Flow uniformizing plate assembly and silicon wafer cleaning device

Abstract

The utility model relates to the field of solar cell manufacturing, and discloses a flow uniformizing plate assembly and a silicon wafer cleaning device. The flow uniformizing plate assembly is used for the silicon wafer cleaning device and comprises a first flow uniformizing plate and a second flow uniformizing plate, the second flow uniformizing plate is arranged below the first flow uniformizing plate at intervals, the first flow uniformizing plate is provided with first flow uniformizing holes, the second flow uniformizing plate is provided with second flow uniformizing holes, and the hole diameter of the second flow uniformizing holes is larger than that of the first flow uniformizing holes. According to the technical scheme, when water bubbles sequentially pass through the second flow uniformizing plate and the first flow uniformizing plate, due to the fact that the hole diameter of the second flow uniformizing holes of the second flow uniformizing plate is larger than that of the first flow uniformizing holes of the first flow uniformizing plate, the sizes of the water bubbles are preliminarily reduced through the second flow uniformizing plate, and then the water bubbles are further reduced through the first flow uniformizing plate; the condition that silicon wafers are broken due to overlarge bubbles is avoided, and the flow uniformizing effect is improved.

Description

Technical Field

[0001] This application relates to the field of solar cell manufacturing, and more particularly to a flow equalizer assembly and a silicon wafer cleaning device. Background Technology

[0002] In the manufacturing process of solar cells, the silicon wafers must first be processed. The silicon wafers are first cleaned and etched in the wet process. The cleaning process removes impurities and contaminants from the surface of the silicon wafers. Then, chemical etching is performed to form a micro-texture structure, which increases the silicon wafers' ability to capture light.

[0003] In the wet process section, water is added to the tank through the inlet pipe, and then a bubbling device is used to form bubbles to clean the silicon wafers. However, excessive water pressure fluctuations during water intake can cause silicon wafer damage. Furthermore, excessively large bubbles formed by the bubbling device can also cause silicon wafer fragmentation. Related technologies use flow equalization plates to reduce the risk of silicon wafer fragmentation, but these plates are only one layer with fixed apertures, resulting in a limited and ineffective method for equalizing the flow of water within the tank. This cannot effectively prevent excessively large bubbles from causing silicon wafer fragmentation. Utility Model Content

[0004] This application discloses a flow equalization plate assembly and a silicon wafer cleaning device, which can control the size of water bubbles by using different apertures of the flow equalization plate, avoiding the situation where excessively large water bubbles cause silicon wafer fragments and improving the flow equalization effect.

[0005] To achieve the above objectives, in a first aspect, embodiments of this application disclose a flow equalization plate assembly, which is used in a silicon wafer cleaning apparatus, and the flow equalization plate assembly includes:

[0006] A first flow equalizer, the first flow equalizer having a first flow equalizer hole; and

[0007] The second flow equalizer is disposed below the first flow equalizer at intervals. The second flow equalizer is provided with a second flow equalizer hole, the diameter of which is larger than that of the first flow equalizer hole.

[0008] As an optional implementation, the difference between the aperture of the second flow equalizer and the aperture of the first flow equalizer is 0.5 cm.

[0009] As an optional implementation, the diameter of the first flow equalization orifice is greater than or equal to 0.5 cm and less than or equal to 1 cm.

[0010] As an optional implementation, when the diameter of the first flow equalization orifice is greater than or equal to 0.5 cm and less than 1 cm, the diameter of the second flow equalization orifice is 1 cm to 1.5 cm.

[0011] As an optional implementation, the flow equalizer assembly further includes a connecting assembly, which includes a spacer and a connector. The spacer is disposed between the first flow equalizer and the second flow equalizer to maintain a preset distance between the first flow equalizer and the second flow equalizer. The first flow equalizer and the second flow equalizer are connected by the connector.

[0012] As an optional implementation, the connecting components are in multiple sets, and the multiple sets of connecting components are arranged at intervals along the edges of the first flow equalizer and the second flow equalizer.

