Turnover device and automatic turnover equipment

Abstract

The utility model relates to the technical field of solar cell manufacturing, in particular to a turnover device and automatic turnover equipment. According to the turnover device, a first rotating wheel disc and a second rotating wheel disc can rotate in the first rotating direction, a first mounting piece is arranged on the first rotating wheel disc, a first limiting groove is formed in the first mounting piece, a second mounting piece is arranged on the second rotating wheel disc, and a second limiting groove is formed in the second mounting piece; when the first rotating wheel disc and the second rotating wheel disc rotate, the first mounting part and the second mounting part can be driven to rotate between the feeding station and the discharging station so that the silicon wafers can be turned over, the correction modules are arranged on the first rotating wheel disc and the second rotating wheel disc, and the correction modules can adjust the positions of the silicon wafers in the width direction of the silicon wafers. When the silicon wafers enter the first bearing assembly, the silicon wafers do not collide with the first bearing assembly to cause damage to the silicon wafers, and the quality of the silicon wafers is ensured.

Description

Technical Field

[0001] This application relates to the field of solar cell manufacturing technology, and in particular to a flipping device and an automated flipping equipment. Background Technology

[0002] The field of solar cell manufacturing technology primarily involves technologies related to the production of cells that convert solar energy into electrical energy. It encompasses the entire production process, from raw material selection to the final cell product, with the aim of manufacturing efficient, stable, and cost-effective solar cells. This field utilizes the photoelectric effect of semiconductor materials. When sunlight shines on a solar cell, photons interact with electrons in the semiconductor, giving the electrons sufficient energy to transition from the valence band to the conduction band, thereby generating an electric current. Heterojunction solar cells are a type of highly efficient solar cell structure. They consist of a PN structure formed from different semiconductor materials; for example, a heterojunction is typically formed on a crystalline silicon wafer using materials such as amorphous silicon or microcrystalline silicon. This structure possesses unique electrical and optical properties.

[0003] In the fabrication of heterojunction solar cells, the coating process is crucial. It requires precisely depositing various thin films onto the silicon wafer surface, such as intrinsic amorphous silicon layers and doped amorphous silicon layers. The quality of the coating directly affects key performance indicators of the cell, such as photoelectric conversion efficiency and open-circuit voltage. After one coating layer, the silicon wafer needs to be flipped using a flipping device to allow for a second coating layer on the other side. However, during this flipping process, the silicon wafer shifts in its width direction. This causes the wafer to misalign with the receiving module in the width direction, resulting in numerous scratches or fragments on the wafers. Utility Model Content

[0004] This application discloses a flipping device and an automated flipping equipment, which can adjust the position of the silicon wafer along the width direction so that the silicon wafer corresponds to the position of the first receiving component in the width direction of the silicon wafer, so that the silicon wafer can smoothly enter the first receiving component without collision and damage.

[0005] To achieve the above objectives, in a first aspect, embodiments of this application disclose a flipping device for flipping a silicon wafer and transporting the silicon wafer to a first receiving assembly, the flipping device comprising:

[0006] A first rotating disk, the first rotating disk being able to rotate around a first rotation direction, the first rotating disk being provided with a first mounting component, the first mounting component being provided with a first limiting groove;

[0007] The second rotating disk is rotatable around the first rotation direction. The rotation axes of the first and second rotating disks are on the same straight line. The second rotating disk is provided with a second mounting member, which is correspondingly arranged with the first mounting member in the width direction of the silicon wafer. The second mounting member is provided with a second limiting groove. The first and second limiting grooves are respectively used to accommodate two opposite sides of the silicon wafer along the width direction. When the first and second rotating disks rotate around the first rotation direction, they can drive the first and second mounting members to rotate between the loading station and the unloading station, so as to flip the silicon wafer. The unloading station corresponds to the position of the first receiving component.

[0008] A correction module is disposed on the first rotating disk and the second rotating disk. When the silicon wafer is flipped, the correction module can contact the silicon wafer and adjust the position of the silicon wafer along the width direction of the silicon wafer so that the position of the silicon wafer corresponds to that of the first receiving component in the width direction of the silicon wafer.

[0009] As an optional implementation, the flipping device further includes a rotating shaft, with both the first rotating disk and the second rotating disk rotatably connected to the rotating shaft. The rotating shaft is provided with a protrusion. The straightening module includes a first straightening module and a second straightening module. The first straightening module is disposed on the first rotating disk, with one end of the first straightening module close to the rotating shaft and the other end extending into the first limiting groove. When the first straightening module rotates toward the unloading station, the protrusion can apply a first radial thrust to the first straightening module. The first straightening module can convert the first radial thrust into a first axial thrust on the silicon wafer, with the first axial thrust pointing toward the second mounting member.

[0010] The second correction module is disposed on the second rotating wheel. One end of the second correction module is close to the rotating shaft, and the other end extends into the second limiting groove. When the second correction module rotates toward the unloading station, the protrusion can apply a second radial thrust to the second correction module. The second correction module can convert the second radial thrust into a second axial thrust on the silicon wafer. The second axial thrust points toward the first mounting member.

[0011] As an optional implementation, the first correction module includes a first radial pusher and a first rotating member. The first radial pusher is slidably disposed on the first rotating disk along the rotation axis, and the first rotating member is rotatably disposed on the first rotating disk. The first end of the first rotating member faces the first radial pusher, and the second end of the first rotating member faces the first mounting member. When the first correction module rotates toward the unloading station, the protrusion can apply the first radial thrust to the first radial pusher. The first radial pusher moves radially along the rotation axis to drive the first rotating member to rotate, so that the second end of the first rotating member extends into the first limiting groove and applies the first axial thrust to the silicon wafer.

[0012] The second correction module includes a second radial pusher and a second rotating member. The second radial pusher is slidably disposed on the second rotating disk along the rotation axis, and the second rotating member is rotatably disposed on the second rotating disk. The first end of the second rotating member faces the second radial pusher, and the second end of the second rotating member faces the second mounting member. When the second correction module rotates toward the unloading station, the protrusion can apply the second radial thrust to the second radial pusher. The second radial pusher moves radially along the rotation axis to drive the second rotating member to rotate, so that the second end of the second rotating member extends into the second limiting groove and applies the second axial thrust to the silicon wafer.

[0013] As an optional implementation, the first radial pusher has a first inclined surface at one end near the first rotating member, and the first end of the first rotating member has a second inclined surface, with the inclination angles of the first inclined surface and the second inclined surface being adapted to each other.

