Heat dissipation structural member of light receiving and transmitting assembly, light receiving and transmitting module and camera module

Abstract

The utility model relates to a heat dissipation structural member of an optical transceiver assembly, an optical transceiver module and a camera module, the heat dissipation structural member of the optical transceiver assembly comprises an adapter body, the adapter body is provided with a receiving end and a fixing end along the axis direction, and the receiving end is internally provided with a butt joint socket for fixing an optical fiber connector. The interior of the fixed end is provided with an installation cavity used for fixing the optical transceiver assembly, and the butt joint jack and the installation cavity are communicated in the axial direction of the adapter body. The fixed end is provided with a cooling fin, the inner surface of the cooling fin is exposed out of the mounting cavity, and the outer surface of the cooling fin is exposed out of the outer surface of the fixed end. By arranging the butt joint socket and the installation cavity in the adapter body, the optical transceiver assembly can be installed in the adapter body, and meanwhile, the optical transceiver assembly can be connected with the optical fiber connector; and the radiating fins arranged at the fixed end can radiate heat of the optical transceiver assembly in the mounting cavity, so that the temperature of the optical transceiver assembly is effectively reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of vehicle-mounted photoelectric technology, in particular to a light transceiver assembly heat dissipation structure, a light transceiver module and a camera module. BACKGROUND

[0002] At present, a light emitting and receiving assembly (Bi-Directional Optical Sub-Assembly, abbreviated as BOSA) is an important component in the field of optical communication. By integrating light emitting and receiving devices into a single module, the efficiency of photoelectric conversion and optical signal transmission is realized, and the application in the vehicle-mounted field is increasingly widespread.

[0003] In related technologies, the BOSA is generally fixed on a circuit board to realize the emission and reception of optical signals. For example, a common way is to directly weld the BOSA on the PCB of a product such as an optical modem or an optical router for work. However, the BOSA always works in the conversion of optical and electrical signals, consumes a large amount of power, and causes the temperature of the BOSA to be relatively high, which will affect the performance of the BOSA after a long working time.

[0004] Therefore, it is necessary to design a light transceiver assembly heat dissipation structure to overcome the above problems. SUMMARY

[0005] The present application provides a light transceiver assembly heat dissipation structure, a light transceiver module and a camera module, which can solve the technical problem that the high temperature of the BOSA in related technologies affects the performance of the BOSA.

[0006] In a first aspect, the present application provides a light transceiver assembly heat dissipation structure, which comprises: an adapter body having a receiving end and a fixed end along its axial direction, the inside of the receiving end being provided with a butt joint socket for fixing an optical fiber connector, the inside of the fixed end being provided with a mounting cavity for fixing a light transceiver assembly, and the butt joint socket and the mounting cavity being communicated along the axial direction of the adapter body; the fixed end is provided with a heat sink, the inner surface of the heat sink is exposed to the mounting cavity, and the outer surface of the heat sink is exposed to the outer surface of the fixed end.

[0007] In combination with the first aspect, in an implementation manner, the receiving end is provided with a buckling site for fixing the optical fiber connector and a directional structure for ensuring the insertion direction of the optical fiber connector.

[0008] In combination with the first aspect, in an implementation manner, the fixed end is provided with a first through hole along the axial direction of the adapter body and a second through hole perpendicular to the axial direction of the adapter body.

[0009] With reference to the first aspect, in an implementation form, the fixed end is provided with a mainboard positioning column and a mainboard clamping portion for connecting and fixing with the mainboard.

[0010] With reference to the first aspect, in an implementation form, the mainboard clamping portion and the mainboard positioning column are perpendicular to the axis of the adapter body, or the mainboard clamping portion and the mainboard positioning column are parallel to the axis of the adapter body.

[0011] With reference to the first aspect, in an implementation form, the heat sink is provided with at least one inner surface for being attached to at least one side of the optical transceiver assembly.