[0013] As an optional implementation, the spacer is an internally threaded component, and the connecting component includes a first bolt and a second bolt. The internally threaded component is disposed between the first flow equalizer and the second flow equalizer. The internally threaded component includes an upper end face and a lower end face. The upper end face of the internally threaded component is provided with a first threaded hole, and the lower end face of the internally threaded component is provided with a second threaded hole. The first bolt passes through the first flow equalizer and is threadedly connected to the first threaded hole, and the second bolt passes through the second flow equalizer and is threadedly connected to the second threaded hole, so that the first flow equalizer and the second flow equalizer are connected.

[0014] As an optional implementation, the first flow equalizer is made of polyvinylidene fluoride or the second flow equalizer is made of polyvinylidene fluoride.

[0015] As an optional implementation, both the first flow equalizer and the second flow equalizer are made of polyvinylidene fluoride.

[0016] Secondly, embodiments of this application disclose a silicon wafer cleaning apparatus, which is used to clean silicon wafers, and the silicon wafer cleaning apparatus includes:

[0017] Tank body;

[0018] As described in the first aspect above, the flow equalizer assembly is located within the tank body;

[0019] A water inlet pipe, located within the tank and positioned below the flow equalization plate assembly, provides water flow to the tank; and,

[0020] A bubbling tube is located in the tank and below the flow equalization plate assembly. The bubbling tube is capable of forming water bubbles on the side closer to the flow equalization plate assembly to clean the silicon wafer.

[0021] As an optional implementation, the circumferential sidewall of the flow equalizer assembly is sealed to the inner wall of the tank.

[0022] As an optional implementation, the bubbling tube has a bubbling hole on the side facing the flow equalization plate assembly, the flow equalization plate assembly includes a first flow equalization plate, the first flow equalization plate has a first flow equalization hole, and the diameter of the bubbling hole is larger than the diameter of the first flow equalization hole.

[0023] As an optional implementation, there are multiple bubbling tubes, and an inlet pipe is provided between two adjacent bubbling tubes.

[0024] Compared with the prior art, the beneficial effects of this application are at least as follows:

[0025] This application provides a flow equalization plate assembly, including a first flow equalization plate and a second flow equalization plate. The diameter of the second flow equalization hole in the second flow equalization plate is larger than the diameter of the first flow equalization hole in the first flow equalization plate. Thus, when bubbles formed by a bubble tube pass sequentially through the second and first flow equalization plates, the size of the bubbles is initially reduced by the second flow equalization plate, and then further reduced by the first flow equalization plate, preventing excessively large bubbles from causing silicon wafer fragmentation and improving the flow equalization effect. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of the flow uniform plate assembly disclosed in the embodiments of this application;

[0028] Figure 2 This is a schematic diagram of the fluid distribution plate assembly disclosed in the embodiments of this application;

[0029] Figure 3 for Figure 1 A schematic diagram of the flow uniformity effect of the flow uniform plate assembly;

[0030] Figure 4 This is a front view of the spacer disclosed in the embodiments of this application;

[0031] Figure 5 This is a cross-sectional view of the spacer disclosed in the embodiments of this application;

[0032] Figure 6 This is a front view of the connector disclosed in the embodiments of this application;

[0033] Figure 7 This is a top view of the connector disclosed in the embodiments of this application.

[0034] Explanation of reference numerals in the attached figures:

[0035] 100-Flow equalizer assembly;

[0036] 1-First flow equalizer; 1a-First flow equalizer hole;

[0037] 2-Second flow equalizer; 2a-Second flow equalizer hole;

[0038] 3-Connecting assembly; 31-Spacer; 32-Connector; 321-First bolt; 321a-First threaded hole; 322-Second bolt; 322a-Second threaded hole;

[0039] 301 - Inlet pipe; 302 - Bubble tube; 302a - Bubble hole. Detailed Implementation

[0040] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0041] In this application, the terms "upper," "lower," "left," "right," "inner," "outer," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0042] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0043] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0044] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, elements, or components (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, elements, or components. Unless otherwise stated, "a plurality of" means two or more.