[0014] As an optional implementation, the first correction module further includes a first reset member, which is capable of providing a reset force to the first radial pusher to move in a direction closer to the rotation axis.

[0015] As an optional implementation, the first radial pushing member includes a first guide portion and a first mating portion. The first guide portion is slidably disposed on the first rotating disk along the rotation axis. The first reset member is connected between the first guide portion and the first mating portion. The first mating portion has a first inclined surface at one end near the first rotating member.

[0016] As an optional implementation, the first radial pusher includes a first guide portion and a first mating portion. The first guide portion is slidably disposed on the first rotating disk along the rotation axis. The first mating portion is connected to the first guide portion. The first mating portion has a first inclined surface at one end near the first rotating member. The first correction module also includes a first stop member. The first reset member is disposed between the first mating portion and the first stop member.

[0017] As an optional implementation, the first correction module further includes a second reset member, which is capable of providing a reset force to the first end of the first rotating member to rotate in the direction of the first radial pushing member.

[0018] As an optional implementation, one end of the second reset member is connected to the first rotating disk, and the other end is connected to the first rotating member, and is located between the rotation axis of the first rotating member and the first end of the first rotating member.

[0019] As an optional implementation, the second end of the first rotating member is provided with a third inclined surface, which is configured to convert the tangential force of the first rotating member along the rotation trajectory into the first axial thrust on the silicon wafer.

[0020] As an optional implementation, the outer surface of the protrusion is an arc surface.

[0021] As an optional implementation, the protrusion is disposed on the side facing the unloading station.

[0022] Secondly, this application discloses an automated flipping device, the automated flipping device comprising:

[0023] The flipping device as described in any of the first aspects;

[0024] A first conveying device is used to convey the silicon wafer after it has been flipped by the flipping device.

[0025] A second conveying device is used to convey silicon wafers into the flipping device.

[0026] As an optional implementation, the first conveying device includes a first conveying track and a first receiving component. The first receiving component is disposed on the first conveying track and is used to receive the flipped silicon wafer. The first conveying track is used to transport the silicon wafer to the next work station.

[0027] As an optional implementation, the first receiving component includes a first receiving member and two first limiting members. The first receiving member is disposed on the first conveying track and is used to receive the silicon wafer. The two first limiting members are respectively disposed at both ends of the first receiving member along the conveying direction of the first conveying track to restrict the movement of the silicon wafer in the conveying direction of the first conveying track.

[0028] As an optional implementation, the first receiving member is provided with two opposite sides along the width direction of the silicon wafer, and the two snap-fit ​​parts are configured to snap onto the two opposite sides of the silicon wafer along the width direction.

[0029] Compared with the prior art, the beneficial effects of this application are:

[0030] The flipping device provided in this application embodiment is used to flip silicon wafers and transport them to a first receiving assembly. The flipping device includes a first rotating disk, a second rotating disk, and a correction module. Both the first and second rotating disks are capable of rotating around a first rotation direction, and their rotation axes are located on the same straight line. A first mounting member is provided on the first rotating disk, and the first mounting member has a first limiting groove. A second mounting member is provided on the second rotating disk, and the second mounting member is correspondingly arranged to the first mounting member in the width direction of the silicon wafer. The second mounting member has a second limiting groove. The first limiting groove and the second limiting groove are respectively used to accommodate two opposite sides of the silicon wafer along the width direction. When the first and second rotating disks rotate around the first rotation direction, they can drive the first and second mounting components to rotate between the loading and unloading stations, so that the silicon wafers are flipped and the unloading station corresponds to the position of the first receiving component. The correction module is set on the first and second rotating disks. When the silicon wafers are flipped, the correction module can contact the silicon wafers and adjust their positions along the width direction of the silicon wafers so that the silicon wafers correspond to the position of the first receiving component in their width direction. In this way, the silicon wafers can smoothly enter the first receiving component without colliding with the first receiving component and causing damage to the silicon wafers, thus ensuring the quality of the silicon wafers, maintaining the stability of the production line, and improving product yield and production efficiency. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 This is a schematic diagram of the flipping device disclosed in the embodiments of this application from a first-view perspective;

[0033] Figure 2 This is a schematic diagram of the structure of the first rotating disk disclosed in the embodiments of this application;

[0034] Figure 3 This is a schematic diagram of the structure of the second rotating disk disclosed in an embodiment of this application;

[0035] Figure 4 This is a schematic diagram of the structure of the first correction module disclosed in the embodiments of this application;

[0036] Figure 5 This is another structural schematic diagram of the first correction module disclosed in the embodiments of this application;

[0037] Figure 6 This is a schematic diagram of the flipping device disclosed in an embodiment of this application from a second perspective.

[0038] Figure 7 for Figure 6 A magnified view of a section at point A in the middle;

[0039] Figure 8 This is a schematic diagram of the structure of the automated flipping device disclosed in the embodiments of this application;

[0040] Figure 9 This is a schematic diagram of the structure of the first receiving component disclosed in an embodiment of this application.

[0041] Explanation of reference numerals in the attached figures:

[0042] 100-Tilting device; a-Loading station; b-Unloading station; 1-First rotating wheel; 11-First mounting component; 111-First limiting groove; 2-Second rotating wheel; 21-Second mounting component; 211-Second limiting groove; 3-Correcting module; 31-First correcting module; 311-First radial pushing component; 311a-First inclined surface; 3111-First guide part; 3112-First mating part; 312-First rotating component; 312a-Second inclined surface; 312b-Third inclined surface; 313-First resetting component; 314-First stop component; 315-Second resetting component ; 32-Second correction module; 321-Second radial pusher; 322-Second rotating component; 4-Rotating shaft; 41-Protrusion; 200-Automatic flipping equipment; 5-First conveying device; 51-First conveying track; 52-First receiving component; 521-First receiving component; 5211-Snap-fit ​​part; 522-First limiting component; 6-Second conveying device; 61-Second conveying track; 62-Second receiving component; 7-Silicon wafer; F1-First radial thrust; F2-Second radial thrust; F3-First axial thrust; F4-Second axial thrust; X-First rotation direction. Detailed Implementation

[0043] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0044] In this application, the terms "upper," "left," "right," "front," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0045] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0046] Furthermore, the terms "installation," "setup," "equipped with," and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0047] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, elements, or components (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, elements, or components. Unless otherwise stated, "a plurality of" means two or more.