[0012] With reference to the first aspect, in an implementation form, the adapter body contains an electrically conductive sheet, the electrically conductive sheet is arranged through the receiving end and the fixed end; wherein the electrically conductive sheet is at least partially exposed on the inner surface of the mating socket at the receiving end; the electrically conductive sheet at least partially extends out of the fixed end along the axial direction or the radial direction of the adapter body at the fixed end.

[0013] With reference to the first aspect, in an implementation form, the electrically conductive sheet at the fixed end is arranged to be isolated from the mounting cavity.

[0014] With reference to the first aspect, in an implementation form, the receiving end is further provided with an adapter sealing ring.

[0015] With reference to the first aspect, in an implementation form, the adapter body includes an adapter main body and a fixing member, the adapter main body has the receiving end and the mating socket, and the adapter main body and the fixing member jointly form the fixed end and the mounting cavity.

[0016] The second aspect, the embodiment of the present application provides an optical transceiver module, which comprises: the optical transceiver assembly heat dissipation structure and the optical transceiver assembly described above, the optical transceiver assembly is fixed in the mounting cavity of the optical transceiver assembly heat dissipation structure.

[0017] With reference to the second aspect, in an implementation form, the optical transceiver assembly is in direct contact with the inner surface of the heat sink, or indirectly contacts through a heat conducting medium.

[0018] The third aspect, the embodiment of the present application provides a camera module, which comprises: a camera cover body, the camera cover body is installed with the optical transceiver module described above.

[0019] With reference to the third aspect, in an implementation form, the outer surface of the heat sink is in direct contact with the inner surface of the camera cover body, or indirectly contacts through a heat conducting medium.

[0020] In combination with the third aspect, in an implementation, the adapter body comprises an adapter main body and a fixing member, the adapter main body has the receiving end and the docking port, and the adapter main body and the fixing member jointly form the fixing end and the mounting cavity; the adapter main body is integrally formed with the camera cover body.

[0021] The technical scheme provided by the embodiments of the present application has the beneficial effects of:

[0022] By arranging the docking port and the mounting cavity in the adapter body, the optical transceiver assembly can be mounted in the adapter body, and the optical transceiver assembly can also be connected with the fiber connector; and the heat dissipation fins arranged at the fixing end can dissipate heat of the optical transceiver assembly in the mounting cavity, effectively reducing the temperature of the optical transceiver assembly, and solving the technical problem that the high temperature of the BOSA affects the performance of the BOSA in the related art. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0024] Figure 1 An exploded structural schematic view of the optical transceiver assembly heat dissipation structure provided by the embodiments of the present application is shown in the figure.

[0025] Figure 2 An exploded structural schematic view of the adapter main body and the fixing member provided by the embodiments of the present application is shown in the figure.

[0026] Figure 3 A combined structural schematic view of the optical transceiver assembly heat dissipation structure provided by the embodiments of the present application is shown in the figure.

[0027] Figure 4 A sectional view schematic view of the optical transceiver assembly heat dissipation structure provided by the embodiments of the present application is shown in the figure.

[0028] Figure 5 Another direction sectional view schematic view of the optical transceiver assembly heat dissipation structure provided by the embodiments of the present application is shown in the figure.

[0029] Figure 6 Another structural schematic view of the optical transceiver assembly heat dissipation structure provided by the embodiments of the present application is shown in the figure.

[0030] Figure 7 A sectional view schematic view of the camera module provided by the embodiments of the present application is shown in the figure.

[0031] Figure 8Another cross-sectional view of the camera module is provided in the embodiments of the present application.

[0032] In the drawings:

[0033] 100, adapter body; 1, adapter body; 10, docking port; 11, mounting cavity;

[0034] 2, optical transceiver assembly; 21, pin;

[0035] 3, fixing member; 4, mainboard positioning column; 5, mainboard clamping part;

[0036] 6, conductive sheet; 7, adapter sealing ring;

[0037] 8, heat sink; 82, metal heat dissipation member;

[0038] 300, camera cover. DETAILED DESCRIPTION

[0039] In order to enable persons skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by persons skilled in the art without creative labor fall within the scope of protection of the present application.