[0045] In the manufacturing process of solar cells, the silicon wafer, as the carrier of the solar cell, determines the conversion efficiency of the solar cell based on its quality. In the wet etching stage, the silicon wafer needs to be cleaned and etched to form the desired structure. Through etching, specific structures, such as pyramidal or textured structures, can be formed on the silicon wafer surface. These structures increase the reflection and scattering of light on the silicon wafer surface, extend the optical path of light within the silicon wafer, thereby improving photon absorption efficiency and consequently increasing the short-circuit current and open-circuit voltage of the cell, thus optimizing the conductivity of the solar cell. However, after undergoing multiple processes, the surface of the silicon wafer may be covered with various impurities, contaminants, or oxides. Before etching in the wet process, the silicon wafer needs to be cleaned to remove these impurities, contaminants, and oxides, providing a clean and smooth surface for subsequent etching steps.

[0046] In related technologies, silicon wafers are placed in a silicon wafer cleaning device for cleaning. This device includes a flow equalization plate and a bubble-forming assembly. The bubble-forming assembly forms water bubbles within the device, which are then reduced in size by passing through the flow equalization holes on the flow equalization plate to clean the surface of the silicon wafer. However, the size of the flow equalization holes on the flow equalization plate determines the size of the bubbles contacting the silicon wafer. Since the hole diameter is fixed, large bubbles formed by the bubble-forming assembly can only shrink slightly after passing through the flow equalization holes, leaving relatively large bubbles exiting the holes. Under water pressure, these larger bubbles can collide with the silicon wafer, causing fragmentation. Furthermore, under water pressure, the bolts connecting the flow equalization plate to the tank of the silicon wafer cleaning device are prone to loosening, causing the flow equalization plate to oscillate within the tank, thus affecting its flow equalization effect.

[0047] Based on this, this application discloses a flow equalization plate assembly and a silicon wafer cleaning device. The flow equalization plate assembly adopts a double-layer flow equalization plate design, and the flow equalization holes of the two flow equalization plates are of different sizes. The hole diameter of the lower flow equalization plate is larger than that of the upper flow equalization plate. In this way, after the water bubbles pass through the two flow equalization plates, the size of the water bubbles is significantly reduced. This ensures the cleaning effect of the silicon wafer while avoiding the situation where the silicon wafer is broken due to the impact of excessively large water bubbles, thus ensuring the flow equalization effect.

[0048] The technical solution of this application will be further described below with reference to the embodiments and accompanying drawings.

[0049] Please see Figure 1 , Figure 1 This is a schematic diagram of the structure of the flow equalization plate assembly 100 disclosed in an embodiment of this application. The first aspect of this application discloses a flow equalization plate assembly 100 used in a silicon wafer cleaning device. Specifically, the flow equalization plate assembly 100 includes a first flow equalization plate 1 and a second flow equalization plate 2. The second flow equalization plate 2 is spaced below the first flow equalization plate 1. The first flow equalization plate 1 has a first flow equalization hole 1a, and the second flow equalization plate 2 has a second flow equalization hole 2a. The diameter of the second flow equalization hole 2a is larger than the diameter of the first flow equalization hole 1a. That is, the upper first flow equalization plate 1 and the lower second flow equalization plate 2 maintain a certain spatial interval to ensure that water bubbles can pass through them smoothly. On the first flow equalization plate 1, a plurality of first flow equalization holes 1a are distributed, which are used to initially disperse and evenly distribute the incoming water bubbles. On the lower second flow equalization plate 2, second flow equalization holes 2a with relatively larger diameters are provided, which further refine and evenly distribute the water bubbles.

[0050] It should be noted that the first flow equalization hole 1a on the first flow equalization plate 1 penetrates the first flow equalization plate 1, allowing water bubbles to pass through the first flow equalization hole 1a and through the first flow equalization plate 1. Similarly, the second flow equalization hole 2a on the second flow equalization plate 2 penetrates the second flow equalization plate 2, allowing water bubbles to pass through the second flow equalization hole 2a and through the second flow equalization plate 2. The water bubbles first pass through the second flow equalization hole 2a of the second flow equalization plate 2, initially reducing their size, and then pass through the first flow equalization hole 1a of the first flow equalization plate 1, further reducing the size of the water bubbles.

