Integrated adsorption heating and cooling device

Abstract

The utility model particularly relates to an integrated adsorption heating and cooling device which comprises a ceramic base and a porous ceramic adsorption plate, the ceramic base comprises an air channel layer, a heating layer and a water cooling layer which are sequentially arranged from top to bottom, and a concave cavity is formed in the upper end of the air channel layer; the air channel layer is provided with an air channel, the air channel is located in the concave cavity, and the porous ceramic adsorption plate is arranged in the concave cavity and located above the air channel; a plurality of air holes are formed in the ceramic base, penetrate through the ceramic base and are communicated with the air channel, the heating layer is provided with a heating circuit, a positive electrode and a negative electrode, the heating circuit is located on the upper end face of the heating layer and located below the air channel layer, and a water channel, a water inlet and a water outlet are formed in the water cooling layer. According to the integrated adsorption, heating and cooling device, the air channel layer, the heating layer and the water cooling layer are arranged in the ceramic base, the integrated function of adsorption, heating and cooling can be achieved, temperature control over the vacuum suction cup is facilitated, the occupied space is small, and the vacuum suction cup can be controlled and used separately; the integrated adsorption heating and cooling device is simple in structure.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of sucking disc, concretely relates to a kind of integrated adsorption heating cooling device. BACKGROUND

[0002] At present, vacuum chuck has been widely applied in the field of semiconductor, panel display, optics, etc., which can effectively solve the problem that the existing mechanical chuck is prone to failure during use and easy to scratch wafer and other bearing objects. With the development of economy and the progress of science and technology, the manufacturing technology and process requirements of semiconductor components are becoming higher and higher. High-level semiconductor components are often used at high temperature and need to be cooled to control the temperature of the vacuum chuck and the workpiece. However, the existing vacuum chuck has single function, and does not have heating and cooling functions or is equipped with additional heating and cooling devices, which has complex structure and high manufacturing cost. Therefore, it is of great significance to provide a simple and functional integrated adsorption heating and cooling device. SUMMARY

[0003] In order to overcome the shortcomings and deficiencies in the prior art, the utility model aims to provide an integrated adsorption heating and cooling device, which has simple structure, realizes adsorption, heating and cooling functions, is convenient for temperature control of vacuum chuck and has strong practicality.

[0004] To achieve the above-mentioned purpose, the utility model adopts the following technical scheme: an integrated adsorption heating and cooling device, comprising a ceramic base and a porous ceramic adsorption plate, the ceramic base comprises an air channel layer, a heating layer and a water cooling layer arranged from top to bottom, and the upper end of the air channel layer is provided with a recessed cavity; the air channel layer is provided with an air channel, which is located in the recessed cavity, and the porous ceramic adsorption plate is arranged in the recessed cavity and above the air channel; a plurality of air holes are arranged in the ceramic base, which penetrate through the ceramic base and communicate with the air channel, the heating layer is provided with a heating circuit, a positive electrode and a negative electrode connected with the heating circuit, the heating circuit is located at the upper end surface of the heating layer and below the air channel layer, and the water cooling layer is provided with a water channel, a water inlet and a water outlet connected with the water channel.

[0005] Further, the recessed cavity comprises a middle accommodating cavity and a plurality of annular accommodating cavities surrounding the outer periphery of the middle accommodating cavity from inside to outside, chamber separation rings are arranged between the middle accommodating cavity and the adjacent annular accommodating cavities and between the adjacent annular accommodating cavities, the chamber separation rings are used to separate the middle accommodating cavity and the adjacent annular accommodating cavities or two adjacent annular accommodating cavities, and air channels are arranged in the middle accommodating cavity and the annular accommodating cavities.

[0006] Further, the number of the porous ceramic adsorption plates is multiple, and the multiple porous ceramic adsorption plates are respectively a middle ceramic adsorption plate arranged in the middle accommodating cavity and multiple annular ceramic adsorption plates respectively arranged in corresponding annular accommodating cavities.

[0007] Further, a plurality of first protrusions are arranged in the annular accommodating cavity, a plurality of first air channel sections are formed between adjacent first protrusions and between the first protrusions and the inner wall of the annular accommodating cavity, and the plurality of first air channel sections are connected to form an air channel.

[0008] Further, the first protrusions are fan ring-shaped protrusions, and the plurality of first protrusions are divided into a plurality of protrusion groups arranged in the radial direction of the ceramic base from inside to outside, each protrusion group includes a plurality of fan ring-shaped protrusions arranged in a ring array, and a first air channel section is formed between adjacent fan ring-shaped protrusions.