[0048] The field of solar cell manufacturing technology primarily involves technologies related to the production of cells that convert solar energy into electrical energy. It encompasses the entire production process, from raw material selection to the final cell product, with the aim of manufacturing efficient, stable, and cost-effective solar cells. This field utilizes the photoelectric effect of semiconductor materials. When sunlight shines on a solar cell, photons interact with electrons in the semiconductor, giving the electrons sufficient energy to transition from the valence band to the conduction band, thereby generating an electric current. Heterojunction solar cells are a type of highly efficient solar cell structure. They consist of a PN structure formed from different semiconductor materials; for example, a heterojunction is typically formed on a crystalline silicon wafer using materials such as amorphous silicon or microcrystalline silicon. This structure possesses unique electrical and optical properties.

[0049] In the fabrication of heterojunction solar cells, the coating process is crucial. It requires the precise deposition of various thin films on the silicon wafer surface, such as intrinsic amorphous silicon layers and doped amorphous silicon layers. After texturing and unloading, the silicon wafers are transported by AGV (Automated Guided Vehicle) carts to the PECVD (Plasma Enhanced Chemical Vapor Deposition) loading position. The carts dock with the CVD (Chemical Vapor Deposition Automation) automation position (this automation is named CVDS), and the carts and automation belts transport a batch of baskets filled with silicon wafers into the automation system, completing the CVD automated loading process. After the loading is completed, the CVD loading automation system (CVDS, Chemical Vapor Deposition System) will again transport the individual baskets to the designated positions via belt conveyor and basket lifting. Then, the wafers are placed on the wafer track by the pull handle in the basket. Each time the pull handle picks up and places a wafer, the track moves forward one grid. When the track is full of wafers, the receiving platform is lifted up, and the edge of the wafer contacts the receiving platform to lift the wafer. Then, the CVDS gantry moves to pick up the wafer and transport it to the carrier plate. The carrier plate is then transported to the first cavity of the main machine for process operations such as coating. Due to the process requirements for silicon wafer coating, after the silicon wafer exits the coating cavity, it is transferred via a carrier plate to the first automated flipping (CVDF1) for the first flipping and then transferred to the main machine for the second coating. After the second coating is completed, it is transferred to the second automated flipping (CVDF2) for the second flipping and then transferred to the main machine for the third coating. After the coating is completed, it is transferred to the automated unloading (CVDX). In this process, the silicon wafer undergoes two flippings and a total of three main machine coating processes.

[0050] After the silicon wafers are coated on the main unit, they are transported to the CVDF1 via a magnetic fluid transfer system inside the cavity. The CVDF1 then picks up the wafers through its gantry. After picking, the wafers move from the gantry to the CVDF1 track for placement. The CVDF1 track consists of two independent tracks and a rotating Ferris wheel (wafer flipper), with the flipper positioned between the two tracks. Once the gantry places the wafers on the track, the track transports them to the flipper. Each time a wafer enters, the flipper rotates clockwise one step forward, repeating this cycle to flip the wafers from left to right, thus achieving the wafer flipping function. The flipper also acts as a buffer for the wafers.

[0051] CVDF1 is divided into two parts: CVDF1X (lower) and CVDF1S (upper). CVDF1X is the coating exit cavity and carrier plate unloading section; CVDF1S is the coating inlet cavity and carrier plate loading section. It can be simplified as follows: the left side of the flipper is entirely CVDF1X, and the right side is entirely CVDF1S. CVDF1 has an independent gantry on each side to realize the unloading and loading functions of the carrier plates. CVDF2 is divided into two parts: CVDF2X (unloading) and CVDF2S (loading). CVDF2X is the coating exit cavity and carrier plate unloading section; CVDF2S is the coating inlet cavity and carrier plate loading section. It can be simplified as follows: the left side of the flipper is entirely CVDF2X, and the right side is entirely CVDF2S. CVDF2 has an independent gantry on each side to realize the unloading and loading functions of the carrier plates.

[0052] In CVDF1X and CVDF2X, silicon wafers are placed on the track by a gantry suction device. The wafers on this side of the track are received using a suspended receiving component, consisting of two small wing-like parts, resembling an inverted trapezoid when viewed from the side. The wafers are secured by pins at the front and rear, minimizing the contact area between the wafers and the track and significantly reducing the risk of scratches during transport. However, during the wafer flipping process, the gantry suction device introduces some positional error, causing the wafer insertion interface of the flipping machine to be slightly wider than the wafer width. This results in a small amount of movement in the width direction of the wafer during flipping, indirectly exacerbating the positional shift of the wafers after flipping. If the wing-like receiving component is used again in CVDF1S and CVDF2S, the wafers will collide with the component in the width direction, leading to mass scratches or fragmentation.

[0053] To address the aforementioned issues, the inventors further improved the automated flipping device by replacing the wing-like receiving component with a square one that contacts the bottom of the silicon wafer (support point). This prevents the flipped silicon wafer from colliding with the receiving component in its width direction. However, this increases the contact area between the silicon wafer and the track, and the contact point between the silicon wafer and the receiving component will produce a support point mark, affecting the quality of the silicon wafer.

[0054] Based on this, this application discloses a flipping device that can adjust the position of the silicon wafer along the width direction so that the silicon wafer corresponds to the position of the first receiving component in the width direction of the silicon wafer, so that the silicon wafer can smoothly enter the first receiving component without collision and damage.

[0055] The technical solution of this application will be further described below with reference to the embodiments and accompanying drawings.

[0056] Please see Figure 1 , Figures 6 to 9 , Figure 1 This is a schematic diagram of the flipping device 100 disclosed in the embodiments of this application from a first-view perspective. Figure 6 This is a schematic diagram of the flipping device 100 disclosed in the embodiments of this application from a second perspective. Figure 7 for Figure 6 A magnified view of a portion of point A in the middle. Figure 8 This is a schematic diagram of the structure of the automated flipping device 200 disclosed in an embodiment of this application. Figure 9 This is a schematic diagram of the structure of the first receiving component 52 disclosed in an embodiment of this application. This application also discloses a flipping device 100 for flipping the silicon wafer 7 and transporting it to the first receiving component 52. The flipping device 100 includes:

[0057] A first rotating wheel 1 is capable of rotating around a first rotation direction X. A first mounting component 11 is provided on the first rotating wheel 1, and a first limiting groove 111 is provided on the first mounting component 11.