[0051] Thus, by designing the diameter of the first flow equalization hole 1a of the first flow equalization plate 1 to be smaller than the diameter of the second flow equalization hole 2a of the second flow equalization plate 2, as shown... Figure 2 and Figure 3 As shown, on the one hand, the second uniform flow holes 2a on the second uniform flow plate 2 serve as a preliminary uniform flow layer, enabling the input water bubbles to undergo preliminary dispersion and homogenization. These relatively small-diameter holes help to initially refine the fluid flow stream and reduce large-scale non-uniformity. The first uniform flow plate 1 is located above the second uniform flow plate 2, and the diameter of the first uniform flow hole 1a on it is smaller than that of the second uniform flow hole 2a. This design allows the water bubbles, after preliminary uniform flow, to be further dispersed and homogenized when passing through the first uniform flow hole 1a, ensuring the cleaning effect on the silicon wafer while avoiding the problem of excessively large water bubbles impacting the silicon wafer and causing silicon wafer fragmentation. Furthermore, due to the reduced hole diameter, the water bubbles can form more fine water bubbles when flowing out, thereby achieving a more uniform distribution throughout the flow field. On the other hand, when water bubbles pass through the two uniform flow plates, the uniform flow holes with different diameters will generate different flow velocities and pressure distributions, which can improve the cleaning effect of the water bubbles on the silicon wafer to a certain extent.

[0052] Furthermore, the diameter of the second flow equalization hole 2a of the second flow equalization plate 2 differs from the diameter of the first flow equalization hole 1a of the first flow equalization plate 1 by 0.5 cm. That is, the diameter of the second flow equalization hole 2a of the second flow equalization plate 2 is 0.5 cm larger than the diameter of the first flow equalization hole 1a of the first flow equalization plate 1. For example, when the diameter of the first flow equalization hole 1a of the first flow equalization plate 1 is 0.3 cm, the diameter of the second flow equalization hole 2a of the second flow equalization plate 2 is 0.8 cm; when the diameter of the first flow equalization hole 1a of the first flow equalization plate 1 is 1.3 cm, the diameter of the second flow equalization hole 2a of the second flow equalization plate 2 is 1.8 cm. In this way, limiting the difference between the aperture of the second uniform flow hole 2a of the second uniform flow plate 2 and the aperture of the first uniform flow hole 1a of the first uniform flow plate 1 to 0.5cm can further improve the uniform distribution of water bubbles after passing through the uniform flow hole, which helps to improve the uniformity of water bubbles passing through the uniform flow plate. This prevents the situation where water bubbles can pass through the second uniform flow hole 2a but cannot pass through the first uniform flow hole 1a due to the large difference between the aperture of the first uniform flow hole 1a of the first uniform flow plate 1 and the second uniform flow hole 2a of the second uniform flow plate 2, thus preventing the silicon wafer from being cleaned. This ensures the normal use of the entire uniform flow plate assembly 100.

[0053] In some embodiments, the diameter of the first uniform flow orifice 1a is greater than or equal to 0.5 cm and less than or equal to 1 cm. That is, the diameter of the first uniform flow orifice 1a is specifically limited to the range of 0.5 cm to 1 cm. Within this diameter range, water bubbles can form a relatively uniform and stable flow when passing through the orifice. An orifice diameter that is too small may obstruct fluid flow, resulting in a large pressure drop and turbulence; while an orifice diameter that is too large may result in uneven fluid distribution, affecting the cleaning effect on the silicon wafer. At the same time, an appropriate orifice diameter design helps reduce energy loss during the passage of water bubbles. An orifice diameter that is too small increases the frictional resistance of the fluid, thereby increasing energy consumption; while an appropriate orifice diameter can reduce unnecessary energy consumption while ensuring uniform distribution of water bubbles.

