Crimping mechanism, temperature control device and test sorting equipment

Abstract

The utility model relates to a crimping mechanism, a temperature control device and test sorting equipment, and the crimping mechanism comprises a crimping part which is provided with a first end face, and the first end face is provided with a pickup part for picking up and crimping electronic components; an airflow channel is formed in the crimping part, the airflow channel is provided with an air inlet and an air outlet, and airflow flowing through the airflow channel can exchange heat with at least part of the crimping part so as to transfer heat to the electronic component picked up by the picking-up part; the air outlet is located in the other surfaces of the crimping part except the first end face. In the process of taking and placing the electronic component by the crimping mechanism, the air flow continuously flows through the air flow channel to exchange heat with the crimping part, so that temperature return caused by heat exchange between the crimping part and the surrounding environment is avoided, the temperature of the electronic component can be stably controlled, and the accuracy of a test result is ensured. As the air outlet is not formed in the first end face, airflow cannot blow to the electronic component, the electronic component cannot fall off from the picking part, and the material picking and placing effect is guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of testing and sorting equipment technology, and in particular to a pressing mechanism, a temperature control device, and testing and sorting equipment. Background Technology

[0002] Before leaving the factory, electronic components (such as chips) need to undergo performance testing, which is generally performed on testing and sorting equipment. This equipment has a crimping mechanism that picks up the electronic components and presses them onto a test board, which then performs the tests.

[0003] The crimping mechanism is provided with an airflow channel. When the gas flows through the airflow channel, it exchanges heat with at least part of the crimping mechanism, thereby controlling the temperature of the crimping mechanism and, consequently, the temperature of the electronic components in contact with the crimping mechanism.

[0004] In traditional technology, when a crimping mechanism picks up and places electronic components, if gas flows out through the airflow channel to control the temperature of the crimping mechanism, the gas will blow towards the surface of the electronic components, giving them a downward blowing force. Under the action of this blowing force, the electronic components are easily dropped off the crimping mechanism. If the gas supply to the airflow channel is cut off when the crimping mechanism picks up and places electronic components, the crimping mechanism will exchange heat with the surrounding environment during movement, causing the crimping mechanism to heat up again. This leads to unstable temperature control of the electronic components, affecting the test results. Utility Model Content

[0005] Therefore, it is necessary to provide a pressing mechanism, temperature control device, and testing and sorting equipment that can improve the above-mentioned problems.

[0006] A crimping mechanism, comprising:

[0007] A crimping component has a first end face, the first end face being provided with a pickup part for picking up and crimping electronic components;

[0008] The crimping member is provided with an airflow channel, which has an air inlet and an air outlet. The airflow flowing through the airflow channel can exchange heat with at least a portion of the crimping member so as to transfer heat to the electronic components picked up by the pickup unit.

[0009] The air outlet is located on the surface of the crimping member other than the first end face.

[0010] In one embodiment, the crimping member includes a crimping head and a connecting structure, the connecting structure being connected to the crimping head, the first end face being disposed on the crimping head, and the connecting structure having an air inlet channel including the air inlet and an air outlet channel including the air outlet.

[0011] An airflow cavity is formed between the connecting structure and the pressure head. The air inlet channel and the air outlet channel are both connected to the airflow cavity. The airflow can flow through the air inlet channel to the airflow cavity to exchange heat with the pressure head, and then flow out through the air outlet channel.

[0012] The airflow channel includes the air inlet channel, the airflow chamber, and the air outlet channel.

[0013] In one embodiment, the pressure head is provided with an airflow groove, and the groove wall of the airflow groove and the connecting structure together form the airflow cavity;

[0014] and / or

[0015] The pressing component also includes a heat exchange plate disposed in the airflow cavity for exchanging heat with the airflow in the airflow cavity and transferring heat to the pressure head.

[0016] In one embodiment, the air intake channel includes an air intake portion and a first connecting portion, the air intake portion including the air inlet; the air outlet channel includes a second connecting portion and an air outlet portion, the air outlet portion including the air outlet.

[0017] The cross-sectional shapes of the first connecting portion, the second connecting portion, and the airflow cavity are all annular, with the second connecting portion surrounding the first connecting portion, and the airflow cavity being located near the center of the pressure head.

