. The current edge bonding adhesive tape mainly needs to have the characteristics of light shielding, fingerprint resistance, high adhesion, electromagnetic shielding, anti-warping, and heavy working. With the development of the industry, display modules are becoming lighter and thinner to meet market demand. The frame of the display module is also becoming narrower, which leads to a thinner edge bonding adhesive tape. The bonding area of the edge bonding adhesive tape is smaller, and the edge bonding adhesive tape is more prone to warping during use, which causes light leakage at the edge of the module and electromagnetic shielding failure. Therefore, the adhesion and anti-warping performance of the edge bonding adhesive tape are becoming increasingly important. On the other hand, there is a certain probability of defective products during the manufacturing process of the display screen module, which requires disassembly and repair of the edge bonding adhesive tape. Therefore, there are certain requirements for the interlayer adhesion and pressure-sensitive adhesive residue rate of the edge bonding adhesive tape.

[0003] CN220642965U discloses a conductive aluminum foil adhesive tape, which comprises a release material layer, a conductive adhesive layer, and an aluminum foil-polyethylene terephthalate base material layer arranged in sequence. The aluminum foil-polyethylene terephthalate base material layer comprises a fingerprint-resistant coating layer, a polyethylene terephthalate layer, an ink layer, a structural adhesive layer, and an aluminum foil layer arranged in sequence. The side of the aluminum foil layer close to the conductive adhesive layer has good initial adhesion, good retention, and a thin overall adhesive tape, which can meet the edge bonding application of light and thin LCD modules.

[0004] The existing edge bonding adhesive tape in the prior art is mainly made of polyethylene terephthalate (PET) and aluminum foil. The aluminum foil has high stiffness, and the edge bonding adhesive tape is prone to warping after edge bonding. PET has poor weather resistance and a small range of application, which cannot meet the demand for ultra-narrow frame edge bonding in the market.

[0005] Therefore, there is a need to develop an adhesive tape that has anti-warping properties and can meet the demand for ultra-narrow frame edge bonding. UTILITY MODEL CONTENTS

[0006] In view of the shortcomings of the prior art, the utility model aims to provide a copper-plated adhesive tape that has anti-warping properties, is thin, has good interlayer adhesion, reliable bonding, strong electromagnetic shielding effect, and good light shielding properties.

[0007] To achieve the utility model purpose, the utility model adopts the following technical solutions:

[0008] The utility model provides a kind of copper plating adhesive tape, the copper plating adhesive tape includes release film layer, adhesive layer and composite substrate layer which are sequentially stacked;The composite substrate layer includes polyimide film layer, copper plating layer and black ink layer which are sequentially stacked;The polyimide film layer is close to adhesive layer.

[0009] In the utility model, the composite substrate layer includes polyimide film layer, copper plating layer and black ink layer which are sequentially stacked, wherein the polyimide film in polyimide film layer has excellent flexibility, and has outstanding weather resistance, radiation resistance, chemical corrosion resistance and electrical insulation performance and tensile strength;Copper is plated on one side of polyimide film layer to form copper plating layer, which can maintain excellent shielding performance, large adhesion, is not easy to delaminate, can reduce metal consumption, lightweight, enhance the softness of copper plating adhesive tape, conformability, improve anti-warping, thereby greatly improve the effective utilization rate of copper plating adhesive tape;The black ink layer can play a shading effect;The utility model improves the anti-rebound warping resistance, heavy work resistance by combining release film layer, adhesive layer and composite substrate layer with specific structure, and has the characteristics of strong electromagnetic shielding effect, thin thickness, good interlayer adhesion, reliable bonding and good shading, meets the demand of ultra-narrow frame edge covering on the market. Avoid the problems of easy curling and bonding during the use of traditional edge covering adhesive tape, easy rebound warping after edge covering and poor heavy work resistance.

[0010] In the utility model, the ultra-narrow frame edge covering means that the edge covering width of display screen module frame is ≤0.5mm, such as 0.2mm, 0.3mm or 0.4mm, etc.

[0011] Preferably, the release film layer is a grid release film layer.

