Production board washing module

Abstract

The utility model provides a production board washing module which comprises a main cleaning tank, a cleaning module, a pump and a filtering module, the cleaning module is used for cleaning and drying residual chemical liquid medicine and impurities on a production board, and a heating module and a cooling module are arranged in the main cleaning tank, so that the temperature of cleaning liquid can be accurately controlled; by adjusting the temperature, the dissolving capacity and the cleaning effect of the cleaning liquid can be optimized, the optimal conditions in different cleaning stages are ensured, and deep cleaning of the production board is achieved; and meanwhile, different temperatures are set for high-temperature cleaning according to different procedures, the cleaning efficiency can be effectively improved, and the cleaning time is shortened.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing equipment technology, and in particular to a production board washing module. Background Technology

[0002] In semiconductor manufacturing, cleaning the production board is a crucial step after etching, electroplating, and other processes. The purpose of cleaning is to remove residual chemicals and impurities from the production board to ensure the smooth progress of subsequent processes and the performance of the final product. Existing conventional cleaning modules have some shortcomings in practical applications, mainly: poor cleaning effect on deeply residual chemicals and impurities; incompletely cleaned chemicals or impurities may be released in subsequent processes, affecting subsequent production processes and reducing product yield; and long cleaning times extend the production cycle and reduce production efficiency. Utility Model Content

[0003] To address the aforementioned technical problems, this application provides a production board washing module, characterized in that it includes a main washing tank, a washing module, a pump, and a filter module; the washing module is disposed on the main washing tank; the washing module is connected to the filter module and the main washing tank respectively; the pump is used to connect the filter module and the main washing tank to realize the circulation of the washing liquid; the main washing tank is provided with a heating module and a cooling module to regulate the temperature of the washing liquid.

[0004] In some embodiments of this application, the cleaning module includes a first cleaning tank disposed above the main cleaning tank and a second cleaning tank disposed above the first cleaning tank; a spray pipe assembly is disposed in the first cleaning tank; and an air duct assembly is disposed in the second cleaning tank.

[0005] In some embodiments of this application, the nozzle assembly consists of two sets, which are arranged opposite to each other, and the production plate is movably disposed between the two sets of nozzle assemblies.

[0006] In some embodiments of this application, the nozzle assembly includes a plurality of nozzles spaced apart in a vertical direction; and along the extension direction of the nozzles, a plurality of nozzles are provided on the nozzles spaced apart and with their nozzles facing the production plate.

[0007] In some embodiments of this application, the cleaning module further includes an ultrasonic generator, which is disposed outside the first cleaning tank; there are multiple ultrasonic generators, which are spaced apart between the nozzles.

[0008] In some embodiments of this application, the nozzle rotates about the axis of the nozzle as the center of rotation, so that the nozzle sprays within the range defined by the upper and lower ultrasonic generators.

[0009] In some embodiments of this application, the duct assembly is in two sets, and the two sets of duct assemblies are arranged opposite to each other; the duct assembly includes one or more ducts arranged in a vertical direction; along the extension direction of the duct, the duct is provided with an air outlet facing the production plate.

[0010] In some embodiments of this application, the cleaning module further includes a waterfall cleaning component disposed in the second cleaning tank, the waterfall cleaning component being disposed below the air duct assembly.

[0011] In some embodiments of this application, the waterfall cleaning assembly includes a housing and a pipe assembly; the pipe assembly is disposed in the housing and has an outlet for liquid to flow out; the housing includes a fixed bottom wall, a top wall, a first side wall, and a second side wall; the second side wall is movably disposed between the top wall and the bottom wall, so that the housing forms an upper opening or a lower opening.

[0012] In some embodiments of this application, the air outlet is elongated, and the air duct is connected to an external air intake device.

[0013] Compared with the prior art, the present invention has the following advantages and beneficial effects: The production board washing module of this application includes a main cleaning tank, a cleaning module, a pump, and a filter module; the cleaning module is equipped with a spray pipe assembly and an air duct assembly, which can clean and dry the residual chemicals and impurities on the production board; the main cleaning tank is equipped with a heating module and a cooling module, which can precisely control the temperature of the cleaning liquid. By adjusting the temperature, the solubility and cleaning effect of the cleaning liquid can be optimized, ensuring optimal conditions at different cleaning stages and achieving deep cleaning of the production board; at the same time, setting different temperatures for high-temperature cleaning according to different processes can effectively improve cleaning efficiency and reduce cleaning time.