[0018] In one embodiment, the connection structure includes a connecting column and a heat insulation block, one end of the connecting column is connected to the pressure head, the heat insulation block and the pressure head form a receiving space, and the connecting column is received within the receiving space;

[0019] The air intake channel is formed by the connecting column and the heat insulation block, the air outlet channel is formed inside the heat insulation block, and the airflow cavity is formed by the connecting column, the heat insulation block, and the pressure head.

[0020] When the airflow passes through the air intake channel, it can exchange heat with the connecting column to transfer heat to the pressure head through the connecting column.

[0021] In one embodiment, the heat insulation block includes a first heat insulation block, an air inlet heat insulation block, an air outlet heat insulation block, a second heat insulation block, and an intermediate heat insulation block, wherein the first heat insulation block is connected to the other end of the connecting column;

[0022] Along the extension direction of the connecting column, from the first heat insulation block to one end of the pressure head, the air inlet heat insulation block, the air outlet heat insulation block, and the second heat insulation block are sequentially disposed between the first heat insulation block and the pressure head; the intermediate heat insulation block is located inside the air outlet heat insulation block and the second heat insulation block, and is located between the air inlet heat insulation block and the pressure head along the extension direction of the connecting column.

[0023] The air intake channel is formed by the air intake heat insulation block, the first heat insulation block, the intermediate heat insulation block and the connecting column. The air outlet channel is formed by the air intake heat insulation block, the intermediate heat insulation block, the pressure head and the air outlet heat insulation block. The airflow cavity is formed by the intermediate heat insulation block, the air outlet heat insulation block, the connecting column and the pressure head.

[0024] In one embodiment, the first end face is located at one end of the crimping member in a first direction, and the air inlet and the air outlet are disposed on the surface of the crimping member in a second direction.

[0025] The first direction and the second direction intersect.

[0026] In one embodiment, the pressing member is provided with a vacuum passage, and the vacuum adsorption port of the vacuum passage is located on the first end face. The pickup part adsorbs electronic components by means of vacuum adsorption.

[0027] and / or

[0028] The pressing mechanism further includes a heating element, which is disposed inside the pressing element and is used to heat the pressing element.

[0029] A temperature control device includes a heat exchanger, a heat exchange mechanism, and a pressing mechanism as described above;

[0030] The heat exchanger has a first heat exchange channel and a second heat exchange channel. The air inlet and the air outlet of the airflow channel are respectively connected to the outlet and the inlet of the first heat exchange channel. The inlet and the outlet of the second heat exchange channel are both connected to the heat exchange mechanism. The heat exchange medium provided by the heat exchange mechanism exchanges heat with the airflow in the airflow channel in the heat exchanger to control the temperature of the airflow.

[0031] A testing and sorting device includes a feeding device, a conveying device, a receiving device, and the aforementioned temperature control device;

[0032] The feeding device is used to provide electronic components to the conveying device. The conveying device is used to transport electronic components between the feeding device and the temperature control device. The pressing mechanism of the temperature control device is used to pick up the electronic components on the conveying device, control their temperature, and press the electronic components onto the testing mechanism for testing. The conveying device can also transport the tested electronic components to the receiving device for collection.

[0033] The aforementioned crimping mechanism, temperature control device, and testing and sorting equipment, because the air outlet of the airflow channel is located on the surface of the crimping component other than the first end face, allow for better temperature control of the electronic components when the crimping mechanism crimps the electronic components onto the testing mechanism. This is because the airflow exchanges heat with the crimping component through the airflow channel, and the heat is transferred to the electronic components through the crimping component. Furthermore, during the process of the crimping mechanism picking up and placing electronic components, the airflow continuously flows through the airflow channel and exchanges heat with the crimping component, preventing the crimping component from exchanging heat with the surrounding environment and regaining its original temperature. This ensures stable temperature control of the electronic components and guarantees the accuracy of the test results. Since the air outlet is not located on the first end face, the airflow will not blow directly onto the electronic components, preventing them from falling off the pick-up section and ensuring efficient material handling. Attached Figure Description

[0034] Figure 1 This is a structural diagram of a crimping mechanism for picking up electronic components according to an embodiment of this application;

[0035] Figure 2 for Figure 1 Another structural view of the crimping mechanism shown ( Figure 2 (The intermediate pressure connection mechanism failed to pick up electronic components);

[0036] Figure 3 for Figure 1 A cross-sectional view of the crimping mechanism shown;

[0037] Figure 4 for Figure 1 Axonometric view of a portion of the crimping mechanism shown in the figure;

[0038] Figure 5 for Figure 1 An exploded view of the crimping mechanism shown;

[0039] Figure 6 This is a schematic diagram of the structure of a temperature control device provided in an embodiment of this application.

