Multi-site chip contact type aging cover socket body

Abstract

The utility model belongs to the technical field of chip test application, and particularly discloses a multi-site chip contact type aging cover socket body, which comprises a test probe, a mainboard, a first through groove, a second through groove, a small socket body, a second screw, an upper fixing plate, a third screw, an aluminum substrate socket, an upper pin mounting plate, a lower pin mounting plate, an upper pin mounting plate pin groove, a lower pin mounting plate pin groove and the like. Wherein the small socket body is used for plugging the temperature sensor module, and the aluminum substrate socket is used for plugging the heating module. The multi-site chip contact type aging cover socket body has the beneficial effects that 1, real-time temperature control can be realized when a client tests various chips, real-time early warning can be realized when the temperature is too high, the client can simultaneously test the safe aging contact type test of the various chips, and the accuracy of chip test parameters is also realized; and 2, the whole body adopts a split combined design, so that assembly, use, disassembly and maintenance are convenient, the operation is convenient, and the popularization is facilitated.

Description

Technical Field

[0001] This utility model belongs to the field of chip testing application technology, specifically relating to a multi-site chip contact aging cover socket. Background Technology

[0002] For some independent temperature-controlled aging sockets, only one chip is tested per socket. Since the testing is usually done in batches, a large number of sockets are required, which may lead to excessive costs.

[0003] Some existing products are designed for independent temperature-controlled aging tests. Due to the large number of products and the need for many sockets, the temperature is high and the cost is high.

[0004] Based on the above problems, this utility model provides a multi-site chip contact aging cover socket. Utility Model Content

[0005] Purpose of the utility model: The purpose of this utility model is to address the shortcomings of the existing technology by providing a multi-site chip contact aging cover socket, which can solve the problem of simultaneous temperature measurement of multiple chips in some aging tests for customers.

[0006] Technical Solution: The multi-site chip contact aging cover socket body provided by this utility model includes a chip to be tested, test probes, and a motherboard. The two end faces of the motherboard are respectively provided with a first through groove and a second through groove. A small socket body is assembled in the first through groove by a first screw. An aluminum substrate socket is assembled in the second through groove by a second screw, an upper fixing plate, and a third screw. An upper needle plate and a lower needle plate are vertically stacked on the bottom surface of the motherboard. The upper needle plate and the lower needle plate are vertically aligned with needle slots in the upper needle plate and the lower needle plate, respectively. The small socket body is used to insert a temperature sensor module, and the aluminum substrate socket is used to insert a heating module.

[0007] In this technical solution, the multi-site chip contact aging cover socket body also includes copper blocks respectively disposed in the needle slots of the upper needle plate; wherein, the contact surface between the copper blocks and the needle slots of the upper needle plate is configured as a quadrilateral structure.

[0008] In this technical solution, the multi-site chip contact aging cover socket body also includes motherboard fixing holes set in the four corners of the motherboard, and bolts, washers and nuts for fixing the motherboard to the test base through the motherboard fixing holes.

[0009] Compared with the existing technology, the advantages of this utility model of multi-site chip contact aging cover socket are as follows: 1. Customers can test multiple chips in real time and receive real-time warnings for excessively high temperatures. This allows customers to test multiple chips simultaneously using safe aging contact testing, and also ensures the accuracy of chip test parameters; 2. The overall design is a modular assembly, which is convenient for assembly, use, disassembly and maintenance, making it easy to operate and promote. Attached Figure Description

[0010] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0011] Figure 1 This is an exploded structural diagram of the multi-site chip contact aging cover socket body of this utility model;

[0012] The numbers in the diagram are as follows: 1-Chip to be tested, 2-Test probe, 3-Main board, 4-First through slot, 5-Small socket body, 6-First screw, 7-Second through slot, 8-Aluminum substrate socket, 9-Copper block, 10-Second screw, 11-Upper fixing plate, 12-Third screw, 13-Upper needle plate, 14-Lower needle plate, 15-Upper needle plate needle groove, 16-Lower needle plate needle groove, 17-Bolt, 18-Main board mounting hole, 19-Washer, 20-Nut. Detailed Implementation

[0013] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0014] In the description of this utility model, it should be noted that the terms "top," "bottom," "one side," "the other side," "front," "back," "middle part," "inner," "top," and "bottom," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. The terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, unless otherwise explicitly specified and limited, the terms "installed," "connected," and "joined" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0015] Example 1

[0016] like Figure 1 The multi-site chip contact aging cover socket shown includes the chip under test 1, test probe 2, and motherboard 3.