[0054] Furthermore, when the diameter of the first uniform flow orifice 1a is greater than or equal to 0.5 cm and less than 1 cm, the diameter of the second uniform flow orifice 2a is 1 cm to 1.5 cm. The large-diameter design (1 cm to 1.5 cm) on the second uniform flow plate 2 helps to initially disperse the fluid and reduce large-scale inhomogeneities. Subsequently, when the water bubbles enter the first uniform flow plate 1, they can be further refined and homogenized through the relatively smaller orifice diameter (1 cm to 1.5 cm). This design of reducing the orifice diameter allows the water bubbles to gradually achieve a more uniform distribution as they pass through the two uniform flow plates. At the same time, although a larger orifice diameter usually means lower water bubble resistance, here, by rationally designing the orifice diameter ratio of the two uniform flow plates, the water bubble resistance of the entire system can be reduced while ensuring a uniform distribution of water bubbles. The second uniform flow orifice 2a of the second uniform flow plate 2 initially disperses the water bubbles, reducing the formation of large-scale eddies and turbulence; the first uniform flow orifice 1a of the first uniform flow plate 1 further refines the fluid and reduces the additional resistance caused by excessive flow velocity. This design helps reduce the energy consumption required for pumping water bubbles and improves the system's energy efficiency.

[0055] See Figure 2 and Figure 3 In some embodiments, the flow equalizer assembly 100 further includes a connecting assembly 3, which includes a spacer 31 and a connector 32. The spacer 31 is disposed between the first flow equalizer 1 and the second flow equalizer 2 to maintain a preset interval between them. The first flow equalizer 1 and the second flow equalizer 2 are connected by the connector 32. The spacer 31 ensures that a preset and stable interval is maintained between the first flow equalizer 1 and the second flow equalizer 2. This interval is crucial for the uniform distribution of water bubbles. If the interval is too large or too small, it may lead to uneven distribution of water bubbles. The preset interval is twice the diameter of the second flow equalizer hole 2a of the second flow equalizer 2. The first flow equalizer 1 and the second flow equalizer 2 are firmly connected together by the connector 32 to form an integral structure. This connection method not only enhances the structural strength of the entire flow equalizer assembly 100, but also makes it more stable under fluid pressure and less prone to deformation or damage. This also ensures that the water bubbles flow along a predetermined path and at a predetermined speed as they pass through the two flow equalization plates. This helps reduce turbulence and eddies during the flow process, improving the efficiency of silicon wafer cleaning.

[0056] Furthermore, the connecting components 3 are in multiple sets, arranged at intervals along the edges of the first flow equalizer 1 and the second flow equalizer 2. That is, multiple connecting components 3 connect the edges of the first flow equalizer 1 and the second flow equalizer 2, forming a stable connection between them. Thus, the multiple sets of connecting components 3, arranged at intervals along the edges, provide multiple support points for the connection between the first flow equalizer 1 and the second flow equalizer 2. This multi-point support significantly enhances the structural stability of the entire flow equalizer assembly 100, making the assembly more robust and durable under pressure or other external loads. Compared to single-point or a few-point connections, multiple sets of connecting components 3 can distribute stress more evenly. This means that when water bubbles pass through, stress will not concentrate at one or a few points, but will be distributed throughout the entire assembly, thereby reducing the risk of damage due to stress concentration. In addition, the arrangement of multiple sets of connecting components 3 allows this design to adapt to flow equalizers of different sizes and shapes. Whether the flow equalizer is round, square, or has other special shapes, stable connection and support can be achieved by adjusting the number and position of the connecting components 3.

[0057] It is worth noting that "multiple connecting components 3" means that there are at least two connecting components 3, that is, there can be two, three, four or more connecting components 3. This embodiment does not specifically limit this. Figure 1 As shown, there are four connecting components 3. Taking a rectangular flow equalizer as an example, the four connecting components 3 are arranged in pairs on both sides of the flow equalizer assembly 100 along the length direction of the flow equalizer assembly 100 so that the first flow equalizer 1 and the second flow equalizer 2 are stably connected.

[0058] It is understood that, in addition to the scheme of connecting the edges of the first flow uniform plate 1 and the second flow uniform plate 2 with multiple connecting components 3, it is also possible to connect the edges of the first flow uniform plate 1 and the second flow uniform plate 2 with a single connecting component 3. This embodiment does not specifically limit this.