[0040] Explanation of reference numerals in the attached figures:

[0041] 1000 Temperature control device; 100 Crimping mechanism; 10 Crimping component; 11 First end face; 12 Pick-up part; 13 Airflow channel; 131 Air inlet; 132 Air outlet; 133 Air inlet channel; 1331 Air inlet section; 1332 First connecting section; 134 Airflow chamber; 135 Air outlet channel; 1351 Air outlet section; 1352 Second connecting section; 14 Pressure head; 141 Airflow groove; 15. Connecting structure; 151. Connecting column; 152. Heat insulation block; 1521. First heat insulation block; 1522. Inlet heat insulation block; 1523. Outlet heat insulation block; 1524. Second heat insulation block; 1525. Intermediate heat insulation block; 16. Vacuum air passage; 161. Vacuum adsorption port; 17. Heat exchange plate; 20. Heating element; 200. Heat exchanger; 300. Heat exchange mechanism; 400. Gas compressor; 2000. Electronic components. Detailed Implementation

[0042] To make the above-mentioned objects, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a full understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.

[0043] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0044] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0045] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0046] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0047] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0048] See Figures 1-3 One embodiment of this application provides a crimping mechanism 100, which is used to pick up an electronic component 2000 and crimp the picked-up electronic component 2000 onto a testing mechanism, whereby the testing mechanism tests the electronic component 2000. Optionally, the electronic component 2000 is a chip. Of course, in some other embodiments, the type of electronic component 2000 is not limited; for example, the electronic component 2000 can also be a transistor or a diode, etc.

[0049] The crimping mechanism 100 includes a crimping member 10, which has a first end face 11. The first end face 11 is provided with a pickup part 12 for picking up electronic components 2000. It should be noted that the first end face 11 can be a plane or a curved surface, that is, the shape of the first end face 11 can be set to a regular or irregular shape. The shape of the first end face 11 is not limited here.

[0050] Furthermore, the crimping member 10 can be connected to a driving assembly, which drives the crimping member 10 to move, causing the pickup unit 12 to crimp the picked-up electronic component 2000 onto the testing mechanism for testing. In some specific embodiments, the crimping mechanism 100 includes the aforementioned driving assembly, that is, the driving assembly is part of the crimping mechanism 100, and the driving assembly of the crimping mechanism 100 drives the crimping member 10 to move, crimping the electronic component 2000 onto the testing mechanism. In other specific embodiments, the driving assembly can also be an external structure of the crimping mechanism 100, that is, an external driving assembly drives the crimping member 10 to move, crimping the electronic component 2000 onto the testing mechanism.

[0051] Specifically, the first end face 11 is located at one end of the crimping member 10 in the first direction, and the driving component can drive the crimping member 10 to move along the first direction to crimp the electronic component 2000 to the testing mechanism for testing. The first direction is parallel to the crimping direction.

[0052] Furthermore, the drive component is connected to the robotic arm, which can drive the drive component to move, thereby driving the pressing component 10 to move, so as to transfer the electronic component 2000 from one position to another, facilitating the testing of the electronic component 2000.

[0053] See Figure 3 The crimping member 10 is provided with an airflow channel 13, which has an air inlet 131 and an air outlet 132. The air outlet 132 is located on the surface of the crimping member 10 other than the first end face 11. When the first end face 11 is the surface of one end of the crimping member 10 in the first direction, the air outlet 132 is located on the surface of the other end of the crimping member 10 in the first direction or on other surfaces of the crimping member 10 used to connect the two end faces. The first direction intersects with the second direction. Specifically, the first direction is perpendicular to the second direction. Figure 3 In the middle, the Y direction is the first direction and the X direction is the second direction. It can be understood that there are multiple second directions that intersect or are perpendicular to the first direction.