[0012] Preferably, the grid release film layer includes grid release film or grid release paper, and the grid wall cross section of the grid release film or grid release paper is any one of regular quadrilateral, regular hexagon or rhombus.

[0013] The grid wall width of the grid release film is 20-30μm (such as 21μm, 22μm, 23μm, 24μm, 25μm, 26μm, 27μm, 28μm or 29μm, etc.), and the grid wall height is 2-7μm (such as 2.5μm, 3μm, 3.5μm, 4μm, 4.5μm, 5μm, 5.5μm, 6μm or 6.5μm, etc.).

[0014] Preferably, the adhesive layer is a grid black pressure-sensitive adhesive layer.

[0015] The grid black pressure sensitive adhesive layer can reduce the bubbles generated during the use of the copper-plated adhesive tape to cause appearance defects and reduce the bonding strength, and the grid black pressure sensitive adhesive layer can also not damage the adhered product components when the product components are torn off due to poor adhesion.

[0016] Preferably, the grid black pressure sensitive adhesive layer is prepared from black acrylic glue.

[0017] The black acrylic glue can be obtained by using the materials known in the prior art or by using any method well known in the art, for example, the components of the second adhesive layer disclosed in CN112708371A; for example, the black acrylic glue can be prepared by uniformly dissolving and dispersing a high molecular polymer, tackifying resin, color powder and curing agent in a solvent, and then coating the surface of the release film layer, and drying the solvent, or the black acrylic glue can be adjusted according to actual conditions.

[0018] As a preferred technical scheme of the present application, the preparation raw materials of the black acrylic glue include the following components by weight: 70-100 parts (for example, 75 parts, 80 parts, 85 parts, 90 parts or 95 parts, etc.) of high molecular polymer, 3-10 parts (for example, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts or 9 parts, etc.) of tackifying resin, 1-5 parts (for example, 1.5 parts, 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts or 4.5 parts, etc.) of color powder, 0.01-2 parts (for example, 0.2 parts, 0.4 parts, 0.6 parts, 0.8 parts, 1.0 parts, 1.2 parts, 1.4 parts, 1.6 parts or 1.8 parts, etc.) of curing agent and 50-200 parts (for example, 70 parts, 90 parts, 110 parts, 130 parts, 150 parts, 170 parts or 190 parts, etc.) of solvent.

[0019] Preferably, the high molecular polymer includes any one or a combination of at least two of polyacrylic acid resin, polyurethane modified acrylic acid resin, epoxy modified acrylic acid resin, silicone modified acrylic acid resin or polyester modified acrylic acid resin.

[0020] Preferably, the tackifying resin includes natural tackifying resin and / or synthetic tackifying resin.

[0021] Preferably, the natural tackifying resin includes any one or a combination of at least two of rosin resin, rosin glyceride or terpene resin.

[0022] Preferably, the synthetic tackifying resin includes polymeric tackifying resin and / or condensed tackifying resin.

[0023] Preferably, the color powder includes carbon black and / or aniline black.

[0024] Preferably, the curing agent is any one of a diisocyanate, a polyisocyanate, a modified diisocyanate, a modified polyisocyanate, an epoxy compound, a modified epoxy compound, a pyridine and its derivatives, an imidazole and its derivatives, a metal salt chelate, a hydrogen-containing double cap, or a hydrogen-containing silicone oil, or a combination of at least two thereof.

[0025] Preferably, the solvent includes any one of acetone, butanone, cyclohexanone, isophorone, ethyl acetate, butyl acetate, toluene, xylene, propylene glycol monomethyl ether, or dipropylene glycol methyl ether, or a combination of at least two thereof.

[0026] Preferably, the black ink layer includes a carbon black ink layer.

[0027] Preferably, the thickness of the release film layer is 50-150 μm, such as 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, 110 μm, 120 μm, 130 μm, or 140 μm, etc.

[0028] Preferably, the thickness of the adhesive layer is 10-20 μm, such as 11 μm, 12 μm, 13 μm, 14 μm, 15 μm, 16 μm, 17 μm, 18 μm, or 19 μm, etc.