[0040] The embodiments of the present application provide an optical transceiver assembly heat dissipation structure, an optical transceiver module and a camera module, which can solve the technical problem that the high temperature of BOSA in the related art affects the performance of BOSA.

[0041] Referring to Figure 1 and Figure 2 As shown in the drawings, an optical transceiver assembly heat dissipation structure provided in the embodiments of the present application comprises: an adapter body 100, the adapter body 100 has a receiving end and a fixed end along the axial direction thereof, the inside of the receiving end is provided with a docking port 10 for fixing a fiber connector, the inside of the fixed end is provided with a mounting cavity 11 for fixing an optical transceiver assembly 2, and the docking port 10 and the mounting cavity 11 are communicated along the axial direction of the adapter body 100; the fixed end is provided with a heat sink 8, the inner surface of the heat sink 8 is exposed to the mounting cavity 11, and the outer surface of the heat sink 8 is exposed to the outer surface of the fixed end.

[0042] In the embodiments, the optical transceiver assembly 2 may, for example, be a bosa, and when the optical transceiver assembly 2 is installed in the mounting cavity 11, the optical transceiver assembly 2 can be in direct contact with the inner surface of the heat sink 8, or can be in indirect contact through a high-thermal-conductivity medium.

[0043] The embodiment sets the docking port 10 and the mounting cavity 11 in the adapter body 100, so that the optical transceiver assembly 2 can be mounted in the adapter body 100, and the optical transceiver assembly 2 can also be connected with the fiber connector; and the heat dissipation fins 8 arranged at the fixed end can dissipate heat for the optical transceiver assembly 2 in the mounting cavity 11, effectively reducing the temperature of the optical transceiver assembly 2, and solving the technical problem that the high temperature of the BOSA in the related art affects the performance of the BOSA.

[0044] In an embodiment, the receiving end is provided with a buckling site for fixing the fiber connector and a directional structure for ensuring the insertion direction of the fiber connector. For example, the buckling site can be a locking groove arranged on the receiving end, for realizing the locking and fixing of the fiber connector and the receiving end.

[0045] Further, in an embodiment, the fixed end is provided with a first through hole along the axis direction of the adapter body 100 and a second through hole perpendicular to the axis direction of the adapter body 100. Referring to FIG. 1, Figure 4 In the embodiment, the optical transceiver assembly 2 has mutually perpendicular pins 21, part of the pins 21 extend along the axis direction of the adapter body 100, and part of the pins 21 extend along the axis direction perpendicular to the adapter body 100. In the embodiment, the first through hole and the second through hole are arranged at the fixed end, so that the two perpendicular pins 21 of the optical transceiver assembly 2 can extend out, facilitating the cooperation with other devices to realize the transmission of signals.

[0046] Further, in an embodiment, referring to FIG. 1, Figure 3 The fixed end is provided with a mainboard positioning column 4 and a mainboard clamping part 5 for connecting and fixing the mainboard. In the embodiment, the mainboard positioning column 4 and the mainboard clamping part 5 are arranged on the fixed end, so that when the optical transceiver assembly heat dissipation structure is mounted to the mainboard, the mainboard positioning column 4 can position and limit the position of the optical transceiver assembly heat dissipation structure mounted on the mainboard, and the mainboard clamping part 5 can be clamped with the mainboard, so that the optical transceiver assembly heat dissipation structure is stably fixed to the mainboard. In addition to the pins 21 of the optical transceiver assembly 2 connected with the mainboard, the mainboard clamping part 5 is fixed with the mainboard, so that the optical transceiver assembly 2 is not easy to be separated from the mainboard, improving the stability and fixing strength; at the same time, the mainboard positioning column 4 can improve the precision of the optical transceiver assembly 2 mounted to the mainboard.