[0054] Optionally, the air inlet 131 can be located close to or far from the air outlet 132. See further details in some specific embodiments. Figure 3 The air inlet 131 and the air outlet 132 are located on the same surface of the crimping member 10 in the second direction.

[0055] The airflow flowing through the airflow channel 13 can exchange heat with at least a portion of the pressing member 10, thereby transferring heat to the electronic component 2000 picked up by the pickup unit 12 and controlling the temperature of the electronic component 2000 picked up by the pickup unit 12. Optionally, the airflow flowing in the airflow channel 13 can be either hot or cold air. When the airflow is hot, the temperature of the pressing member 10 increases after heat exchange; when the airflow is cold, the temperature of the pressing member 10 decreases after heat exchange. Generally, refer to... Figure 3 The crimping mechanism 100 also includes a heating element 20, which is located inside the crimping component 10 and is used to heat the crimping component 10. At this time, the cold airflow and the heating element 20 control the temperature of the crimping component 10 by means of mutual heating and cooling, thereby accurately controlling the temperature of the electronic component 2000.

[0056] The crimping mechanism 100 provided in this embodiment has an air outlet 132 on the surface of the crimping member 10 other than the first end face 11. When the crimping mechanism 100 crimps the electronic component 2000 onto the testing mechanism, the airflow flows through the airflow channel 13 and exchanges heat with the crimping member 10. The heat is transferred to the electronic component 2000 through the crimping member 10, thus better controlling the temperature of the electronic component 2000. Furthermore, during the process of the crimping mechanism 100 picking up and placing the electronic component 2000, the airflow continuously flows through the airflow channel 13 and exchanges heat with the crimping member 10, preventing the crimping member 10 from exchanging heat with the surrounding environment and regaining its temperature. This ensures stable temperature control of the electronic component 2000 and guarantees the accuracy of the test results. Since the air outlet 132 is not located on the first end face 11, the airflow will not blow towards the electronic component 2000, preventing the electronic component 2000 from falling off the pickup part 12, thus ensuring the effective picking and placing of components.

[0057] In some embodiments, see further reference. Figure 1 and Figure 2 The crimping member 10 includes a crimping head 14 and a connecting structure 15. The connecting structure 15 is used to connect to the drive assembly, and the crimping head 14 is connected to the connecting structure 15. (Continue reading...) Figure 3 The first end face 11 is disposed on the pressure head 14. The connecting structure 15 has an air inlet channel 133 and an air outlet channel 135. The air inlet channel 133 includes an air inlet 131, and the air outlet channel 135 includes an air outlet 132. An airflow cavity 134 is formed between the connecting structure 15 and the pressure head 14. Both the air inlet channel 133 and the air outlet channel 135 are connected to the airflow cavity 134, allowing airflow to flow from the air inlet channel 133 to the airflow cavity 134, where it exchanges heat with the pressure head 14, and then flows out through the air outlet channel 135. The airflow channel 13 includes the air inlet channel 133, the airflow cavity 134, and the air outlet channel 135. The pressure fitting 10, including the pressure head 14 and the connecting structure 15, facilitates the formation of the airflow channel 13.

[0058] Optionally, the pressure head 14 has a flat plate structure to facilitate the pressing of the electronic component 2000. It should be understood that in some other embodiments, the shape of the pressure head 14 is not limited.

[0059] Further reading Figure 4 The pressure head 14 is provided with an airflow groove 141, and the groove wall of the airflow groove 141 and the connecting structure 15 together form an airflow cavity 134. Since the pressure head 14 is provided with an airflow groove 141, and the groove wall of the airflow groove 141 and the connecting structure 15 together form an airflow cavity 134, when the airflow flows through the airflow cavity 134, it can exchange heat with the pressure head 14 through the groove wall of the airflow groove 141. The heat exchange area between the pressure head 14 and the airflow is increased, so that more heat is conducted to the pressure head 14, so that it can be conducted to the electronic component 2000 through the pressure head 14 to control the temperature of the electronic component 2000.

[0060] It is understood that in some other embodiments, the airflow cavity 134 may be formed in other ways. For example, the airflow groove 141 may be omitted on the pressure head 14, and instead, a groove may be made on the connecting structure 15, with the surface of the pressure head 14 and the groove wall on the connecting structure 15 together forming the airflow cavity 134.