[0017] The motherboard 3 has a first through groove 4 and a second through groove 7 respectively provided in the end faces of its two ends.

[0018] A small socket body 5 is assembled in the first through groove 4 by the first screw 6.

[0019] An aluminum substrate socket 8 is assembled in the second through slot 7 via a second screw 10, an upper fixing plate 11, and a third screw 12.

[0020] The bottom surface of the motherboard 3 is vertically stacked with an upper needle plate 13 and a lower needle plate 14.

[0021] The upper needle plate 13 and the lower needle plate 14 are vertically aligned with each other, and the upper needle plate 15 and the lower needle plate 16 are respectively provided.

[0022] Among them, the small socket body 5 is used to plug in the temperature sensor module, and the aluminum substrate socket 8 is used to plug in the heating module.

[0023] The working principle is as follows: A temperature sensor module is plugged into the small socket body 5 to feed back the temperature during testing to an external PLC controller; a heating module is plugged into the aluminum substrate socket 8. When the temperature during testing is low (not meeting the test temperature), the PLC controller controls the heating module plugged into the aluminum substrate socket 8 to start heating, and simultaneously controls the heating module plugged into the aluminum substrate socket 8 to stop heating based on the temperature parameters fed back from the temperature sensor module plugged into the small socket body 5. The PLC controller, temperature sensor module, and heating module are not shown in the figure, but they do not affect the disclosure of the technical solution of this application.

[0024] Example 2

[0025] Based on Embodiment 1, the multi-site chip contact aging cover socket body also includes copper blocks 9 respectively disposed in the needle grooves 15 of the upper needle plate;

[0026] The contact surface between the copper block 9 and the needle groove 15 of the upper needle plate is set as a quadrilateral structure. The copper block 9 is a grounded heat dissipation copper block, which is used to achieve corresponding rapid heat dissipation when the temperature is too high during the test.

[0027] Example 3

[0028] Based on Embodiment 1 or Embodiment 2, the multi-site chip contact aging cover socket body also includes motherboard fixing holes 18 disposed in the four corners of the motherboard 3, and bolts 17, washers 19 and nuts 20 for fixing the motherboard 3 to the test base through the motherboard fixing holes 18.

[0029] During assembly, the motherboard 3 is conveniently fixed to the test base (not shown in the figure, but it does not affect the disclosure of the technical solution of this application) through the motherboard fixing hole 18 using bolts 17, washers 19, and nuts 20.

[0030] It should be noted that, in this document, terms such as "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0031] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A multi-site chip contact aging cover socket body, comprising a chip to be tested (1), test probes (2) and a motherboard (3), characterized in that: The motherboard (3) has a first through groove (4) and a second through groove (7) respectively provided in the end faces of its two ends. A small socket body (5) is assembled in the first through groove (4) by a first screw (6). An aluminum substrate socket (8) is assembled in the second through groove (7) via a second screw (10), an upper fixing plate (11), and a third screw (12). The bottom surface of the motherboard (3) is vertically stacked with an upper needle plate (13) and a lower needle plate (14). The upper needle plate (13) and the lower needle plate (14) are vertically aligned with each other, and the upper needle plate groove (15) and the lower needle plate groove (16) are respectively provided. Among them, the small socket body (5) is used to plug in the temperature sensor module, and the aluminum substrate socket (8) is used to plug in the heating module.

2. The multi-site chip contact aging cover socket body according to claim 1, characterized in that: The multi-site chip contact aging cover socket body also includes copper blocks (9) respectively disposed in the needle slots (15) of the upper needle plate; The contact surface between the copper block (9) and the needle groove (15) of the upper needle plate is set as a quadrilateral structure.

3. The multi-site chip contact aging cover socket body according to claim 1 or 2, characterized in that: The multi-site chip contact aging cover socket also includes motherboard fixing holes (18) set in the four corners of the motherboard (3), and bolts (17), washers (19) and nuts (20) for fixing the motherboard (3) to the test base through the motherboard fixing holes (18).

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