[0029] Preferably, the thickness of the composite substrate layer is 10-28 μm, such as 12 μm, 14 μm, 16 μm, 18 μm, 20 μm, 22 μm, 24 μm, or 26 μm, etc.

[0030] Preferably, the thickness of the adhesive layer and the composite substrate layer is 20-48 μm, such as 23 μm, 26 μm, 29 μm, 32 μm, 34 μm, 37 μm, 40 μm, 43 μm, or 46 μm, etc.

[0031] Preferably, the thickness of the polyimide film layer is 5-15 μm, such as 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, 11 μm, 12 μm, 13 μm, or 14 μm, etc.

[0032] Preferably, the thickness of the copper plating layer is 2-5 μm, such as 2.5 μm, 3 μm, 3.5 μm, 4 μm, or 4.5 μm, etc.

[0033] Preferably, the thickness of the black ink layer is 2-5 μm, such as 2.5 μm, 3 μm, 3.5 μm, 4 μm, or 4.5 μm, etc.

[0034] Preferably, the composite substrate layer further includes a fingerprint-resistant coating layer, and the composite substrate layer includes a polyimide film layer, a copper plating layer, a black ink layer, and a fingerprint-resistant coating layer, which are sequentially stacked.

[0035] Preferably, the anti-fingerprint coating has a thickness of 1-3 μm, such as 1.2 μm, 1.4 μm, 1.6 μm, 1.8 μm, 2.0 μm, 2.2 μm, 2.4 μm, 2.6 μm or 2.8 μm, etc.

[0036] Preferably, the anti-fingerprint coating comprises a water-soluble polyurethane.

[0037] In the present application, the anti-fingerprint coating has the effects of ethanol resistance, scratch resistance and anti-fingerprint.

[0038] Exemplarily, the copper-plated adhesive tape is prepared by the following method:

[0039] (1) Copper is plated on one side of the polyimide film layer to form a copper-plated layer, then carbon black ink and optionally an anti-fingerprint coating are successively coated on the copper-plated layer by coating equipment to form an ink layer and optionally an anti-fingerprint coating layer, and the resulting composite substrate layer is dried.

[0040] (2) An adhesive layer is prepared by coating an adhesive on the release film layer and drying, and then the composite substrate layer prepared in step (1) is laminated with the adhesive layer, with the polyimide film layer of the composite substrate layer being close to the adhesive layer, to obtain the copper-plated adhesive tape.

[0041] Compared with the prior art, the present application has the following beneficial effects:

[0042] The copper-plated adhesive tape of the present application has the characteristics of strong electromagnetic shielding effect, anti-warping, thin thickness, good interlayer adhesion, reliable bonding and good light shielding property, and can meet the special needs of ultra-narrow frame edge wrapping in the market, avoiding the problems of easy curling and bonding in use, easy rebounding after edge wrapping lamination and poor reworkability of the traditional PET aluminum foil edge wrapping adhesive tape. BRIEF DESCRIPTION OF DRAWINGS

[0043] Figure 1 The structure of the copper-plated adhesive tape provided for Example 1 is shown in the figure;

[0044] 1 - release film layer; 2 - adhesive layer; 3 - composite substrate layer; 31 - polyimide film layer; 32 - copper-plated layer; 33 - black ink layer; 34 - anti-fingerprint coating. DETAILED DESCRIPTION

[0045] The technical solutions of the present application will be further described by specific embodiments. Those skilled in the art should understand that the embodiments are only to help understand the present application and should not be regarded as a specific limitation of the present application.

[0046] In the following examples and comparative examples, some raw materials are as follows:

[0047] Carbon black ink: Grade 9000 series, ten manufacturers;

[0048] Anti-fingerprint coating: Water-soluble polyurethane, brand name PU-3109, manufacturer: Sansheng Chemical.

[0049] Adhesive: The composition of the second adhesive layer is as provided in Example 5 of CN112708371A.