[0061] Further reading Figure 3 and Figure 4 The pressing component 10 also includes a heat exchange plate 17, which is disposed in the airflow cavity 134 for exchanging heat with the airflow in the airflow cavity 134 and transferring heat to the pressure head 14. By disposing of the heat exchange plate 17 in the airflow cavity 134, the airflow can transfer heat to the heat exchange plate 17 as it flows through the airflow cavity 134, and the heat exchange plate 17 can transfer heat to the pressure head 14, enabling more heat to be conducted to the pressure head 14 for temperature control of the electronic components 2000.

[0062] It should be noted that both the pressure head 14 and the heat exchange plate 17 are made of materials with good thermal conductivity, such as copper. Of course, in other embodiments, the materials used for the pressure head 14 and the heat exchange plate 17 are not limited, as long as they can conduct the heat of the airflow to the electronic component 2000.

[0063] In some embodiments, see further reference. Figure 3 The air intake channel 133 includes an air intake portion 1331 and a first connecting portion 1332, with the air intake portion 1331 including an air inlet 131. The air outlet channel 135 includes a second connecting portion 1352 and an air outlet portion 1351, with the air outlet portion 1351 including an air outlet 132. The cross-sectional shape of the first connecting portion 1332, the second connecting portion 1352, and the airflow cavity 134 are all annular. The second connecting portion 1352 is arranged around the first connecting portion 1332, and the airflow cavity 134 is located near the center of the pressure head 14.

[0064] In the above configuration, the first connecting portion 1332, the second connecting portion 1352, and the airflow cavity 134 are all annular, which increases the volume of the airflow cavity 134 and improves the heat exchange effect between the airflow and the pressure head 14. Furthermore, the second connecting portion 1352 is arranged around the first connecting portion 1332, and the airflow cavity 134 is located close to the center of the pressure head 14. In this way, the airflow flows to the pressure head 14 from a relatively central position, and the heat dissipates outward from the center of the pressure head 14, which can ensure that the temperature is evenly distributed throughout the pressure head 14.

[0065] It is understood that in other embodiments, the arrangement of the air intake channel 133 and the air outlet channel 135 is not limited. Similarly, the cross-sectional shapes of the first connecting portion 1332, the second connecting portion 1352, and the airflow cavity 134 are not limited; for example, the cross-sectional shapes of the first connecting portion 1332, the second connecting portion 1352, and the airflow cavity 134 can all be circular. Furthermore, the position of the airflow cavity 134 formed on the pressure head 14 is not limited; for example, the airflow cavity 134 can also be formed near the edge of the pressure head 14.

[0066] In some embodiments, see further reference. Figure 2 and Figure 3 The connecting structure 15 includes a connecting column 151 and a heat insulation block 152. One end of the connecting column 151 is connected to the pressure head 14. The heat insulation block 152 and the pressure head 14 form a receiving space, and the connecting column 151 is housed within the receiving space. The air intake channel 133 is formed by the connecting column 151 and the heat insulation block 152, and the air outlet channel 135 is formed within the heat insulation block 152. The airflow cavity 134 is formed by the connecting column 151, the heat insulation block 152, and the pressure head 14. When the airflow flows through the air intake channel 133, it can exchange heat with the connecting column 151 to transfer heat to the pressure head 14. With this configuration, the airflow can transfer heat to the connecting column 151 when passing through the air intake channel 133. Since the connecting column 151 is connected to the pressure head 14, the heat absorbed by the connecting column 151 is transferred to the pressure head 14. At this time, more heat will be conducted to the pressure head 14 to ensure the temperature control effect of the electronic component 2000. Meanwhile, the heat insulation block 152 has a heat insulation function. When the airflow flows through the airflow channel 13, the heat insulation block 152 can reduce the transfer of heat between the airflow and the outside, making it easier for more heat to be conducted to the pressure head 14.

[0067] The connecting post 151 is made of a thermally conductive material, such as copper. Of course, in other embodiments, the material used for the connecting post 151 is not limited, as long as it can exchange heat with the airflow and conduct heat to the pressure head 14.

[0068] In some embodiments, the pressure head 14, heat exchange plate 17, and connecting column 151 are integrally formed. It is understood that in other embodiments, the pressure head 14, heat exchange plate 17, and connecting column 151 may also be manufactured separately.

