Integrated power supply communication device for case board card and case

Abstract

The utility model relates to the technical field of power electronics, and discloses an integrated power supply communication device for a case board card, which comprises a substrate and a plurality of multi-pin electronic connectors plugged on the substrate, each electronic connector can be correspondingly connected with a board card, the substrate is provided with a signal line and a power line, and the power line is connected with the multi-pin electronic connectors. The signal line is connected with a signal pin in each electronic connector, and the power line is connected with a power pin in each electronic connector; the substrate is also provided with ground wires which are in one-to-one correspondence with the electronic connectors, and the ground wires are respectively connected with ground wire pins in the electronic connectors. The electronic connectors are connected in parallel through power lines and ground lines. The electronic connectors are communicated in series through signal lines. The power supply lines and the signal lines of a plurality of board cards only need to be arranged on one substrate, communication connecting lines and power supply connecting lines can be reduced, the reliability of the system is improved, meanwhile, modular expansion can be supported, and upgrading and maintenance of the system are facilitated.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of power electronics, in particular to an integrated power supply communication device for a chassis board card and a chassis. BACKGROUND

[0002] A chassis such as a data acquisition chassis, a computer chassis, etc. often has multiple independent board cards for processing signals of multiple channels. When multiple independent board cards are integrated in the chassis, the management of power supply and communication of the board cards is crucial. A conventional solution is to place all the board cards in the same chassis and realize power supply and communication through a backplane. In this way, all the board cards need to be fixed in the same chassis. Once a board card fails, the entire chassis needs to be disassembled for inspection and repair. This not only increases the difficulty of maintenance, but also prolongs the downtime of the equipment and affects the normal operation of the system.

[0003] Therefore, how to improve the reliability and maintainability of the chassis equipment becomes a technical problem to be solved. CONTENT OF THE UTILITY MODEL

[0004] Therefore, the present application provides an integrated power supply communication device for a chassis board card and a chassis to solve the technical problem of how to improve the reliability and maintainability of the chassis equipment in the related art.

[0005] The present application provides an integrated power supply communication device for a chassis board card, comprising a substrate and multiple multi-pin electronic connectors plugged on the substrate, each of the electronic connectors being capable of connecting a board card, wherein the substrate is provided with signal lines and power supply lines, the signal lines being connected to signal pins in each of the electronic connectors respectively, and the power supply lines being connected to power supply pins in each of the electronic connectors respectively; the substrate is further provided with ground lines corresponding to the electronic connectors one by one and connected to ground pins in each of the electronic connectors respectively; the electronic connectors are connected in parallel through the power supply lines and the ground lines; and the electronic connectors are connected in series through the signal lines.

[0006] In an embodiment, the integrated power supply communication device for a chassis board card further comprises a chassis panel, the substrate is fixedly connected to the chassis panel, and a board card mounting position is formed at a position corresponding to each of the electronic connectors for mounting and fixing the board card.

[0007] In an embodiment, the chassis panel is a 2U panel.

[0008] In an embodiment, the length of the substrate is adapted to the length of the chassis panel.

[0009] In an embodiment, the substrate is fixed to the chassis panel by screws, and the ground wires are communicated with the chassis panel by the screws.

[0010] In an embodiment, the signal lines include serial signal lines having first signal lines and second signal lines, and the electronic connectors include first signal pins and second signal pins, the first signal lines being connected to the first signal pins of the electronic connectors respectively, and the second signal lines being connected to the second signal pins of the electronic connectors respectively.

[0011] In an embodiment, the signal lines and the power lines are distributed in different wiring layers of the substrate.

[0012] In an embodiment, the electronic connectors include four-pin female connectors or four-pin male connectors.

[0013] According to a second aspect, the embodiments of the present application further provide a chassis, comprising: a chassis body and the integrated power supply and communication device for a board card of any one of the above-mentioned first aspect arranged on the chassis body; and a plurality of board cards mounted on the integrated power supply and communication device.

[0014] In an embodiment, the connection port of the board card connected to the integrated power supply and communication device is a hot plug port.