[0009] Further, the plurality of second protrusions are divided into a plurality of middle protrusions and a plurality of outer peripheral protrusions surrounding the plurality of middle protrusions, the plurality of middle protrusions are arranged in a ring array, and the plurality of outer peripheral protrusions are arranged in a ring array.

[0010] Further, the water cooling layer includes a plurality of water channels, the water channels are repeatedly bent in the water cooling layer, and the plurality of water channels are arranged in the radial direction of the water cooling layer from inside to outside.

[0011] Further, the water cooling layer includes at least four water channels, the water channels are repeatedly bent in the water cooling layer, and the plurality of water channels are arranged in the radial direction of the water cooling layer from inside to outside.

[0012] Further, the heating layer is provided with a plurality of heating lines, each of the plurality of heating lines is provided with a positive electrode and a negative electrode, and the heating lines are repeatedly bent at the upper end of the heating layer.

[0013] Further, the heating layer is provided with at least four heating lines, and the plurality of heating lines are arranged in the radial direction of the heating layer from inside to outside.

[0014] The integrated adsorption heating and cooling device has the advantages that the integrated adsorption heating and cooling device is provided with an air channel layer, a heating layer and a water cooling layer in the ceramic base, can realize the functions of adsorption, heating and cooling, is convenient for temperature control of the vacuum chuck, and has simple structure and high practicability. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 is the three-dimensional structure schematic diagram of the integrated adsorption heating and cooling device.

[0016] Figure 2 is the top view of the integrated adsorption heating and cooling device.

[0017] Figure 3 is the sectional view of the integrated adsorption heating and cooling device.

[0018] Figure 4 is the top view of the air channel layer of the integrated adsorption heating and cooling device.

[0019] Figure 5 is the top view of the heating layer of the integrated adsorption heating and cooling device.

[0020] Figure 6 is the top view of the water cooling layer of the integrated adsorption heating and cooling device.

[0021] The figure mark is: 1, ceramic base; 11, air channel layer; 111, air channel; 112, middle containing cavity; 113, annular containing cavity; 114, cavity separation ring; 115, first convex strip; 116, middle convex strip; 117, outer peripheral convex strip; 12, heating layer; 121, heating line; 122, positive electrode; 123, negative electrode; 13, water cooling layer; 131, water channel; 132, water inlet; 133, water outlet; 14, air hole; 15, hoisting hole; 2, porous ceramic adsorption plate; 21, middle ceramic adsorption plate; 22, annular ceramic adsorption plate. DETAILED DESCRIPTION

[0022] In order to facilitate the understanding of those skilled in the art, the present application will be further described below in conjunction with the embodiments and drawings, and the content mentioned in the embodiments is not a limitation of the present application.

[0023] As Figures 1-6As shown, an integrated adsorption heating and cooling device includes a ceramic base 1 and a porous ceramic adsorption plate 2, the ceramic base 1 includes a gas channel layer 11, a heating layer 12 and a water cooling layer 13 arranged in sequence from top to bottom, the upper end of the gas channel layer 11 is provided with a recessed cavity; the gas channel layer 11 is provided with a gas channel 111, which is located in the recessed cavity, and the porous ceramic adsorption plate 2 is arranged in the recessed cavity and above the gas channel 111; a plurality of gas holes 14 are arranged in the ceramic base 1, the gas holes 14 penetrate the ceramic base 1 and communicate with the gas channel 111, the heating layer 12 is provided with a heating circuit 121 and a positive electrode 122 and a negative electrode 123 connected with the heating circuit 121, the heating circuit 121 is located on the upper end surface of the heating layer 12 and below the gas channel layer 11, and the water cooling layer 13 is provided with a water channel 131 and a water inlet 132 and a water outlet 133 connected with the water channel 131.

[0024] The integrated adsorption heating and cooling device of the utility model has the advantages that the gas channel layer 11, the heating layer 12 and the water cooling layer 13 are arranged in sequence from top to bottom and are independent of each other, occupy small space and can be controlled and used respectively, the integrated adsorption heating and cooling device is simple in structure and high in practicability, and can meet the needs of rapid heating and cooling in the film tearing and film pasting packaging process, improve process efficiency and reduce the heating and cooling time.

[0025] Further, the recessed cavity includes a middle accommodating cavity 112 and a plurality of annular accommodating cavities 113 arranged in sequence from inside to outside around the outer periphery of the middle accommodating cavity 112, chamber separation rings 114 are arranged between the middle accommodating cavity 112 and the adjacent annular accommodating cavities 113 and between the adjacent annular accommodating cavities 113, the chamber separation rings 114 are used for separating the middle accommodating cavity 112 and the adjacent annular accommodating cavities 113 or two adjacent annular accommodating cavities 113, the gas channels 111 are arranged in the middle accommodating cavity 112 and the annular accommodating cavities 113, and the gas channels 111 communicate with the corresponding gas holes 14.