[0069] Continue reading Figure 4 Multiple heat exchange plates 17 are arranged around the connecting column 151, with each heat exchange plate 17 extending from the first connecting portion 1332 to the second connecting portion 1352. By setting multiple heat exchange plates 17, the heat exchange effect can be further improved. At the same time, the heat exchange plates 17 can guide the airflow from the first connecting portion 1332 to the second connecting portion 1352, facilitating the flow of airflow in the airflow channel 13.

[0070] Optionally, see Figure 3 and Figure 5 The heat insulation block 152 includes a first heat insulation block 1521, an inlet heat insulation block 1522, an outlet heat insulation block 1523, a second heat insulation block 1524, and an intermediate heat insulation block 1525, which are separately configured. The first heat insulation block 1521 is connected to the other end of the connecting column 151. Along the extension direction of the connecting column 151 from the first heat insulation block 1521 to one end of the pressure head 14, the inlet heat insulation block 1522, the outlet heat insulation block 1523, and the second heat insulation block 1524 are sequentially disposed between the first heat insulation block 1521 and the pressure head 14. The intermediate heat insulation block 1525 is located inside the outlet heat insulation block 1523 and the second heat insulation block 1524, and is located between the inlet heat insulation block 1522 and the pressure head 14 along the extension direction of the connecting column 151. The intake channel 133 is formed by the intake heat insulation block 1522, the first heat insulation block 1521, the intermediate heat insulation block 1525, and the connecting column 151. The exhaust channel 135 is formed by the intake heat insulation block 1522, the intermediate heat insulation block 1525, the pressure head 14, and the exhaust heat insulation block 1523. The airflow cavity 134 is formed by the intermediate heat insulation block 1525, the exhaust heat insulation block 1523, the connecting column 151, and the pressure head 14. This facilitates the formation of the intake channel 133, the airflow cavity 134, and the exhaust channel 135.

[0071] Furthermore, the air intake portion 1331 is formed on the air intake heat insulation block 1522, and the first connecting portion 1332 is formed together by the air intake heat insulation block 1522, the first heat insulation block 1521, the intermediate heat insulation block 1525, and the connecting post 151. The air outlet portion 1351 is formed on the air outlet heat insulation block 1523, and the second connecting portion 1352 is formed together by the air intake heat insulation block 1522, the intermediate heat insulation block 1525, the pressure head 14, and the air outlet heat insulation block 1523. To facilitate the formation of the annular first connecting portion 1332 and the second connecting portion 1352, the intermediate heat insulation block 1525 is annular.

[0072] It is understood that in other embodiments, the connecting structure 15 may also adopt other configurations to form an air intake channel 133, an airflow cavity 134, and an air outlet channel 135, which are not limited here. Furthermore, in other embodiments, when the connecting structure 15 includes a connecting post 151 and a heat insulation block 152, the number of heat insulation blocks 152 and the positional relationship between each heat insulation block 152 are not limited.

[0073] Further reading Figure 3 The crimping member 10 is provided with a vacuum passage 16, and the vacuum adsorption port 161 of the vacuum passage 16 is located on the first end face 11. The pickup part 12 picks up the electronic component 2000 by vacuum adsorption. Optionally, the vacuum passage 16 is formed by the first heat insulation block 1521, the connecting post 151, and the pressure head 14. In some specific embodiments, the pickup part 12 is a pickup surface, which is formed by a portion of the first end face 11, and the pickup surface picks up the electronic component 2000. In other specific embodiments, the pickup part 12 can also be a suction nozzle located on the first end face 11, which is connected to the vacuum adsorption port 161 and adsorbs the electronic component 2000.

[0074] It is conceivable that in some other embodiments, the arrangement of the pickup unit 12 is not limited. For example, the pickup unit 12 may also use a non-vacuum adsorption method to pick up the electronic component 2000. Optionally, the pickup unit 12 is a clamping member provided on the first end face 11, and the clamping member picks up the electronic component 2000 by clamping.

[0075] See Figure 6 Another embodiment of this application also provides a temperature control device 1000, which includes a heat exchanger 200, a heat exchange mechanism 300, and the aforementioned pressing mechanism 100. The heat exchanger 200 has a first heat exchange channel and a second heat exchange channel. The air inlet 131 and the air outlet 132 of the airflow channel 13 are respectively connected to the outlet and inlet of the first heat exchange channel. The inlet and outlet of the second heat exchange channel are both connected to the heat exchange mechanism 300. The heat exchange medium provided by the heat exchange mechanism 300 exchanges heat with the airflow in the airflow channel 13 in the heat exchanger 200 to control the temperature of the airflow.