[0058] The second rotating disk 2 is capable of rotating around the first rotation direction X. The rotation axes of the first rotating disk 1 and the second rotating disk 2 are located on the same straight line. The second rotating disk 2 is provided with a second mounting member 21, which is correspondingly arranged with the first mounting member 11 in the width direction of the silicon wafer 7. The second mounting member 21 is provided with a second limiting groove 211. The first limiting groove 111 and the second limiting groove 211 are respectively used to accommodate the two opposite sides of the silicon wafer 7 along the width direction. When the first rotating disk 1 and the second rotating disk 2 rotate around the first rotation direction X, they can drive the first mounting member 11 and the second mounting member 21 to rotate between the loading station a and the unloading station b, so that the silicon wafer 7 can be flipped. The unloading station b corresponds to the position of the first receiving component 52.

[0059] The correction module 3 is disposed on the first rotating disk 1 and the second rotating disk 2. When the silicon wafer 7 is flipped, the correction module 3 can contact the silicon wafer 7 and adjust the position of the silicon wafer 7 along the width direction of the silicon wafer 7 so that the position of the silicon wafer 7 corresponds to that of the first receiving component 52 in the width direction of the silicon wafer 7.

[0060] It should be noted that the loading station a and unloading station b here refer to the loading and unloading of silicon wafer 7 on the flipping device 100. The position where silicon wafer 7 enters the flipping device 100 is the loading station a, and the position where silicon wafer 7 docks with the first receiving component 52 after being flipped by the flipping device 100 is the unloading station b.

[0061] When the silicon wafer 7 is flipped from the loading station a to the unloading station b by the first rotating wheel 1 and the second rotating wheel 2, the distance between the mounting parts on the two wheels may be greater than the width of the silicon wafer 7 itself, and there may be slight vibrations during the rotation process, resulting in a positional deviation in the width direction of the silicon wafer 7. The correction module 3 can correct this deviation to ensure that the silicon wafer 7 can smoothly reach the receiving position of the first receiving component 52. The first receiving component 52, which is similar to a small wing shape, can still be used later without collision, thus reducing the number of defective products caused by damage to the silicon wafer 7.

[0062] By preventing collisions between the silicon wafer 7 and the first receiving component 52, the integrity of the silicon wafer 7 is ensured. The quality of the silicon wafer 7 directly affects subsequent processing and use; if the surface of the silicon wafer 7 is damaged, it may affect its electrical or other physical properties. The correction module 3 indirectly ensures the quality of the silicon wafer 7 by ensuring that it enters the first receiving component 52 smoothly and without damage.

[0063] On the one hand, the correction module 3 reduces equipment downtime caused by issues such as collisions between the silicon wafer 7 and the first receiving component 52. Equipment downtime for maintenance or adjustment can severely impact production efficiency, and the correction module 3 avoids such situations. On the other hand, it reduces the need for manual intervention, eliminating the need for manual adjustment of improperly positioned silicon wafers 7, making the entire production process smoother and thus improving production efficiency.

[0064] Optionally, combined Figures 1 to 3 , Figure 6 and Figure 7 , Figure 2 This is a schematic diagram of the structure of the first rotating disk 1 disclosed in the embodiments of this application. Figure 3This is a schematic diagram of the structure of the second rotating disk 2 disclosed in the embodiments of this application. The flipping device 100 also includes a rotating shaft 4. The first rotating disk 1 and the second rotating disk 2 are both rotatably connected to the rotating shaft 4. The rotating shaft 4 is provided with a protrusion 41. The correction module 3 includes a first correction module 31 and a second correction module 32. The first correction module 31 is disposed on the first rotating disk 1. One end of the first correction module 31 is close to the rotating shaft 4, and the other end extends into the first limiting groove 111. When the first correction module 31 rotates to the lower material station b, the protrusion 41 can apply a first radial thrust F1 to the first correction module 31. The first correction module 31 can convert the first radial thrust F1 into a first axial thrust F3 on the silicon wafer 7. The first axial thrust F3 points towards the second mounting member 21.

[0065] The second correction module 32 is disposed on the second rotating wheel 2. One end of the second correction module 32 is close to the rotating shaft 4, and the other end extends into the second limiting groove 211. When the second correction module 32 rotates to the lower material station b, the protrusion 41 can apply a second radial thrust F2 to the second correction module 32. The second correction module 32 can convert the second radial thrust F2 into a second axial thrust F4 on the silicon wafer 7. The second axial thrust F4 points towards the first mounting member 11.

[0066] When the wheel rotates, the protrusion 41 interacts with the correction module 3, enabling the silicon wafer 7 to be positioned during the flipping process. This design cleverly utilizes the rotation of the wheel and the cooperation between the protrusion 41 and the correction module 3 to convert the force during rotation into an adjustment force on the silicon wafer 7 in the width direction, ensuring that the silicon wafer 7 can accurately correspond to the first receiving component 52 in the width direction.

[0067] In the actual silicon wafer 7 processing, there may be some deviation in the initial placement of silicon wafer 7. With this structure, as the wheel rotates, the correction module 3 can automatically adjust the silicon wafer 7, just like an automatic calibration device, which improves the accuracy of silicon wafer 7 processing.

[0068] As the first correction module 31 rotates towards the feeding station b, the protrusion 41 applies a first radial thrust F1 to the first correction module 31. The first correction module 31 then converts this radial thrust F1 into a first axial thrust F3 on the silicon wafer 7 (pointing towards the second mounting component 21). Similarly, the second correction module 32 undergoes a similar force conversion process. This force conversion mechanism allows for more precise adjustment of the silicon wafer 7's position. Because the radial thrust is converted into axial thrust through a specific structure, the position of the silicon wafer 7 in the width direction can be adjusted more specifically. Compared to simple direct pushing, this converted thrust better adapts to the dynamic positional changes of the silicon wafer 7 during the flipping process, thereby more accurately adjusting the silicon wafer 7 to the correct position, reducing the possibility of misalignment between the silicon wafer 7 and the first receiving component 52, and thus improving the conveying efficiency and quality of the silicon wafer 7.

[0069] The first correction module 31 and the second correction module 32 are located on both sides of the silicon wafer 7, adjusting the silicon wafer 7 from two directions. This bidirectional adjustment mechanism can better correct various positional deviations that may occur in the width direction of the silicon wafer 7. The silicon wafer 7 may be subjected to external forces or have a large initial placement deviation on one side. Through the coordinated adjustment of the two correction modules 3, it can be ensured that the center position of the silicon wafer 7 in the width direction accurately corresponds to the first receiving component 52, thereby improving the accuracy and reliability of the silicon wafer 7's position adjustment.