[0015] The present application has at least the following beneficial effects:

[0016] The power supply and communication of the board card to be installed in the chassis are integrated by using the integrated power supply and communication device. The power supply lines, signal lines, ground lines and the electronic connectors carrying a plurality of power supply ports and communication ports capable of connecting the board cards are carried by the substrate. Therefore, only one substrate is needed to arrange the power supply lines and signal lines of a plurality of board cards, which can reduce the communication lines and power supply lines, eliminate the need for complex wiring in the chassis, reduce the cables and connection points in the chassis, improve the reliability of the system, reduce the potential failure rate, and further enhance the stability of the entire system. In addition, it can also support modular expansion, facilitate system upgrade and maintenance, and easily replace or add new board cards without changing the entire chassis. The maintenance efficiency is significantly improved, and the downtime and maintenance cost are reduced. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the following will briefly introduce the drawings needed to be used in the description of the specific embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without creative labor.

[0018] Figure 1 This is a schematic diagram of the circuit structure of an integrated power supply and communication device for chassis boards provided according to an embodiment of this application;

[0019] Figure 2 This is a schematic diagram of the substrate structure of an integrated power supply and communication device for chassis boards provided according to an embodiment of this application;

[0020] Figure 3 This is a schematic diagram of the integrated power supply and communication device for chassis boards provided according to an embodiment of this application. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0022] This application provides an integrated power supply and communication device for chassis boards, such as... Figures 1 to 3 As shown, the integrated power supply and communication device includes: a substrate 10 and a plurality of multi-pin electronic connectors 20 plugged into the substrate 10. Each electronic connector 20 can be connected to a corresponding board. The substrate 10 is provided with signal lines 11 and power lines 12. The signal lines 11 are respectively connected to the signal pins of each electronic connector 20, and the power lines 12 are respectively connected to the power pins of each electronic connector 20. The substrate 10 is also provided with ground lines 13 corresponding to each electronic connector 20, and are respectively connected to the ground line 13 pins of each electronic connector 20. The electronic connectors 20 are connected in parallel through the power lines 12 and the ground lines 13. The electronic connectors 20 communicate in series through the signal lines.

[0023] In the embodiment, the power supply and communication of the board card to be installed in the chassis adopt the integrated power supply and communication device. The substrate 10 carries the signal line 11, the power supply line 12, the ground line 13, and the electronic connector 20 capable of connecting the power supply port and the communication port of the board card, so that only one substrate 10 is needed to arrange the power supply line and the signal line of multiple board cards, which can reduce the communication connection and the power supply connection, eliminate the need for complex connection in the chassis, reduce the cable and the connection point in the chassis, improve the reliability of the system, reduce the potential failure rate, and further enhance the stability of the entire system. Moreover, the integrated power supply and communication device can support modular expansion, facilitate the upgrading and maintenance of the system, and easily replace or add new board cards without changing the entire chassis, which significantly improves the maintenance efficiency and reduces the downtime and maintenance cost.

[0024] In an embodiment, as shown in Figure 3 The substrate 10 is fixedly connected to the chassis panel 30, and the board card mounting position 31 is arranged at the position corresponding to each electronic connector 20 for mounting and fixing the board card. The substrate 10 is mounted on the chassis panel 30, and the board card mounting position 31 is reserved on the chassis panel 30 to lock the board card on the panel through the mounting interface on the panel to achieve firm fixation. By closely combining the substrate 10 and the chassis panel 30, the board cards do not need to be densely arranged in the chassis, which avoids the space occupation in the chassis and optimizes the space utilization of the chassis.

[0025] In an embodiment, the chassis panel 30 can be a 2U panel. For a 2U panel chassis, if multiple board cards are simultaneously mounted and arranged on the back plate in the existing manner, the multiple board cards need to be densely arranged in the chassis. When the multiple board cards work simultaneously, the heat generated by the densely arranged board cards is difficult to dissipate effectively, which may cause overheating of the equipment and affect the performance and stability. Therefore, in the 2U panel chassis, the substrate 10 is closely combined with the chassis panel 30, and the board card is mounted on the chassis panel 30, which not only optimizes the space utilization in the chassis but also improves the heat dissipation performance of the board card and prevents the heat accumulation caused by the simultaneous work of the multiple board cards from affecting the performance of the chassis or system.

[0026] In an embodiment, the length of the substrate 10 is adapted to the length of the chassis panel 30. The length of the substrate 10 is adapted to the standard length of the 2U panel, which occupies very little space, and under this length, the substrate 10 and the chassis panel 30 can carry more board cards, for example, 16 board cards can be simultaneously mounted on the panel to realize simultaneous power supply and serial communication.

[0027] In one embodiment, the substrate 10 has screw holes 14, and the corresponding position on the chassis panel 30 has corresponding screw holes 14. The substrate 10 and the chassis panel 30 are fixed by screws 14, and the ground line on the substrate 10 is connected to the chassis panel 30 by screws 14, thereby achieving grounding.