[0076] In the aforementioned temperature control device 1000, after the airflow in the airflow channel 13 exchanges heat with the pressure head 14, it flows through the outlet 132 to the first heat exchange channel to exchange heat with the heat exchange medium flowing through the second heat exchange channel, and then flows back to the airflow channel 13 through the inlet 131, repeating this cycle to ensure a continuous supply of high-temperature or low-temperature airflow to the pressure head 14. Because the airflow, after heat exchange in the airflow channel 13, circulates back to the heat exchanger 200 to exchange heat with the heat exchange medium, instead of being directly discharged into the cavity where the pressing mechanism 100 is located through the outlet 132, energy is saved. When the airflow is cold, the heat exchange mechanism 300 acts as a refrigerant compressor. If the cold airflow is directly discharged into the cavity, the temperature of the cavity will decrease, and frost will easily form on the cavity when the external temperature is lower than the dew point inside the cavity. In this application, since the cold airflow is not directly discharged into the cavity, there is no risk of frost formation on the cavity.

[0077] Further reading Figure 6 The temperature control device 1000 also includes a gas compressor 400, which is used to circulate airflow between the airflow channel 13 and the first heat exchange channel.

[0078] Another embodiment of this application provides a testing and sorting device, including a feeding device, a conveying device, a receiving device, and the aforementioned temperature control device 1000. The feeding device is used to provide electronic components 2000 to the conveying device. The conveying device is used to transport the electronic components 2000 between the feeding device and the temperature control device 1000. The pressing mechanism 100 of the temperature control device 1000 is used to pick up the electronic components 2000 on the conveying device, control their temperature, and press the electronic components 2000 onto the testing mechanism for testing. The conveying device can also transport the tested electronic components 2000 to the receiving device for collection.

[0079] Since the aforementioned crimping mechanism 100 has beneficial effects, the temperature control device 1000 including the aforementioned crimping mechanism 100 and the testing and sorting equipment including the aforementioned temperature control device 1000 have the same beneficial effects, which will not be described in detail here.

[0080] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0081] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A crimping mechanism, characterized in that, include: The crimping member (10) has a first end face (11), and the first end face (11) is provided with a pickup part (12) for picking up and crimping electronic components (2000); The crimping member (10) is provided with an airflow channel (13), which has an air inlet (131) and an air outlet (132). The airflow flowing through the airflow channel (13) can exchange heat with at least a portion of the crimping member (10) so as to transfer heat to the electronic components (2000) picked up by the pickup unit (12). The air outlet (132) is located on the other surfaces of the crimping member (10) other than the first end face (11).

2. The crimping mechanism according to claim 1, characterized in that, The crimping member (10) includes a crimping head (14) and a connecting structure (15). The connecting structure (15) is connected to the crimping head (14). The first end face (11) is disposed on the crimping head (14). The connecting structure (15) is provided with an air inlet channel (133) including the air inlet (131) and an air outlet channel (135) including the air outlet (132). An airflow cavity (134) is formed between the connecting structure (15) and the pressure head (14). The air inlet channel (133) and the air outlet channel (135) are both connected to the airflow cavity (134). The airflow can flow through the air inlet channel (133) to the airflow cavity (134) to exchange heat with the pressure head (14), and flow out through the air outlet channel (135). The airflow channel (13) includes the air inlet channel (133), the airflow chamber (134), and the air outlet channel (135).

3. The crimping mechanism according to claim 2, characterized in that, The pressure head (14) is provided with an airflow groove (141), and the groove wall of the airflow groove (141) and the connecting structure (15) together form the airflow cavity (134); and / or The pressing component (10) further includes a heat exchange plate (17), which is disposed in the airflow cavity (134) for exchanging heat with the airflow in the airflow cavity (134) and transferring heat to the pressure head (14).