[0070] The design, which integrates the correction module 3 with components such as the rotating shaft 4 and the rotating wheel, improves the equipment's integration. All these components work together to achieve the flipping and positioning adjustment of the silicon wafer 7 within a relatively compact space. In industries with high space utilization requirements, such as semiconductor manufacturing, this compact design reduces the equipment's footprint while also facilitating overall layout and maintenance.

[0071] In some possible implementations, combined Figures 1 to 3 , Figure 6 and Figure 7 The first correction module 31 includes a first radial pusher 311 and a first rotating member 312. The first radial pusher 311 is slidably disposed on the first rotating disk 1 along the radial direction of the rotating shaft 4. The first rotating member 312 is rotatably disposed on the first rotating disk 1. The first end of the first rotating member 312 faces the first radial pusher 311, and the second end of the first rotating member 312 faces the first mounting member 11. When the first correction module 31 rotates to the lower material station b, the protrusion 41 can apply a first radial thrust F1 to the first radial pusher 311. The first radial pusher 311 moves radially along the rotating shaft 4 to drive the first rotating member 312 to rotate, so that the second end of the first rotating member 312 extends into the first limiting groove 111 and applies a first axial thrust F3 to the silicon wafer 7.

[0072] The second correction module 32 includes a second radial pusher 321 and a second rotating member 322. The second radial pusher 321 is slidably disposed on the second rotating disk 2 along the radial direction of the rotation axis 4. The second rotating member 322 is rotatably disposed on the second rotating disk 2. The first end of the second rotating member 322 faces the second radial pusher 321, and the second end of the second rotating member 322 faces the second mounting member 21. When the second correction module 32 rotates to the lower material station b, the protrusion 41 can apply a second radial thrust F2 to the second radial pusher 321. The second radial pusher 321 moves radially along the rotation axis 4 to drive the second rotating member 322 to rotate, so that the second end of the second rotating member 322 extends into the second limiting groove 211 and applies a second axial thrust F4 to the silicon wafer 7.

[0073] The first radial pusher 311 is slidably disposed on the first rotating disk 1 along the radial direction of the rotation axis 4. This sliding arrangement allows the first radial pusher 311 to flexibly respond to the radial thrust applied by the protrusion 41. When the protrusion 41 applies a first radial thrust F1 to the first radial pusher 311, the first radial pusher 311 moves radially, thereby driving the first rotating member 312 to rotate. The second end of the first rotating member 312 extends into the first limiting groove 111 and applies a first axial thrust F3 to the silicon wafer 7. This structural design converts radial motion into rotation, and then into an axial thrust on the silicon wafer 7, allowing for more precise control over the direction and magnitude of the thrust on the silicon wafer 7. For example, during the flipping process of the silicon wafer 7, different positions and states of the silicon wafer 7 may require different magnitudes and directions of adjustment forces, and this structure can make precise adjustments according to the actual situation. Similarly, the structural design of the second correction module 32 has the same effect. The cooperation of the second radial pusher 321 and the second rotating member 322 of the second correction module 32, when the protrusion 41 applies the second radial thrust F2 to the second radial pusher 321, can convert it into the second axial thrust F4 on the silicon wafer 7, thereby making precise position adjustment on the other side of the silicon wafer 7.

[0074] The engagement relationship between the first radial pusher 311 and the first rotating member 312, and between the second radial pusher 321 and the second rotating member 322, is relatively stable. As long as the radial thrust applied by the protrusion 41 exists, the silicon wafer 7 can be continuously and correctly adjusted. The silicon wafer 7 can enter the first receiving assembly 52 more accurately, reducing the potential risk of damage to the equipment. If the silicon wafer 7 collides with the equipment or rubs due to improper positioning, it may damage some parts of the equipment. This situation is now avoided, improving the reliability of the equipment and reducing the maintenance and repair costs.

[0075] In some embodiments, combined with Figure 2 and Figure 4 , Figure 4This is a schematic diagram of the structure of the first correction module 31 disclosed in the embodiment of this application. The first radial pusher 311 has a first inclined surface 311a at one end near the first rotating member 312, and the first end of the first rotating member 312 has a second inclined surface 312a. The inclination angles of the first inclined surface 311a and the second inclined surface 312a are matched.

[0076] This inclined surface design facilitates efficient force transmission. When the first radial pusher 311 moves under the radial thrust applied by the protrusion 41, the interaction between the first inclined surface 311a and the second inclined surface 312a more smoothly converts the radial thrust into a force that rotates the first rotating member 312. For example, compared to planar contact, the presence of the inclined surface makes the decomposition and transmission of force more natural, reduces force loss during transmission, and ensures that the first rotating member 312 can more effectively receive the thrust from the first radial pusher 311 and rotate.

[0077] By adapting the inclined plane, the rotation angle and speed of the first rotating member 312 can be controlled more precisely. Since the second end of the first rotating member 312 extends into the first limiting groove 111 and applies axial thrust to the silicon wafer 7, precise control of the rotation of the first rotating member 312 can more accurately adjust the position of the silicon wafer 7 in the width direction.

[0078] As an optional implementation, it is combined with 2 and Figure 4 The first correction module 31 also includes a first reset member 313, which can provide a reset force to the first radial push member 311 to move in a direction closer to the rotation axis 4.

[0079] During the flipping of silicon wafer 7, when the first radial pusher 311 moves away from the rotation axis 4 due to the radial thrust applied by the protrusion 41, the first reset member 313 ensures that it returns to its initial position at the appropriate time. After each flipping of silicon wafer 7, the first radial pusher 311 needs to return to its initial state so that it can accurately respond to the thrust of the protrusion 41 during the next flipping of silicon wafer 7. The first reset member 313 can return to its original shape after being stretched or compressed by external forces, ensuring the cyclic use and stable operation of the correction module 3.

[0080] Since the first reset member 313 enables the first radial pusher 311 to be accurately reset, this helps improve the working accuracy of the entire correction module 3. If the first radial pusher 311 cannot be accurately reset, its pushing action on the first rotating member 312 may deviate during the next flip of the silicon wafer 7. If the first radial pusher 311 is not fully reset, the magnitude and direction of the force it transmits to the first rotating member 312 when it is pushed by the protrusion 41 next time may be different from the expected one, thus affecting the position adjustment accuracy of the silicon wafer 7. The first reset member 313 ensures its accurate reset, thereby ensuring that the adjustment of the silicon wafer 7 is accurate and reliable every time.