[0014] It should be understood that the above general description and the following detailed description are merely exemplary and explanatory, and do not limit this document. Attached Figure Description

[0015] The accompanying drawings, which form part of this document, are used to provide a further understanding of the document. The illustrative embodiments and descriptions herein are used to explain the document and do not constitute an undue limitation thereof. In the drawings:

[0016] Figure 1 This is a schematic diagram of the structure of a production board washing module provided in an exemplary embodiment of this application;

[0017] Figure 2 This is a front view of a production board washing module provided in an exemplary embodiment of this application;

[0018] Figure 3This is a schematic diagram of a production board washing module provided in an exemplary embodiment of this application;

[0019] Figure 4 This is a schematic diagram of the structure of a waterfall cleaning assembly provided in an exemplary embodiment of this application;

[0020] Figure 5 This is a cross-sectional view of a waterfall cleaning assembly provided in an exemplary embodiment of this application.

[0021] In the picture:

[0022] 100. Main cleaning tank; 200. Cleaning module; 300. Pump; 400. Filter module;

[0023] 101. Heating module; 102. Cooling module; 201. First cleaning tank; 202. Second cleaning tank; 203. Nozzle assembly; 204. Air duct assembly; 205. Waterfall cleaning assembly; 2051. Pipe assembly; 2052. Housing; 2052a. Top wall; 2052b. Bottom wall; 2052c. First side wall; 2052d. Second side wall; 206. Ultrasonic generator. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be arbitrarily combined with each other.

[0025] In semiconductor manufacturing, cleaning the production board is a crucial step after etching, electroplating, and other processes. The purpose of cleaning is to remove residual chemicals and impurities from the production board to ensure the smooth progress of subsequent processes and the performance of the final product. Existing conventional cleaning modules have some shortcomings in practical applications, mainly: poor cleaning effect on deeply residual chemicals and impurities; incompletely cleaned chemicals or impurities may be released in subsequent processes, affecting subsequent production processes and reducing product yield; and long cleaning times extend the production cycle and reduce production efficiency.

[0026] Based on this, an exemplary embodiment of this application provides a production board washing module, which includes a main washing tank, a washing module, a pump, and a filtration module. The washing module is used to clean and dry residual chemicals and impurities on the production board. The main washing tank is equipped with a heating module and a cooling module, which can precisely control the temperature of the cleaning liquid. By adjusting the temperature, the solubility and cleaning effect of the cleaning liquid can be optimized, ensuring optimal conditions at different cleaning stages to achieve deep cleaning of the production board. At the same time, setting different temperatures for high-temperature cleaning according to different processes can effectively improve cleaning efficiency and reduce cleaning time.

[0027] An exemplary embodiment of this application provides a production board washing module, such as... Figure 1 and 2 As shown, the module includes a main cleaning tank 100, a cleaning module 200, a pump 300, and a filter module 400. The cleaning module 200, pump 300, and filter module 400 are all mounted on the main cleaning tank 100. The cleaning module 200 is used to clean and dry residual chemicals and impurities on the production board. The pump 300 is connected to the filter module 400 and the main cleaning tank 100 via pipes and valves, respectively, to achieve circulation of the cleaning liquid and control the flow rate and pressure of the liquid. Preferably, the cleaning liquid used in this solution is deionized water. The main cleaning tank 100 is equipped with a heating module 101 and a cooling module 102. The heating module 101 heats the cleaning liquid, raising its temperature; the cooling module 102 cools the cleaning liquid, lowering its temperature. A temperature sensor is installed in the main cleaning tank 100 to measure the temperature of the cleaning liquid. The heating module 101 and the cooling module 102 work together to control and regulate the temperature of the cleaning liquid, keeping it within a preset temperature range at all times. This achieves precise temperature control of the cleaning liquid. By adjusting the temperature, the solubility and cleaning effect of the cleaning liquid can be optimized, ensuring optimal conditions at different cleaning stages and achieving deep cleaning of the production board. For example, a temperature range of 20°C to 80°C can meet the requirements for deep cleaning of production boards in most processes of semiconductor manufacturing. Thus, setting different temperatures for high-temperature cleaning according to different processes can effectively improve cleaning efficiency and reduce cleaning time.