4. The crimping mechanism according to claim 2, characterized in that, The air intake channel (133) includes an air intake portion (1331) and a first connecting portion (1332), the air intake portion (1331) includes the air inlet (131), the air outlet channel (135) includes a second connecting portion (1352) and an air outlet portion (1351), the air outlet portion (1351) includes the air outlet (132); The cross-sectional shape of the first connecting portion (1332), the second connecting portion (1352) and the airflow cavity (134) are all annular, and the second connecting portion (1352) is arranged around the first connecting portion (1332), and the airflow cavity (134) is arranged near the middle of the pressure head (14).

5. The crimping mechanism according to claim 2, characterized in that, The connection structure (15) includes a connecting column (151) and a heat insulation block (152). One end of the connecting column (151) is connected to the pressure head (14). The heat insulation block (152) and the pressure head (14) form a receiving space. The connecting column (151) is received in the receiving space. The air intake channel (133) is formed by the connecting column (151) and the heat insulation block (152), the air outlet channel (135) is formed in the heat insulation block (152), and the airflow cavity (134) is formed by the connecting column (151), the heat insulation block (152) and the pressure head (14). When the airflow flows through the air intake channel (133), it can exchange heat with the connecting column (151) to transfer heat to the pressure head (14) through the connecting column (151).

6. The crimping mechanism according to claim 5, characterized in that, The heat insulation block (152) includes a first heat insulation block (1521), an air inlet heat insulation block (1522), an air outlet heat insulation block (1523), a second heat insulation block (1524), and an intermediate heat insulation block (1525). The first heat insulation block (1521) is connected to the other end of the connecting column (151). Along the extension direction of the connecting post (151), from the first heat insulation block (1521) to one end of the pressure head (14), the air inlet heat insulation block (1522), the air outlet heat insulation block (1523), and the second heat insulation block (1524) are sequentially disposed between the first heat insulation block (1521) and the pressure head (14); the intermediate heat insulation block (1525) is located inside the air outlet heat insulation block (1523) and the second heat insulation block (1524), and is located between the air inlet heat insulation block (1522) and the pressure head (14) along the extension direction of the connecting post (151). The air intake channel (133) is formed by the air intake heat insulation block (1522), the first heat insulation block (1521), the intermediate heat insulation block (1525) and the connecting column (151). The air outlet channel (135) is formed by the air intake heat insulation block (1522), the intermediate heat insulation block (1525), the pressure head (14) and the air outlet heat insulation block (1523). The airflow cavity (134) is formed by the intermediate heat insulation block (1525), the air outlet heat insulation block (1523), the connecting column (151) and the pressure head (14).

7. The crimping mechanism according to claim 1, characterized in that, The first end face (11) is located at one end of the crimping member (10) in the first direction, and the air inlet (131) and the air outlet (132) are provided on the surface of the crimping member (10) in the second direction; The first direction and the second direction intersect.

8. The crimping mechanism according to claim 1, characterized in that, The crimping member (10) is provided with a vacuum passage (16), and the vacuum adsorption port (161) of the vacuum passage (16) is located on the first end face (11). The pickup part (12) adsorbs electronic components (2000) by means of vacuum adsorption. and / or The pressing mechanism further includes a heating element (20), which is disposed inside the pressing element (10) and is used to heat the pressing element (10).

9. A temperature control device, characterized in that, It includes a heat exchanger (200), a heat exchange mechanism (300), and a pressing mechanism as described in any one of claims 1-8; The heat exchanger (200) has a first heat exchange channel and a second heat exchange channel. The air inlet (131) and the air outlet (132) of the airflow channel (13) are respectively connected to the outlet and inlet of the first heat exchange channel. The inlet and outlet of the second heat exchange channel are both connected to the heat exchange mechanism (300). The heat exchange medium provided by the heat exchange mechanism (300) exchanges heat with the airflow in the airflow channel (13) in the heat exchanger (200) to control the temperature of the airflow.

10. A testing and sorting device, characterized in that, Includes a feeding device, a conveying device, a receiving device, and a temperature control device as described in claim 9; The feeding device is used to provide electronic components (2000) to the conveying device. The conveying device is used to transport the electronic components (2000) between the feeding device and the temperature control device. The pressing mechanism of the temperature control device is used to pick up the electronic components (2000) on the conveying device, control their temperature, and press the electronic components (2000) onto the testing mechanism for testing. The conveying device can also transport the tested electronic components (2000) to the receiving device for collection.

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