Intelligent control semiconductor heat dissipation docking station
By using an intelligent control semiconductor heat dissipation expansion dock, the semiconductor cooling chip and cooling fan are dynamically adjusted, solving the problem that existing expansion docks cannot adapt to different loads, achieving stable cooling of equipment and improving user experience.
Patent Information
- Application Number
- CN202423191801.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-20
- Publication Date
- 2025-12-02
- Estimated Expiration
- 2034-12-20
AI Technical Summary
Existing thermal expansion docks cannot dynamically adjust the heat dissipation requirements according to the different workloads of electronic devices, resulting in unstable operation or even damage of electronic devices in high-temperature environments.
The intelligent control semiconductor heat dissipation expansion dock uses an MCU control module to dynamically adjust the workload of the semiconductor cooler and the speed of the cooling fan. Combined with NTC sensors or precision resistors to monitor the power output status, it realizes intelligent control of the semiconductor cooler and heat dissipation module.
It enables the device to maintain a low temperature based on the dynamic heat dissipation requirements of the electronic device load, thereby improving the stable operation of the device and the user experience.
Smart Images
Figure CN223626206U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of heat dissipation technology for electronic devices, and in particular to an intelligent control semiconductor heat dissipation expansion dock. Background Technology
[0002] Mini PCs, laptops, tablets, and other electronic devices generate heat during operation. Their own heat dissipation capabilities are insufficient to dissipate all this heat, leading to consistently high temperatures without additional cooling measures. Prolonged exposure to high temperatures can negatively impact the stability of these devices and may even damage them.
[0003] Currently, thermal expansion docks are typically used to make thermal contact with electronic devices to achieve the purpose of cooling them. However, existing thermal expansion docks can only provide simple cooling, and the load is fixed during the cooling process, which cannot meet the heat dissipation requirements of electronic devices under different workloads. Utility Model Content
[0004] The purpose of this invention is to provide an intelligent control semiconductor heat dissipation expansion dock that can dynamically control the operation of the semiconductor cooling chip according to the workload of the electronic device, so as to realize intelligent control of different heat dissipation needs, achieve smooth operation of electronic devices, improve user experience, and has a wide range of applications.
[0005] To achieve the above objectives, the following technical solution is adopted:
[0006] A smart control semiconductor heat dissipation expansion dock includes a heat-conducting shell, and a semiconductor refrigeration chip, a power board, and a heat dissipation module built into the heat-conducting shell. The cold side of the semiconductor refrigeration chip is disposed in close contact with the inner wall of the heat-conducting shell, and the hot side of the semiconductor refrigeration chip is in thermal contact with the heat dissipation module. The power board includes an MCU control module, and a power output control module, a semiconductor refrigeration chip power supply module, and an output monitoring module, which are electrically connected to the MCU control module respectively. The power output control module is used to manage the output voltage and current to adapt to different loads. The semiconductor refrigeration chip power supply module is electrically connected to the semiconductor refrigeration chip. The output monitoring module is used to monitor the status of the power output control module and report it to the MCU control module to control the operation of the semiconductor refrigeration chip power supply module and the heat dissipation module.
[0007] Preferably, the heat dissipation module includes at least one heat dissipation component; the heat dissipation component includes a cooling fan, a plurality of heat sinks disposed outside the cooling fan, a heat dissipation plate that is in close contact with the hot surface of the semiconductor cooling chip, and a heat dissipation guide rod connecting the heat dissipation plate and the plurality of heat sinks; the first end of the heat dissipation guide rod is in close contact with the heat dissipation plate, and the second end of the heat dissipation guide rod passes through the plurality of heat sinks; the cooling fan is electrically connected to the MCU control module.
[0008] Preferably, the plurality of heat sinks are arranged in parallel, and a vent is formed between each pair of adjacent heat sinks; the side wall of the heat-conducting shell is provided with a ventilation port corresponding to the plurality of heat sinks, and the ventilation port is connected to the ventilation port; the second end of the heat dissipation guide rod passes through the plurality of heat sinks one by one.