[0081] Once the first radial pusher 311 is stably reset, during the next round of silicon wafer 7 flipping, the force transmission relationship within the correction module 3 and the interaction between components can proceed according to design requirements. Abnormal forces or interference will not occur due to positional deviations of the first radial pusher 311, thus ensuring the stability of the silicon wafer 7 flipping process. The first reset member 313 reduces the risk of equipment failure and improves equipment reliability. The equipment can operate continuously and stably, reducing the frequency and cost of maintenance and repair.

[0082] Some possible implementation methods, combined with Figure 2 and Figure 4 The first radial pushing member 311 includes a first guide portion 3111 and a first mating portion 3112. The first guide portion 3111 is slidably disposed on the first rotating disk 1 along the radial direction of the rotating shaft 4. The first reset member 313 is connected between the first guide portion 3111 and the first mating portion 3112. The first mating portion 3112 is provided with a first inclined surface 311a at one end near the first rotating member 312.

[0083] The first reset member 313 is connected between the first guide portion 3111 and the first mating portion 3112. This connection allows the first reset member 313 to more effectively provide a reset force to the first radial push member 311 to move closer to the rotation axis 4. When the first radial push member 311 is subjected to the radial thrust of the protrusion 41, causing the first mating portion 3112 to move outward along the first guide portion 3111, the first reset member 313 can accurately pull back the first mating portion 3112 and push the first guide portion 3111 back to abut against the rotation axis 4 based on its connection between the two, ensuring the reset accuracy of the first radial push member 311. The first mating portion 3112 has a first inclined surface 311a at one end near the first rotating member 312, which helps to improve accuracy during force transmission. When the first radial pusher 311 is subjected to radial thrust, the force is transmitted to the first inclined surface 311a through the structure of the first guide part 3111 and the first mating part 3112, and then interacts with the second inclined surface 312a of the first rotating part 312.

[0084] Specifically, the first guide portion 3111 may have a groove on the side near the first rotating disk 1, and the length direction of the groove is arranged along the axial direction of the rotation axis. Correspondingly, the first rotating disk 1 is provided with a mating part, which may be a screw or a protruding block, etc. The mating part can extend into the groove. When the first guide portion 3111 moves along the axial direction of the rotation axis, the groove moves accordingly. The mating part restricts the movement direction of the groove, thereby achieving a guiding effect on the first guide portion 3111.

[0085] Optionally, combined Figure 5 , Figure 5 This is another structural schematic diagram of the first correction module 31 disclosed in the embodiments of this application. The first radial pusher 311 includes a first guide portion 3111 and a first mating portion 3112. The first guide portion 3111 is slidably disposed on the first rotating disk 1 along the radial direction of the rotation axis 4. The first mating portion 3112 is connected to the first guide portion 3111. The first mating portion 3112 is provided with a first inclined surface 311a at one end near the first rotating member 312. The first correction module 31 also includes a first stop member 314. The first reset member 313 is disposed between the first mating portion 3112 and the first stop member 314.

[0086] This configuration allows the first reset member 313 to more effectively provide reset force to the first radial push member 311. After the correction module 3 completes the position adjustment of the silicon wafer 7, the first reset member 313 can accurately reset the first radial push member 311, ensuring that the initial position of the first radial push member 311 is accurate during the next correction operation, thereby ensuring the repeatability and accuracy of the entire correction module 3 in adjusting the position of the silicon wafer 7.

[0087] In some alternative implementations, combined with Figure 4 The first correction module 31 also includes a second reset member 315, which can provide a reset force to the first end of the first rotating member 312 in the direction of rotation towards the first radial pushing member 311.

[0088] During the flipping of silicon wafer 7, the first rotating member 312 rotates according to the pushing action of the first radial pushing member 311 to apply axial thrust to silicon wafer 7. After this operation is completed, the second resetting member 315 ensures that the first rotating member 312 returns to its initial position. Because the second resetting member 315 ensures accurate resetting of the first rotating member 312, it helps improve the working accuracy of the first rotating member 312 during subsequent silicon wafer 7 flipping processes. If the first rotating member 312 cannot accurately reset, the engagement relationship between it and the first radial pushing member 311 will deviate. During the next silicon wafer 7 flip, the inaccurate starting angle of the first rotating member 312 will cause abnormal response to the first radial pushing member 311, thus affecting the position adjustment accuracy of silicon wafer 7. The second resetting member 315 ensures accurate resetting, thereby ensuring that each adjustment of silicon wafer 7 is accurate and reliable.

[0089] It is understood that the first reset member 313 and the second reset member 315 can be any possible elastic member capable of providing a reset force, such as a spring, and this embodiment does not limit this.

[0090] As an optional implementation method, combined with Figure 4 One end of the second reset member 315 is connected to the first rotating disk 1, and the other end is connected to the first rotating member 312, and is located between the rotation axis of the first rotating member 312 and the first end of the first rotating member 312.

[0091] Because it is close to the first end of the first rotating member 312, the reset force can act more directly on the part that needs to be reset, allowing the first rotating member 312 to return to its initial position more efficiently and accurately after adjusting the position of the silicon wafer 7. This connection position helps ensure the accuracy of the reset of the first rotating member 312. This is because it is set based on the structural characteristics of the first rotating member 312, taking into account factors such as the rotation axis of the first rotating member 312. During the flipping process of the silicon wafer 7, the rotation angle and direction of the first rotating member 312 are determined according to the design of the correction module 3, and the connection of the second reset member 315 at this specific position ensures that the first rotating member 312 returns to the correct angle and position during reset, thereby ensuring the consistency of the correction module 3 in each operation.

[0092] In some alternative implementations, combined with Figure 4 The second end of the first rotating member 312 is provided with a third inclined surface 312b, which is configured to convert the tangential force of the first rotating member 312 along the rotation trajectory into a first axial thrust F3 on the silicon wafer 7.

[0093] This inclined structure can effectively change the direction of force. During the flipping process of silicon wafer 7, the tangential force generated by the rotation of the first rotating component 312 is converted into an axial thrust on silicon wafer 7 in the width direction through the structure of the third inclined surface 312b, thereby realizing the adjustment of the position of silicon wafer 7. This force conversion method is more direct and efficient compared to other complex force transmission structures.