[0050] Example 1

[0051] This embodiment provides a copper-plated tape, such as Figure 1 As shown, the copper-plated tape includes a release film layer 1, an adhesive layer 2 and a composite substrate layer 3 stacked in sequence. The composite substrate layer includes a polyimide film layer 31, a copper plating layer 32, a black ink layer 33 and an anti-fingerprint coating 34 stacked in sequence. The polyimide film layer 31 is close to the adhesive layer 2.

[0052] The release film layer 1 is a PET mesh release film with a thickness of 100μm. The surface of the PET mesh release film opposite to the adhesive layer 2 is provided with a mesh wall that protrudes towards the adhesive layer 2. The width of the mesh wall is 25μm and the height is 5μm. The cross-sectional shape of the mesh wall is a regular quadrilateral.

[0053] The adhesive layer 2 is a grid-like black pressure-sensitive adhesive layer with a thickness of 15μm;

[0054] The polyimide film layer 31 is a polyimide film with a thickness of 15 μm;

[0055] The thickness of the copper plating layer 32 is 5 μm;

[0056] The thickness of the black ink layer 33 is 2 μm;

[0057] The thickness of the anti-fingerprint coating 34 is 1 μm.

[0058] The copper-plated tape is prepared using the following method:

[0059] (1) Copper is plated on one side of the polyimide film layer to form a copper plating layer. Then, carbon black ink and water-soluble polyurethane are sequentially coated on the copper plating layer using a coating equipment to form an ink layer and an anti-fingerprint coating. The composite substrate layer is obtained by drying in an oven.

[0060] (2) Apply adhesive to the release film layer, dry it in an oven, and then bond it with the composite substrate layer obtained in step (1) to obtain the copper-plated tape.

[0061] Example 2

[0062] The embodiment provides a copper-plated adhesive tape, which is different from the embodiment 1 only in that the release film layer is a PET grid release film with a thickness of 50 mu m, and a net wall protruding towards the adhesive layer is arranged on the surface of the PET grid release film opposite to the adhesive layer, the width of the net wall is 30 mu m, the height of the net wall is 7 mu m, and the shape of the cross section of the net wall is a regular hexagon.

[0063] The adhesive layer is a grid black pressure-sensitive adhesive layer with a thickness of 10 mu m.

[0064] The polyimide film layer is a polyimide film with a thickness of 15 mu m.

[0065] The thickness of the copper-plated layer is 2 mu m.

[0066] The thickness of the black ink layer is 5 mu m.

[0067] The thickness of the anti-fingerprint coating is 3 mu m.

[0068] The other conditions are the same as those in the embodiment 1.

[0069] Embodiment 3

[0070] The embodiment provides a copper-plated adhesive tape, which is different from the embodiment 1 only in that the release film layer is a PET grid release film with a thickness of 150 mu m, and a net wall protruding towards the adhesive layer is arranged on the surface of the PET grid release film opposite to the adhesive layer, the width of the net wall is 20 mu m, the height of the net wall is 2 mu m, and the shape of the cross section of the net wall is a regular hexagon.

[0071] The adhesive layer is a grid black pressure-sensitive adhesive layer with a thickness of 10 mu m.

[0072] The polyimide film layer is a polyimide film with a thickness of 6 mu m.

[0073] The thickness of the copper-plated layer is 3 mu m.

[0074] The thickness of the black ink layer is 4 mu m.

[0075] The thickness of the anti-fingerprint coating is 2 mu m.

[0076] The other conditions are the same as those in the embodiment 1.

[0077] Embodiment 4

[0078] The embodiment provides a copper-plated adhesive tape, which is different from the embodiment 1 only in that the polyimide film layer is a polyimide film with a thickness of 3 mu m, and the other conditions are the same as those in the embodiment 1.

[0079] Embodiment 5

[0080] The present example provides a copper-plated adhesive tape, which is different from example 1 only in that the polyimide film layer has a thickness of 20 μm, and other conditions are the same as those of example 1.

[0081] Example 6

[0082] The present example provides a copper-plated adhesive tape, which is different from example 1 only in that the copper-plated layer has a thickness of 7 μm, and other conditions are the same as those of example 1.