[0009] Preferably, the power board further includes a power input interface for connecting to an external power source and a power output interface for connecting to an electronic device; the power output interface is electrically connected to the power output control module.
[0010] Preferably, the output monitoring module includes an NTC sensor; the NTC sensor is used to monitor the temperature of the power output control module.
[0011] Preferably, the output monitoring module includes a precision resistor; the precision resistor is used to monitor the output power of the power output control module.
[0012] Preferably, the heat-conducting outer shell includes a front shell and a rear shell that are snapped together; an inner cavity is formed between the front shell and the rear shell, and the semiconductor cooling chip, power board, and heat dissipation module are disposed in the inner cavity; the front side of the front shell is used for thermal contact with the electronic device, and the cold side of the semiconductor cooling chip is tightly attached to the inner wall of the front shell; a plurality of heat dissipation holes are provided on the rear shell.
[0013] By adopting the above solution, the beneficial effects of this utility model are:
[0014] This invention, by incorporating a semiconductor cooling chip, a heat dissipation module, an MCU control module, a power output control module, a semiconductor cooling chip power supply module, and an output monitoring module, can dynamically control the operation of the semiconductor cooling chip according to the workload of the electronic device. This enables intelligent control of different heat dissipation requirements, ensuring smooth operation of the electronic device, improving user experience, and has a wide range of applications. Attached Figure Description
[0015] Figure 1 This is a perspective view of the utility model in use;
[0016] Figure 2 This is an exploded view of the present invention;
[0017] Figure 3This is a perspective view of the semiconductor cooling chip, power board, and heat dissipation module of this utility model;
[0018] Figure 4 This is a perspective view of the power board of this utility model;
[0019] Figure 5 This is a schematic block diagram of the present invention;
[0020] Figure 6 This is a flowchart illustrating the workflow of this utility model.
[0021] The following are explanations of the labels in the attached diagram:
[0022] 1—Heat-conducting outer casing; 2—Semiconductor cooling chip;
[0023] 3—Power supply board, 4—Cooling module
[0024] 5 — Electronic equipment, 6 — Input power cord,
[0025] 7—Output power cable, 11—Front cover,
[0026] 12—Back cover, 13—Heat dissipation holes
[0027] 31—MCU control module, 32—Power output control module,
[0028] 33—Power supply module for semiconductor refrigeration chip; 34—Output monitoring module;
[0029] 35—Power input interface, 36—Power output interface
[0030] 41—Cooling fan, 42—Heat sink,
[0031] 43—Heat sink, 44—Heat sink guide rod. Detailed Implementation
[0032] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.
[0033] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0034] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.
[0035] Reference Figures 1 to 6 As shown, this utility model provides an intelligent control semiconductor heat dissipation expansion dock, including a heat-conducting shell 1, and a semiconductor cooling chip 2, a power board 3, and a heat dissipation module 4 built into the heat-conducting shell 1. The cold side of the semiconductor cooling chip 2 is closely attached to the inner wall of the heat-conducting shell 1 to achieve cooling of the heat-conducting shell 1; the hot side of the semiconductor cooling chip 2 is in thermal contact with the heat dissipation module 4 to dissipate heat from the semiconductor cooling chip 2. Specifically, the heat-conducting shell 1 is made of aluminum alloy, which has good thermal conductivity. Through the thermal contact between the heat-conducting shell 1 and the electronic device 5, and the close contact between the semiconductor cooling chip 2 and the inner wall of the heat-conducting shell 1, the semiconductor cooling chip 2 cools to achieve cooling of the electronic device 5.
[0036] The power board 3 provides power and intelligent control for the electronic devices 5, the thermoelectric cooler 2, and the heat dissipation module 4. The power board 3 includes an MCU control module 31, and a power output control module 32, a thermoelectric cooler power supply module 33, and an output monitoring module 34, all electrically connected to the MCU control module 31. The power output control module 32 manages the output voltage and current to adapt to different loads. The thermoelectric cooler power supply module 33 is electrically connected to the thermoelectric cooler 2. The output monitoring module 34 monitors the status of the power output control module 32 and reports it to the MCU control module 31 to control the operation of the thermoelectric cooler power supply module 33 and the heat dissipation module 4.