[0059] Furthermore, combined Figures 2 to 5 Spacer 31 is an internally threaded component (such as...) Figure 4 As shown), the connector 32 includes a first bolt 321 (as shown). Figure 6 and Figure 7 (As shown) and the second bolt 322, the internally threaded component is disposed between the first flow equalizer 1 and the second flow equalizer 2, the internally threaded component includes an upper end face and a lower end face, and the upper end face of the internal thread is provided with a first threaded hole 321a (as shown). Figure 5 As shown), the lower end face of the internally threaded component is provided with a second threaded hole 322a (as shown). Figure 5As shown, the first bolt 321 passes through the first flow equalizer 1 and connects to the first threaded hole 321a, and the second bolt 322 passes through the second flow equalizer 2 and connects to the second threaded hole 322a, thereby connecting the first flow equalizer 1 and the second flow equalizer 2. It should be noted that the structure of the second bolt 322 is similar to... Figure 6 , Figure 7 The structure of the first bolt 321 is the same.

[0060] By using internally threaded components as spacers and securing them to the two flow equalizers with two bolts respectively, the connection strength and stability between the two flow equalizers can be significantly enhanced. By selecting appropriate bolt specifications and lengths, the connection assembly 3 can be flexibly adjusted to meet different needs. Furthermore, when maintenance or component replacement is required, the flow equalizers can be easily disassembled and reinstalled by loosening the bolts, without disassembling the entire assembly, thus reducing maintenance costs and time.

[0061] It is worth noting that, in addition to the above-mentioned detachable connection between the first flow equalizer 1 and the second flow equalizer 2 via bolts and internal threaded parts, the first flow equalizer 1 and the second flow equalizer 2 can also be connected by welding, or other methods can be used to connect the first flow equalizer 1 and the second flow equalizer 2. This embodiment does not specifically limit these methods.

[0062] In some embodiments, the first flow equalizer 1 and the second flow equalizer 2 are made of polyvinylidene fluoride (PVDF). On one hand, PVDF is a highly chemically inert material, resistant to corrosion from various acids, alkalis, salts, and organic solvents. Furthermore, PVDF has high thermal stability, maintaining stable physical and chemical properties at high temperatures, allowing the flow equalizer to be used in high-temperature environments. In addition, PVDF has high strength and rigidity, capable of withstanding certain mechanical stress and pressure. This makes the PVDF flow equalizer less prone to deformation or breakage when subjected to fluid impact and vibration, ensuring the stability and reliability of the system. On the other hand, since water bubbles generate a certain scouring effect when passing through the flow equalizer, the flow equalizer needs to have good wear resistance. PVDF material has a smooth and wear-resistant surface, reducing fluid scouring damage to the plate surface and extending the service life of the flow equalizer. Simultaneously, PVDF material has good processing performance and can be molded through various processes such as injection molding, extrusion, and pressing. This allows PVDF flow equalizers to be customized according to actual needs, meeting requirements for different shapes and sizes.

[0063] It is worth noting that, in addition to the fact that the first flow equalizer 1 and the second flow equalizer 2 are both made of polyvinylidene fluoride as described in this embodiment, it is also possible that only the first flow equalizer 1 is made of polyvinylidene fluoride, or only the second flow equalizer 2 is made of polyvinylidene fluoride. This embodiment does not make specific limitations on this.