[0028] In one embodiment, the cleaning module 200 includes a first cleaning tank 201 disposed above the main cleaning tank 100 and a second cleaning tank 202 disposed above the first cleaning tank 201; the first cleaning tank 201, the second cleaning tank 202, and the main cleaning tank 100 are interconnected. A nozzle assembly 203 is disposed within the first cleaning tank 201; there are two sets of nozzle assemblies 203, which are arranged opposite to each other, and the production plate is movably disposed between the two sets of nozzle assemblies 203, thus allowing simultaneous cleaning of both sides of the production plate. Figure 3 As shown, the nozzle assembly 203 includes a plurality of nozzles spaced apart in a vertical direction; preferably, each nozzle is equally spaced in the vertical direction; each nozzle is horizontally arranged within the second cleaning tank 202. Along the extension direction of the nozzle, a plurality of nozzles are arranged at intervals and facing the production board; preferably, the nozzles are equally spaced, and each nozzle forms a spray area with a preset range. To thoroughly clean the production board, the spray ranges of adjacent nozzles can be partially overlapped by controlling the flow rate and pressure, thus cross-spraying the production board and improving the cleaning effect.

[0029] For example, such as Figure 1 As shown, the cleaning module 200 also includes an ultrasonic generator 206, which is disposed outside the first cleaning tank 201 and extends horizontally. Multiple ultrasonic generators 206 are spaced apart between the nozzles. Thus, each ultrasonic generator 206 between the nozzles can generate high-frequency vibrations, causing numerous tiny bubbles to form in the cleaning liquid in the first and second cleaning tanks 201 and the liquid sprayed from the nozzles. During the growth and collapse of these bubbles, strong shock waves and localized high pressure are generated, effectively removing residues and impurities from the surface of the production board and from its tiny pores, improving cleaning efficiency and shortening cleaning time. Simultaneously, by adjusting the frequency of the ultrasonic waves, cleaning can be optimized for different types of residues and impurities, improving the cleaning effect. Real-time monitoring of the ultrasonic frequency and power by the control unit ensures the stability and consistency of the cleaning process, guaranteeing that each cleaning achieves the same standard and improving the product yield.

[0030] In one embodiment, a drive unit and a transmission mechanism are also provided outside the cleaning module 200. The transmission mechanism drives the drive unit and the nozzle to rotate the nozzle around its axis, ensuring that the nozzle sprays within the range defined by the upper and lower ultrasonic generators 206. This ensures that the cleaning liquid is evenly sprayed to every corner of the production board, improving the cleaning effect. Simultaneously, the rotary sweeping spray can cover a larger area, reducing the time of a single spray and accelerating the cleaning speed. Under the control system, the pressure of the liquid spray is adjusted to enable high-pressure spraying from the nozzle, effectively removing residues and impurities from the production board and further enhancing the cleaning effect.

[0031] The second cleaning tank 202 is equipped with a duct assembly 204; there are two sets of duct assemblies 204, which are arranged opposite to each other; the duct assembly 204 includes one or more ducts arranged in a vertical direction; along the extension direction of the duct, the duct is provided with an air outlet facing the production board. Preferably, the air outlet is elongated and its length is greater than the width of the production board. The duct is connected to an air intake device, which can introduce compressed air into the duct so as to blow air onto the entire surface of the production board and achieve the drying of the production board.

[0032] The cleaning module 200 also includes a waterfall cleaning component 205 disposed in the second cleaning tank 202, below the duct assembly 204. The waterfall cleaning component 205 can perform high-flow-rate rinsing of the production board, achieving the purpose of removing impurities from the production board. In this application's solution, the duct assembly 204 performs the first-stage cleaning of the production board, the waterfall cleaning component 205, located above the nozzle assembly 203, performs the second-stage cleaning, and the nozzle assembly 203 performs the third-stage cleaning. Through the sequentially arranged multi-stage cleaning and the ultrasonic generator 206, the cleaning effect can be effectively improved.

[0033] like Figure 4 and 5 As shown, the waterfall cleaning assembly 205 includes a housing 2052 and a pipe assembly 2051. The pipe assembly 2051 is disposed inside the housing 2052 and extends along the length of the housing 2052. One end of the pipe assembly 2051 is connected to the filter module 400, and the pipe assembly 2051 has an outlet for liquid outflow. The housing 2052 includes a fixed bottom wall 2052b, a top wall 2052a, a first side wall 2052c, and a second side wall 2052d. The second side wall 2052d is movably disposed between the top wall 2052a and the bottom wall 2052b, so that the housing 2052 forms an upper opening or a lower opening. The upper or lower opening can be selected according to different process requirements. When the housing 2052 forms an opening like... Figure 5When the lower opening is shown, the liquid level flowing out through the pipe assembly 2051 is higher than the lower opening. At this time, the liquid inside the tank 2052 is ejected from the lower opening at a certain preset pressure, which is suitable for conditions requiring higher cleanliness. By adjusting the flow rate of the liquid inside the pipe assembly 2051, the pressure and flow rate of the liquid ejected from the lower outlet can be adjusted to achieve a stable pressure effect. When an upper opening is formed on the tank 2052, the liquid level inside the tank 2052 exceeds the upper opening, allowing the liquid to flow out from the upper opening. At this time, the liquid inside the tank 2052 flows out without pressure, which is suitable for conditions requiring slightly lower cleanliness.