[0037] Furthermore, the power output control module 32 includes a power output chip, which manages the output voltage and current to adapt to different load requirements. The MCU control module 31 includes an MCU chip, and the thermoelectric cooler power supply module 33 includes a thermoelectric cooler power supply chip, which regulates the workload of the thermoelectric cooler 2.
[0038] The heat dissipation module 4 includes at least one heat dissipation component; specifically, two heat dissipation components are provided, and the two heat dissipation components are symmetrically arranged to enhance the heat dissipation effect. The heat dissipation component includes a cooling fan 41, a plurality of heat sinks 42 disposed outside the cooling fan 41, a heat sink plate 43 disposed in close contact with the hot surface of the thermoelectric cooler 2, and a heat dissipation guide rod 44 connecting the heat sink plate 43 and the plurality of heat sinks 42; the first end of the heat dissipation guide rod 44 is disposed in close contact with the heat sink plate 43, and the second end of the heat dissipation guide rod 44 passes through the plurality of heat sinks 42; the cooling fan 41 is electrically connected to the MCU control module 31. By controlling the workload of the thermoelectric cooler 2 and the speed of the cooling fan 41 through the MCU control module 31, the cooling fan 41 can be prevented from running at high speed all the time, thereby avoiding noise that would affect the customer experience.
[0039] The plurality of heat sinks 42 are arranged in parallel, and a vent is formed between each pair of adjacent heat sinks 42; the side wall of the heat-conducting shell 1 is provided with a ventilation port corresponding to the plurality of heat sinks 42, and the ventilation port is connected to the ventilation port; the second end of the heat dissipation guide rod 44 passes through the plurality of heat sinks 42 one by one.
[0040] Specifically, the heat sink 43, heat dissipation guide rod 44, and heat sink 42 are all made of copper. By bringing the heat sink 43 into close contact with the hot surface of the thermoelectric cooler 2, heat is transferred to the heat sink 43 and then to the heat sink 42 via the heat dissipation guide rod 44. The cooling fan 41 then blows air onto the heat sink 42 to accelerate heat dissipation. By arranging several heat sinks 42 in parallel to form vents, which are connected to the air exchange port, airflow between the inside and outside of the heat-conducting outer casing 1 is achieved.
[0041] The power board 3 also includes a power input interface 35 for connecting to an external power source, and a power output interface 36 for connecting to the electronic device 5; the power output interface 36 is electrically connected to the power output control module 32. The power input interface 35 connects to an external power source via an input power cable 6 to provide power to the heat dissipation expansion dock. The power output interface 36 provides power to the electronic device 5 from the heat dissipation expansion dock via an output power cable 7.
[0042] The heat-conducting outer shell 1 includes a front shell 11 and a rear shell 12 that are snap-fitted together. An inner cavity is formed between the front shell 11 and the rear shell 12, in which the thermoelectric cooler 2, the power board 3, and the heat dissipation module 4 are disposed. The front side of the front shell 11 is used for thermal contact with the electronic device 5, and the cold side of the thermoelectric cooler 2 is tightly attached to the inner wall of the front shell 11. The rear shell 12 has a plurality of heat dissipation holes 13, which are corresponding to the cooling fan 41 and the thermoelectric cooler 2. Furthermore, the thermoelectric cooler 2, the power board 3, and the cooling fan 41 are laid flat in sequence in the inner cavity of the heat-conducting outer shell 1, so that the heat dissipation expansion dock can be made thin.
[0043] Electronic device 5 is in thermally conductive contact (fitted) with the cooling surface of the heat dissipation expansion dock, and is powered by the heat dissipation expansion dock through the output power cable 7. When electronic device 5 is under different workloads, the temperature or output power of the power output chip will change with the magnitude of the output power. After the output monitoring module 34 detects the change, it reports it to the MCU control module 31. On the one hand, the MCU control module 31 controls the output current of the semiconductor cooling chip power supply module 33 to control the workload of the semiconductor cooling chip 2; on the other hand, the MCU control module 31 simultaneously controls the speed of the cooling fan 41 to achieve intelligent control and ensure that the temperature of electronic device 5 is maintained at a low level.