[0094] The presence of the third inclined plane 312b allows for precise control of the thrust direction on the silicon wafer 7. Due to the specific angle and shape of the inclined plane, it ensures that the converted axial thrust accurately points in the direction the silicon wafer 7 needs to be adjusted, thus aligning the silicon wafer 7 with the first receiving component 52 in the width direction. This helps improve the accuracy of the silicon wafer 7's position adjustment, preventing unnecessary displacement of the silicon wafer 7 or collisions with other components during the adjustment process due to force direction deviations.

[0095] It should be noted that the second correction module 32 has the same structure as the first correction module 31, that is, the structure of the second radial pusher 321 is the same as the structure of the first radial pusher 311, the structure of the second rotating member 322 is the same as the structure of the first rotating member 312, and it also has the structure of the first reset member 313 and the second reset member 315, which will not be described in detail here.

[0096] Optionally, combined Figures 2 to 4 The outer surface of the protrusion 41 is an arc surface. This shape helps to smoothly transmit force when the straightening module 3 is working. When the first straightening module 31 or the second straightening module 32 rotates to the material feeding station b, the protrusion 41 applies a radial thrust to the straightening module 3.

[0097] The curved surface allows for a more uniform and stable transmission of radial thrust. Compared to other shapes (such as square or angular shapes), the curved surface avoids sudden force changes or stress concentration points, thus reducing potential vibrations or abnormal stress on the correction module 3 when receiving thrust. The smoother force transmission also reduces wear between the protrusion 41 and the correction module 3. Excessive localized stress prevents accelerated wear, extending the lifespan of related components and reducing equipment maintenance costs.

[0098] In some possible implementations, combined Figure 2The protrusion 41 is located on the side facing the unloading station b. During the transfer of the silicon wafer 7 from the flipping device 100 to the first receiving assembly 52, the protrusion 41 at this location can better perform its function on the straightening module 3. When the straightening module 3 rotates with the rotating wheel to the unloading station b, the protrusion 41 is in a suitable position and can apply radial thrust to the straightening module 3 in a timely and effective manner, thereby ensuring that the straightening module 3 accurately adjusts the position of the silicon wafer 7, so that the silicon wafer 7 can smoothly enter the first receiving assembly 52 corresponding to the unloading station b.

[0099] The direction and timing of the thrust applied to the correction module 3 are matched with the unloading and transfer process of the silicon wafer 7. This helps improve the accuracy of the alignment between the silicon wafer 7 and the first receiving component 52 in the width direction. When the silicon wafer 7 is about to reach the unloading station b, the protrusion 41 can precisely push the correction module 3, allowing the position of the silicon wafer 7 to be finely adjusted, reducing the positional deviation of the silicon wafer 7 during the unloading process, and improving the success rate of transferring the silicon wafer 7 to the first receiving component 52.

[0100] Secondly, this application also discloses an automated flipping device 200, please refer to... Figure 8 The automated flipping device 200 includes;

[0101] As described in the first aspect, the flipping device 100;

[0102] The first conveying device 5 is used to convey the silicon wafer 7 after it has been flipped by the flipping device 100, and is located at the unloading station b.

[0103] The second conveying device 6 is used to convey the silicon wafer 7 into the flipping device 100, located at the loading station a.

[0104] The second conveying device 6 transports the silicon wafer 7 to the flipping device 100, which flips the silicon wafer 7. The flipped silicon wafer 7 is then transported to the second conveying device 6, which transports it to the next station for a second coating. The silicon wafer 7 can smoothly enter the first receiving assembly 52 without malfunctioning due to inaccurate positioning, thus helping to maintain the stable operation of the entire production line, reducing damage to the silicon wafer 7, and improving product yield.

[0105] Optionally, combined Figure 8The first conveying device 5 includes a first conveying track 51 and a first receiving component 52. The first receiving component 52 is disposed on the first conveying track 51 and is used to receive the flipped silicon wafer 7. The first conveying track 51 is used to transport the silicon wafer 7 to the next work station. The second conveying device 6 includes a second conveying track 61 and a second receiving component 62. The second receiving component 62 is disposed on the second conveying track 61 and is used to receive the silicon wafer 7. The second conveying track 61 transports the silicon wafer 7 to the flipping device 100.

[0106] This provides an efficient transportation method for the subsequent processing of silicon wafer 7, enabling it to be transported quickly and stably to the next process, avoiding delays and risks that may be caused by manual handling. The silicon wafer 7 does not require complex transfer operations during its journey from the flipping device 100 to the next workstation, reducing the risk of damage to the silicon wafer 7 or production delays that may result from pauses or improper operation during the transfer process.

[0107] In some embodiments, combined with Figure 8 The first receiving component 52 includes a first receiving member 521 and two first limiting members 522. The first receiving member 521 is disposed on the first conveying track 51 and is used to receive the silicon wafer 7. The two first limiting members 522 are respectively disposed at both ends of the first receiving member 521 along the conveying direction of the first conveying track 51 to restrict the movement of the silicon wafer 7 in the conveying direction of the first conveying track 51.

[0108] The two first limiting members 522 can precisely limit the movement of the silicon wafer 7 in the conveying direction of the first conveying track 51. During the transportation of the silicon wafer 7, if the silicon wafer 7 is not limited in the conveying direction, it may deviate from the correct position due to vibration, acceleration, deceleration or other factors during transportation, which may cause damage to the silicon wafer 7.

[0109] Specifically, the first limiting member 522 can be a pin, and the silicon wafer 7 is held between the two pins on both sides along the transport direction, which makes it less likely to cause wear to the silicon wafer 7 and affect its performance.

[0110] Because the silicon wafer 7 is confined in the transport direction, its transport on the first receiving assembly 52 is more stable. The silicon wafer 7 will not slide or deviate from the predetermined transport path, ensuring transport stability. This helps reduce energy loss and equipment wear during transport, while also improving the reliability of the entire transport process.

[0111] It should be noted that the second receiving component 62 has the same structure as the first receiving component 52, which will not be described in detail here.

[0112] As an optional implementation method, combined with Figure 8 and Figure 9The first receiving member 521 has two opposite sides with snap-fit ​​parts 5211 along the width direction of the silicon wafer 7, and the two snap-fit ​​parts 5211 are configured to snap-fit ​​the two opposite sides of the silicon wafer 7 along the width direction.