[0047] In an embodiment, referring to FIG. 1, Figure 3As shown, the axis of the mainboard clamping portion 5 and the mainboard positioning column 4 is perpendicular to the axis of the adapter body 100, or the axis of the mainboard clamping portion 5 and the mainboard positioning column 4 is parallel to the axis of the adapter body 100. In this embodiment, the mainboard clamping portion 5 and the mainboard positioning column 4 at the fixed end are perpendicular to the axis of the adapter body 100, so that the optical transceiver assembly heat dissipation structure and the mainboard can be installed horizontally; the mainboard clamping portion 5 and the mainboard positioning column 4 at the fixed end are parallel to the axis of the adapter body 100, so that the optical transceiver assembly heat dissipation structure and the mainboard can be installed vertically.

[0048] Further, in an embodiment, referring to Figure 5 As shown, the heat dissipation fin 8 has at least one inner surface for adhering to at least one side of the optical transceiver assembly 2. Preferably, in this embodiment, the heat dissipation fin 8 has three inner surfaces, one of which is located above the optical transceiver assembly 2, and the other two are located on the left and right sides of the optical transceiver assembly 2. The three inner surfaces can be directly or indirectly adhered to the optical transceiver assembly 2, so that the entire heat dissipation fin 8 can dissipate heat from the optical transceiver assembly 2 in three directions, and the contact area between the heat dissipation fin 8 and the optical transceiver assembly 2 is larger, which can greatly improve the heat dissipation efficiency.

[0049] In some embodiments, referring to Figure 1 and Figure 2 As shown, the adapter body 100 contains a conductive sheet 6, which is arranged through the receiving end and the fixed end; wherein the conductive sheet 6 is at least partially exposed on the inner surface of the docking port 10 at the receiving end; the conductive sheet 6 at least partially extends out of the fixed end along the axial or radial direction of the adapter body 100. In this embodiment, the adapter body 100 is also provided with two terminal grooves, each of which is provided with a conductive sheet 6. The terminal groove can wrap the conductive sheet 6 inside, and the two terminal grooves extend along the axial direction of the adapter body 100, and are spaced apart in the left-right direction and distributed on the left and right sides of the mounting cavity 11. At the same time, the optical transceiver assembly 2 is separated from the conductive sheet 6 after being mounted in the mounting cavity 11. By mounting the optical transceiver assembly 2 and the conductive sheet 6 in the adapter body 100, the adapter body 100 can not only transmit optical signals, but also transmit electrical signals.

[0050] Preferably, in an embodiment, the conductive sheet 6 at the fixed end is isolated from the mounting cavity 11. In this embodiment, the conductive sheet 6 mounted in the adapter body 100 does not enter the mounting cavity 11 at the fixed end. By separating the conductive sheet 6 from the mounting cavity 11 through the structure of the adapter body 100, the optical transceiver assembly 2 mounted in the mounting cavity 11 will not contact the conductive sheet 6, and they are independent of each other.

[0051] Further, in an embodiment, referring to Figure 3 In this embodiment, the adapter sealing ring 7 is arranged at the receiving end, and can be in close contact with the inner wall of the camera cover body 300 to achieve sealing and waterproof of the inside of the camera cover body 300.

[0052] Preferably, in an embodiment, the adapter body 100 can include an adapter main body 1 and a fixing member 3, the adapter main body 1 has the receiving end and the docking port 10, and the adapter main body 1 and the fixing member 3 jointly form the fixed end and the mounting cavity 11. Referring to Figure 2 In this embodiment, the adapter body 100 is preferably split into the adapter main body 1 and the fixing member 3 distributed along the axial direction, which not only can wrap the optical transceiver assembly 2 entirely in the adapter main body 1 and the fixing member 3, but also can be arranged along the front-rear direction, so that the adapter main body 1 located at the front of the optical transceiver assembly 2 is an integral whole, facilitating sealing at the front of the adapter main body 1 and being suitable for the vehicle-mounted field. In other embodiments, the adapter main body 1 and the fixing member 3 can be arranged to be distributed along other directions, for example, wrapping the optical transceiver assembly 2 along the up-down direction; or the adapter main body 1 and the fixing member 3 can be integrally formed.