[0044] Example 1: (Output monitoring module 34 includes an NTC sensor)
[0045] The NTC sensor monitors the temperature of the power output chip and reports it to the MCU control module 31. The MCU control module 31 controls the output voltage and current of the semiconductor cooling chip power supply chip based on the temperature information, and controls the speed of the cooling fan 41 to achieve intelligent control.
[0046] Example 2: (Output monitoring module 34 includes a precision resistor)
[0047] Specifically, the precision resistor is 5mΩ. The precision resistor monitors the output power of the power output chip, and the MCU control module 31 controls the workload of the semiconductor cooling chip 2 and the speed of the cooling fan 41 according to the changes in output power, with a rapid response and precise control.
[0048] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model. Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the utility model and are not intended to limit the implementation of this utility model. For those skilled in the art, various obvious changes, readjustments, and substitutions can be made without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.
Claims
1. A smart control semiconductor heat dissipation expansion dock, characterized in that, The device includes a heat-conducting housing, and a thermoelectric cooler, a power board, and a heat dissipation module built into the heat-conducting housing; the cold side of the thermoelectric cooler is in close contact with the inner wall of the heat-conducting housing, and the hot side of the thermoelectric cooler is in thermal contact with the heat dissipation module; the power board includes an MCU control module, and a power output control module, a thermoelectric cooler power supply module, and an output monitoring module that are electrically connected to the MCU control module respectively. The power output control module is used to manage the output voltage and current to adapt to different loads; the semiconductor cooling chip power supply module is electrically connected to the semiconductor cooling chip; the output monitoring module is used to monitor the status of the power output control module and report it to the MCU control module to control the semiconductor cooling chip power supply module and the heat dissipation module to work.
2. The intelligent control semiconductor heat dissipation expansion dock according to claim 1, characterized in that, The heat dissipation module includes at least one heat dissipation component; the heat dissipation component includes a cooling fan, a plurality of heat sinks disposed outside the cooling fan, a heat dissipation plate that is in close contact with the hot surface of the semiconductor cooling chip, and a heat dissipation guide rod connecting the heat dissipation plate and the plurality of heat sinks; the first end of the heat dissipation guide rod is in close contact with the heat dissipation plate, and the second end of the heat dissipation guide rod passes through the plurality of heat sinks; the cooling fan is electrically connected to the MCU control module.
3. The intelligent control semiconductor heat dissipation expansion dock according to claim 2, characterized in that, The plurality of heat sinks are arranged in parallel, and a vent is formed between each pair of adjacent heat sinks; the side wall of the heat-conducting shell is provided with a ventilation port corresponding to the plurality of heat sinks, and the ventilation port is connected to the ventilation port; the second end of the heat dissipation guide rod passes through the plurality of heat sinks one by one.
4. The intelligent control semiconductor heat dissipation expansion dock according to claim 1, characterized in that, The power board also includes a power input interface for connecting to an external power source, and a power output interface for connecting to an electronic device; the power output interface is electrically connected to the power output control module.
5. The intelligent control semiconductor heat dissipation expansion dock according to claim 1, characterized in that, The output monitoring module includes an NTC sensor; the NTC sensor is used to monitor the temperature of the power output control module.
6. The intelligent control semiconductor heat dissipation expansion dock according to claim 1, characterized in that, The output monitoring module includes a precision resistor; the precision resistor is used to monitor the output power of the power output control module.
7. The intelligent control semiconductor heat dissipation expansion dock according to claim 1, characterized in that, The heat-conducting outer shell includes a front shell and a rear shell that are snapped together; an inner cavity is formed between the front shell and the rear shell, and a semiconductor cooling chip, a power board, and a heat dissipation module are disposed in the inner cavity; the front side of the front shell is used for thermal contact with the electronic device, and the cold side of the semiconductor cooling chip is tightly attached to the inner wall of the front shell; a number of heat dissipation holes are provided on the rear shell.