[0083] Comparative Example 1

[0084] The present comparative example provides a copper-plated adhesive tape, which is different from example 1 only in that the composite substrate layer comprises a copper-plated layer, a polyimide film layer, a black ink layer and a fingerprint-resistant coating layer which are sequentially stacked, and the copper-plated layer is close to the adhesive layer, and other conditions are the same as those of example 1.

[0085] Comparative Example 2

[0086] The present comparative example provides a copper-plated adhesive tape, which is different from example 1 only in that the polyimide film layer is replaced by a polyethylene terephthalate film layer with the same thickness, and other conditions are the same as those of example 1.

[0087] Comparative Example 3

[0088] The present comparative example provides a wrapped adhesive tape, which is different from example 1 only in that the copper-plated layer is replaced by an aluminum foil layer with a thickness of 2 μm, and a bonding layer with a thickness of 2 μm is further included between the polyimide film layer and the aluminum foil layer, and the bonding layer is prepared from the adhesive for aluminum-plastic film provided in example 4 of CN115232592A.

[0089] The wrapped adhesive tape is prepared by the following method:

[0090] (1) The aluminum-plastic film adhesive is coated on one side of the polyimide film layer, and then the aluminum foil is attached to form a bonding layer and an aluminum foil layer on the polyimide film layer, and then the carbon black ink and water-soluble polyurethane are sequentially coated on the aluminum foil layer by a coating device to form an ink layer and a fingerprint-resistant coating layer, and an oven is used for drying to obtain a composite substrate layer.

[0091] (2) The adhesive is coated on the release film layer, and an oven is used for drying, and then the composite substrate layer prepared in step (1) is attached to obtain the wrapped adhesive tape.

[0092] Other conditions are the same as those of example 1.

[0093] The copper-plated adhesive tapes provided in examples 1-6 and comparative examples 1-2, and the wrapped adhesive tape provided in comparative example 3 are tested as follows:

[0094] (1) Peeling force: tested according to GB / T 2792-2014.

[0095] (2) Holding force: tested according to GB / T 4851-2014, and the test condition was 85℃ / 85%RH.

[0096] (3) Anti-curling performance: the size of the sample to be tested (copper-plated adhesive tape or edge-wrapping adhesive tape) was cut into 5mm in width and 400mm in length, and then wrapped and attached to the frame of a 16-inch display screen module. The width of the edge-wrapped adhesive tape attached to the side of the display screen glass was 0.3mm. After the wrapping and attaching were completed, the sample was pressed tightly by hand, and then placed in a programmable constant temperature and humidity oven after being left to stand for 1 day under standard laboratory conditions (23℃, 50%RH). The temperature program of the programmable constant temperature and humidity oven was set to run at -40℃ for 30min and 85℃ for 30min as one cycle (the time from high temperature to low temperature or from low temperature to high temperature was 10min), and the cycle was run for 100 cycles. The curling of the sample on the side of the display screen glass was observed after being taken out. If there was no curling at all, it was marked as ++++, if there was curling, the curling height was observed from low to high, and it was marked as +++, ++ and + in turn.

[0097] (4) Re-workability: the size of the sample to be tested (copper-plated adhesive tape or edge-wrapping adhesive tape) was cut into 10mm in width and 150mm in length, and then wrapped around four kinds of plates, i.e. glass plate, standard SUS304 steel plate, aluminum plate and polycarbonate (PC) plate (the thickness of the plates was 2mm). The width of the edge-wrapped adhesive tape on both sides of the plates was 2mm, and the excess part was cut off. Then the plates were put into a 50℃ oven for 4h, and then left to stand at room temperature (25℃) for 2h. The 180° peeling sample was used to observe the residual adhesive rate on the surface of the plates and the delamination rate of the copper-plated adhesive tape (the delamination rate was the percentage of the area of the delaminated part to the area of the copper-plated adhesive tape).

[0098] The results of the test are shown in Table 1 below:

[0099] Table 1

[0100]

[0101]

[0102] In Table 1, " / " represents that the result of the item is not measured.