[0026] In the embodiment, the middle accommodating cavity 112 and the middle ceramic adsorption plate 21 are circular or approximately circular. The number of the annular accommodating cavities 113 is three. The middle ceramic adsorption plate 21 and the three annular ceramic adsorption plates 22 are respectively 4-inch, 6-inch, 8-inch and 12-inch porous ceramic adsorption plates. The application scenarios are various. The common wafer sizes on the market are compatible. The frequency of changing the plate is reduced. The loss caused by changing the plate of the machine is reduced. The time of adjusting the machine during changing the plate is reduced. The size of the porous ceramic adsorption plate 2 can also be set according to the needs of the person skilled in the art. The porous ceramic adsorption plate 2 is made of anti-static silicon carbide material. Compared with the metal adsorption plate, it does not need to be additionally provided with an anti-static coating. The integrated adsorption heating and cooling device in the embodiment is an integrated vacuum chuck. The heating and cooling functions are integrated. The manufacturing is simple. The functionality is strong.

[0027] Further, a plurality of first protrusions 115 are arranged in the annular accommodating cavity 113. A plurality of first air passages 111 are formed between adjacent first protrusions 115 and between the first protrusions 115 and the inner wall of the annular accommodating cavity. A plurality of second protrusions are arranged in the middle accommodating cavity 112. A plurality of second air passages 111 are formed between adjacent second protrusions and between the second protrusions and the inner wall of the middle accommodating cavity 112.

[0028] Further, the first protrusions 115 are fan-shaped annular protrusions. The plurality of first protrusions 115 are divided into a plurality of protrusion groups arranged in the radial direction of the ceramic base 1 from the inside to the outside. Each protrusion group includes a plurality of fan-shaped annular protrusions arranged in an annular array. The first air passages 111 are formed between adjacent fan-shaped annular protrusions. The plurality of second protrusions are divided into a plurality of middle protrusions 116 and a plurality of outer peripheral protrusions 117 surrounding the plurality of middle protrusions 116. The plurality of middle protrusions 116 are arranged in an annular array. The plurality of outer peripheral protrusions 117 are arranged in an annular array. The cross section of the middle protrusion 116 is fan-shaped. The cross section of the outer peripheral protrusion 117 is fan-shaped annular.

[0029] In the embodiment, the air passages 111 in the annular accommodating cavity 113 and the air passages 111 in the middle accommodating cavity 112 are formed by being communicated with the corresponding air holes 14 to form a gas passage. The vacuum adsorption layer is formed in the ceramic base 1 to facilitate the fixation of the workpiece and the processing. The first protrusions 115 and the second protrusions are both adhesive strips. The middle ceramic adsorption plate 21 and the annular ceramic adsorption plate 22 are respectively connected with the upper ends of the corresponding adhesive strips to seal the air passages 111 and ensure the packaging effect.

[0030] Further, the water cooling layer 13 comprises a plurality of water channels 131, the water channels 131 are provided with water inlets 132 and water outlets 133 at the head and tail ends respectively, and the water channels 131 are repeatedly bent in the water cooling layer 13. Preferably, the water cooling layer 13 comprises at least four water channels 131, the water channels 131 are repeatedly bent in the water cooling layer 13, and the plurality of water channels 131 are arranged in sequence from inside to outside along the radial direction of the water cooling layer 13. The path profile of each water channel 131 is generally annular or spiral. In the embodiment, the water cooling layer 13 comprises four water channels 131, each water channel 131 is independent of each other and is independently connected with the water inlet 132 and the water outlet 133, so as to facilitate the cooling of the vacuum chuck inside the ceramic base 1.

[0031] Further, the heating layer 12 is provided with a plurality of heating lines 121, each of the plurality of heating lines 121 is provided with a positive electrode 122 and a negative electrode 123, and the heating lines 121 are repeatedly bent at the upper end of the heating layer 12. Preferably, the heating layer 12 is provided with at least four heating lines 121, and the plurality of heating lines 121 are arranged in sequence from inside to outside along the radial direction of the heating layer 12. The path profile of each heating line 121 is generally annular or spiral. In the embodiment, the heating layer 12 is provided with four heating lines 121, each heating line 121 is independent of each other, the integrated adsorption heating and cooling device adopts four-zone heating, improves the temperature uniformity, independently controls the temperature of each zone, reduces the loss of heating power, and is clean and environmentally friendly.