[0064] The second aspect of this application discloses a silicon wafer cleaning apparatus, combined with... Figures 1 to 3 The silicon wafer cleaning device includes a tank, a water inlet pipe 301, a bubble tube 302, and the flow equalization plate assembly 100 described in the first aspect. The flow equalization plate assembly 100 is located inside the tank. The water inlet pipe 301 is located inside the tank and positioned below the flow equalization plate assembly 100, providing water flow to the tank. The bubble tube 302 is located inside the tank and positioned below the flow equalization plate assembly 100, and can form bubbles towards the side closer to the flow equalization plate assembly 100 to clean the silicon wafer. This silicon wafer cleaning device can effectively disperse and homogenize the water flow from the water inlet pipe 301, ensuring a more uniform distribution of water flow throughout the tank. This uniform water flow distribution helps to ensure that every area on the silicon wafer surface is thoroughly rinsed, thereby improving cleaning efficiency and the uniformity of cleaning effect. The bubble tube 302 is positioned to form bubbles towards the side closer to the flow equalization plate assembly 100. These bubbles not only increase the contact area between the water flow and the silicon wafer surface, but also help to remove stubborn dirt through bubble bursting and agitation, further enhancing the cleaning effect. Simultaneously, the flow equalization plate assembly 100 achieves uniform water flow distribution. By reducing the volume of the bubbles formed by the bubble tube 302, the flow equalization plate assembly 100 reduces the impact of the bubbles on the silicon wafer surface, lowering the risk of scratches or damage caused by excessively large or unevenly distributed bubbles. Furthermore, the uniform water flow distribution achieved by the flow equalization plate assembly 100 avoids the localized excessively strong or weak water flow that may occur in traditional cleaning methods, thereby reducing unnecessary energy and water consumption.

[0065] Furthermore, the circumferential sidewall of the flow equalizer assembly 100 is sealed to the inner wall of the tank. This sealed connection ensures a tight fit between the flow equalizer assembly 100 and the tank, effectively preventing water leakage from gaps during the cleaning process and reducing ineffective fluid flow and eddy currents within the tank (such as...). Figure 2 As shown, this allows the bubbles formed by the bubbling tube 302 to flow more smoothly through the flow equalization plate assembly and act evenly on the silicon wafer surface. Simultaneously, the stable sealing connection makes the entire silicon wafer cleaning device more stable and reliable during operation. Furthermore, the sealing connection helps optimize the flow field distribution within the tank. By reducing the flow resistance of the bubbles in the gaps, the bubbles can pass through the flow equalization plate assembly 100 more smoothly and form a uniform flow field on the silicon wafer surface. This helps to further improve the cleaning effect and ensure the cleaning quality of the silicon wafer surface.

[0066] It is understandable that there are many ways to seal the connection between the side wall of the flow equalizer assembly 100 and the inner wall of the tank. Bolts can be installed on the side wall of the flow equalizer assembly 100, and threaded holes can be opened on the inner wall of the tank. The connection can be achieved by connecting the bolts to the threaded holes and applying sealant or wrapping sealing tape at the threaded connection. Alternatively, welding can be used for sealing. Furthermore, an O-ring can be installed between the side wall of the flow equalizer assembly 100 and the inner wall of the tank, and the two can be pressed together by an appropriate clamping device (such as bolts, clamps, etc.) to make the O-ring elastically deform, thereby filling and sealing the gap at the connection. This embodiment does not specifically limit this.

[0067] Optionally, combined Figure 1 and Figure 3 The bubbling tube 302 has a bubbling hole 302a on the side facing the flow equalizer assembly 100. The diameter of the bubbling hole 302a is larger than the diameter of the first flow equalizer hole 1a of the first flow equalizer 1 of the flow equalizer assembly 100. Thus, as... Figure 3 As shown, due to the large aperture of the bubbling hole 302a, water bubbles can form larger bubbles when entering the space below the flow equalizer assembly 100 through the bubbling hole 302a, and gradually disperse into smaller bubbles during their ascent. This process helps to form a more uniform bubble distribution below the flow equalizer assembly 100, reducing local bubble accumulation and eddy phenomena. The larger bubbling hole 302a can generate a stronger disturbance effect, causing the bubbles to churn more violently within the tank. This strong disturbance helps to quickly remove impurities and particles from the silicon wafer surface, thereby improving cleaning efficiency.

[0068] Furthermore, such as Figure 1 As shown, there are multiple bubbling tubes 302, with a water inlet pipe 301 between each adjacent bubbling tube 302. This arrangement of multiple bubbling tubes 302 below the flow equalizer assembly 100 creates a uniform bubbling effect below the flow equalizer assembly 100. The water inlet pipes 301 between adjacent bubbling tubes 302 help reduce dead zones in the water flow, ensuring that the water bubbles fully contact the silicon wafer and improving the cleaning effect. Furthermore, the design of multiple bubbling tubes 302 helps balance the pressure distribution within the silicon wafer cleaning device, reducing instability caused by excessively high or low local pressure, thereby ensuring the cleaning effect on the silicon wafer.