[0113] This snap-fit ​​design securely fixes the silicon wafer 7 in the width direction, preventing it from wobbling or shifting and ensuring its accurate positioning on the first receiving component 52. Furthermore, compared to a fulcrum support, this first receiving component 521 prevents the upper and lower surfaces of the silicon wafer 7 from contacting it, avoiding fulcrum marks and significantly reducing the risk of scratches during transport, thus minimizing the number of defective products caused by wafer damage.

[0114] It should be noted that the second receiving component has the same structure as the first receiving component 521, which will not be described in detail here.

[0115] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A flipping device for flipping a silicon wafer and transporting the silicon wafer to a first receiving assembly, characterized in that, The flipping device includes: A first rotating disk, the first rotating disk being able to rotate around a first rotation direction, the first rotating disk being provided with a first mounting component, the first mounting component being provided with a first limiting groove; The second rotating disk is rotatable around the first rotation direction. The rotation axes of the first and second rotating disks are on the same straight line. The second rotating disk is provided with a second mounting member, which is correspondingly arranged with the first mounting member in the width direction of the silicon wafer. The second mounting member is provided with a second limiting groove. The first and second limiting grooves are respectively used to accommodate two opposite sides of the silicon wafer along the width direction. When the first and second rotating disks rotate around the first rotation direction, they can drive the first and second mounting members to rotate between the loading station and the unloading station, so as to flip the silicon wafer. The unloading station corresponds to the position of the first receiving component. A correction module is disposed on the first rotating disk and the second rotating disk. When the silicon wafer is flipped, the correction module can contact the silicon wafer and adjust the position of the silicon wafer along the width direction of the silicon wafer so that the position of the silicon wafer corresponds to that of the first receiving component in the width direction of the silicon wafer.

2. The flipping device according to claim 1, characterized in that, The flipping device further includes a rotating shaft, and both the first rotating disk and the second rotating disk are rotatably connected to the rotating shaft. The rotating shaft is provided with a protrusion. The straightening module includes a first straightening module and a second straightening module. The first straightening module is disposed on the first rotating disk. One end of the first straightening module is close to the rotating shaft, and the other end extends into the first limiting groove. When the first straightening module rotates toward the unloading station, the protrusion can apply a first radial thrust to the first straightening module. The first straightening module can convert the first radial thrust into a first axial thrust on the silicon wafer. The first axial thrust points toward the second mounting member. The second correction module is disposed on the second rotating wheel. One end of the second correction module is close to the rotating shaft, and the other end extends into the second limiting groove. When the second correction module rotates toward the unloading station, the protrusion can apply a second radial thrust to the second correction module. The second correction module can convert the second radial thrust into a second axial thrust on the silicon wafer. The second axial thrust points toward the first mounting member.

3. The flipping device according to claim 2, characterized in that, The first correction module includes a first radial pusher and a first rotating member. The first radial pusher is slidably disposed on the first rotating disk along the rotation axis. The first rotating member is rotatably disposed on the first rotating disk. The first end of the first rotating member faces the first radial pusher, and the second end of the first rotating member faces the first mounting member. When the first correction module rotates toward the unloading station, the protrusion can apply the first radial thrust to the first radial pusher. The first radial pusher moves radially along the rotation axis to drive the first rotating member to rotate, so that the second end of the first rotating member extends into the first limiting groove and applies the first axial thrust to the silicon wafer. The second correction module includes a second radial pusher and a second rotating member. The second radial pusher is slidably disposed on the second rotating disk along the rotation axis, and the second rotating member is rotatably disposed on the second rotating disk. The first end of the second rotating member faces the second radial pusher, and the second end of the second rotating member faces the second mounting member. When the second correction module rotates toward the unloading station, the protrusion can apply the second radial thrust to the second radial pusher. The second radial pusher moves radially along the rotation axis to drive the second rotating member to rotate, so that the second end of the second rotating member extends into the second limiting groove and applies the second axial thrust to the silicon wafer.

4. The flipping device according to claim 3, characterized in that, The first radial pusher has a first inclined surface at one end near the first rotating member, and the first end of the first rotating member has a second inclined surface, with the inclination angles of the first inclined surface and the second inclined surface being adapted to each other. The first correction module further includes a first reset member, which is capable of providing a reset force to the first radial push member to move in a direction closer to the rotation axis.

5. The flipping device according to claim 4, characterized in that, The first radial pushing member includes a first guide portion and a first mating portion. The first guide portion is slidably disposed on the first rotating disk along the rotation axis. The first resetting member is connected between the first guide portion and the first mating portion. The first mating portion has a first inclined surface at one end near the first rotating member; or, The first radial pusher includes a first guide portion and a first mating portion. The first guide portion is slidably disposed on the first rotating disk along the radial direction of the rotation axis. The first mating portion is connected to the first guide portion. The first mating portion has a first inclined surface at one end near the first rotating member. The first correction module also includes a first stop member. The first reset member is disposed between the first mating portion and the first stop member.

6. The flipping device according to claim 4, characterized in that, The first correction module further includes a second reset member, which is capable of providing a reset force to the first end of the first rotating member to rotate in the direction of the first radial pushing member; One end of the second reset member is connected to the first rotating disk, and the other end is connected to the first rotating member, and is located between the rotation axis of the first rotating member and the first end of the first rotating member.

7. The flipping device according to claim 6, characterized in that, The second end of the first rotating member is provided with a third inclined surface, which is configured to convert the tangential force of the first rotating member along the rotation trajectory into the first axial thrust on the silicon wafer.

8. The flipping device according to claim 2, characterized in that, The outer surface of the protrusion is an arc surface; And / or, The protrusion is located on the side facing the unloading station.

9. An automated flipping device, characterized in that, include: The flipping device as described in any one of claims 1-8; A first conveying device is used to convey the silicon wafer after it has been flipped by the flipping device. A second conveying device is used to convey silicon wafers into the flipping device.

10. The automated flipping device according to claim 9, characterized in that, The first conveying device includes a first conveying track and a first receiving component. The first receiving component is disposed on the first conveying track and is used to receive the flipped silicon wafer. The first conveying track is used to transport the silicon wafer to the next work station. The first receiving component includes a first receiving member and two first limiting members. The first receiving member is disposed on the first conveying track and is used to receive the silicon wafer. The two first limiting members are respectively disposed at both ends of the first receiving member along the conveying direction of the first conveying track to restrict the movement of the silicon wafer in the conveying direction of the first conveying track. The first receiving member has a locking part on each of the two opposite sides along the width direction of the silicon wafer, and the two locking parts are configured to lock the two opposite sides of the silicon wafer along the width direction.

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