[0103] From the content of Table 1, it can be seen that the copper-plated adhesive tapes provided by Examples 1-4 have good anti-curling performance, and no residual adhesive is left after peeling.

[0104] The copper-plated adhesive tapes provided by Examples 1-3 have no curling at all, no residual adhesive is left after peeling, no delamination occurs, the mechanical properties are good, and the overall performance is good. The thickness of the adhesive layer of Example 1 is larger, and the peeling force of the copper-plated adhesive tape prepared is larger.

[0105] Compared with Example 1, if the thickness of the polyimide film is too small (Example 4), the prepared copper-plated adhesive tape is prone to breakage during the heavy working process due to the thin polyimide film layer, and the mechanical properties are poor.

[0106] Compared with Example 1, if the thickness of the polyimide film is too large (Example 5), the prepared copper-plated adhesive tape has too large a rebound stress, and the anti-lifting performance is slightly poor.

[0107] Compared with Example 1, if the thickness of the copper-plated layer is too large (Example 6), the prepared copper-plated adhesive tape has too large a rebound stress, and the anti-lifting performance is slightly poor.

[0108] Compared with Example 1, if the positions of the copper-plated layer and the polyimide film layer are reversed (Comparative Example 1), the prepared copper-plated adhesive tape has reduced anti-lifting performance, and there are residual glue and delamination phenomena during the heavy working process, which cannot meet the requirements.

[0109] Compared with Example 1, if the polyimide film layer is replaced by a polyethylene terephthalate film layer (Comparative Example 2), the anti-lifting performance is poor, which cannot meet the requirements.

[0110] Compared with Example 1, if the copper-plated layer is replaced by an aluminum foil layer (Comparative Example 3), the anti-lifting performance is poor, which cannot meet the requirements.

[0111] The applicant declares that the process method of the utility model is illustrated by the above examples, but the utility model is not limited to the above process steps, that is, it does not mean that the utility model must rely on the above process steps to be implemented. It should be understood by those skilled in the art that any improvement of the utility model, equivalent replacement of the raw materials selected by the utility model, addition of auxiliary ingredients, selection of specific methods, etc. fall within the protection scope and disclosure scope of the utility model.

Claims

1. A copper-plated tape, characterized in that, The copper-plated tape includes a release film layer, an adhesive layer, and a composite substrate layer stacked in sequence. The composite substrate layer includes a polyimide film layer, a copper plating layer, and a black ink layer stacked in sequence. The polyimide film layer is located close to the adhesive layer.

2. The copper-plated tape according to claim 1, characterized in that, The release film layer is a grid release film layer; The mesh release film layer includes a mesh release film or a mesh release paper, wherein the cross-section of the mesh wall of the mesh release film or the mesh release paper is any one of a regular square, a regular hexagon, or a rhombus; The mesh release film has a mesh wall width of 20–30 μm and a mesh wall height of 2–7 μm.

3. The copper-plated tape according to claim 2, characterized in that, The adhesive layer is a grid-like black pressure-sensitive adhesive layer.

4. The copper-plated tape according to claim 1, characterized in that, The black ink layer includes a carbon black ink layer.

5. The copper-plated tape according to claim 1, characterized in that, The thickness of the release film is 50–150 μm.

6. The copper-plated tape according to claim 1, characterized in that, The thickness of the adhesive layer is 10–20 μm; The thickness of the composite substrate layer is 10–28 μm.

7. The copper-plated tape according to claim 1, characterized in that, The thickness of the polyimide film layer is 5–15 μm.

8. The copper-plated tape according to claim 1, characterized in that, The thickness of the copper plating layer is 2–5 μm; The thickness of the black ink layer is 2–5 μm.

9. The copper-plated tape according to claim 1, characterized in that, The composite substrate layer also includes an anti-fingerprint coating, and the composite substrate layer includes a polyimide film layer, a copper plating layer, a black ink layer and an anti-fingerprint coating stacked sequentially.

10. The copper-plated tape according to claim 9, characterized in that, The thickness of the anti-fingerprint coating is 1–3 μm.

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