[0032] Further, the cross section of the ceramic base 1 is circular or polygonal, such as square, regular hexagon, etc., which can meet different sizes, different shapes and product requirements. Preferably, the cross section of the ceramic base 1 is circular. The outer periphery of the ceramic base 1 of the embodiment is provided with a lifting hole 15, which is convenient for installation and use.

[0033] The above embodiment is a preferred implementation scheme of the present application, in addition to this, the present application can be realized in other ways, and any obvious replacement without departing from the concept of the present application is within the protection scope of the present application.

Claims

1. An integrated adsorptive heating and cooling device, characterized by: The ceramic base comprises a gas channel layer, a heating layer and a water cooling layer arranged in sequence from top to bottom, and the upper end of the gas channel layer is provided with a concave cavity; the gas channel layer is provided with a gas channel located in the concave cavity, and the porous ceramic adsorption plate is arranged in the concave cavity and above the gas channel; a plurality of air holes are arranged in the ceramic base, the air holes penetrate through the ceramic base and communicate with the gas channel, the heating layer is provided with a heating circuit, a positive electrode and a negative electrode connected with the heating circuit, the heating circuit is located at the upper end surface of the heating layer and below the gas channel layer, and the water cooling layer is provided with a water channel, a water inlet and a water outlet connected with the water channel.

2. The integrated adsorptive heating and cooling device of claim 1, wherein: The concave cavity comprises a middle accommodating cavity and a plurality of annular accommodating cavities successively arranged outside the middle accommodating cavity, chamber separation rings are arranged between the middle accommodating cavity and the adjacent annular accommodating cavities and between the adjacent annular accommodating cavities, and the chamber separation rings are used for separating the middle accommodating cavity and the adjacent annular accommodating cavities or two adjacent annular accommodating cavities, and the middle accommodating cavity and the annular accommodating cavities are provided with gas channels.

3. The integrated adsorptive heating and cooling device of claim 2, wherein: The number of the porous ceramic adsorption plates is multiple, and the multiple porous ceramic adsorption plates are respectively a middle ceramic adsorption plate arranged in the middle accommodating cavity and a plurality of annular ceramic adsorption plates arranged in the corresponding annular accommodating cavities.

4. The integrated adsorptive heating and cooling device of claim 2, wherein: The annular accommodating cavities are provided with a plurality of first convex strips arranged at intervals, a plurality of first gas channel sections in communication with each other are formed between adjacent first convex strips and between the first convex strips and the inner wall of the annular accommodating cavity, and the plurality of first gas channel sections are communicated to form a gas channel; the middle accommodating cavity is provided with a plurality of second convex strips arranged at intervals, a plurality of second gas channel sections in communication with each other are formed between adjacent second convex strips and between the second convex strips and the inner wall of the middle accommodating cavity, and the plurality of second gas channel sections are communicated to form a gas channel.

5. The integrated adsorptive heating and cooling device of claim 4, wherein: The first convex strips are fan ring-shaped convex strips, and the plurality of first convex strips are divided into a plurality of convex strip groups arranged in sequence from inside to outside along the radial direction of the ceramic base, each convex strip group comprises a plurality of fan ring-shaped convex strips arranged in an annular array at intervals, and a first gas channel section is formed between adjacent fan ring-shaped convex strips.

6. The integrated adsorptive heating and cooling device of claim 4, wherein: The plurality of second convex strips are divided into a plurality of middle convex strips and a plurality of peripheral convex strips surrounding the plurality of middle convex strips, the plurality of middle convex strips are arranged in an annular array at intervals, the plurality of peripheral convex strips are arranged in an annular array at intervals, the cross section of the middle convex strip is fan-shaped, and the cross section of the peripheral convex strip is fan ring-shaped.

7. The integrated adsorptive heating and cooling device of claim 1, wherein: The water cooling layer comprises a plurality of water channels, the first end and the tail end of the water channel are respectively provided with a water inlet and a water outlet, and the water channel repeatedly bends in the water cooling layer.

8. The integrated adsorptive heating and cooling device of claim 7, wherein: The water cooling layer comprises at least four water channels, and the plurality of water channels are arranged in sequence from inside to outside along the radial direction of the water cooling layer.

9. The integrated adsorptive heating and cooling device of claim 1, wherein: The heating layer is provided with a plurality of heating circuits, and each of the plurality of heating circuits is provided with a positive electrode and a negative electrode, and the heating circuit repeatedly bends at the upper end of the heating layer.

10. The integrated adsorptive heating and cooling device of claim 9, wherein: The heating layer is provided with at least four heating circuits, and the plurality of heating circuits are arranged in sequence from inside to outside along the radial direction of the heating layer.

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