[0034] Preferred, such as Figure 5 As shown, the housing 2052 has a downward-sloping bottom wall, which allows the liquid to be sprayed onto the production plate at a certain angle. At the same time, under the action of gravity, the liquid flow rate can be accelerated and the liquid spraying distance can be extended, preventing the situation where the cleaning is not in place due to the distance between the production plate and the waterfall cleaning component 205.

[0035] After electroplating, etching, and other processes are completed, the production board is first washed with ordinary water. Then, the production board is held by a clamp and lifted by a lifting mechanism and placed into the cleaning module 200 from above the second cleaning tank 202. The waterfall cleaning component 205, the nozzle component 203, and the ultrasonic generator 206 perform multi-stage, deep cleaning on the production board. At the same time, the cleaning time of the production board in the cleaning module 200 varies depending on the different processes and requirements of the production board to be cleaned. After the preset time, the production board is removed from the cleaning module 200 by the clamp and the lifting mechanism. During the process of the production board rising, the waterfall cleaning component 205, the nozzle component 203, and the ultrasonic generator 206 continue to clean the production board. The air duct component 204 blows air onto the production board to remove moisture and dry the production board.

[0036] In this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that an article or device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such an article or device. Without further limitation, an element defined by the phrase "comprising..." does not exclude the presence of other identical elements in the article or device that includes said element.

[0037] Although preferred embodiments of this application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this application.

[0038] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if these modifications and variations fall within the scope of the claims of this application and their equivalents, the intent of this application also includes these modifications and variations.

Claims

1. A production board washing module, characterized in that, It includes a main cleaning tank, a cleaning module, a pump, and a filter module; the cleaning module is mounted on the main cleaning tank; the cleaning module is connected to the filter module and the main cleaning tank respectively; the pump is used to connect the filter module and the main cleaning tank to realize the circulation of the cleaning liquid; the main cleaning tank is equipped with a heating module and a cooling module to regulate the temperature of the cleaning liquid.

2. The production board washing module according to claim 1, characterized in that, The cleaning module includes a first cleaning tank disposed above the main cleaning tank and a second cleaning tank disposed above the first cleaning tank; a spray pipe assembly is disposed in the first cleaning tank; and an air duct assembly is disposed in the second cleaning tank.

3. The production board washing module according to claim 2, characterized in that, The nozzle assembly consists of two sets, which are arranged opposite to each other, and the production plate is movably disposed between the two sets of nozzle assemblies.

4. The production board washing module according to claim 2, characterized in that, The nozzle assembly includes a plurality of nozzles spaced apart in a vertical direction; along the extension direction of the nozzles, a plurality of nozzles are arranged at intervals on the nozzles and the nozzle openings face the production plate.

5. The production board washing module according to claim 4, characterized in that, The cleaning module also includes an ultrasonic generator, which is disposed outside the first cleaning tank; there are multiple ultrasonic generators, which are spaced apart between the nozzles.

6. The production board washing module according to claim 4, characterized in that, The nozzle rotates around its axis, causing the nozzle to spray within the range defined by the upper and lower ultrasonic generators.

7. The production board washing module according to claim 2, characterized in that, The air duct assembly consists of two sets, which are arranged opposite to each other; the air duct assembly includes one or more air ducts arranged in a vertical direction; and an air outlet facing the production board is provided on the air duct along its extension direction.

8. The production board washing module according to claim 2, characterized in that, The cleaning module also includes a waterfall cleaning component disposed in the second cleaning tank, which is located below the air duct assembly.

9. The production board washing module according to claim 8, characterized in that, The waterfall cleaning assembly includes a housing and a pipe assembly; the pipe assembly is disposed in the housing and has an outlet for liquid to flow out; the housing includes a fixed bottom wall, a top wall, a first side wall and a second side wall; the second side wall is movably disposed between the top wall and the bottom wall, so that the housing forms an upper opening or a lower opening.

10. The production board washing module according to claim 7, characterized in that, The air outlet is elongated, and the air duct is connected to an external air intake device.

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