[0028] In one embodiment, the signal line 11 includes a serial port signal line, which has a first signal line 111 and a second signal line 112. The electronic connector 20 includes a first signal pin and a second signal pin. The first signal line 111 is connected to the first signal pin of a plurality of electronic connectors 20, and the second signal line 112 is connected to the second signal pin of a plurality of electronic connectors 20. This enables serial communication between the plurality of electronic connectors 20.

[0029] In this embodiment, the substrate 10 can be a printed circuit board, the electronic connector 20 can be a female header or a pin header, or a connector. In this embodiment, a four-pin female header can be used as an example. The serial port signal line can include a 485 bus, a 232 bus, or a TTL bus. In this embodiment, the serial port signal line is described using a 485 bus as an example.

[0030] For example, such as Figure 1 As shown, each row of pins includes a first pin 21, a second pin 22, a third pin 23, and a fourth pin 24. The first pin 21 is connected to the A signal line (first signal line 111) of the 485 bus, the second pin 22 is connected to the ground line 13, the third pin 23 is connected to the B signal line (second signal line 112) of the 485 bus, and the fourth pin 24 is connected to the power line 12. This allows multiple boards to be connected in parallel for power supply and in series for communication.

[0031] A power connection terminal 40 for connecting to the power supply can also be provided at one end of the substrate 10. The power connection terminal 40 can be a two-pin connector, with one pin connected to the power line 12 and the other pin connected to the ground line 13.

[0032] In one embodiment, to avoid the power line 12 affecting the signal line, the power line 12 and the signal line are distributed on different wiring layers of the substrate 10.

[0033] The application further provides a chassis comprising the integrated power supply and communication device for the chassis board card described in any of the above embodiments, and a plurality of board cards are installed on the integrated power supply and communication device. The power supply and communication of the board cards to be installed in the chassis are integrated by using the integrated power supply and communication device. The power supply line, signal line and ground line are carried by the substrate, and the electronic connector carrying a plurality of power supply ports and communication ports capable of connecting the board cards, so that only one substrate is needed to arrange the power supply lines and signal lines of a plurality of board cards, which can reduce the communication connection and power supply connection, eliminate the need for complex connection in the chassis, reduce the cables and connection points in the chassis, improve the reliability of the system, reduce the potential failure rate, and further enhance the stability of the entire system. Moreover, it can also support modular expansion, facilitate system upgrade and maintenance, and easily replace or add new board cards without changing the entire chassis according to the requirements.

[0034] In the embodiment, the connection port of the board card connected with the integrated power supply and communication device is a hot plug port. Since the board card is installed on the chassis panel and a plurality of board cards use the integrated power supply and communication substrate, the operation and maintenance personnel can conveniently remove the problematic board card from the panel and perform hot plug operation without affecting other normally working board cards, which significantly improves the maintenance efficiency and reduces downtime and maintenance cost.

[0035] In the above embodiments of the application, the description of each embodiment has its own focus, and the parts not described in detail in a certain embodiment can be referred to the related description of other embodiments.

[0036] The above is only the preferred embodiment of the application. It should be noted that for ordinary skilled in the art, without departing from the principles of the application, a number of improvements and refinements can be made, which should also be considered as the protection scope of the application.

Claims

1. An integrated power supply and communication device for chassis boards, characterized in that, The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card.

2. The integrated power communications device for a chassis board card of claim 1, wherein, The application relates to an integrated power supply and communication device for a chassis board card.

3. The integrated power communications device for a chassis board card of claim 2, wherein, The application relates to an integrated power supply and communication device for a chassis board card.

4. The integrated power communications device for a chassis board card of claim 3, wherein, The application relates to an integrated power supply and communication device for a chassis board card.

5. The integrated power communications device for a chassis board card of claim 2, wherein, The application relates to an integrated power supply and communication device for a chassis board card.

6. The integrated power communications device for a chassis board card of claim 1, wherein, The application relates to an integrated power supply and communication device for a chassis board card.

7. The integrated power communications device for a chassis board card of claim 1, wherein, The application relates to an integrated power supply and communication device for a chassis board card.

8. The integrated power communications device for a chassis board card of any of claims 1-7, wherein, The application relates to an integrated power supply and communication device for a chassis board card.

9. A cabinet, characterized in that The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card.

10. The cabinet of claim 9, wherein, The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device for a chassis board card. The application relates to an integrated power supply and communication device

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