[0069] It is understood that multiple bubbling tubes 302 means that there are at least two bubbling tubes 302, that is, there can be two, three or four bubbling tubes 302. This embodiment does not make a specific limitation in this regard.

[0070] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A flow equalization plate assembly, said flow equalization plate assembly being used in a silicon wafer cleaning apparatus, characterized in that, The flow equalizer assembly includes: A first flow equalizer, the first flow equalizer having a first flow equalizer hole; and The second flow equalizer is disposed below the first flow equalizer at intervals. The second flow equalizer is provided with a second flow equalizer hole, the diameter of which is larger than that of the first flow equalizer hole.

2. The flow equalization plate assembly according to claim 1, characterized in that, The difference between the diameter of the second flow equalization orifice and the diameter of the first flow equalization orifice is 0.5 cm.

3. The flow equalization plate assembly according to claim 1, characterized in that, The diameter of the first flow equalization orifice is greater than or equal to 0.5 cm and less than or equal to 1 cm.

4. The flow equalization plate assembly according to claim 3, characterized in that, When the diameter of the first flow equalization orifice is greater than or equal to 0.5 cm and less than 1 cm, the diameter of the second flow equalization orifice is 1 cm to 1.5 cm.

5. The flow equalization plate assembly according to claim 1, characterized in that, The flow equalizer assembly further includes a connecting component, which includes a spacer and a connector. The spacer is disposed between the first flow equalizer and the second flow equalizer to maintain a preset distance between the first flow equalizer and the second flow equalizer. The first flow equalizer and the second flow equalizer are connected by the connector.

6. The flow equalization plate assembly according to claim 5, characterized in that, The connecting components are in multiple sets, and the multiple sets of connecting components are arranged at intervals along the edges of the first flow equalizer and the second flow equalizer.

7. The flow equalizer assembly according to claim 5, characterized in that, The spacer is an internally threaded component, and the connecting component includes a first bolt and a second bolt. The internally threaded component is disposed between the first flow equalizer and the second flow equalizer. The internally threaded component includes an upper end face and a lower end face. The upper end face of the internally threaded component is provided with a first threaded hole, and the lower end face of the internally threaded component is provided with a second threaded hole. The first bolt passes through the first flow equalizer and is threadedly connected to the first threaded hole, and the second bolt passes through the second flow equalizer and is threadedly connected to the second threaded hole, so that the first flow equalizer and the second flow equalizer are connected.

8. The flow equalizer assembly according to any one of claims 1-7, characterized in that, The first flow equalizer and / or the second flow equalizer are made of polyvinylidene fluoride.

9. A silicon wafer cleaning apparatus, characterized in that, The silicon wafer cleaning device includes: Tank body; The flow equalizer assembly as described in any one of claims 1-8, wherein the flow equalizer assembly is located within the tank body; A water inlet pipe, located within the tank and positioned below the flow equalization plate assembly, provides water flow to the tank; and... A bubbling tube is located in the tank and below the flow equalization plate assembly. The bubbling tube is capable of forming water bubbles on the side closer to the flow equalization plate assembly to clean the silicon wafer.

10. The silicon wafer cleaning apparatus according to claim 9, characterized in that, The one-way sidewall of the flow equalizer assembly is sealed to the inner wall of the tank.

11. The silicon wafer cleaning apparatus according to claim 9, characterized in that, The bubbling tube has a bubbling hole on the side facing the flow equalization plate assembly. The flow equalization plate assembly includes a first flow equalization plate, which has a first flow equalization hole. The diameter of the bubbling hole is larger than the diameter of the first flow equalization hole.

12. The silicon wafer cleaning apparatus according to claim 9, characterized in that, There are multiple bubbling tubes, and an inlet pipe is provided between two adjacent bubbling tubes.

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