[0053] The optical transceiver module provided in the embodiments of the present application can include the optical transceiver assembly heat dissipation structure and the optical transceiver assembly 2, and the optical transceiver assembly 2 is fixed in the mounting cavity 11 of the optical transceiver assembly heat dissipation structure. In the embodiments of the present application, the optical transceiver assembly heat dissipation structure can adopt any of the optical transceiver assembly heat dissipation structures in the above embodiments and achieve the corresponding functions, which will not be described here.

[0054] Further, in an embodiment, the optical transceiver assembly 2 is in direct contact with the inner surface of the heat sink 8, or is in indirect contact through a heat-conducting medium. In this embodiment, after the optical transceiver assembly 2 is installed into the mounting cavity 11, the optical transceiver assembly 2 can be in direct contact with the inner surface of the heat sink 8 and dissipate heat through the heat sink 8, or there can be a gap between the inner surface of the heat sink 8 and the surface of the optical transceiver assembly 2, and a high-heat-conducting medium is arranged in the gap, so that the heat of the optical transceiver assembly 2 is transmitted to the heat sink 8 through the high-heat-conducting medium and then dissipated through the heat sink 8.

[0055] Referring to Figure 7 and Figure 8 The camera module provided in the embodiments of the present application can include the camera cover body 300, and the camera cover body 300 is installed with the optical transceiver module. In the embodiments of the present application, the optical transceiver module can adopt any of the optical transceiver modules in the above embodiments and achieve the corresponding functions, which will not be described here.

[0056] Further, in an embodiment, the outer surface of the heat sink 8 is in direct contact with the inner surface of the camera cover 300, or in indirect contact through a heat-conducting medium. As shown in Figure 6 and Figure 8 In this embodiment, a metal heat-dissipating piece 82 can be arranged between the inner surface of the camera cover 300 and the heat sink 8, and heat-conducting silicone grease can be applied between the inner surface of the camera cover 300 and the metal heat-dissipating piece 82 and between the metal heat-dissipating piece 82 and the heat sink 8, so that the heat of the heat sink 8 can be transmitted to the camera cover 300 through the metal heat-dissipating piece 82 for heat dissipation. Of course, in some embodiments, the outer surface of the heat sink 8 can be directly arranged in contact with the inner surface of the camera cover 300.

[0057] In some embodiments, the adapter body 100 preferably comprises an adapter main body 1 and a fixing piece 3, the adapter main body 1 has the receiving end and the docking port 10, and the adapter main body 1 and the fixing piece 3 jointly form the fixed end and the mounting cavity 11; the adapter main body 1 is integrally formed with the camera cover 300. In this embodiment, the camera cover 300 can comprise a camera first cover and a camera second cover, the camera first cover and the camera second cover are detachably connected, and the adapter main body 1 can be integrally formed with the camera first cover.

[0058] In the description of the present application, it should be noted that the positions or position relationships indicated by the terms "upper", "lower", etc. are based on the positions or position relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular position, be constructed and operated in a particular position, and therefore cannot be understood as a limitation on the present application. Unless otherwise specified and limited, the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, and it can be the communication between two elements. For those skilled in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0059] It should be noted that, in the present application, the relational terms such as "first" and "second", and the like, are used solely to distinguish one entity or action from another, without necessarily requiring or implying any actual relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element proceeded by "comprises... a" does not, without more constraints, exclude the existence of additional identical elements in the process, method, article, or apparatus that comprises the element.

[0060] The foregoing is considered as illustrative only of the principles of the application. Numerous modifications and changes will readily occur to those skilled in the art, and the generic principles defined herein can be applied to other embodiments without departing from the spirit or scope of the application. Therefore, the application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A heat dissipation structure for an optical transceiver assembly, characterized in that, It comprises: An adapter body (100) has a receiving end and a fixed end along its axial direction, the inside of the receiving end is provided with a docking socket (10) for fixing the optical fiber connector, the inside of the fixed end is provided with a mounting cavity (11) for fixing the optical transceiver assembly (2), and the docking socket (10) and the mounting cavity (11) are in communication along the axial direction of the adapter body (100); The fixed end is provided with a heat sink (8), the inner surface of the heat sink (8) is exposed to the mounting cavity (11), and the outer surface of the heat sink (8) is exposed to the outer surface of the fixed end.

2. The optical transceiver assembly heat dissipation structure of claim 1, wherein: The receiving end is provided with a snap-fit position for fixing the optical fiber connector and an orientation structure for ensuring the insertion direction of the optical fiber connector.

3. The optical transceiver assembly heat dissipation structure of claim 1, wherein: The fixed end is provided with a first through hole along the axial direction of the adapter body (100) and a second through hole perpendicular to the axial direction of the adapter body (100).

4. The optical transceiver assembly heat dissipation structure of claim 1, wherein: The fixed end is provided with a mainboard positioning column (4) and a mainboard clamping part (5) for fixing connection with the mainboard.

5. The optical transceiver assembly heat dissipation structure of claim 4, wherein: The axes of the mainboard clamping part (5) and the mainboard positioning column (4) are perpendicular to the axis of the adapter body (100), or the axes of the mainboard clamping part (5) and the mainboard positioning column (4) are parallel to the axis of the adapter body (100).

6. The optical transceiver assembly heat dissipation structure of claim 1, wherein: The heat sink (8) has at least one inner surface for adhering to at least one side of the optical transceiver assembly (2).

7. The optical transceiver assembly heat dissipation structure of claim 1, wherein: The adapter body (100) contains a conductive sheet (6), and the conductive sheet (6) is provided through the receiving end and the fixed end; Wherein, the conductive sheet (6) is at least partially exposed to the inner surface of the docking socket (10) at the receiving end; the conductive sheet (6) at least partially extends from the fixed end along the axial direction or the radial direction of the adapter body (100).

8. The optical transceiver assembly heat dissipation structure of claim 7, wherein: The conductive sheet (6) at the fixed end is isolated from the mounting cavity (11).

9. The optical transceiver assembly heat dissipation structure of claim 1, wherein: The receiving end is further provided with an adapter sealing ring (7).

10. The optical transceiver assembly heat dissipation structure of claim 1, wherein: The adapter body (100) comprises an adapter main body (1) and a fixing member (3), the adapter main body (1) has the receiving end and the docking port (10), and the adapter main body (1) and the fixing member (3) jointly form the fixed end and the mounting cavity (11).

11. An optical transceiver module, comprising: It comprises: The optical transceiver module (2) is fixed in the mounting cavity (11) of the optical transceiver module heat dissipation structure.

12. The optical transceiver module of claim 11, wherein: The optical transceiver module (2) is in direct contact with the inner surface of the heat dissipation fin (8), or is in indirect contact through a heat conducting medium.

13. A camera module, comprising: It comprises: The camera cover (300) is provided with the optical transceiver module.

14. The camera module of claim 13, wherein: The outer surface of the heat dissipation fin (8) is in direct contact with the inner surface of the camera cover (300), or is in indirect contact through a heat conducting medium.

15. The camera module of claim 13, wherein: The adapter body (100) comprises an adapter main body (1) and a fixing member (3), the adapter main body (1) has the receiving end and the docking port (10), and the adapter main body (1) and the fixing member (3) jointly form the fixed end and the mounting cavity (11); The adapter main body (1) is integrally formed with the camera cover (300).

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